JP6597487B2 - Electrode substrate film and method for producing the same - Google Patents

Electrode substrate film and method for producing the same Download PDF

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JP6597487B2
JP6597487B2 JP2016118946A JP2016118946A JP6597487B2 JP 6597487 B2 JP6597487 B2 JP 6597487B2 JP 2016118946 A JP2016118946 A JP 2016118946A JP 2016118946 A JP2016118946 A JP 2016118946A JP 6597487 B2 JP6597487 B2 JP 6597487B2
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秀晴 大上
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Sumitomo Metal Mining Co Ltd
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Description

本発明は樹脂フィルムから成る基板上に金属層が成膜された電極基板フィルム及びその製造方法に関し、特に、その正反射成分近傍の拡散分散光がほぼ黒色として視認されるタッチパネル用の電極基板フィルム及びその製造方法に関する。   The present invention relates to an electrode substrate film in which a metal layer is formed on a substrate made of a resin film, and a method for manufacturing the electrode substrate film, and in particular, an electrode substrate film for a touch panel in which diffuse dispersion light in the vicinity of the regular reflection component is visually recognized as almost black. And a manufacturing method thereof.

携帯電話、携帯電子文書機器、自動販売機、カーナビゲーション等の電子機器が具備するフラットパネルディスプレイ(FPD)の表面には、近年、「タッチパネル」を設置することが多くなっている。「タッチパネル」は格子状電極を2枚の透明基板で挟み込んだ構造になっており、この格子状電極には、ITO(酸化インジウム−酸化錫)等の透明導電層又は金属層をパターニング加工したものが使用されている。   In recent years, a “touch panel” is often installed on the surface of a flat panel display (FPD) provided in an electronic device such as a mobile phone, a portable electronic document device, a vending machine, or a car navigation system. The “touch panel” has a structure in which a grid electrode is sandwiched between two transparent substrates, and this grid electrode has a patterned conductive layer or metal layer such as ITO (indium oxide-tin oxide). Is used.

これらのうち、金属層はITOに比べて電気抵抗値が低いためタッチパネルの大型化や応答速度の高速化に適しているが、可視波長領域における反射率が高いため、細線構造や微細なメッシュ構造にパターニング加工しても高輝度照明下では回路パターンが視認されることが問題になることがある。この問題を抑えるため、様々な技術が提案されている。   Of these, the metal layer has a lower electrical resistance than ITO, so it is suitable for increasing the size of touch panels and increasing the response speed. However, it has a high reflectivity in the visible wavelength region, so it has a fine line structure and fine mesh structure. Even if patterning is performed, it may be a problem that the circuit pattern is visually recognized under high luminance illumination. In order to suppress this problem, various techniques have been proposed.

例えば金属層の上に、黒色で消衰係数の高い物性を有する金属吸収層を成膜する技術が提案されている。しかしながら、金属吸収層は製造コストや後工程で行われるエッチングによるパターニング加工を考慮すると膜厚に限界があり、必要とする低反射率や黒色を実現できないことがある。そこで、反射率を比較的確実に低下させる方法として、金属層の表面を粗面にして正反射成分を散乱させる方法が提案されている。   For example, a technique for forming a black metal absorption layer having physical properties with a high extinction coefficient on a metal layer has been proposed. However, the metal absorption layer has a limit in film thickness in consideration of the manufacturing cost and patterning processing by etching performed in a later process, and the required low reflectance or black may not be realized. Therefore, as a method of reducing the reflectance relatively reliably, a method of scattering the specular reflection component by making the surface of the metal layer rough is proposed.

例えば特許文献1には、透明基板の少なくとも片面に複数の錐状突起をサブミクロンピッチでマトリックス状に配置し、得られた錐状突起群の上に金属製細線を形成することで高輝度照明下での反射防止機能が高められた電極基板フィルムが開示されている。この電極基板フィルムは、さらに錐状突起群と金属製細線との間若しくは金属製細線の上に黒色層を設けて可視波長域の光を吸収することが示されている。   For example, in Patent Document 1, a plurality of conical protrusions are arranged in a matrix at a submicron pitch on at least one surface of a transparent substrate, and high-luminance illumination is performed by forming metal thin wires on the obtained conical protrusion group. An electrode substrate film having an improved antireflection function below is disclosed. It has been shown that this electrode substrate film further absorbs light in the visible wavelength region by providing a black layer between the conical projection group and the metal fine wire or on the metal fine wire.

しかしながら、電極基板フィルムを上記の構造とすることで低反射率を実現しても、これにより生じる拡散光の色が色味によっては好まれない場合があり、また、黒色層を設ける場合においても、光沢色のある黒色ではかえって格子状配線が目立ってしまうおそれがある。なお、特許文献2には、透明導電膜フィルムを様々な角度から視認しても色味にばらつきが生じないように、正反射成分のL*a*b*表色系におけるa*値及びb*値のばらつきを所定の値に抑える技術が開示されている。   However, even if the electrode substrate film has the above-described structure to achieve low reflectance, the color of the diffused light generated thereby may not be preferred depending on the color, and even when a black layer is provided. On the other hand, there is a possibility that the grid-like wiring is conspicuous in the glossy black. In Patent Document 2, the a * value and b in the L * a * b * color system of the specular reflection component are used so that the color tone does not vary even when the transparent conductive film is viewed from various angles. * A technique for suppressing variation in values to a predetermined value is disclosed.

特開2016−9285号公報Japanese Patent Laying-Open No. 2006-9285 特開2015−179489号公報Japanese Patent Laying-Open No. 2015-179489

前述したようにタッチパネルを構成する格子状電極は、通常は肉眼で見えにくくなるように工夫されているものの、金属の有する本質的に高い反射率のため、高輝度照明下ではわずかに見えてしまうことがある。タッチパネルを備えた電子機器のうち特にモバイル機器は、強い照明灯の映り込みを避けるため、パネル面を若干傾けて使用することがある。そのため、前述したように表面を粗面化しても、これに起因する拡散光(拡散反射光)の色が品質上の問題になることがあり、これを抑えるため正反射成分近傍の拡散光成分も黒色に近いことが望まれる。   As described above, although the grid electrodes constituting the touch panel are usually devised to be difficult to see with the naked eye, they are slightly visible under high-intensity illumination due to the inherently high reflectivity of the metal. Sometimes. Among electronic devices provided with a touch panel, mobile devices, in particular, may be used with the panel surface slightly tilted in order to avoid reflection of strong illumination light. Therefore, even if the surface is roughened as described above, the color of the diffused light (diffuse reflected light) resulting from this may become a quality problem, and in order to suppress this, the diffused light component near the regular reflection component It is also desirable that the color be close to black.

本発明はタッチパネル用として使用される従来の電極基板フィルムがかかえる上記の問題に鑑みてなされたものであり、格子状電極としてパターニング加工されたとき、正反射成分及びその近傍の拡散反射光成分が黒色若しくはこれに近い色で視認される金属電極フィルムを提供することを目的にしている。   The present invention has been made in view of the above-described problems of conventional electrode substrate films used for touch panels. When patterned as a grid electrode, the specular reflection component and the diffuse reflection light component in the vicinity thereof are present. It aims at providing the metal electrode film visually recognized by the color close | similar to black.

上記目的を達成するため、本発明に係る電極基板フィルムは、樹脂フィルム基板の少なくとも片面に金属吸収層及び金属層から成る積層体が成膜された電極基板フィルムであって、該電極基板フィルムの成膜面上の任意の部位に対して所定の入射光角度に固定した照射素子から入射したときの拡散反射光を、一定の角度間隔おきに受光角度が移動する受光素子で受光したとき、該照射素子の陰になる角度位置と正反射成分が受光される角度位置とを除いて該受光した拡散反射光のL*a*b*表色系におけるb*値が−15から0の範囲にあるか、あるいは該電極基板フィルムの成膜面上の任意の部位に対して一定の角度間隔おきに入射光角度が移動する照射素子から入射したときの拡散反射光を、所定の受光角度に固定した受光素子で受光したとき、該受光素子の陰になる角度位置と正反射成分が受光される角度位置とを除いて該拡散反射光のL*a*b*表色系におけるb*値が−15から0の範囲にあり、前記電極基板フィルムの成膜面に垂直な方向を0°としたとき、前記所定の入射光角度が−45°であり、前記所定の受光角度が45°であり、前記受光素子の移動範囲は、前記成膜面に垂直で且つ前記固定した照射素子からの入射光の光路を含む面上において、照射される部位を中心とする半円周上での−80°から80°の角度範囲であり、前記照射素子の移動範囲は、前記成膜面に垂直で且つ前記固定した受光素子への受光光路を含む面上において、該受光素子が臨む成膜面上の部位を中心とする半円周上での−80°から80°の角度範囲であり、前記一定の角度間隔が5°であることを特徴としている。 To achieve the above object, an electrode substrate film according to the present invention is an electrode substrate film in which a laminate comprising a metal absorption layer and a metal layer is formed on at least one surface of a resin film substrate, When diffuse reflected light when incident from an irradiation element fixed at a predetermined incident light angle with respect to an arbitrary part on the film formation surface is received by a light receiving element whose light receiving angle moves at regular angular intervals, The b * value in the L * a * b * color system of the diffusely reflected light received in the L * a * b * color system is in the range of −15 to 0 except for the angular position that is behind the irradiation element and the angular position where the specular reflection component is received. The diffuse reflected light when incident from an irradiation element whose incident light angle moves at a certain angular interval with respect to an arbitrary part on the film formation surface of the electrode substrate film is fixed at a predetermined light receiving angle. Receive light The b * value in the L * a * b * color system of the diffuse reflected light is −15 to 0 except for the angular position behind the light receiving element and the angular position where the specular reflection component is received. range near is, when the 0 ° direction perpendicular to the deposition surface of the electrode substrate film, wherein a predetermined angle of incident light is -45 °, the predetermined light receiving angle is 45 °, the light receiving The movement range of the element is from −80 ° to 80 ° on the semicircular center around the irradiated portion on the plane perpendicular to the film formation surface and including the optical path of the incident light from the fixed irradiation element. The irradiation element moves within a range perpendicular to the film forming surface and includes a light receiving optical path to the fixed light receiving element. An angular range of −80 ° to 80 ° on the semicircular circumference as the center, and the constant angular interval Is 5 ° .

本発明によれば、輝度の高い照明灯等の映り込みを避けるためにパネル面を若干傾けて使用する場合においても、格子状電極の正反射成分近傍の拡散光成分がほぼ黒色として視認されるタッチパネルを提供することができる。   According to the present invention, the diffused light component in the vicinity of the regular reflection component of the grid-like electrode is visually recognized as almost black even when the panel surface is slightly tilted to avoid the reflection of a high-intensity illumination lamp or the like. A touch panel can be provided.

本発明の一具体例の電極基板フィルムの断面図である。It is sectional drawing of the electrode substrate film of one specific example of this invention. 図1の電極基板フィルムをパターニング加工して得た格子状電極基板フィルムの断面図である。It is sectional drawing of the grid | lattice-like electrode substrate film obtained by patterning the electrode substrate film of FIG. 電極基板フィルムに対して照射素子から入射光角度を固定したまま照射し、その拡散反射光を受光素子の受光角度を変化させて測定する方法を示す正面図である。It is a front view which shows the method of irradiating with a fixed incident light angle from an irradiation element with respect to an electrode substrate film, and measuring the diffuse reflection light by changing the light reception angle of a light receiving element. 電極基板フィルムに対して照射素子から入射光角度を変化させながら照射し、その拡散反射光を受光素子の受光角度を固定したまま測定する方法を示す正面図である。It is a front view which shows the method of irradiating an electrode substrate film, changing an incident light angle from an irradiation element, and measuring the diffuse reflection light, fixing the light reception angle of a light receiving element. 図3に示す方法で実施例のサンプルA(a)及びサンプルB(b)の電極基板フィルムをそれぞれ測定したときの拡散反射光のL*a*b*表色系におけるa*値及びb*値を、横軸を受光角度にしてプロット示したグラフである。The a * value and b * in the L * a * b * color system of diffuse reflected light when the electrode substrate films of Sample A (a) and Sample B (b) of the example were measured by the method shown in FIG. It is the graph which plotted the value by making a horizontal axis the light reception angle. 図4に示す方法で実施例のサンプルA(a)及びサンプルB(b)の電極基板フィルムをそれぞれ測定したときの拡散反射光のL*a*b*表色系におけるa*値及びb*値を、横軸を入射光角度にしてプロット示したグラフである。The a * value and b * in the L * a * b * color system of diffuse reflected light when the electrode substrate films of Sample A (a) and Sample B (b) of the example were measured by the method shown in FIG. It is the graph which plotted the value by making a horizontal axis into incident light angle.

以下、本発明の一具体例の電極基板フィルムについて図1を参照しながら詳細に説明する。この本発明の一具体例の電極基板フィルムは、樹脂フィルム基板50と、その両面にスパッタリング法などの真空成膜法により成膜された第1金属吸収層51と、その上に同様の成膜法で成膜された薄膜金属層52と、その上に湿式めっき法により成膜された厚膜金属層53と、その上にスパッタリング法などの真空成膜法又は湿式めっき法で成膜された最表面の第2金属吸収層54とから構成される。   Hereinafter, the electrode substrate film of one specific example of the present invention will be described in detail with reference to FIG. The electrode substrate film of one specific example of the present invention includes a resin film substrate 50, a first metal absorption layer 51 formed on both surfaces thereof by a vacuum film formation method such as a sputtering method, and a similar film formation thereon. The thin film metal layer 52 formed by the method, the thick metal layer 53 formed by the wet plating method thereon, and the vacuum metal film method such as the sputtering method or the wet plating method formed thereon. It is comprised from the 2nd metal absorption layer 54 of the outermost surface.

上記の樹脂フィルム基板50の材質としては特に限定はないが、ポリエチレンテレフタレート(PET)、ポリエーテルスルフォン(PES)、ポリアリレート(PAR)、ポリカーボネート(PC)、ポリオレフィン(PO)、トリアセチルセルロース(TAC)、及びノルボルネンなどの樹脂材料群の中から選択された樹脂フィルム単体、又はこの樹脂フィルム単体の片面又は両面をアクリル系有機膜で覆ってなる複合体が好ましい。ノルボルネンの場合は、代表的なものとして、日本ゼオン社のゼオノア(商品名)やJSR社のアートン(商品名)を挙げることができる。本発明の一具体例の電極基板フィルムはタッチパネルとして使用するため、上記樹脂フィルム基板の材質の中では可視波長領域での透明性に優れるものが望ましい。   The material of the resin film substrate 50 is not particularly limited, but polyethylene terephthalate (PET), polyethersulfone (PES), polyarylate (PAR), polycarbonate (PC), polyolefin (PO), triacetyl cellulose (TAC) ) And a resin material selected from the group of resin materials such as norbornene, or a composite comprising one or both sides of this resin film alone covered with an acrylic organic film is preferable. In the case of norbornene, representative examples include ZEONOR (trade name) of ZEON Corporation and ARTON (trade name) of JSR Corporation. Since the electrode substrate film of one specific example of the present invention is used as a touch panel, it is desirable that the resin film substrate is excellent in transparency in the visible wavelength region.

第1金属吸収層51は、上記金属層及び金属吸収層をパターニング加工して格子状電極を形成した時に、反対側の積層膜の裏面が樹脂フィルム基板越しに視認されにくくする役割を担う。また、薄膜金属層52は、後工程の湿式めっきの際に電極としての役割を担う。上記の厚膜金属層53や第2金属吸収層54の成膜で使用する湿式めっきでは、めっき液への添加剤や印加電流を変えることにより表面粗さを調整することができ、これにより反射率を低減させることが可能になる。   The 1st metal absorption layer 51 plays the role which makes the back surface of the opposite laminated film difficult to be visually recognized through a resin film board | substrate when patterning the said metal layer and a metal absorption layer, and forming a grid | lattice-like electrode. In addition, the thin metal layer 52 serves as an electrode in the subsequent wet plating. In the wet plating used in the formation of the thick metal layer 53 and the second metal absorption layer 54, the surface roughness can be adjusted by changing the additive and applied current to the plating solution. The rate can be reduced.

第1及び第2金属吸収層51、54の材料は、Ni単体又はNiにTi、Al、V、W、Ta、Si、Cr、Ag、Mo、Cu、及びZnからなる群から選ばれる1種以上の元素が添加されたNi系合金を採用するか、あるいはCu単体又はCuにTi、Al、V、W、Ta、Si、Cr、Ag、Mo、Ni、及びZnからなる群から選ばれる1種以上の元素が添加されたCu系合金を採用するのが好ましい。一方、薄膜及び厚膜金属層52、53はCu単体又はCuにTi、Al、V、W、Ta、Si、Cr、Ag、Mo、Ni、及びZnからなる群から選ばれる1種以上の元素が添加されたCu系合金を採用するのが好ましい。   The material of the first and second metal absorption layers 51 and 54 is one kind selected from the group consisting of Ni alone or Ni and Ti, Al, V, W, Ta, Si, Cr, Ag, Mo, Cu, and Zn. A Ni-based alloy to which the above elements are added is adopted, or Cu is selected from the group consisting of Ti, Al, V, W, Ta, Si, Cr, Ag, Mo, Ni, and Zn on Cu alone or Cu. It is preferable to employ a Cu-based alloy to which more than one element is added. On the other hand, the thin and thick metal layers 52 and 53 are made of Cu alone or one or more elements selected from the group consisting of Ti, Al, V, W, Ta, Si, Cr, Ag, Mo, Ni and Zn on Cu. It is preferable to employ a Cu-based alloy to which is added.

なお、樹脂フィルム基板の片面側にのみ上記順序で第1及び第2金属吸収層並びに薄膜及び厚膜金属層を積層する場合は、成膜後であっても樹脂フィルム基板側から第1金属吸収層の分光光学特性を測定することが可能である。しかし、図1に示すように、樹脂フィルム基板の両面に上記順序で第1及び第2金属吸収層並びに薄膜及び厚膜金属層を積層する場合は、成膜後に第1金属吸収層の分光光学特性を測定するのは不可能である。   In addition, when laminating the first and second metal absorption layers, the thin film, and the thick film metal layer in the above order only on one side of the resin film substrate, the first metal absorption is performed from the resin film substrate side even after film formation. It is possible to measure the spectroscopic properties of the layer. However, as shown in FIG. 1, when the first and second metal absorption layers, the thin film, and the thick metal layer are laminated on the both sides of the resin film substrate in the above order, the spectroscopic optics of the first metal absorption layer after the film formation is formed. It is impossible to measure properties.

上記の方法で作製した第1及び第2金属吸収層並びに薄膜及び厚膜金属層からなる積層体を有する図1に示すような電極基板フィルムに対して、タッチパネル用のストライプ状又は格子状の電極(配線)パターンが形成されるようにパターニング加工することにより、図2に示すようなタッチパネル用の電極を作製することができる。   Striped or grid-like electrodes for a touch panel with respect to the electrode substrate film as shown in FIG. 1 having the laminate composed of the first and second metal absorption layers and the thin film and the thick film metal layer produced by the above method. By patterning so that a (wiring) pattern is formed, an electrode for a touch panel as shown in FIG. 2 can be produced.

すなわち、この図2に示す格子状電極は、樹脂フィルム基板50の両面に各々パターニングされた積層体が設けられており、この積層体は、第1金属吸収層51a、薄膜金属層52a、厚膜金属層53a、及び第2金属吸収層54aがこの順に積層された構造になっている。このパターニングされた電極(配線)は、図1に示す電極基板フィルムの積層構造を維持しているので、図1の電極基板フィルムの後述する光学的特性と同様の特性を有している。そのため、青みを生ずることなく可視波長領域の反射率が略均質に抑えられており、よって配線幅を5μm程度にしても肉眼ではほとんど見えない。   That is, the grid electrode shown in FIG. 2 is provided with a laminated body that is patterned on both surfaces of the resin film substrate 50. The laminated body includes a first metal absorption layer 51a, a thin metal layer 52a, a thick film. The metal layer 53a and the second metal absorption layer 54a are stacked in this order. Since this patterned electrode (wiring) maintains the laminated structure of the electrode substrate film shown in FIG. 1, it has the same characteristics as the optical properties described later of the electrode substrate film of FIG. For this reason, the reflectance in the visible wavelength region is suppressed almost uniformly without causing bluishness. Therefore, even if the wiring width is about 5 μm, it is hardly visible to the naked eye.

上記の電極配線のパターニング加工法については限定がなく、公知のサブトラクティブ法を用いることができる。サブトラクティブ法は、上記積層体の表面にフォトレジスト膜を塗布し、所望の配線パターンと同じパターンを有するフォトレジスト膜が残存するように露光及び現像を行った後、残存するフォトレジスト膜で覆われていない積層体の露出箇所に対して塩化第二鉄水溶液や塩化第二銅水溶液等のエッチング液を用いて化学エッチングすることにより、配線パターンを形成する方法である。   There is no limitation about the patterning method of said electrode wiring, A well-known subtractive method can be used. In the subtractive method, a photoresist film is applied to the surface of the laminate, and after exposure and development so that a photoresist film having the same pattern as a desired wiring pattern remains, the photoresist film is covered with the remaining photoresist film. In this method, a wiring pattern is formed by chemically etching an exposed portion of the laminated body using an etching solution such as a ferric chloride aqueous solution or a cupric chloride aqueous solution.

(3)L*a*b*表色系の測定
上記の積層構造を有する本発明の一具体例の電極基板フィルムは、該電極基板フィルムの成膜面上の任意の部位に対して所定の入射光角度に固定した照射素子から入射したときの拡散反射光を、一定の角度間隔おきに受光角度が移動する受光素子で受光したとき、該照射素子の陰になる角度位置と正反射成分が受光される角度位置とを除いて該受光した拡散反射光のL*a*b*表色系におけるb*値が−15から0の範囲にあるか、あるいは該電極基板フィルムの成膜面上の任意の部位に対して一定の角度間隔おきに入射光角度が移動する照射素子から入射したときの拡散反射光を、所定の受光角度に固定した受光素子で受光したとき、該受光素子の陰になる角度位置と正反射成分が受光される角度位置とを除いて該受光した拡散反射光のL*a*b*表色系におけるb*値が−15から0の範囲にある。
(3) Measurement of L * a * b * color system The electrode substrate film of one specific example of the present invention having the above laminated structure has a predetermined structure with respect to an arbitrary portion on the film formation surface of the electrode substrate film. When diffusely reflected light when incident from an irradiation element fixed at an incident light angle is received by a light receiving element whose light receiving angle moves at regular angular intervals, the angular position and the specular reflection component that are shaded by the irradiation element are The b * value in the L * a * b * color system of the received diffuse reflected light, excluding the received angular position, is in the range of -15 to 0, or on the film formation surface of the electrode substrate film When diffusely reflected light received from an illuminating element whose incident light angle moves at a certain angular interval with respect to any part of the light is received by a light receiving element fixed at a predetermined light receiving angle, And the angular position where the specular reflection component is received The b * value in the L * a * b * color system of the received diffuse reflected light is in the range of −15 to 0 except for.

より具体的に説明すると、本発明の一具体例の電極基板フィルムは、図3に示す第1の測定方法と図4に示す第2の測定方法の2種類の測定方法で測定した拡散反射光のL*a*b*表色系におけるb*値を規定するものである。図3に示す第1の測定方法では、該電極基板フィルムの成膜面に垂直な方向(法線)を0°として、該電極基板フィルムの成膜面上の任意の部位に対して入射光角度を例えば−45°に固定した照射素子11から入射したときの拡散反射光を、受光素子12の受光角度を例えば−80°から80°まで一定の角度間隔おきに変えながら受光する。なお、この図3の測定方法では、受光素子12は上記成膜面に垂直で且つ固定した照射素子11からの入射光の光路11aを含む面上において、照射される部位を中心とする半円周上を移動することになる。   More specifically, the electrode substrate film of one specific example of the present invention has diffuse reflection light measured by two types of measurement methods, the first measurement method shown in FIG. 3 and the second measurement method shown in FIG. This defines the b * value in the L * a * b * color system. In the first measurement method shown in FIG. 3, the incident light is incident on an arbitrary part on the film formation surface of the electrode substrate film with the direction (normal line) perpendicular to the film formation surface of the electrode substrate film being 0 °. Diffuse reflected light when incident from the irradiation element 11 whose angle is fixed at −45 °, for example, is received while changing the light reception angle of the light receiving element 12 from −80 ° to 80 ° at regular angular intervals. In the measuring method of FIG. 3, the light receiving element 12 is a semicircle centered on the irradiated portion on the surface perpendicular to the film formation surface and including the optical path 11a of the incident light from the irradiation element 11 fixed. It will move on the circumference.

上記の測定の際、照射素子11の大きさと一定の角度間隔おきに移動させる受光素子12の角度間隔によるが、例えば受光素子12を5°おきに移動させる場合は、照射素子11の陰になる−45°とその前後の−40°及び−50°では受光できない。また、フラットパネルディスプレイを使用する時は、パネル面に照明灯等が映り込むのを避けるため、パネル面を意図的に傾けて正反射成分とその近傍の成分とを見ないようにすることが多いため、正反射成分45°とその前後の40°及び50°は評価に含んでいない。   In the above measurement, depending on the size of the irradiation element 11 and the angular interval of the light receiving element 12 that is moved at regular angular intervals, for example, when the light receiving element 12 is moved every 5 °, it is behind the irradiation element 11. Light cannot be received at −45 ° and before and after that at −40 ° and −50 °. In addition, when using a flat panel display, it is necessary to intentionally tilt the panel surface so that the specular reflection component and its nearby components are not seen in order to avoid illumination lamps, etc. appearing on the panel surface. Therefore, the specular reflection component 45 ° and the front and rear 40 ° and 50 ° are not included in the evaluation.

一方、図4に示す第2の測定方法では、該電極基板フィルムの表面に垂直な方向(法線)を0°として、該電極基板フィルムの成膜面上の任意の部位に対して照射素子21からの入射光角度を例えば−80°から80°まで一定の角度間隔おきに変えながら入射したときの拡散反射光を、例えば45°の受光角度に固定した受光素子22で受光する。なお、この図4の測定方法では、照射素子21は上記成膜面に垂直で且つ固定した受光素子22への受光光路22aを含む面上において、該受光素子22が臨む成膜面上の部位を中心とする半円周上を移動することになる。   On the other hand, in the second measuring method shown in FIG. 4, an irradiation element is applied to an arbitrary part on the film formation surface of the electrode substrate film with the direction (normal line) perpendicular to the surface of the electrode substrate film being 0 °. Diffuse reflected light when incident while changing the incident light angle from 21 at a constant angular interval from −80 ° to 80 °, for example, is received by the light receiving element 22 fixed at a light receiving angle of 45 °, for example. In the measurement method of FIG. 4, the irradiation element 21 is a part on the film-forming surface that the light-receiving element 22 faces on the surface that is perpendicular to the film-forming surface and includes the light-receiving optical path 22a to the light-receiving element 22 that is fixed. It moves on a semicircle centered on.

その際、受光素子22の大きさと一定の角度間隔おきに移動させる受光素子21の角度間隔によるが、例えば照射素子21を5°おきに移動させる場合は、受光素子22の陰になる45°とその前後の40°及び50°では照射はできない。また、フラットパネルディスプレイを使用する時は、パネル面に照明灯等が映り込むのを避けるため、パネル面を意図的に傾けて正反射成分とその近傍の成分とを見ないようにすることが多いため、正反射成分−45°とその前後の−40°及び−50°は評価に含んでいない。   At that time, depending on the size of the light receiving element 22 and the angular interval of the light receiving element 21 moved at regular angular intervals, for example, when the irradiation element 21 is moved every 5 °, it is 45 ° which is the shadow of the light receiving element 22. Irradiation is not possible at 40 ° and 50 ° before and after that. In addition, when using a flat panel display, it is necessary to intentionally tilt the panel surface so that the specular reflection component and its nearby components are not seen in order to avoid illumination lamps, etc. appearing on the panel surface. For this reason, the specular reflection component of −45 ° and −40 ° and −50 ° before and after the specular reflection component are not included in the evaluation.

本発明の一具体例の電極基板フィルムは、上記の第1及び第2の測定方法で測定した拡散反射光のL*a*b*表示系におけるb*値が−15から0の範囲内にあることを要件としている。その理由は、本発明の一具体例の電極基板フィルムを格子状電極に加工した後、タッチパネルとして使用する場合、高輝度物体の映り込みを避けるためにパネル面を少し傾けて見ることが多いため、正反射成分及びその近傍を除いた拡散反射光成分のL*a*b*表色系におけるb*値が−15より小さくなると、パネル面を見た時の色調が青くなるので好ましくない。逆にb*値が0より大きくなると、パネル面を見た時の色調が黄色になるので好ましくない。   In the electrode substrate film of one specific example of the present invention, the b * value in the L * a * b * display system of diffuse reflected light measured by the first and second measuring methods is within a range of −15 to 0. There is a requirement. The reason for this is that when the electrode substrate film of one embodiment of the present invention is processed into a grid electrode and then used as a touch panel, the panel surface is often tilted slightly to avoid reflection of a high-brightness object. When the b * value in the L * a * b * color system of the diffuse reflection light component excluding the regular reflection component and its vicinity is smaller than −15, the color tone when viewing the panel surface becomes blue, which is not preferable. Conversely, if the b * value is greater than 0, the color tone when viewing the panel surface is yellow, which is not preferable.

拡散反射光成分のL*a*b*表色系におけるb*値が上記の範囲を外れる場合は、成膜条件を調整するのが好ましい。すなわち、高輝度物体の映り込みは、スネルの法則による正反射成分であり、界面が完全に鏡面(平坦)ならば正反射以外の成分はないが、実際には樹脂フィルム基板と金属吸収層の界面、金属層と金属吸収層の界面、金属吸収層と媒質の界面の表面粗さに起因する散乱成分がある。これらの中で散乱に最も大きく影響するのは、金属層と金属吸収層との界面の粗さであり、これらの層は湿式めっき法で成膜される。湿式めっき法では添加剤や印加電流により表面粗度を制御することができるので、上記の拡散反射光のL*a*b*表示系におけるb*値の結果に基づいて湿式めっき工程で使用する添加剤や印加電流を調整すればよい。   When the b * value in the L * a * b * color system of the diffuse reflected light component is out of the above range, it is preferable to adjust the film forming conditions. In other words, the reflection of a high-brightness object is a regular reflection component according to Snell's law, and if the interface is perfectly mirror (flat), there is no component other than regular reflection, but actually the resin film substrate and the metal absorption layer There are scattering components due to the surface roughness of the interface, the interface between the metal layer and the metal absorption layer, and the interface between the metal absorption layer and the medium. Among these, the largest influence on scattering is the roughness of the interface between the metal layer and the metal absorption layer, and these layers are formed by a wet plating method. In the wet plating method, the surface roughness can be controlled by an additive or an applied current. Therefore, the wet plating method is used in the wet plating step based on the result of the b * value in the L * a * b * display system of the diffuse reflection light. What is necessary is just to adjust an additive and an applied electric current.

具体的には、電極基板フィルムを上記方法で測定したときの拡散反射光のL*a*b*表色系におけるb*値が−15より小さくなる場合は、印加電流値を下げて最表面の金属吸収膜を薄くすればよい。逆にこのb*値が0より大きくなる場合は、印加電流値を上げて最表面の金属吸収膜を厚くすればよい。従って、この測定を検査工程として製造後に行うことによって、電極基板フィルムの品質のばらつきを抑えることができる。なお、一般的に表面粗度を荒くし過ぎると、散乱成分は増加し正反射成分は低下していわゆる艶消し色になるが、その散乱成分が青っぽく見えてしまうことがある。   Specifically, when the b * value in the L * a * b * color system of diffuse reflected light when the electrode substrate film is measured by the above method is smaller than −15, the applied current value is lowered to reduce the outermost surface. The metal absorption film may be thinned. Conversely, if this b * value is greater than 0, the applied current value may be increased to thicken the outermost metal absorption film. Therefore, by performing this measurement as an inspection process after manufacturing, variations in the quality of the electrode substrate film can be suppressed. In general, if the surface roughness is too rough, the scattering component increases and the specular reflection component decreases to a so-called matte color, but the scattering component may appear bluish.

このように、本発明の電極基板フィルムは、所定の条件で受光した拡散反射光のL*a*b*表色系におけるb*値を−15から0の範囲内に規定することで、パターニング加工後にパネル面を傾けて見ても青みや黄色みを感じることがなくほぼ均一な黒色を呈するようになる。よって、色味のばらつきの少ない高品質の電極基板フィルムを提供することができる。   As described above, the electrode substrate film of the present invention is patterned by defining the b * value in the L * a * b * color system of diffuse reflected light received under a predetermined condition within the range of −15 to 0. Even if the panel surface is tilted after processing, it does not feel bluish or yellowish, and becomes almost uniform black. Therefore, a high quality electrode substrate film with little variation in color can be provided.

図1に示すような、樹脂フィルム基板50の両面に積層体が設けられた電極基板フィルムを作製し、一定の角度間隔で移動可能な照射素子及び受光素子を備えた測定器を用いて電極基板フィルムの成膜面に光を照射してその拡散反射光を測定し、そのL*a*b*表色系におけるa*値及びb*値を求めた後、パターニング加工を行って表面の色調について目視にて検査を行った。なお、本発明は以下の実施例には何ら限定されるものではない。   As shown in FIG. 1, an electrode substrate film in which a laminate is provided on both surfaces of a resin film substrate 50 is manufactured, and an electrode substrate is used using a measuring instrument equipped with an irradiation element and a light receiving element that can move at a constant angular interval. The film surface is irradiated with light, its diffuse reflection light is measured, the a * value and b * value in the L * a * b * color system are obtained, and then patterning is performed to obtain the color tone of the surface. Was visually inspected. The present invention is not limited to the following examples.

具体的に説明すると、樹脂フィルム基板50として、幅600mm×長さ1200mのPETフィルムを2つ用意し、各々、連続的に乾式めっきを行うことが可能なスパッタリングウェブコータを用いて、該PETフィルムの表面に第1金属吸収層51として膜厚200nmのNi−Cu層を成膜した後、その上に薄膜金属層52として膜厚800nmのCu層を成膜し、同様に裏面にも第1金属吸収層51として膜厚200nmのNi−Cu層と薄膜金属層52として膜厚800nmのCu層とを成膜した。このNi−Cu層のスパッタリング成膜時には、酸素を導入した反応性スパッタリング法により黒色膜が得られるようにした。これにより、当該Ni−Cu層の反射率が下がるため、後述する格子状電極形成のためのパターニング加工後にPET越しに裏側の積層体を見えにくくすることができた。   Specifically, two PET films having a width of 600 mm and a length of 1200 m are prepared as the resin film substrate 50, and each of the PET films is used by using a sputtering web coater capable of continuously performing dry plating. After forming a Ni—Cu layer with a thickness of 200 nm as the first metal absorption layer 51 on the surface, a Cu layer with a thickness of 800 nm is formed as the thin metal layer 52 on the first metal absorption layer 51. A 200 nm thick Ni—Cu layer as the metal absorbing layer 51 and a 800 nm thick Cu layer as the thin metal layer 52 were formed. When the Ni—Cu layer was formed by sputtering, a black film was obtained by a reactive sputtering method in which oxygen was introduced. Thereby, since the reflectance of the Ni—Cu layer is lowered, it was possible to make it difficult to see the laminated body on the back side through the PET after patterning processing for forming a grid electrode described later.

次に、湿式めっき法により厚膜金属層53として膜厚2000nmのCu層を成膜した。この湿式めっき法では、上記乾式めっきで成膜した2つのPETフィルムに対して、それぞれ異なる印加電流でめっきすることで表面粗さRa15nmのサンプルAと25nmのサンプルBを得た。これら両サンプルの各々に対して、再度スパッタリングウェブコータを用いて第2金属吸収層54として膜厚200nmのNi−Cu層を両面に成膜した。このNi−Cu層のスパッタリング成膜時には、酸素を導入した反応性スパッタリング法により黒色膜が得られるようにした。これにより、当該Ni−Cu層の反射率が下がるため、後述する格子状電極形成のためのパターニング加工後に表面から積層体を見えにくくすることができた。   Next, a Cu layer having a thickness of 2000 nm was formed as the thick metal layer 53 by a wet plating method. In this wet plating method, two PET films formed by dry plating were plated with different applied currents to obtain Sample A with a surface roughness Ra of 15 nm and Sample B with a thickness of 25 nm. For each of these samples, a Ni—Cu layer having a thickness of 200 nm was formed on both surfaces as the second metal absorption layer 54 using a sputtering web coater again. When the Ni—Cu layer was formed by sputtering, a black film was obtained by a reactive sputtering method in which oxygen was introduced. Thereby, since the reflectance of the said Ni-Cu layer falls, it was made difficult to see a laminated body from the surface after the patterning process for grid | lattice electrode formation mentioned later.

上記にて作製したサンプルA及びBの電極基板フィルムの各々に対して、株式会社村上色彩技術研究所製の変角分光測色システムGCMS−4を用いて拡散反射光のL*a*b*表色系におけるa*値及びb*値を測定した。具体的には、先ず図3に示すように、各サンプルに対して入射光角度が−45°となるように照射素子を固定して照射すると共に、その拡散反射光を受光角度が−80°から80°まで5°間隔で変わるように受光素子を移動させて受光した。その際、照射素子の陰になる−50°、−45°、及び−40°は受光できず、正反射成分及びその近傍の40°、45°、及び50°は、パネル面での映り込みを避けるため意図的に傾けることで外されるので、評価に含めなかった。また、測定波長間隔はJIS Z8722に準じて10nmとした。   For each of the electrode substrate films of Samples A and B produced above, diffuse reflected light L * a * b * using the variable angle spectrocolorimetry system GCMS-4 manufactured by Murakami Color Research Laboratory Co., Ltd. The a * value and b * value in the color system were measured. Specifically, as shown in FIG. 3, first, the irradiation element is fixed and irradiated so that the incident light angle is −45 ° to each sample, and the diffuse reflection light is received at an angle of −80 °. The light-receiving element was moved so as to change at intervals of 5 ° from 80 ° to 80 °. At that time, −50 °, −45 °, and −40 °, which are shaded by the irradiation element, cannot receive light, and the specular reflection component and its neighboring 40 °, 45 °, and 50 ° are reflected on the panel surface. It was not included in the evaluation because it was removed by deliberately tilting to avoid. The measurement wavelength interval was 10 nm according to JIS Z8722.

次に、図4に示すように、各サンプルに対して入射光角度が80°から80°まで5°間隔で変わるように照射素子を移動させながら照射し、受光角度45°で固定した受光素子でその拡散反射光を受光した。その際、受光素子の陰になる40°、45°、及び50°は測定できず、正反射成分になる−40°、−45°、及び−50°はタッチパネルの映り込みを意図的避けて傾けるために評価に含めなかった。また、測定波長間隔はJIS Z8722に準じて10nmとした。   Next, as shown in FIG. 4, the light receiving element is fixed at a light receiving angle of 45 ° by irradiating each sample while moving the irradiation element so that the incident light angle changes at intervals of 5 ° from 80 ° to 80 °. The diffuse reflected light was received at. At that time, 40 °, 45 °, and 50 °, which are shaded by the light receiving element, cannot be measured, and −40 °, −45 °, and −50 °, which are specular reflection components, intentionally avoid reflection of the touch panel. Not included in the evaluation to tilt. The measurement wavelength interval was 10 nm according to JIS Z8722.

上記の図3の測定方法で測定した表面粗さRa15nmのサンプルA及びRa25nmのサンプルBのa*値とb*値とを横軸を受光角度としてプロットしたグラフをそれぞれ図5(a)及び図5(b)に示す。これら図から分かるように、a*値はサンプルAとサンプルBでほとんど差異がないが、b*値については、サンプルAは本発明の要件を満たしているのに対して表面粗さが大きいサンプルBは−15より小さくなっている。   Graphs in which the a * value and b * value of sample A with surface roughness Ra 15 nm and sample B with Ra 25 nm measured by the measurement method of FIG. 3 are plotted with the horizontal axis as the light receiving angle are shown in FIG. Shown in 5 (b). As can be seen from these figures, there is almost no difference in the a * value between sample A and sample B, but with respect to the b * value, sample A satisfies the requirements of the present invention, but the sample has a large surface roughness. B is smaller than −15.

また、図4の測定方法で測定した表面粗さRa15nmのサンプルA及びRa25nmのサンプルBのa*値とb*値とを横軸を入射光角度としてプロットしたグラフをそれぞれ図6(a)及び図6(b)に示す。これら図から分かるように、a*値はサンプルAとサンプルBでほとんど差異がないが、b*値については、サンプルAは本発明の要件を満たしているのに対して表面粗さが大きいサンプルBは−15より小さくなっている。   Further, graphs in which the a * value and the b * value of the sample A having a surface roughness Ra of 15 nm and the sample B having a surface roughness Ra of 25 nm measured by the measurement method of FIG. As shown in FIG. As can be seen from these figures, there is almost no difference in the a * value between sample A and sample B, but with respect to the b * value, sample A satisfies the requirements of the present invention, but the sample has a large surface roughness. B is smaller than −15.

次に、これら両サンプルの電極基板フィルムを、タッチパネルとして使用する場合を考慮して格子状電極にパターニング加工した。これら両サンプルを高輝度物体の映り込み避けるために少し傾けたとき、サンプルAは正反射成分近傍の色調には特に問題がなかったが、サンプルBでは正反射成分近傍の色が青みがかっていた。これは、サンプルBはL*a*b*表色系におけるb*値が−15より小さいためであると考えられる。   Next, the electrode substrate films of both samples were patterned into a grid electrode in consideration of the case where the electrode substrate film was used as a touch panel. When these two samples were slightly tilted to avoid the reflection of a high-luminance object, Sample A had no particular problem with the color tone near the regular reflection component, but Sample B had a bluish color near the regular reflection component. This is presumably because Sample B has a b * value smaller than −15 in the L * a * b * color system.

以上のことから、入射光角度を固定して受光角度を可変にする場合、又は受光角度を固定して入射光角度を可変にする場合のいずれにおいても、正反射領域と測定不能領域を除いた拡散反射光のL*a*b*表色系におけるb*値が−15より小さくなると、パターニング加工後のパネル面を傾けて見た時に青く感じるので、最表面の金属吸収層の下に設けるCu層を湿式めっきで成膜する時には表面粗さを適宜調整して、上記b*値が−15より小さくならないようにする必要があることが分かる。   From the above, the regular reflection area and the non-measurable area are excluded in both cases where the incident light angle is fixed and the light reception angle is variable, or where the light reception angle is fixed and the incident light angle is variable. If the b * value in the L * a * b * color system of diffuse reflected light is smaller than −15, the panel surface after patterning will feel blue when tilted, so it is provided under the outermost metal absorption layer. It can be seen that when the Cu layer is formed by wet plating, it is necessary to adjust the surface roughness appropriately so that the b * value does not become smaller than −15.

11、21 照射素子
12、22 受光素子
11a 入射光の光路
22a 受光の光路
50 樹脂フィルム基板
51、51a 第1金属吸収層
52、52a 薄膜金属層
53、53a 厚膜金属層
54、54a 第2金属吸収層


DESCRIPTION OF SYMBOLS 11, 21 Irradiation element 12, 22 Light receiving element 11a Optical path of incident light 22a Optical path of light reception 50 Resin film substrate 51, 51a First metal absorption layer 52, 52a Thin metal layer 53, 53a Thick metal layer 54, 54a Second metal Absorption layer


Claims (10)

樹脂フィルム基板の少なくとも片面に金属吸収層及び金属層から成る積層体が成膜された電極基板フィルムであって、
該電極基板フィルムの成膜面上の任意の部位に対して所定の入射光角度に固定した照射素子から入射したときの拡散反射光を、一定の角度間隔おきに受光角度が移動する受光素子で受光したとき、該照射素子の陰になる角度位置と正反射成分が受光される角度位置とを除いて該受光した拡散反射光のL*a*b*表色系におけるb*値が−15から0の範囲にあるか、
あるいは該電極基板フィルムの成膜面上の任意の部位に対して一定の角度間隔おきに入射光角度が移動する照射素子から入射したときの拡散反射光を、所定の受光角度に固定した受光素子で受光したとき、該受光素子の陰になる角度位置と正反射成分が受光される角度位置とを除いて該拡散反射光のL*a*b*表色系におけるb*値が−15から0の範囲にあり、
前記電極基板フィルムの成膜面に垂直な方向を0°としたとき、前記所定の入射光角度が−45°であり、前記所定の受光角度が45°であり、前記受光素子の移動範囲は、前記成膜面に垂直で且つ前記固定した照射素子からの入射光の光路を含む面上において、照射される部位を中心とする半円周上での−80°から80°の角度範囲であり、前記照射素子の移動範囲は、前記成膜面に垂直で且つ前記固定した受光素子への受光光路を含む面上において、該受光素子が臨む成膜面上の部位を中心とする半円周上での−80°から80°の角度範囲であり、前記一定の角度間隔が5°であることを特徴とする電極基板フィルム。
An electrode substrate film in which a laminate comprising a metal absorption layer and a metal layer is formed on at least one surface of a resin film substrate,
Diffuse reflected light when incident from an irradiation element fixed at a predetermined incident light angle with respect to an arbitrary part on the film formation surface of the electrode substrate film is received by a light receiving element whose light receiving angle moves at regular angular intervals. When the received light is received, the b * value in the L * a * b * color system of the received diffuse reflected light is −15 except for the angular position behind the irradiation element and the angular position where the regular reflection component is received. Or in the range of 0,
Alternatively, a light receiving element in which diffuse reflected light when incident from an irradiation element whose incident light angle moves at a certain angular interval with respect to an arbitrary portion on the film forming surface of the electrode substrate film is fixed at a predetermined light receiving angle The b * value in the L * a * b * color system of the diffusely reflected light is from −15 except for the angular position behind the light receiving element and the angular position where the specular reflection component is received. range near zero is,
When the direction perpendicular to the film formation surface of the electrode substrate film is 0 °, the predetermined incident light angle is −45 °, the predetermined light receiving angle is 45 °, and the movement range of the light receiving element is In an angle range from −80 ° to 80 ° on a semicircular center around the irradiated portion on a surface perpendicular to the film formation surface and including an optical path of incident light from the fixed irradiation element. The moving range of the irradiation element is a semicircle centered on a part on the film formation surface facing the light receiving element on a surface perpendicular to the film formation surface and including a light receiving optical path to the fixed light receiving element. An electrode substrate film having an angular range of −80 ° to 80 ° on the circumference, and wherein the constant angular interval is 5 ° .
前記照射素子の陰になる角度位置が−40°−45°、及び−50°であり、前記照射素子を固定したときの正反射成分が受光される角度位置が40°45°、及び50°であり、前記受光素子の陰になる角度位置が40°45°、及び50°であり、前記受光素子を固定したときの正反射成分が受光される角度位置が−40°−45°、及び−50°であることを特徴とする、請求項に記載の電極基板フィルム。 The angular positions behind the irradiation element are −40 ° −45 ° and −50 °, and the angular positions where the specular reflection component is received when the irradiation element is fixed are 40 ° 45 ° and 50 °. And the angular position behind the light receiving element is 40 ° 45 ° and 50 °, and the angular position where the specular reflection component is received when the light receiving element is fixed is −40 ° -45 °, and The electrode substrate film according to claim 1 , wherein the electrode substrate film is −50 °. 前記電極基板フィルムの最表面層が金属吸収層であることを特徴とする、請求項1又は2に記載の電極基板フィルム。 Wherein the outermost layer of the electrode substrate film is a metal absorber layer, the electrode substrate film according to claim 1 or 2. 前記金属吸収層の材料が、Ni単体若しくはNiにTi、Al、V、W、Ta、Si、Cr、Ag、Mo、Cu、及びZnからなる群から選ばれる1種以上の元素が添加されたNi系合金か、又はCu単体若しくはCuにTi、Al、V、W、Ta、Si、Cr、Ag、Mo、Ni、及びZnからなる群から選ばれる1種以上の元素が添加されたCu系合金であることを特徴とする、請求項1〜のいずれか1項に記載の電極基板フィルム。 As the material of the metal absorption layer, one or more elements selected from the group consisting of Ti, Al, V, W, Ta, Si, Cr, Ag, Mo, Cu, and Zn are added to Ni alone or Ni. Cu alloy in which one or more elements selected from the group consisting of Ti, Al, V, W, Ta, Si, Cr, Ag, Mo, Ni, and Zn are added to Ni alloy or Cu alone or Cu It is an alloy, The electrode substrate film of any one of Claims 1-3 characterized by the above-mentioned. 前記金属層の材料が、Cu単体又はCuにTi、Al、V、W、Ta、Si、Cr、Ag、Mo、Ni、及びZnからなる群から選ばれる1種以上の元素が添加されたCu系合金であることを特徴とする、請求項1〜のいずれか1項に記載の電極基板フィルム。 The material of the metal layer is Cu alone or Cu in which one or more elements selected from the group consisting of Ti, Al, V, W, Ta, Si, Cr, Ag, Mo, Ni, and Zn are added to Cu. characterized in that it is a system alloy, the electrode substrate film according to any one of claims 1-4. 前記金属層が湿式めっき法により形成されることを特徴とする、請求項1〜のいずれか1項に記載の電極基板フィルム。 Wherein said metal layer is formed by a wet plating method, the electrode substrate film according to any one of claims 1-5. 樹脂フィルム基板の少なくとも片面に第1金属吸収層、金属層、及び最表面層の第2金属吸収層から成る積層体がこの順に該樹脂フィルム基板側から成膜された電極基板フィルムであって、A laminate comprising a first metal absorption layer, a metal layer, and a second metal absorption layer of the outermost surface layer on at least one surface of the resin film substrate is an electrode substrate film formed in this order from the resin film substrate side,
該電極基板フィルムの成膜面上の任意の部位に対して所定の入射光角度に固定した照射素子から入射したときの拡散反射光を、一定の角度間隔おきに受光角度が移動する受光素子で受光したとき、該照射素子の陰になる角度位置と正反射成分が受光される角度位置とを除いて該受光した拡散反射光のL*a*b*表色系におけるb*値が−15から0の範囲にあるか、Diffuse reflected light when incident from an irradiation element fixed at a predetermined incident light angle with respect to an arbitrary part on the film formation surface of the electrode substrate film is received by a light receiving element whose light receiving angle moves at regular angular intervals. When the received light is received, the b * value in the L * a * b * color system of the received diffuse reflected light is −15 except for the angular position behind the irradiation element and the angular position where the regular reflection component is received. Or in the range of 0,
あるいは該電極基板フィルムの成膜面上の任意の部位に対して一定の角度間隔おきに入射光角度が移動する照射素子から入射したときの拡散反射光を、所定の受光角度に固定した受光素子で受光したとき、該受光素子の陰になる角度位置と正反射成分が受光される角度位置とを除いて該拡散反射光のL*a*b*表色系におけるb*値が−15から0の範囲にあり、Alternatively, a light receiving element in which diffuse reflected light when incident from an irradiation element whose incident light angle moves at a certain angular interval with respect to an arbitrary portion on the film forming surface of the electrode substrate film is fixed at a predetermined light receiving angle The b * value in the L * a * b * color system of the diffusely reflected light is from −15 except for the angular position behind the light receiving element and the angular position where the specular reflection component is received. In the range of 0,
前記金属層の表面が粗面化されていることを特徴とする電極基板フィルム。An electrode substrate film, wherein a surface of the metal layer is roughened.
樹脂フィルム基板の少なくとも片面に金属吸収層及び金属層から成る積層体が成膜された電極基板フィルムの製造方法であって、
該電極基板フィルムの成膜面上の任意の部位に対して所定の入射光角度に固定した照射素子から入射したときの拡散反射光を、一定の角度間隔おきに受光角度が移動する受光素子で受光したとき、該照射素子の陰になる角度位置と正反射成分が受光される角度位置とを除いて該受光した拡散反射光のL*a*b*表色系におけるb*値が−15から0の範囲内になるように金属層の表面粗さを調整するか、
あるいは該電極基板フィルムの成膜面上の任意の部位に対して一定の角度間隔おきに入射光角度が移動する照射素子から入射したときの拡散反射光を、所定の受光角度に固定した受光素子で受光したとき、該受光素子の陰になる角度位置と正反射成分が受光される角度位置とを除いて該拡散反射光のL*a*b*表色系におけるb*値が−15から0の範囲内になるように金属層の表面粗さを調整することを特徴とする電極基板フィルムの製造方法。
A method for producing an electrode substrate film in which a laminate comprising a metal absorption layer and a metal layer is formed on at least one surface of a resin film substrate,
Diffuse reflected light when incident from an irradiation element fixed at a predetermined incident light angle with respect to an arbitrary part on the film formation surface of the electrode substrate film is received by a light receiving element whose light receiving angle moves at regular angular intervals. When the received light is received, the b * value in the L * a * b * color system of the received diffuse reflected light is −15 except for the angular position behind the irradiation element and the angular position where the regular reflection component is received. To adjust the surface roughness of the metal layer to be in the range of 0 to 0,
Alternatively, a light receiving element in which diffuse reflected light when incident from an irradiation element whose incident light angle moves at a certain angular interval with respect to an arbitrary portion on the film forming surface of the electrode substrate film is fixed at a predetermined light receiving angle The b * value in the L * a * b * color system of the diffusely reflected light is from −15 except for the angular position behind the light receiving element and the angular position where the specular reflection component is received. A method for producing an electrode substrate film, comprising adjusting the surface roughness of a metal layer so as to be within a range of 0.
樹脂フィルム基板の少なくとも片面に金属吸収層及び金属層から成る積層体が成膜された電極基板フィルムの検査方法であって、
該電極基板フィルムの成膜面上の任意の部位に対して所定の入射光角度に固定した照射素子から入射したときの拡散反射光を、一定の角度間隔おきに受光角度が移動する受光素子で受光したとき、該照射素子の陰になる角度位置と正反射成分が受光される角度位置とを除いて該受光した拡散反射光のL*a*b*表色系におけるb*値が−15から0の範囲から外れているか、
あるいは該電極基板フィルムの成膜面上の任意の部位に対して一定の角度間隔おきに入射光角度が移動する照射素子から入射したときの拡散反射光を、所定の受光角度に固定した受光素子で受光したとき、該受光素子の陰になる角度位置と正反射成分が受光される角度位置とを除いて該拡散反射光のL*a*b*表色系におけるb*値が−15から0の範囲から外れている場合に品質上の問題ありと判断するものであり、
前記電極基板フィルムの成膜面に垂直な方向を0°としたとき、前記所定の入射光角度が−45°であり、前記所定の受光角度が45°であり、前記受光素子の移動範囲は、前記成膜面に垂直で且つ前記固定した照射素子からの入射光の光路を含む面上において、照射される部位を中心とする半円周上での−80°から80°の角度範囲であり、前記照射素子の移動範囲は、前記成膜面に垂直で且つ前記固定した受光素子への受光光路を含む面上において、該受光素子が臨む成膜面上の部位を中心とする半円周上での−80°から80°の角度範囲であり、前記一定の角度間隔が5°であることを特徴とする電極基板フィルムの検査方法。
An inspection method for an electrode substrate film in which a laminate comprising a metal absorption layer and a metal layer is formed on at least one surface of a resin film substrate,
Diffuse reflected light when incident from an irradiation element fixed at a predetermined incident light angle with respect to an arbitrary part on the film formation surface of the electrode substrate film is received by a light receiving element whose light receiving angle moves at regular angular intervals. When the received light is received, the b * value in the L * a * b * color system of the received diffuse reflected light is −15 except for the angular position behind the irradiation element and the angular position where the regular reflection component is received. Is outside the range of 0 from
Alternatively, a light receiving element in which diffuse reflected light when incident from an irradiation element whose incident light angle moves at a certain angular interval with respect to an arbitrary portion on the film forming surface of the electrode substrate film is fixed at a predetermined light receiving angle The b * value in the L * a * b * color system of the diffusely reflected light is from −15 except for the angular position behind the light receiving element and the angular position where the specular reflection component is received. It is judged that there is a quality problem when it is out of the range of 0 ,
When the direction perpendicular to the film formation surface of the electrode substrate film is 0 °, the predetermined incident light angle is −45 °, the predetermined light receiving angle is 45 °, and the movement range of the light receiving element is In an angle range from −80 ° to 80 ° on a semicircular center around the irradiated portion on a surface perpendicular to the film formation surface and including an optical path of incident light from the fixed irradiation element. The moving range of the irradiation element is a semicircle centered on a part on the film formation surface facing the light receiving element on a surface perpendicular to the film formation surface and including a light receiving optical path to the fixed light receiving element. An inspection method for an electrode substrate film, characterized in that the angle range is from −80 ° to 80 ° on the circumference, and the constant angular interval is 5 ° .
樹脂フィルム基板の少なくとも片面に第1金属吸収層、金属層、及び最表面層の第2金属吸収層から成る積層体がこの順に該樹脂フィルム基板側から成膜された電極基板フィルムの検査方法であって、A method for inspecting an electrode substrate film in which a laminate comprising a first metal absorption layer, a metal layer, and a second metal absorption layer as an outermost surface layer is formed in this order from the resin film substrate side on at least one surface of the resin film substrate. There,
該電極基板フィルムの成膜面上の任意の部位に対して所定の入射光角度に固定した照射素子から入射したときの拡散反射光を、一定の角度間隔おきに受光角度が移動する受光素子で受光したとき、該照射素子の陰になる角度位置と正反射成分が受光される角度位置とを除いて該受光した拡散反射光のL*a*b*表色系におけるb*値が−15から0の範囲から外れているか、Diffuse reflected light when incident from an irradiation element fixed at a predetermined incident light angle with respect to an arbitrary part on the film formation surface of the electrode substrate film is received by a light receiving element whose light receiving angle moves at regular angular intervals. When the received light is received, the b * value in the L * a * b * color system of the received diffuse reflected light is −15 except for the angular position behind the irradiation element and the angular position where the regular reflection component is received. Is out of range from 0,
あるいは該電極基板フィルムの成膜面上の任意の部位に対して一定の角度間隔おきに入射光角度が移動する照射素子から入射したときの拡散反射光を、所定の受光角度に固定した受光素子で受光したとき、該受光素子の陰になる角度位置と正反射成分が受光される角度位置とを除いて該拡散反射光のL*a*b*表色系におけるb*値が−15から0の範囲から外れている場合に品質上の問題ありと判断するものであり、Alternatively, a light receiving element in which diffuse reflected light when incident from an irradiation element whose incident light angle moves at a certain angular interval with respect to an arbitrary portion on the film forming surface of the electrode substrate film is fixed at a predetermined light receiving angle The b * value in the L * a * b * color system of the diffusely reflected light is from −15 except for the angular position behind the light receiving element and the angular position where the specular reflection component is received. When it is out of the range of 0, it is judged that there is a quality problem,
前記金属層の表面が粗面化されていることを特徴とする電極基板フィルムの検査方法。An inspection method of an electrode substrate film, wherein a surface of the metal layer is roughened.
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