TWI718654B - Conductive plate for touch device - Google Patents

Abstract

The conductive plate for the touch control device includes a light-transmitting support substrate, first and second optical adjustment film structures formed on the first and second surfaces opposite to the light-transmitting support substrate, and the first and second optical adjustment film structures respectively stacked on the first and second surfaces. The first and second conductive film structures on the optical adjustment film structure. The first optical adjustment and conductive film layer structure each sequentially includes an optical adjustment layer with a refractive index greater than 2 and an adhesion layer and an inner copper oxide layer, an inner nickel-copper alloy layer, a copper conductor layer, and an outer nickel-copper alloy in sequence along the first surface. Layer and outer copper oxide layer. The second optical adjustment and conductive film layer structure each sequentially includes a first optical adjustment layer with a refractive index greater than 2, an adhesion layer, and a second optical adjustment layer with a refractive index smaller than the first optical adjustment layer, and indium oxide along the back to the second surface. Tin layer, copper conductor layer and nickel-copper alloy layer.

Description

Conductive plate for touch device

The present invention relates to a conductive plate, in particular to a conductive plate used in a touch device.

Referring to FIG. 1, a conductive plate 1 for a conventional touch device includes a supporting substrate 11 made of polyethylene terephthalate (PET), and a pair of supporting substrates 11 formed on the supporting substrate 11 A hard coat layer 12 on the upper and lower surfaces, an optical adjustment layer 13 formed on the hard coat layer 12 above the pair of hard coat layers 12, and a conductive film layer structure 14 formed on the optical adjustment layer 13 . The conductive film layer structure 14 has an indium tin oxide (ITO) layer 141 formed on the optical adjustment layer 13, a copper conductor layer 142 formed on the indium tin oxide layer 141, and a nickel-copper alloy layer 143.

The conductive plate 1 used in the conventional touch device is generally supplied to downstream manufacturers to etch the conductive film layer structure 14 by etching the circuit for the touch device. However, the adhesion between the optical adjustment layer 13 and the indium tin oxide layer 141 in the conductive plate 1 for the existing touch device is not good, so that downstream manufacturers are in the process of etching their conductive film layer structure 14 In addition, the indium tin oxide layer 141 in the conductive film layer structure 14 is easily detached from the optical adjustment layer 13 to have a bad influence on the electrical properties. Furthermore, the indium tin oxide layer 141 in the conductive film layer structure 14 is a metal oxide, and its electrical conductivity is relatively lower than that of a metal (eg, copper), which also affects the electrical performance of the final circuit.

It can be seen from the above description that the structure of the conductive plate used in the touch device is improved so that downstream manufacturers can ensure that the indium tin oxide layer 141 is not affected by the etchant and is detached from the optical adjustment layer 13 and etched during the etching process. A complete circuit, which can also meet the electrical performance requirements of the conductive plate used in the touch device, is a problem to be solved by the relevant technical personnel in the relevant technical field.

Therefore, the object of the present invention is to provide a conductive plate for touch devices that can be supplied to downstream manufacturers of touch devices to etch a complete circuit during the etching process and meet the electrical performance requirements of the conductive plate for touch devices.

Therefore, the conductive plate used in the touch device of the present invention includes a light-transmitting support substrate, a first optical adjustment film structure, a second optical adjustment film structure, a first conductive film structure, and a second Conductive film layer structure. The first optical adjustment film structure is formed on a first surface of the translucent support substrate, and includes a refractive index greater than 2 along a first stacking direction facing away from the first surface of the translucent support substrate. Optical adjustment layer, and an adhesion layer. The second optical adjustment film structure is formed on a second surface of the translucent support substrate opposite to the first surface, and along a second stacking direction facing away from the second surface of the translucent support substrate The sequence includes a first optical adjustment layer with a refractive index greater than 2, an adhesion layer, and a second optical adjustment layer with a refractive index smaller than the first optical adjustment layer. The first conductive film layer structure is stacked on the first optical adjustment film layer structure, and includes an inner copper oxide layer, an inner nickel-copper alloy layer, a copper conductor layer, and an outer layer in sequence along the first stacking direction A nickel-copper alloy layer and an outer copper oxide layer. The second conductive film layer structure is stacked on the second optical adjustment film layer structure, and includes an indium tin oxide layer, a copper conductor layer, and a nickel copper alloy layer in sequence along the second stacking direction.

The effect of the present invention is that the inner copper oxide layer in the first conductive film layer structure and the indium tin oxide layer in the second conductive film layer structure can be adjusted by the adhesion layer and the adhesion layer in the first optical adjustment film layer structure, respectively. The adhesion layer in the second optical adjustment film structure respectively assists its inner copper oxide layer and its indium tin oxide layer to still adhere to the first optical adjustment film structure and the second optical adjustment film structure to avoid touch The downstream manufacturers of the device destroy the integrity of the final circuit when etching each conductive film layer structure with an etchant, and the copper conductor layer can also meet the circuit performance requirements of the touch device related equipment factory.

Referring to FIG. 2, an embodiment of the conductive plate used in the touch device of the present invention includes a light-transmitting support substrate 2, a first optical adjustment film structure 3, a second optical adjustment film structure 4, and a first conductive Film layer structure 5, and a second conductive film layer structure 6. The transparent support substrate 2 suitable for this embodiment of the present invention is made of polyethylene terephthalate (PET), cyclic olefin copolymer (COC), colorless polyimide , Referred to as CPI), optical polyimide (optical polyimide, referred to as OPI) or cyclic olefin polymer (cyclic olefin polymer, referred to as COP). In this embodiment of the present invention, the translucent support substrate 2 is made of PET.

The first optical adjustment film structure 3 is formed on a first surface 21 of the light-transmitting support substrate 2, and includes sequentially along a first stacking direction facing away from the first surface 21 of the light-transmitting support substrate 2 An optical adjustment layer 31 with a refractive index greater than 2 and an adhesion layer 32.

The second optical adjustment film structure 4 is formed on a second surface 22 of the translucent support substrate 2 opposite to the first surface 21 and along a second surface 22 facing away from the translucent support substrate 2 The second stacking direction includes a first optical adjustment layer 41 with a refractive index greater than 2, an adhesion layer 43, and a second optical adjustment layer 42 with a refractive index smaller than that of the first optical adjustment layer 41 in sequence.

The first conductive film layer structure 5 is stacked on the first optical adjustment film layer structure 3, and includes an inner copper oxide layer 51, an inner nickel-copper alloy layer 52, and a copper conductor in sequence along the first stacking direction Layer 53, an outer nickel-copper alloy layer 54 and an outer copper oxide layer 55.

The second conductive film layer structure 6 is stacked on the second optical adjustment film layer structure 4, and includes an indium tin oxide layer 61, a copper conductor layer 62, and a nickel copper alloy in sequence along the second stacking direction Layer 63.

In detail, this embodiment of the present invention improves the light transmittance of the second optical adjustment film structure 4 by the refractive index difference between the first optical adjustment layer 41 and the second optical adjustment layer 42. However, the adhesion between the optical adjustment layer 31 of the first optical adjustment film structure 3 and the inner copper oxide layer 51 of the first conductive film structure 5 is poor, and the second optical adjustment film structure The adhesion between the first optical adjustment layer 41 and the second optical adjustment layer 42 of 4 is low, and it also lacks adhesion with the indium tin oxide layer 61 in the second conductive film layer structure 6, so the first optical adjustment The optical adjustment layer 31 of the film structure 3 needs to pass through its adhesion layer 32 to improve the adhesion between the optical adjustment layer 31 and the inner copper oxide layer 51 of the first conductive film structure 5, and the second optical adjustment film structure The first optical adjustment layer 41 of 4 also needs to improve the adhesion of the first optical adjustment layer 41 and the second optical adjustment layer 42 and the indium tin oxide layer 61 in the second electrical film layer structure 6 through the adhesion layer 43. Sex.

Therefore, preferably, the adhesion layers 32, 43 of the first optical adjustment film structure 3 and the second optical adjustment film structure 4 are made of amorphous silicon (amorphous Si), silicon monoxide (SiO) or chromium ( Cr) and has a thickness less than 5 nm; the optical adjustment layer 31 of the first optical adjustment film structure 3 and the first optical adjustment layer 41 of the second optical adjustment film structure 4 are selected from TiO _2. Ti ₃ O ₅ , Ta ₂ O ₅ , Nb ₂ O ₅ or ZrO ₂ ; the second optical adjustment layer 42 of the second optical adjustment film structure 4 is crystalline SiO ₂ . In this embodiment of the present invention, the adhesion layer 32 of the first optical adjustment film structure 3 and the adhesion layer 43 of the second optical adjustment film structure 4 are made of 1.2 nm amorphous silicon, and the second The thickness of the second optical adjustment layer 42 of the optical adjustment film structure 4 is 10 nm.

It is worth mentioning that the purpose of the inner copper oxide layer 51 and the outer copper oxide layer 55 in the first conductive film layer structure 5 of this embodiment of the present invention is to reduce the copper conductor layer of the first conductive layer structure 5 53. In other words, the inner copper oxide layer 51 and the outer copper oxide layer 55 are used as a blackened layer. It should be further explained here that when the thickness of the inner copper oxide layer 51 and the outer copper oxide layer 55 is insufficient or too thick, an effective blackening effect cannot be achieved. Therefore, preferably, the thickness of the inner copper oxide layer 51 and the outer copper oxide layer 55 of the first conductive film layer structure 5 of this embodiment of the present invention is between 35 nm and 45 nm. In this embodiment of the present invention, the inner copper oxide layer 51 and the outer copper oxide layer 55 each have a thickness of 40 nm, the inner nickel-copper alloy layer 52 and the outer nickel-copper alloy layer 54 each have a thickness of 5 nm, and The thickness of the copper conductor layer 53 is 200 nm.

This embodiment of the present invention also optionally includes a first hard coating layer 71 and a second hard coating layer 72. The first hard coating layer 71 and the second hard coating layer 72 are respectively formed on the first surface 21 and the second surface 22 of the translucent support substrate 2 so as to be interposed between the first optical adjustment film structure 3 And between the transparent supporting substrate 2 and between the second optical adjustment film layer structure 4 and the transparent supporting substrate 2. In this embodiment of the present invention, the first hard layer 71 and the second hard coating layer 72 are made of ZrO ₂ .

It should be added here that the _{refractive index based on ZrO 2} is about 2.16; therefore, the first hard layer 71 and the second hard coating layer 72 of this embodiment of the present invention can also be replaced by the first optical adjustment film layer. The optical adjustment layer 31 of the structure 3 and the first optical adjustment layer 41 of the second optical adjustment film structure 4, and when the optical adjustment layer 31 and the second optical adjustment layer 31 of the first optical adjustment film structure 3 of this embodiment of the present invention When the first optical adjustment layer 41 of the adjustment film structure 4 is ZrO ₂ , the first hard coating layer 71 and the second hard coating layer 72 can be omitted. That is, when the optical adjustment layer 31 of the first optical adjustment film structure 3 (and the first optical adjustment layer 41 of the second optical adjustment film structure 4) and the first and second hard coating layers 71, 72 When one of the two materials is ZrO ₂ , the other can be omitted, so that a single film layer can achieve the purpose of protection and optical adjustment at the same time. In this embodiment of the present invention, the optical adjustment layer 31 of the first optical adjustment film structure 3 and the first optical adjustment layer 41 of the second optical adjustment film structure 4 are selected from ZrO _{2 with a thickness of 1000 nm} And the first optical adjustment layer 31 and the first hard coat layer 71 of the first optical adjustment film structure 3 and the first optical adjustment layer 41 and the second optical adjustment film structure 4 as shown in FIG. Each of the second hard coating layers 72 is a single film layer.

According to the foregoing detailed description of the embodiment of the present invention, it can be seen that the present invention uses the adhesion layer 32 of the first optical adjustment film structure 3 to improve the optical adjustment layer 31 and the inner copper oxide 51 of the first conductive film structure 5 Adhesion, and use the adhesion layer 43 of the second optical adjustment film structure 4 to improve the adhesion of the first optical adjustment layer 41 and the second optical adjustment layer 42 and the indium tin oxide layer 61 of the second conductive film structure 6 Adhesiveness. When downstream manufacturers of touch devices etch the first conductive film layer structure 5 and the second conductive film layer structure 6 through etching technology, the first conductive film layer structure 5 and the second conductive film layer structure 6 can be used separately The adhesion layer 32 and the adhesion layer 43 maintain the inner copper oxide layer 51 of the first conductive film layer structure 5 and the indium tin oxide layer 61 of the second conductive film layer structure 6 from the etchant, and desorb respectively In its first optical adjustment film structure 3 and its second optical adjustment film structure 4, a complete circuit is etched.

Incidentally, the conductivity of the copper conductor layer 53 in the first conductive film layer structure 5 of this embodiment of the present invention is relatively higher than that of the indium tin oxide layer 141 mentioned in the prior art; therefore, this embodiment of the present invention After supplying to downstream manufacturers to etch their final circuits, the corresponding electrical performance contributed will inevitably meet the needs of manufacturers related to touch devices.

Table 1 below shows the etched electrical test, adhesion test (100 grid test), and optical test analysis results of this embodiment of this case; wherein, the first conductive film layer structure 5 is etched into a net Lattice state. After baking before baking

Table 1. Sheet resistance (Ω/□) 0.13 Hundred grid test (ASTM3359) Before baking 5B/5B After baking 5B/5B 3 sides of the first optical adjustment film structure Before baking CIE1976 chromaticity L* 36.9 a* 1.6 b* -4.3 C* 4.6 h˚ 290.8 Reflectivity(%) 10.4 @550 nm reflectance (%) 9.3 After baking CIE1976 chromaticity L* 39 a* 4 b* -2 C* 4 h˚ 334 Reflectivity(%) 12 @550 nm reflectance (%) 10 4 sides of the second optical adjustment film structure Before baking CIE1976 chromaticity L* 45.8 a* -9.3 b* -10.4 C* 13.9 h˚ 228.4 Reflectivity(%) 13.9 @550 nm reflectance (%) 16.3 After baking CIE1976 chromaticity L* 49 a* -8 b* -9 C* 11 h˚ 228 Reflectivity(%) 16 @550 nm reflectance (%) 18

From the display in Table 1. above, it can be seen that the sheet resistance of this embodiment of the present invention is only 0.13Ω/□, which shows that its electrical performance is sufficient to meet the requirements of touch device related equipment manufacturers.

In addition, the 100-grid test of this embodiment of the present invention has the highest adhesion grade 5B/5B before and after baking, which proves that the first conductive film structure 5 and the second conductive film structure 5 and the second layer are etched in this embodiment of the present invention. After the conductive film structure 6, the first conductive film structure 5 and the second conductive film structure 6 can be improved by the adhesion layers 32 and 43 of the first and second optical adjustment film structures 3 and 4, respectively. The first and second optics adjust the adhesion between the film structures 3 and 4.

In addition, comparing the optical test results of the first optical adjustment film structure 3 side and the second optical adjustment film structure 4 side, it can be seen that the reflectance of the first optical adjustment film structure 3 side after baking and 550 nm The reflectivity at the wavelength is only 12% and 10%, and the brightness (L*) is only 39; in contrast, the reflectivity at the side of the second optical adjustment film structure 4 after baking and the reflectivity at the wavelength of 550 nm It is increased to 16% and 18%, respectively, and the brightness (L*) is also increased to 49, which proves that the inner copper oxide layer 51 and the outer copper oxide layer 55 of the first conductive film layer structure 5 achieve the blackening effect. Prevent the reflection problem of the copper conductor layer 53.

In summary, the adhesion layers 32 and 43 of the first and second optical adjustment film structures 3 and 4 of the conductive plate used in the touch device of the present invention can enable downstream manufacturers of the touch device to etch the first and second layers through the etchant. When the conductive film layer structures 5 and 6 are not affected by the etchant, they are desorbed from the first and second optical adjustment film structures 3 and 4, thereby maintaining the integrity of the final circuit, and the first conductive film layer structure The copper conductor layer 53 of 5 also has a lower sheet resistance and meets the requirements of touch device related equipment manufacturers because of its relatively higher conductivity than indium tin oxide (ITO), so it can indeed achieve the purpose of the invention.

However, the above are only examples of the present invention. When the scope of implementation of the present invention cannot be limited by this, all simple equivalent changes and modifications made in accordance with the scope of the patent application of the present invention and the content of the patent specification still belong to Within the scope covered by the patent of the present invention.

2: Translucent support substrate 51: Inside copper oxide layer 21: The first surface 52: Inner nickel copper alloy layer 22: second surface 53: Copper conductor layer 3: The first optical adjustment film structure 54: Outer nickel-copper alloy layer 31: Optical adjustment layer 55: outer copper oxide layer 32: Adhesion layer 6: Second conductive film layer structure 4: The second optical adjustment film structure 61: Indium tin oxide layer 41: The first optical adjustment layer 62: Copper conductor layer 42: second optical adjustment layer 63: Nickel-copper alloy layer 43: Adhesion layer 71: The first hard coat 5: The first conductive film layer structure 72: second hard coat

Other features and effects of the present invention will be clearly presented in the embodiments with reference to the drawings, in which: Figure 1 is a schematic front view illustrating an existing conductive plate used in a conventional touch device; and 2 is a schematic front view illustrating an embodiment of the conductive plate used in the touch device of the present invention.

2: Translucent support substrate

21: The first surface

22: second surface

3: The first optical adjustment film structure

31: Optical adjustment layer

32: Adhesion layer

4: The second optical adjustment film structure

41: The first optical adjustment layer

51: Inside copper oxide layer

52: Inner nickel copper alloy layer

53: Copper conductor layer

54: Outer nickel-copper alloy layer

55: outer copper oxide layer

6: Second conductive film layer structure

61: Indium tin oxide layer

62: Copper conductor layer

42: second optical adjustment layer

43: Adhesion layer

5: The first conductive film layer structure

63: Nickel-copper alloy layer

71: The first hard coat

72: second hard coat

Claims (8)

A conductive plate for a touch device, including: A transparent supporting substrate; A first optical adjustment film structure is formed on a first surface of the translucent support substrate, and includes a refractive index greater than 2 optical adjustment layer and an adhesion layer; A second optical adjustment film structure formed on a second surface of the transparent supporting substrate opposite to the first surface and along a second stacking direction facing away from the second surface of the transparent supporting substrate Sequentially including a first optical adjustment layer with a refractive index greater than 2, an adhesion layer, and a second optical adjustment layer with a refractive index smaller than the first optical adjustment layer; A first conductive film layer structure is stacked on the first optical adjustment film structure and includes an inner copper oxide layer, an inner nickel-copper alloy layer, a copper conductor layer, and a copper oxide layer in sequence along the first stacking direction. An outer nickel-copper alloy layer and an outer copper oxide layer; and A second conductive film layer structure is stacked on the second optical adjustment film structure and includes an indium tin oxide layer, a copper conductor layer, and a nickel copper alloy layer in sequence along the second stacking direction. The conductive plate for a touch device according to claim 1, wherein the thickness of the inner copper oxide layer and the outer copper oxide layer of the first conductive film layer structure is between 35 nm and 45 nm. The conductive plate for a touch device according to claim 1, wherein the adhesion layer of the first optical adjustment film structure and the second optical film structure is made of amorphous silicon, silicon monoxide or chromium. The conductive plate for a touch device according to claim 1, wherein each adhesion layer has a thickness of less than 5 nm. The conductive plate for a touch device according to claim 1, wherein the optical adjustment layer of the first optical adjustment film structure and the first optical adjustment layer of the second optical adjustment film structure are selected from TiO ₂ , Ti ₃ O ₅ , Ta ₂ O ₅ , Nb ₂ O ₅ or ZrO ₂ ; the second optical adjustment layer of the second optical adjustment film structure is SiO ₂ . The conductive plate for a touch device according to claim 1, further comprising a first hard coating layer and a second hard coating layer, and the first hard coating layer and the second hard coating layer are respectively formed on the transparent The first surface and the second surface of the flexible support substrate are respectively interposed between the first optical adjustment film structure and the light-transmitting support substrate and between the second optical adjustment film structure and the light-transmitting support Between the substrates. The conductive plate for a touch device according to claim 6, wherein the first hard coating layer and the second hard coating layer are made of ZrO ₂ . The conductive plate for a touch device according to claim 1, wherein the light-transmitting support substrate is made of polyethylene terephthalate, cyclic olefin copolymer, colorless polyimide, and optical grade polyimide Made of imine or cyclic olefin polymer.

Images