JP2011175628A - Conductive sheet, method for using the same, and capacitance-type touch panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a suitable conductive sheet which can achieve low resistance, can improve visibility and is suitable to be used for a projection type capacitance type touch panel. <P>SOLUTION: A first large grating 16A is formed on a first transparent base substance 14A, a second large grating 16B is formed on a second transparent base substance 14B, the respective first large grating 16A and second large grating 16B are respectively constituted by combining small gratings, a first dummy pattern 20A non-connected to the first large grating 16A is formed around the sides of the first large grating 16A, and a second dummy pattern 20B non-connected to the second large grating 16B is formed around the sides of the second large grating 16B. When seen from the above, the second large grating 16B is arranged adjacently to the first large grating 16A, and a combined pattern by making the first dummy pattern 20A and the second dummy pattern 20B face each other is formed between the first large grating 16A and the second large grating 16B. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a conductive sheet, a method of using the conductive sheet, and a capacitive touch panel, and more particularly to a conductive sheet suitable for use in a projected capacitive touch panel, a method of using the conductive sheet, and a capacitive touch panel.

Recently, the touch panel has attracted attention. In such a touch panel, examples are disclosed in which the electrodes are made of ITO (indium tin oxide) so that the electrodes arranged in a matrix are not conspicuous (see, for example, Patent Documents 1 and 2).
The touch panel is mainly applied to a small size such as a PDA (personal digital assistant) or a mobile phone, but it is considered that the touch panel will be increased in size by being applied to a display for a personal computer.
In such a future trend, since the conventional electrode uses ITO (indium tin oxide), the resistance increases (several hundred ohms / sq.) And the current between the electrodes increases as the application size increases. There is a problem that the transmission speed is slowed down and the response speed (the time from when the fingertip is touched until the position is detected) is slowed down.
Therefore, it is conceivable to reduce the surface resistance by forming an electrode by arranging a large number of grids made of metal fine wires (metal fine wires). For example, Patent Documents 3 to 8 are known as touch panels using metal fine wires as electrodes.

JP 2008-129708 A JP-A-5-224818 US Pat. No. 5,130,041 International Publication No. 95/027334 Pamphlet US Patent Application Publication No. 2004/0239650 US Pat. No. 7,202,859 International Publication No. 97/018508 Pamphlet JP 2003-099185 A

However, when a thin metal wire is used for an electrode, transparency and visibility become a problem because the thin metal wire is made of an opaque material.
The present invention has been made in consideration of such problems, and can reduce the resistance of the conductive pattern and improve the visibility. For example, it is used for a projected capacitive touch panel. It is an object to provide a suitable conductive sheet and a method of using the conductive sheet.
Another object of the present invention is to reduce the resistance of the conductive pattern and to improve the visibility, for example, to cope with an increase in the size of a projected capacitive touch panel. It is an object of the present invention to provide a capacitive touch panel that can be used.

[1] In the conductive sheet according to the first aspect of the present invention, two or more conductive first large lattices of fine metal wires are formed on one main surface of the substrate, and the fine metal wires are formed on the other main surface of the substrate. 2 or more conductive second large lattices are formed, and each of the first large lattices and each of the second large lattices is formed by combining two or more small lattices, and the sides of the first large lattices A first non-connection pattern is formed by a fine metal wire disconnected from the first large lattice around the first large lattice, and a metal disconnected from the second large lattice around the side of the second large lattice. A second non-connection pattern is formed by a thin line, and when viewed from above, the second large lattice is arranged adjacent to the first large lattice, and the first large lattice and the second large lattice Between the first non-connection pattern and the second non-connection pattern facing each other A combination pattern is formed, and the combination pattern is formed by combining two or more small lattices.
[2] In the first aspect of the present invention, the projection distance between the straight line portion on the side of the first large lattice and the straight line portion on the side of the second large lattice is set based on the size of the small lattice. Features.
[3] In the first aspect of the present invention, a distance obtained by projecting the shortest distance between the side of the first large lattice and the side of the second large lattice facing the side onto one main surface of the base body is the combination pattern. When the width of the combination pattern is defined, the width of the combination pattern is one or more times longer than the side of the small lattice.
[4] In the first aspect of the present invention, the width of the combination pattern is twice to ten times the side length of the small lattice.
[5] In the first aspect of the present invention, each of the first non-connection patterns has a shape in which two or more shapes obtained by removing a part of the small lattice are arranged along the side of the first large lattice. Each of the second non-connected patterns has a shape in which two or more shapes obtained by removing a part of the small lattice are arranged along the side of the second large lattice.
[6] In the first aspect of the present invention, the shape of the small lattice is a square, and each of the first non-connection pattern and the second non-connection pattern has two or more shapes obtained by removing one side of the small lattice. It has the shape which was arranged.
[7] In the first aspect of the present invention, a first connection portion is formed on one main surface of the base body by a fine metal wire that electrically connects the adjacent first large lattices, and the other main surface of the base body is formed. A second connection portion is formed on the surface by a thin metal wire that electrically connects the adjacent second large lattices, and two or more first large lattices are arranged in the first direction via the first connection portions. Thus, one first conductive pattern is configured, and two or more second large lattices are arranged in a second direction orthogonal to the first direction via the second connection portion, and one second conductive pattern is formed. And two or more first conductive patterns are arranged in the second direction, two or more second conductive patterns are arranged in the first direction, and the first connection part and the second connection part are The first conductive patterns that face each other with the substrate interposed therebetween are electrically isolated. An edged first insulating part is disposed, and a second insulating part electrically insulated is disposed between the adjacent second conductive patterns, and the first connecting part and the second connecting part serve as the base. The combination pattern is formed by facing the first insulating portion and the second insulating portion with the base interposed therebetween, and the first connecting portion and the second connecting portion facing each other. It is characterized in that two or more small lattices are combined.
[8] In the first aspect of the present invention, the first insulating portion is formed with a first insulating pattern by a thin metal wire that is not connected to the first large lattice, and the second insulating portion is the second large portion. A combination pattern of the first insulation pattern and the second insulation pattern is formed by forming a second insulation pattern made of fine metal wires that are not connected to the lattice, and the first insulation portion and the second insulation portion face each other. Is formed by combining two or more small lattices.
[9] In the first aspect of the present invention, the first insulating pattern has a set portion in which two or more small lattices are arranged, and the second insulating pattern has a blank portion corresponding to the set portion. It is characterized by that.
[10] In the first aspect of the present invention, the first insulating pattern has a wavy line portion in which two sides constituting the small lattice are continuously arranged, and the second insulating pattern includes the small lattice. The two continuous sides which comprise are arranged, and it has the wavy line part of a pattern reverse to the said wavy line part of the said 1st insulating pattern, It is characterized by the above-mentioned.
[11] In the first aspect of the present invention, when the arrangement pitch of the small lattices is P and the shortest distance between the adjacent first conductive patterns is defined as the width of the first insulating portion, The width is m × P (m is an integer of 1 or more), and the maximum length of the first insulating pattern in the width direction of the first insulating pattern is not more than m × P, and adjacent When the shortest distance between the second conductive patterns is defined as the width of the second insulating portion, the width of the second insulating portion is n × P (n is an integer of 1 or more), and the second The maximum length of the portion of the insulating pattern in the width direction of the second insulating portion is n × P or less.
[12] In the first aspect of the present invention, the small lattice has a polygonal shape.
[13] In the first aspect of the present invention, the small lattice has a curved shape on at least one side.
[14] In the first invention, at least one side of the small lattice has an arc shape.
[15] A conductive sheet according to a second aspect of the present invention includes a base and a conductive portion formed on one main surface of the base, each of the conductive portions extending in the first direction, and Having two or more conductive patterns of fine metal wires arranged in a second direction orthogonal to the first direction, the conductive pattern is configured by connecting two or more large lattices in series in the first direction; Each of the large lattices is configured by combining two or more small lattices, and a first non-connected pattern of fine metal wires disconnected from the first large lattice is formed around the side of the first large lattice. It is formed.
[16] In the second aspect of the present invention, the thin metal wire has a line width of 1 to 15 μm.
[17] In the conductive sheet according to the third aspect of the present invention, two or more conductive first large lattices of fine metal wires are formed on one main surface of the substrate, and the fine metal wires are formed on the other main surface of the substrate. 2 or more conductive second large lattices are formed, and each of the first large lattices and each of the second large lattices is formed by combining two or more small lattices, and the sides of the first large lattices A first non-connection pattern is formed by a fine metal wire disconnected from the first large lattice around the first large lattice, and a metal disconnected from the second large lattice around the side of the second large lattice. A second non-connection pattern is formed by a thin line, and when viewed from above, the second large lattice is arranged adjacent to the first large lattice, and the first large lattice and the second large lattice Between the first non-connection pattern and the second non-connection pattern. A combination pattern is formed, and the combination pattern is configured to be combined so as to be substantially similar to the inside of each of the first large lattices and each of the second large lattices.
[18] In the third aspect of the present invention, the projection distance between the straight line portion on the side of the first large lattice and the straight line portion on the side of the second large lattice is set based on the size of the small lattice. Features.
[19] A conductive sheet according to a fourth aspect of the present invention is a conductive sheet for a touch panel disposed on a display panel of a display device, and includes a first base and a first base formed on the main surface of the first base. A second conductive sheet having a first conductive sheet having a conductive portion, a second base, and a second conductive portion formed on a main surface of the second base, and on the second conductive sheet The first conductive sheets are stacked, and the first conductive portions each extend in a first direction and are two or more first conductives by thin metal wires arranged in a second direction orthogonal to the first direction. The first conductive pattern includes two or more second conductive patterns that extend in the second direction and are formed of metal wires arranged in the first direction. Is constructed by arranging two or more first large lattices in the first direction, and the second The conductive pattern is formed by arranging two or more second large lattices in the second direction, and a first thin metal wire that is not connected to the first large lattice around the side of the first large lattice. A non-connection pattern is formed, and a second non-connection pattern is formed around the side of the second large lattice by a thin metal wire that is not connected to the second large lattice. The second large lattice is arranged adjacent to the large lattice, and the first disconnected pattern and the second disconnected pattern are disposed between the first large lattice and the second large lattice. A combination pattern is formed by facing each other, and the combination pattern is configured by combining two or more small lattices.
[20] In the fourth aspect of the present invention, the first conductive portion further includes a first terminal wiring pattern connected to an end portion of each first conductive pattern, and a length of one side of the first conductive sheet. A plurality of first terminals connected to the corresponding first terminal wiring pattern, and the second conductive portion is further connected to an end portion of each second conductive pattern. The second terminal wiring pattern, and a plurality of second terminals formed in the lengthwise central portion of one side of the second conductive sheet and connected to the corresponding second terminal wiring pattern. Features.
[21] In the fourth aspect of the present invention, when the first conductive sheet and the second conductive sheet are viewed from above, a portion where the plurality of first terminals are arranged and a plurality of the second terminals are arranged. It is characterized in that the part is adjacent.
[22] In the fourth aspect of the present invention, an end portion of each first conductive pattern is connected to the corresponding first terminal wiring pattern via a first connection portion, and an end portion of each second conductive pattern. And the corresponding second terminal wiring patterns are respectively connected via the second connection portions, and the plurality of first connection portions are arranged linearly along the second direction, and the plurality of second connection portions Are arranged in a straight line along the first direction.
[23] A method for using a conductive sheet according to a fifth aspect of the present invention includes: a first conductive sheet having two or more conductive first large lattices formed of thin metal wires each formed by combining two or more small lattices; , A method of using a conductive sheet using a second conductive sheet having a second large lattice of two or more conductive metal thin wires each composed of a combination of two or more small lattices, the first large A first non-connection pattern is formed around the sides of the lattice by a thin metal wire disconnected from the first large lattice, and the second large lattice is disconnected from the periphery of the second large lattice. A second non-connecting pattern is formed by the thin metal wires, and the second large lattice is disposed adjacent to the first large lattice by combining the first conductive sheet and the second conductive sheet. , Before the first non-connection pattern The second non-connection pattern is combined so as to form the small lattice array.
[24] In the fifth aspect of the present invention, a first connection portion is formed by a thin metal wire that electrically connects adjacent first large lattices in the first conductive sheet, and two or more first large lattices are formed. One first conductive pattern is configured in the first direction through the first connection portion, and two or more first conductive patterns are arranged in a second direction orthogonal to the first direction, and the first A second connection portion is formed by a thin metal wire that electrically connects the adjacent second large lattices in the two conductive sheets, and two or more second large lattices pass through the second connection portions in the second direction. One second conductive pattern is arranged, two or more second conductive patterns are arranged in the first direction, and the first conductive sheet and the second conductive sheet are combined, 1 connection portion and the second connection portion are combined. The small lattices are arranged so as to form an array of the small lattices.
[25] In the fifth aspect of the present invention, an electrically insulated first insulating portion is disposed between the adjacent first conductive patterns in the first conductive sheet, and the first insulating portion includes the first insulating portion. A first insulating pattern is formed by a thin metal wire that is not connected to the large lattice, and an electrically insulated second insulating portion is disposed between adjacent second conductive patterns in the second conductive sheet, A second insulating pattern is formed on the second insulating portion by a thin metal wire that is not connected to the second large lattice, and the first insulating pattern is formed by combining the first conductive sheet and the second conductive sheet. And the second insulating pattern are combined to form an array of the small lattices.
[26] A capacitive touch panel according to a sixth aspect of the present invention includes the above-described conductive sheet according to the first to fourth aspects of the present invention.

As described above, according to the conductive sheet and the method of using the conductive sheet according to the present invention, it is possible to reduce the resistance of the conductive pattern formed on the substrate and to improve the visibility. For example, it is suitable for use in a projected capacitive touch panel.
In addition, the capacitive touch panel according to the present invention can reduce the resistance of the conductive pattern formed on the substrate and can improve the visibility, for example, a projected capacitive touch panel. It is possible to cope with an increase in size.

It is a top view which shows the example of a pattern of the 1st conductive pattern formed in a 1st conductive sheet. It is sectional drawing which abbreviate | omits and shows a 1st conductive sheet. It is a disassembled perspective view which shows the structure of a touchscreen. It is a disassembled perspective view which abbreviate | omits and shows a 1st lamination | stacking electrically conductive sheet. 5A is a cross-sectional view showing an example of a laminated conductive sheet with a part omitted, and FIG. 5B is a cross-sectional view showing another example of the laminated conductive sheet, with a part omitted. It is a top view which shows the example of a pattern of the 2nd conductive pattern formed in the 2nd conductive sheet in a 1st lamination | stacking conductive sheet. It is a top view which abbreviate | omits and shows the example which made the 1st laminated conductive sheet combining the 1st conductive sheet and the 2nd conductive sheet. 8A is a schematic diagram illustrating a first configuration example to which an antireflection film is applied, FIG. 8B is a schematic diagram illustrating the second configuration example, and FIG. 8C is a schematic diagram illustrating the third configuration example. It is a disassembled perspective view which abbreviate | omits and shows a 2nd laminated conductive sheet. It is a top view which shows the example of a pattern of the 1st conductive pattern formed in the 1st conductive sheet in a 2nd lamination | stacking conductive sheet. It is a top view which shows the example of a pattern of the 2nd conductive pattern formed in the 2nd conductive sheet in a 2nd lamination | stacking conductive sheet. It is a top view which abbreviate | omits and shows the example which combined the 1st conductive sheet and the 2nd conductive sheet, and was set as the 2nd laminated conductive sheet. It is a disassembled perspective view which abbreviate | omits and shows a 3rd lamination | stacking electrically conductive sheet. It is a top view which shows the example of a pattern of the 1st conductive pattern formed in the 1st conductive sheet in a 3rd laminated conductive sheet. It is a top view which shows the example of a pattern of the 2nd conductive pattern formed in the 2nd conductive sheet in a 3rd laminated conductive sheet. It is a top view which abbreviate | omits and shows the example which made the 3rd laminated conductive sheet combining the 1st conductive sheet and the 2nd conductive sheet. It is a disassembled perspective view which abbreviate | omits and shows a 4th laminated conductive sheet. FIG. 18A is a cross-sectional view showing a part of the fourth laminated conductive sheet with a part omitted, and FIG. 18B is a cross-sectional view showing a part of another example of the fourth laminated conductive sheet. It is a top view which shows the example of a pattern of the 1st electroconductive part formed in the 1st electroconductive sheet of a 4th laminated electroconductive sheet. It is a top view which shows the example of a pattern of the 2nd electroconductive part formed in the 2nd conductive sheet of a 4th laminated conductive sheet. It is a top view which abbreviate | omits and shows the example which made the 4th laminated conductive sheet combining the 1st conductive sheet and the 2nd conductive sheet. It is explanatory drawing which shows the state in which one line was formed of the 1st auxiliary line and the 2nd auxiliary line. It is a flowchart which shows the manufacturing method of the transparent conductive film which concerns on this Embodiment. FIG. 24A is a cross-sectional view in which a part of the produced photosensitive material is omitted, and FIG. 24B is an explanatory view showing double-sided simultaneous exposure on the photosensitive material. The first exposure process and the second exposure process are performed so that the light irradiated to the first photosensitive layer does not reach the second photosensitive layer and the light irradiated to the second photosensitive layer does not reach the first photosensitive layer. FIG.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of a conductive sheet, a method for using a conductive sheet, and a touch panel according to the present invention will be described with reference to FIGS. In the present specification, “˜” indicating a numerical range is used as a meaning including numerical values described before and after the numerical value as a lower limit value and an upper limit value.

A conductive sheet according to the first embodiment (hereinafter referred to as the first conductive sheet 10A) will be described with reference to FIGS.
As shown in FIG. 1, the first conductive sheet 10 </ b> A includes a first conductive portion 13 </ b> A formed on one main surface of the first transparent base 14 </ b> A (see FIG. 2). The first conductive portion 13A is formed with two or more conductive first large lattices 16A formed of fine metal wires 15. Each first large lattice 16A is configured by combining two or more small lattices 18, respectively. Around the side of the first large lattice 16A, a first dummy pattern 20A (first unconnected pattern) is formed by the fine metal wires 15 that are not connected to the first large lattice 16A. Further, between the adjacent first large lattices 16A, the first connecting portions 22A are formed by the fine metal wires 15 that electrically connect the first large lattices 16A. 22 A of 1st connection parts are comprised by arrange | positioning the 1 or more medium grating | lattice 24 (24a-24d) which has the pitch of n times the small grating | lattice 18 (n is a real number larger than 1). Here, the small lattice 18 has the smallest square shape. The thin metal wire 15 is made of, for example, gold (Au), silver (Ag), or copper (Cu).

  The length of one side of the first large lattice 16A is preferably 3 to 10 mm, and more preferably 4 to 6 mm. If the length of one side is less than the above lower limit value, when the first conductive sheet 10A is used for a touch panel, for example, the capacitance of the first large lattice 16A at the time of detection is reduced, and thus there is a possibility of detection failure. Becomes higher. On the other hand, if the upper limit is exceeded, the position detection accuracy may be reduced. From the same viewpoint, the length of one side of the small lattice 18 constituting the first large lattice 16A is preferably 50 to 500 μm, and more preferably 150 to 300 μm. When the small lattice 18 is in the above range, it is possible to keep the transparency better, and when it is attached to the front surface of the display device, the display can be visually recognized without a sense of incongruity.

  The line width of the fine metal wire 15 is preferably 1 μm or more, 3 μm or more, 4 μm or more, or 5 μm or more, and the upper limit is preferably 15 μm, 10 μm or less, 9 μm or less, or 8 μm or less. When the line width is less than the above lower limit value, the conductivity becomes insufficient, so that when used for a touch panel, the detection sensitivity becomes insufficient. On the other hand, when the above upper limit is exceeded, moire caused by the conductive metal portion becomes noticeable, or visibility is deteriorated when used for a touch panel. In addition, by being in the said range, the moire of an electroconductive metal part is improved and visibility becomes especially good.

Further, two or more first large lattices 16A are arranged in the x direction (first direction) via the first connecting portion 22A, and one first conductive pattern 26A is formed by the thin metal wires 15 to form two or more first conductive lattices 26A. The conductive patterns 26A are arranged in the y direction (second direction) orthogonal to the x direction, and a first insulating portion 28A that is electrically insulated is disposed between the adjacent first conductive patterns 26A.
The x direction indicates, for example, the horizontal direction (or vertical direction) of a projection capacitive touch panel 100 (see FIG. 3) described later or the horizontal direction (or vertical direction) of the display panel 110 on which the touch panel 100 is installed.

  As shown in FIG. 1, the four sides 32 of the first large lattice 16A, that is, the first side 32a and the second side 32b adjacent to one vertex 30a not connected to the adjacent first large lattice 16A. The third side 32c and the fourth side 32d adjacent to the other vertex 30b not connected to the adjacent first large lattice 16A have a linear shape. In other words, the boundary portion between the linear shape of the first side 32a and the linear shape of the second side 32b constitutes one vertex 30a of the first large lattice 16A, and the linear portion of the third side 32c and the fourth side 32d. The boundary portion with the straight line portion constitutes the other vertex 30b of the first large lattice 16A.

  The first connecting portion 22A has a shape in which four medium lattices 24 having a size including four small lattices 18 (first medium lattice 24a to fourth medium lattice 24d) are arranged in a zigzag shape. That is, the first middle lattice 24a exists at the boundary portion between the second side 32b and the fourth side 32d, and has a shape in which one small lattice 18 and an L-shaped space are formed. The second middle lattice 24b is adjacent to one side of the first middle lattice 24a and has a shape in which a square space is formed, that is, four small lattices 18 are arranged in a matrix, and a cross in the center is formed. It has a shape as removed. The third medium lattice 24c is adjacent to one vertex of the first medium lattice 24a and adjacent to one side of the second medium lattice 24b, and has the same shape as the second medium lattice 24b. The fourth middle lattice 24d exists at the boundary between the third side 32c and the first side 32a, is adjacent to one vertex of the second middle lattice 24b, and is adjacent to one side of the third middle lattice 24c. Similar to the first middle lattice 24a, it has a shape in which one small lattice 18 and an L-shaped space are formed. When the arrangement pitch of the small lattices 18 is P, the arrangement pitch of the medium lattices 24 has a relationship of 2P.

  In addition, the first dummy pattern 20A described above is formed around each of the four sides 32 (first side 32a to fourth side 32d) of the first large lattice 16A. Each of the shapes obtained by removing a part of the small lattice 18 has two or more shapes arranged along corresponding sides (linear shapes). In the example of FIG. 1, a shape obtained by removing one side of the small lattice 18 (substantially U-shaped, having two bent portions, and having one opening: substantially U-shaped for convenience. However, ten openings are arranged in the opposite direction with respect to the corresponding side of the first large lattice 16A, and the arrangement pitch is the arrangement pitch of the small lattices 18 of the first large lattice 16A. An example in which P is doubled is shown. For example, the shortest distance from the linear shape of the first side 32 a to the substantially U shape of the first dummy pattern 20 </ b> A is substantially the same as the length of one side on the inner peripheral side of the small lattice 18. The same applies to the second side 32b to the fourth side 32d.

Further, a first insulating pattern 34A that is not connected to the first large lattice 16A is formed in the first insulating portion 28A. The first insulating pattern 34A includes a first collective pattern portion 36a in which two or more small lattices 18 are arranged, and three blank portions 38 (38a to 38c) in which the small lattices 18 do not exist.
Specifically, the first collective pattern portion 36a is configured by combining four straight portions (two long straight portions and two short straight portions) by a plurality of small lattices 18. Each straight line portion is configured by arranging a plurality of small lattices 18 so as to connect vertices. The three blank portions 38 are small lattices surrounded by the first collective pattern portion 36a when attention is paid to the two first large lattices 16A and 16B adjacent to each other with the first insulating portion 28A interposed therebetween. The first blank portion 38a in which no 18 exists, the second blank portion 38b in which the small lattice 18 near the other vertex 30a in one first large lattice 16A does not exist, and the one vertex 30a in the other first large lattice 16A It is composed of a third blank portion 38c in which the small lattice 18 in the vicinity does not exist.

  Of the four straight line portions, the two long straight line portions are configured such that, for example, seven small lattices 18 are arranged so as to connect the vertices, respectively. The first dummy pattern 20A arranged along the third side 32c of the first large lattice 16A is disposed at a position adjacent to the other top portion 30b side of one first large lattice 16A at the same pitch, The small lattice 18 located at the other end is on the one top 30a side of the other first large lattice 16A with respect to the first dummy pattern 20A arranged along the first side 32a of the other first large lattice 16A. Are arranged at positions adjacent to each other at the same pitch. Similarly, the small lattice 18 located at one end of the other long straight line portion has one first large pattern with respect to the first dummy pattern 20A arranged along the fourth side 32d of one first large lattice 16A. The first and second small lattices 18 arranged at the same pitch adjacent to the other top portion 30b of the lattice 16A and located at the other end are arranged along the second side 32b of the other first large lattice 16A. It is arranged at a position adjacent to the pattern 20A at the same pitch on the one top 30a side of the other first large lattice 16A.

  Of the two short straight portions, one short straight portion includes two short lattices 18 from one end of one long straight portion and the second small lattice 18 from one end of the other long straight portion. The small lattice 18 is used. Similarly, the other short straight line portion includes two small lattices 18 connecting the second small lattice 18 from the other end in one long straight line portion and the second small lattice 18 from the other end in the other long straight line portion. It is composed of.

  The arrangement pitch of the small lattices 18 is P, and the shortest distance between adjacent first conductive patterns 26A, that is, the other vertex 30b of one first large lattice 16A and one vertex of the other first large lattice 16A. When the distance to 30a is defined as the width of the first insulating portion 28A, the width of the first insulating portion 28A is m × P (m is an integer of 1 or more), and the first insulating pattern 34A Of these, the maximum length of the first insulating portion 28A in the width direction, that is, one of the short straight portions, the portion facing the other vertex 30b of the first large lattice 16A, and the other short straight portion. Among the portions, the distance between the one vertex 30a of the other first large lattice 16A and the facing portion is m × P or less.

  As described above, in the first conductive sheet 10A, one first conductive pattern 26A formed by the thin metal wires 15 is configured by connecting two or more first large lattices 16A in series in the first direction, and each first large The lattice 16A is configured by combining two or more small lattices 18 and the first dummy pattern 20A is formed by the fine metal wires 15 that are not connected to the first large lattice 16A around the sides of the first large lattice 16A. In addition, since the line width of the fine metal wire 15 is 1 to 15 μm and the length of one side of the small lattice 18 is 50 to 500 μm, the electric resistance is greatly reduced as compared with the configuration in which one electrode is formed of one ITO film. It becomes possible. Accordingly, when the first conductive sheet 10A is used for the projected capacitive touch panel 100, for example, the response speed can be increased and the touch panel 100 can be increased in size.

Next, the touch panel 100 using the first conductive sheet 10A described above will be described with reference to FIGS.
The touch panel 100 includes a sensor body 102 and a control circuit (configured by an IC circuit or the like) not shown. As shown in FIGS. 3, 4 and 5A, the sensor main body 102 is for the touch panel according to the first embodiment configured by laminating the first conductive sheet 10A and the second conductive sheet 10B described later. It has a conductive sheet (hereinafter referred to as the first laminated conductive sheet 12A) and a protective layer 106 laminated thereon (the description of the protective layer 106 is omitted in FIG. 5A). The first laminated conductive sheet 12A and the protective layer 106 are arranged on the display panel 110 in the display device 108 such as a liquid crystal display. When viewed from above, the sensor main body 102 has a sensor unit 112 disposed in a region corresponding to the display screen 110 a of the display panel 110 and a terminal wiring unit 114 disposed in a region corresponding to the outer peripheral portion of the display panel 110. (So-called picture frame).

  In the first conductive sheet 10A applied to the touch panel 100, the open end of the first large lattice 16A existing on one end side of each first conductive pattern 26A has a shape in which the first connection portion 22A does not exist. . The end portion of the first large lattice 16A existing on the other end portion side of each first conductive pattern 26A is electrically connected to the first terminal wiring pattern 42a by the metal thin wire 15 via the first connection portion 40a (see FIG. 4). Connected. Further, as shown in FIG. 4, the first conductive patterns 26 </ b> A described above are arranged in a portion corresponding to the sensor unit 112, and the terminal wiring unit 114 has a plurality of first conductive patterns derived from the first connection units 40 a. A one-terminal wiring pattern 42a is arranged.

  In the example of FIG. 3, the outer shape of the first conductive sheet 10 </ b> A has a rectangular shape when viewed from above, and the outer shape of the sensor unit 112 also has a rectangular shape. Among the terminal wiring portions 114, a plurality of first terminals 116a are arranged in the lengthwise central portion at the peripheral portion on the one long side of the first conductive sheet 10A in the length direction of the one long side. Is formed. A plurality of first connection portions 40a are linearly arranged along one long side of sensor portion 112 (long side closest to one long side of first conductive sheet 10A: y direction). The first terminal wiring pattern 42a led out from each first connection portion 40a is routed toward the substantially central portion of one long side of the first conductive sheet 10A, and is electrically connected to the corresponding first terminal 116a. It is connected. Therefore, the first terminal wiring patterns 42a connected to the first connection portions 40a corresponding to both sides of one long side in the sensor unit 112 are routed with substantially the same length. Of course, the first terminal 116a may be formed at or near the corner of the first conductive sheet 10A, but the longest first terminal wiring pattern 42a and the shortest first among the plurality of first terminal wiring patterns 42a. A large difference in length occurs between the terminal wiring pattern 42a and signal transmission to the first conductive pattern 26A corresponding to the longest first terminal wiring pattern 42a and the plurality of first terminal wiring patterns 42a in the vicinity thereof. There is a problem of being slow. Therefore, as in the present embodiment, local signal transmission delay can be suppressed by forming the first terminal 116a at the central portion in the length direction of one long side of the first conductive sheet 10A. it can. This leads to an increase in response speed.

  On the other hand, as shown in FIGS. 3, 4 and 5A, the second conductive sheet 10B has a second conductive portion 13B formed on one main surface of the second transparent base 14B (see FIG. 5A). The second conductive portion 13B is formed with two or more conductive second large lattices 16B formed by the fine metal wires 15, and each second large lattice 16B is configured by combining two or more small lattices 18, respectively. A second dummy pattern 20B (second unconnected pattern) that is not connected to the second large lattice 16B is formed around the side of the second large lattice 16B. In addition, a second connection portion 22B is formed between the adjacent second large lattices 16B by the fine metal wires 15 that electrically connect the second large lattices 16B. The second connection portion 22B is configured by arranging one or more medium lattices 24 (24e to 24h) having a pitch n times that of the small lattice 18 (n is a real number larger than 1). The length of one side of the second large lattice 16B is also preferably 3 to 10 mm, and more preferably 4 to 6 mm, like the first large lattice 16A described above.

Further, two or more second large lattices 16B are arranged in the y direction (second direction) via the second connection portion 22B to constitute one second conductive pattern 26B, and two or more second conductive patterns 26B are formed. A second insulating portion 28B arranged in the x direction (first direction) and electrically insulated between the adjacent second conductive patterns 26B is disposed.
As shown in FIG. 4, the open ends of the second large lattices 16B existing on the one end side of every other (for example, odd-numbered) second conductive pattern 26B, and the other of the even-numbered second conductive patterns 26B. The second connecting portion 22B does not exist at the open end of the second large lattice 16B existing on the end side. On the other hand, the second large lattice 16B existing on the other end side of each odd-numbered second conductive pattern 26B and the second end existing on one end side of each even-numbered second conductive pattern 26B. The end portions of the large lattice 16B are electrically connected to the second terminal wiring patterns 42b formed by the thin metal wires 15 through the second connection portions 40b.
A large number of second conductive patterns 26B are arranged at portions corresponding to the sensor unit 112, and a plurality of second terminal wiring patterns 42b derived from the respective second connection portions 40b are arranged at the terminal wiring unit 114. Yes.

  As shown in FIG. 3, among the terminal wiring portions 114, a plurality of second terminals 116 b are arranged at the one long side of the second conductive sheet 10 </ b> B at the central portion in the length direction. An array is formed in the length direction of the side. Further, a plurality of second connection portions 40b (for example, odd-numbered second connection portions 40b) along one short side of the sensor unit 112 (short side closest to one short side of the second conductive sheet 10B: x direction). ) Are arranged in a straight line, and a plurality of second connection portions 40b (for example, even-numbered ones) along the other short side of sensor portion 112 (short side closest to the other short side of second conductive sheet 10B: x direction) Are connected in a straight line.

  Among the plurality of second conductive patterns 26B, for example, odd-numbered second conductive patterns 26B are connected to the corresponding odd-numbered second connection portions 40b, respectively, and even-numbered second conductive patterns 26B are respectively corresponding even-numbered. It is connected to the second second connection part 40b. The second terminal wiring pattern 42b derived from the odd-numbered second connection portion 40b and the second terminal wiring pattern 42b derived from the even-numbered second connection portion 40b are arranged on one long side of the second conductive sheet 10B. The wires are routed substantially toward the center and are electrically connected to the corresponding second terminals 116b. Accordingly, for example, the first and second second terminal wiring patterns 42b are routed with substantially the same length. Similarly, the 2n-1th and 2nth second terminal wiring patterns 42b are , Respectively, are drawn with substantially the same length (n = 1, 2, 3,...).

Of course, the second terminal 116b may be formed in the corner portion of the second conductive sheet 10B or in the vicinity thereof, but as described above, the longest second terminal wiring pattern 42b and a plurality of second terminal wiring patterns in the vicinity thereof. There is a problem that signal transmission to the second conductive pattern 26B corresponding to 42b becomes slow. Therefore, as in the present embodiment, local signal transmission delay can be suppressed by forming the second terminal 116b in the central portion in the length direction of one long side of the second conductive sheet 10B. it can. This leads to an increase in response speed.
The first terminal wiring pattern 42a may be derived in the same manner as the second terminal wiring pattern 42b described above, and the second terminal wiring pattern 42b may be derived in the same manner as the first terminal wiring pattern 42a.
When the first laminated conductive sheet 12A is used as a touch panel, a protective layer 106 is formed on the first conductive sheet 10A, and the first conductive pattern 26A derived from the multiple first conductive patterns 26A of the first conductive sheet 10A. The terminal wiring pattern 42a and the second terminal wiring pattern 42b derived from the multiple second conductive patterns 26B of the second conductive sheet 10B are connected to, for example, a control circuit that controls scanning.

  As a touch position detection method, a self-capacitance method or a mutual capacitance method can be preferably employed. That is, in the case of the self-capacitance method, voltage signals for touch position detection are sequentially supplied to the first conductive pattern 26A, and voltage signals for touch position detection are sequentially supplied to the second conductive pattern 26B. Supply. The first conductive pattern 26 </ b> A and the second conductive pattern 26 </ b> B that face a touch position (a position where the finger touches the upper surface of the protective layer 106 or a position where the finger approaches) when the fingertip contacts or approaches the upper surface of the protective layer 106. Since the capacitance between the first conductive pattern 26A and the second conductive pattern 26B increases, the waveform of the transmission signal from the first conductive pattern 26A and the second conductive pattern 26B is different from the waveform of the transmission signal from the other conductive patterns. Therefore, the control circuit calculates the touch position based on the transmission signal supplied from the first conductive pattern 26A and the second conductive pattern 26B. On the other hand, in the case of the mutual capacitance method, for example, a voltage signal for touch position detection is sequentially supplied to the first conductive pattern 26A, and sensing (detection of a transmission signal) is sequentially performed on the second conductive pattern 26B. Do. Since the fingertip is in contact with or close to the upper surface of the protective layer 106, the stray capacitance of the finger is added in parallel to the parasitic capacitance between the first conductive pattern 26A and the second conductive pattern 26B facing the touch position. The waveform of the transmission signal from the second conductive pattern 26B is different from the waveform of the transmission signal from the other second conductive pattern 26B. Therefore, in the control circuit, the touch position is calculated based on the order of the first conductive pattern 26A that supplies the voltage signal and the transmission signal from the supplied second conductive pattern 26B. By adopting such a self-capacitance type or mutual capacitance type touch position detection method, it is possible to detect each touch position even when two fingertips are simultaneously in contact with or close to the upper surface of the protective layer 106. Become. As prior art documents related to a projection type capacitance detection circuit, US Pat. No. 4,582,955, US Pat. No. 4,686,332, US Pat. No. 4,733,222 Specification, US Pat. No. 5,374,787, US Pat. No. 5,543,588, US Pat. No. 7,030,860, US Published Patent No. 2004/0155871, etc. is there.

As shown in FIG. 6, unlike the first large lattice 16A described above, the second large lattice 16B has a substantially octagonal shape and has four short sides 44 (first short side 44a to fourth short side). Side 44d) and four long sides 46 (first long side 46a to fourth long side 46d). The second connecting portion 22B is formed between the first short side 44a of one second large lattice 16B adjacent to the y direction and the second short side 44b of the other second large lattice 16B, and is configured to be a second insulating portion. 28B is arranged between the third short side 44c of one second large lattice 16B adjacent to the x direction and the fourth short side 44d of the other second large lattice 16B.
Four long sides of the second large lattice 16B, that is, the first long side 46a and the second long side 46b adjacent to the third short side 44c facing the second insulating part 28B, and the other second insulating part. The third long side 46c and the fourth long side 46d adjacent to the fourth short side 44d facing 28B each have a linear shape.

  The second connecting portion 22B has a shape in which four medium lattices 24 having a size including four small lattices 18 (fifth medium lattice 24e to eighth medium lattice 24h) are arranged in a zigzag shape. That is, the fifth middle lattice 24e exists on the first short side 44a and has a shape in which one small lattice 18 and an L-shaped space are formed. The sixth middle lattice 24f is adjacent to one side of the fifth middle lattice 24e, and has a shape in which a square space is formed, that is, four small lattices 18 are arranged in a matrix, and a cross in the center is formed. It has a shape as removed. The seventh middle grating 24g is adjacent to one vertex of the fifth middle grating 24e and adjacent to one side of the sixth middle grating 24f, and has the same shape as the sixth middle grating 24f. The eighth middle lattice 24h exists on the second short side 44b, is adjacent to one vertex of the sixth middle lattice 24f, and is adjacent to one side of the seventh middle lattice 24g. Similarly to 24e, it has a shape in which one small lattice 18 and an L-shaped space are formed. When the arrangement pitch of the small lattices 18 is P, the arrangement pitch of the medium lattices 24 has a relationship of 2P.

  The second dummy patterns 20B described above are formed around the four long sides 46 (first long side 46a to fourth long side 46d) of the second large lattice 16B, and each second dummy pattern is formed. 20B has a shape in which two or more shapes obtained by removing a part of the small lattice 18 are arranged along corresponding sides (linear shapes). In the example of FIG. 6, the shape obtained by removing one side of the small lattice 18 (substantially U-shaped) is 10 with the opening portion directed in the opposite direction with respect to the corresponding long side of the second large lattice 16B. In this example, the arrangement pitch is two times the arrangement pitch P of the small lattices 18 of the second large lattice 16B. For example, the shortest distance from the linear shape of the first long side 46a to the substantially U shape of the second dummy pattern 20B is substantially the same as the length of one side on the inner peripheral side of the small lattice 18. The same applies to the second long side 46b to the fourth long side 46d.

In addition, a second insulating pattern 34B that is not connected to the second large lattice 16B is formed in the second insulating portion 28B. The second insulating pattern 34B includes a second collective pattern portion 36b in which two or more small lattices are arranged, a first bent pattern portion 48a and a second bent pattern portion 48b each having two substantially U shapes. And one blank portion (fourth blank portion 38d) in which the small lattice 18 does not exist.
Specifically, the second aggregate pattern portion 36b has apexes of the number of small lattices 18 (for example, six) that can fit in the first blank portion 38a of the first insulating pattern 34A in the first conductive pattern 26A shown in FIG. Are arranged in a matrix so as to connect the two.

The first bent pattern portion 48a has one end portion of the second insulating pattern 34B (the boundary between the fourth short side 44d and the third long side 46c in one second large lattice 16B, and the other second large lattice 16B. Between the third short side 44c and the boundary between the first long side 46a), the two substantially U-shapes are connected at one end, and The angle formed by each side at one end is approximately 90 °.
Similarly, the second bent pattern portion 48b is connected to the other end of the second insulating pattern 34B (the boundary between the fourth short side 44d and the fourth long side 46d in one second large lattice 16B, and the other second Two large U-shapes formed between the third short side 44c and the second long side 46b in the large lattice 16B), and these two substantially U-shaped are connected at one end, In addition, the angle formed by each side at the one end is approximately 90 °.
The fourth blank portion 38d is configured by a blank region (region where the small lattice 18 does not exist) in which the four straight line portions constituting the first aggregate pattern portion 36a of the first insulating pattern 34A shown in FIG. 1 are accommodated. Yes.

  The arrangement pitch of the small lattices 18 is P, and the shortest distance between the adjacent second conductive patterns 26B, that is, the fourth short side 44d of one second large lattice 16B and the third distance of the other second large lattice 16B. When the distance from the short side 44c is defined as the width of the second insulating portion 28B, the width of the second insulating portion 28B is n × P (n is an integer of 1 or more), and the second insulating pattern 34B, the maximum length of the portion in the width direction of the second insulating portion 28B, that is, the portion of the second aggregate pattern portion 36b that faces the fourth short side 44d of one second large lattice 16B, The distance between the portion of the other second large lattice 16B facing the third short side 44c is n × P or less, preferably less than n × P.

  For example, when the first conductive sheet 10A is laminated on the second conductive sheet 10B to form the first laminated conductive sheet 12A, as shown in FIG. 7, the first connection portion 22A of the first conductive pattern 26A and the second conductive pattern The second connecting portion 22B of 26B faces the first transparent base 14A (see FIG. 5A), and the first insulating portion 28A of the first conductive pattern 26A and the second insulating portion 28B of the second conductive pattern 26B. Are opposed to each other with the first transparent substrate 14A interposed therebetween. Although the line widths of the first conductive pattern 26A and the second conductive pattern 26B are the same, in FIG. 7, the positions of the first conductive pattern 26A and the first conductive pattern 26A are shown so that the positions of the first conductive pattern 26A and the second conductive pattern 26B can be seen. The line width is thick and the line width of the second conductive pattern 26B is narrowed and exaggerated.

  When the stacked first conductive sheet 10A and second conductive sheet 10B are viewed from above, the second large size of the second conductive sheet 10B is filled so as to fill the gaps of the first large lattice 16A formed in the first conductive sheet 10A. The lattice 16B is arranged. In other words, a large lattice is spread. At this time, a combination pattern is formed between the first large lattice 16A and the second large lattice 16B because the first dummy pattern 20A and the second dummy pattern 20B face each other. A distance obtained by projecting the shortest distance between, for example, the first side 32a of the first large lattice 16A and the second long side 46b of the second large lattice 16B facing the first side 32a onto one main surface of the first transparent base 14A. Is defined as the width of the combination pattern, the width of the combination pattern has a length that is one or more times the length of the side of the small lattice 18. In the example of FIG. 7, the width of the combination pattern has a length twice as long as the side of the small lattice 18. This also applies to the relationship between the second side 32b to the fourth side 32d of the first large lattice 16A and the second long side 46b to the fourth long side 46d of the second large lattice 16B.

  Accordingly, a plurality of substantially U-shaped openings in the first dummy pattern 20A of the first large lattice 16A are connected to each other by a straight shape of the long side of the second large lattice 16B, and a plurality of openings are formed. The substantially U-shaped bottom portions are connected to each other at a plurality of substantially U-shaped bottom portions in the second dummy pattern 20B of the second large lattice 16B. Similarly, the second large lattice 16B A plurality of substantially U-shaped openings in the second dummy pattern 20B are connected to each other by linear shapes of the long sides of the first large lattice 16A, and between the plurality of substantially U-shaped bottom portions. Are connected at the bottoms of the plurality of substantially U shapes in the first dummy pattern 20A of the first large lattice 16A, and as a result, the plurality of small lattices 18 are arranged, 1 large lattice 16A and 2nd large lattice 16B A state that can not distinguish most of the boundary.

  Here, for example, when the first dummy pattern 20A and the second dummy pattern 20B are not formed, a blank area corresponding to the width of the combination pattern is formed, whereby the boundary of the first large lattice 16A, the second large pattern The boundary of the grid 16B becomes conspicuous, causing a problem that visibility is deteriorated. In order to avoid this, it is conceivable that the long side of the second large lattice 16B is overlapped with each side of the first large lattice 16A to eliminate the blank area. The width of the overlapping portion increases (thickening of the lines), thereby causing a problem that the boundary between the first large lattice 16A and the second large lattice 16B becomes conspicuous and the visibility deteriorates.

In contrast, in the present embodiment, as described above, the boundary between the first large lattice 16A and the second large lattice 16B becomes inconspicuous due to the overlap between the first dummy pattern 20A and the second dummy pattern 20B. Visibility is improved.
Further, as described above, for example, when the long side of the second large lattice 16B is overlapped on each side of the first large lattice 16A to eliminate the blank area, the first side 32a to the fourth side of the first large lattice 16A. The first long side 46a to the fourth long side 46d of the second large lattice 16B are located immediately below 32d. At this time, since the first side 32a to the fourth side 32d and the first long side 46a to the fourth long side 46d also function as conductive portions, the sides of the first large lattice 16A and the long sides of the second large lattice 16B A parasitic capacitance is formed between them, and the presence of this parasitic capacitance serves as a noise component for the charge information, causing a significant decrease in the S / N ratio. Moreover, since a parasitic capacitance is formed between each first large lattice 16A and each second large lattice 16B, a large number of parasitic capacitances are connected in parallel to the first conductive pattern 26A and the second conductive pattern 26B. As a result, there is a problem that the CR time constant becomes large. When the CR time constant is increased, the rise time of the waveform of the voltage signal supplied to the first conductive pattern 26A (and the second conductive pattern 26B) is delayed, and an electric field for position detection is hardly generated in a predetermined scan time. There is a risk that it will not be performed. Further, the rise time or the fall time of the waveform of the transmission signal from the first conductive pattern 26A and the second conductive pattern 26B is also delayed, and there is a possibility that the change in the waveform of the transmission signal cannot be captured during a predetermined scan time. . This leads to a decrease in detection accuracy and a decrease in response speed. That is, in order to improve detection accuracy and response speed, the number of first large lattices 16A and second large lattices 16B must be reduced (reduction in resolution) or the size of the display screen to be adapted must be reduced. For example, there arises a problem that it cannot be applied to B5 version, A4 version and larger screens.

  On the other hand, in this embodiment, as shown in FIG. 5A, the projection distance Lf between the side 32 of the first large lattice 16A and the long side 46 of the second large lattice 16B is set to the length of one side of the small lattice 18. It is almost the same as twice the length. Therefore, the parasitic capacitance formed between the first large lattice 16A and the second large lattice 16B is reduced. As a result, the CR time constant is also reduced, and the detection accuracy and response speed can be improved. In the combination pattern of the first dummy pattern 20A and the second dummy pattern 20B, each bent portion of the first dummy pattern 20A and each bent portion of the second dummy pattern 20B face each other. The dummy pattern 20A is disconnected from the first large lattice 16A and electrically insulated, and the second dummy pattern 20B is also disconnected from the second large lattice 16B and electrically insulated. The parasitic capacitance formed between the first large lattice 16A and the second large lattice 16B does not increase.

The optimum distance of the projection distance Lf described above is smaller than the sizes of the first large lattice 16A and the second large lattice 16B, but the size (line width and one side) of the small lattice 18 constituting the first large lattice 16A and the second large lattice 16B. It is preferable to appropriately set the length according to the length). In this case, if the size of the small lattice 18 is too large for the first large lattice 16A and the second large lattice 16B having a certain size, the translucency is improved, but the dynamic range of the transmission signal is reduced. Therefore, there is a risk of causing a decrease in detection sensitivity. On the other hand, if the size of the small lattice 18 is too small, the detection sensitivity is improved, but there is a limit to the reduction of the line width, so that the translucency may be deteriorated.
Therefore, the optimum value (optimum distance) of the projection distance Lf is preferably 100 to 400 μm, more preferably 200 to 300 μm, when the line width of the small lattice 18 is 1 to 9 μm. If the line width of the small lattice 18 is reduced, the above-mentioned optimum distance can be shortened. However, since the electrical resistance increases, the CR time constant increases even if the parasitic capacitance is small, resulting in detection sensitivity. May cause a decrease in response speed and response speed. Therefore, the line width of the small lattice 18 is preferably in the above range.
Then, for example, based on the size of the display panel 110 or the size of the sensor unit 112 and the resolution of touch position detection (pulse period of the drive pulse, etc.), the size of the first large lattice 16A and the second large lattice 16B and the small lattice 18 The optimum distance between the first large lattice 16A and the second large lattice 16B is determined based on the line width of the small lattice 18.

  Further, when the portion where the first connection portion 22A and the second connection portion 22B are opposed to each other is viewed from above, the intersection of the fifth middle lattice 24e and the seventh middle lattice 24g of the second connection portion 22B is the first large lattice. 16A is located approximately at the center of the second middle grating 24b, and the intersection of the sixth middle grating 24f and the eighth middle grating 24h of the second connecting portion 22B is at the substantial center of the third middle grating 24c of the first large grating 16A. A plurality of small lattices 18 are formed by a combination of the first medium lattice 24a to the eighth medium lattice 24h. That is, a plurality of small lattices 18 are arranged in a portion where the first connection portion 22A and the second connection portion 22B face each other by a combination of the first connection portion 22A and the second connection portion 22B. It becomes indistinguishable from the small lattice 18 constituting the first large lattice 16A and the small lattice 18 constituting the second large lattice 16B, and visibility is improved.

  Further, when a portion where the first insulating pattern 34A of the first insulating portion 28A and the second insulating pattern 34B of the second insulating portion 28B are opposed to each other is viewed from above, the first aggregate pattern portion 36a of the first insulating pattern 34A and The fourth blank portion 38d of the second insulating pattern 34B faces, and the first blank portion 38a of the first insulating pattern 34A and the second aggregate pattern portion 36b of the second insulating pattern 34B face each other. Further, the second blank portion 38b of the first insulating pattern 34A and the first bent pattern portion 48a of the second insulating pattern 34B face each other, and the third blank portion 38c of the first insulating pattern 34A and the second insulating pattern 34B The second bent pattern portion 48b faces each other, and at this time, each opening of the first bent pattern portion 48a has a linear shape (the other vertex 30b) of the third side 32c and the fourth side 32d of the first large lattice 16A. Each of the openings in the second bent pattern portion 48b has a linear shape (near one vertex 30a) of the first side 32a and the second side 32b of the first large lattice 16A. It is a shape that is connected with each linear shape). Thus, a plurality of small lattices 18 are formed by a combination of the first insulating pattern 34A and the second insulating pattern 34B. As a result, the small lattice 18 constituting the surrounding first large lattice 16A and the small lattice 18 constituting the second large lattice 16B cannot be distinguished from each other, and the visibility is improved.

In the present embodiment, among the terminal wiring portions 114, a plurality of first terminals 116a are formed in the center portion in the length direction at the peripheral portion on one long side of the first conductive sheet 10A, and the second conductive sheet 10B A plurality of second terminals 116b are formed in the central portion in the length direction of the peripheral portion on one long side. In particular, in the example of FIG. 3, the first terminal 116 a and the second terminal 116 b are arranged so as not to overlap with each other, and further, the first terminal wiring pattern 42 a and the second terminal wiring pattern 42 b are arranged. To avoid overlapping. The first terminal 116a and, for example, the odd-numbered second terminal wiring pattern 42a may partially overlap each other.
Thereby, the plurality of first terminals 116a and the plurality of second terminals 116b are connected to two connectors (first terminal connector and second terminal connector) or one connector (first terminal 116a and second terminal 116b). And can be electrically connected to the control circuit via a cable.
In addition, since the first terminal wiring pattern 42a and the second terminal wiring pattern 42b do not overlap each other, the generation of parasitic capacitance between the first terminal wiring pattern 42a and the second terminal wiring pattern 42b is suppressed. , A decrease in response speed can be suppressed.

Since the first connection part 40a is arranged along one long side of the sensor part 112 and the second connection part 40b is arranged along the short sides on both sides of the sensor part 112, the area of the terminal wiring part 114 Can be reduced. This can promote downsizing of the display panel 110 including the touch panel 100, and can make the display screen 110a look impressively large. In addition, the operability as the touch panel 100 can be improved.
In order to further reduce the area of the terminal wiring portion 114, it is conceivable to reduce the distance between the adjacent first terminal wiring patterns 42a and the distance between the adjacent second terminal wiring patterns 42b. In consideration of prevention of occurrence, it is preferably 10 μm or more and 50 μm or less.

  In addition, when viewed from above, it is conceivable to reduce the area of the terminal wiring portion 114 by arranging the second terminal wiring pattern 42b between the adjacent first terminal wiring patterns 42a. If there is, there is a possibility that the first terminal wiring pattern 42a and the second terminal wiring pattern 42b overlap each other, and the parasitic capacitance between the wirings increases. This results in a decrease in response speed. Therefore, when adopting such an arrangement, it is preferable to set the distance between adjacent first terminal wiring patterns 42a to 50 μm or more and 100 μm or less.

As described above, in the first laminated conductive sheet 12A, when the first laminated conductive sheet 12A is applied to the projected capacitive touch panel 100, for example, the response speed can be increased. Increase in size can be promoted.
Moreover, a combination of the first dummy pattern 20A formed around the first large lattice 16A of the first conductive sheet 10A and the second dummy pattern 20B formed around the second large lattice 16B of the second conductive sheet 10B. The plurality of small lattices 18 are formed by the combination, the plurality of small lattices 18 are formed by the combination of the first connection portion 22A and the second connection portion 22B, and the first insulation pattern 34A and the second insulation pattern 34B. Since a plurality of small lattices 18 are formed by the combination of the above, the boundary between the first large lattice 16A of the first conductive sheet 10A and the second large lattice 16B of the second conductive sheet 10B becomes inconspicuous, and the line thickness is locally increased. Inconveniences such as occurrence are eliminated, and the visibility is improved as a whole.
In addition, the CR time constants of a large number of first conductive patterns 26A and second conductive patterns 26B can be greatly reduced, thereby increasing the response speed and detecting the position within the drive time (scan time). Will also be easier. This leads to an increase in the screen size of the touch panel 100 (vertical x horizontal size, not including thickness).

In the above example, the outer shape of the first large lattice 16A is a quadrangular shape as shown in FIG. 1, and the outer shape of the second large lattice 16B is an octagonal shape as shown in FIG. The outer shape of the second large lattice 16B is not limited to these shapes, and the size of the first large lattice 16A and the second large lattice 16B may be large enough to sense the touch position. That's fine.
Moreover, although the shape of the small lattice 18 is a square shape, it may be a polygonal shape. Further, the shape of one side may be a curved shape or a circular arc shape in addition to a linear shape. In the case of an arc shape, for example, two opposing sides may be outwardly convex arc shapes, and the other two opposing sides may be inwardly convex arc shapes. The shape of each side may be a wavy shape in which an outwardly convex arc and an inwardly convex arc are continuous. Of course, the shape of each side may be a sine curve.

In the first conductive sheet 10A and the second conductive sheet 10B described above, the arrangement pitch of the intermediate lattices 24 constituting the first connection portion 22A and the second connection portion 22B is set to twice the arrangement pitch P of the small lattices 18. However, it can be arbitrarily set according to the number of medium lattices, such as 1.5 times or 3 times. The arrangement pitch of the medium lattices 24 is too small or too large, so that the arrangement of the first large lattice 16A and the second large lattice 16B becomes difficult and the appearance may be deteriorated. 1 to 10 times the arrangement pitch P is more preferable, and 1 to 5 times is more preferable.
The size of the small lattice 18 (the length of one side, the length of the diagonal line, etc.), the number of small lattices 18 constituting the first large lattice 16A, and the number of small lattices 18 constituting the second large lattice 16B are also as follows. It can be set as appropriate according to the size and resolution (number of wires) of the applied touch panel.

  In the first laminated conductive sheet 12A described above, as shown in FIGS. 3, 4, and 5A, the first conductive pattern 26A is formed on one main surface of the first transparent base 14A, and the main part of the second transparent base 14B is formed. The second conductive pattern 26B is formed on the surface. In addition, as shown in FIG. 5B, the first conductive portion 13A is formed on one main surface of the first transparent substrate 14A, and other than the first transparent substrate 14A. The second conductive portion 13B may be formed on the main surface. In this case, the second transparent substrate 14B does not exist, the first transparent substrate 14A is laminated on the second conductive portion 13B, and the first conductive portion 13A is laminated on the first transparent substrate 14A. Further, there may be another layer between the first conductive sheet 10A and the second conductive sheet 10B. If the first conductive pattern 26A and the second conductive pattern 26B are in an insulating state, they are opposed to each other. May be arranged.

In this case, as schematically shown in FIGS. 8A to 8C, three configuration modes can be preferably adopted.
That is, in the first configuration example shown in FIG. 8A, the first laminated conductive sheet 12A (the first conductive portion 13A, the first transparent base 14A, and the second conductive layer shown in FIG. 5B is disposed on the display device 108 via the transparent adhesive 120. 13B), a hard coat layer 122 is laminated on the first laminated conductive sheet 12A, and an antireflection layer 124 is laminated on the hard coat layer 122. Here, the touch panel 100 is configured by the transparent adhesive 120, the second conductive portion 13 </ b> B, the first transparent base 14 </ b> A, and the first conductive portion 13 </ b> A on the display device 108, and the hard coat layer 122 and the antireflection on the touch panel 100. The layer 124 constitutes an antireflection film 126.

  In the second configuration example shown in FIG. 8B, the first laminated conductive sheet 12A and the protective resin layer 128 shown in FIG. 5B are laminated on the display device 108 via the transparent adhesive 120, and further on the protective resin layer 128. A hard coat layer 122 is laminated, and an antireflection layer 124 is laminated on the hard coat layer 122. Here, the touch panel 100 is configured by the transparent adhesive 120, the second conductive portion 13B, the first transparent base 14A, the first conductive portion 13A, and the protective resin layer 128 on the display device 108, and the hard coat on the touch panel 100 is formed. The layer 122 and the antireflection layer 124 constitute an antireflection film 126.

  In the third configuration example shown in FIG. 8C, the first laminated conductive sheet 12A and the second transparent adhesive 120B shown in FIG. 5B are laminated on the display device 108 via the first transparent adhesive 120A. A transparent film 130 is laminated on the transparent adhesive 120B, a hard coat layer 122 is laminated on the transparent film 130, and an antireflection layer 124 is laminated on the hard coat layer 122. Here, the touch panel 100 is configured by the first transparent adhesive 120A, the second conductive portion 13B, the first transparent base 14A, the first conductive portion 13A, and the second transparent adhesive 120B on the display device 108. The upper transparent film 130, the hard coat layer 122, and the antireflection layer 124 constitute an antireflection film 126.

  In addition, as shown in FIG. 3, for example, the first conductive sheet 10A and the second conductive sheet 10B are positioned at the corner portions, for example, at the first conductive sheet 10A and the second conductive sheet 10B. It is preferable to form the first alignment mark 118a and the second alignment mark 118b. The first alignment mark 118a and the second alignment mark 118b become new composite alignment marks when the first conductive sheet 10A and the second conductive sheet 10B are bonded to form the first laminated conductive sheet 12A. The mark also functions as an alignment mark for positioning used when the first laminated conductive sheet 12A is installed on the display panel 110.

Next, a conductive sheet for a touch panel (hereinafter referred to as a second laminated conductive sheet 12B) according to a second embodiment will be described with reference to FIGS.
As shown in FIG. 9, the second laminated conductive sheet 12B has substantially the same configuration as the first laminated conductive sheet 12A described above, but the shape of the first insulation pattern 34A and the second insulation in the first insulation portion 28A. The shape of the second insulating pattern 34B in the portion 28B is different.

  That is, as shown in FIG. 10, the first aggregate pattern portion 36a of the first insulating pattern 34A has a shape in which the first blank portion 38a (see FIG. 1) is filled with the second aggregate pattern portion 36b (see FIG. 6). The small lattice 18 is filled up from one short straight line portion to the other short straight line portion. Accordingly, the first blank portion 38a does not exist. Further, as shown in FIG. 11, the fourth blank portion 38d of the second insulating pattern 34B has a shape in which the second aggregate pattern portion 36b (see FIG. 6) is removed. That is, the second insulating portion 28B has a shape in which the small lattice 18 does not exist.

  For example, when the first conductive sheet 10A is laminated on the second conductive sheet 10B to form the second laminated conductive sheet 12B, as shown in FIG. 12, the first laminated conductive sheet 12A (see FIG. 7) and Similarly, the first connection portion 22A of the first conductive pattern 26A and the second connection portion 22B of the second conductive pattern 26B are opposed to each other with the first transparent base 14A (see FIG. 5A) therebetween, and the first conductive pattern The first insulating portion 28A of 26A and the second insulating portion 28B of the second conductive pattern 26B are opposed to each other with the first transparent base 14A interposed therebetween. Although the line widths of the first conductive pattern 26A and the second conductive pattern 26B are the same, in FIG. 12, as in FIG. 7, the positions of the first conductive pattern 26A and the second conductive pattern 26B can be understood. The line width of the first conductive pattern 26A is widened, and the line width of the second conductive pattern 26B is thinned and exaggerated.

In particular, when a portion where the first insulating pattern 34A of the first insulating portion 28A and the second insulating pattern 34B of the second insulating portion 28B are opposed to each other is viewed from above, the first aggregate pattern portion 36a of the first insulating pattern 34A and The fourth blank portion 38d of the second insulation pattern 34B is opposed to the second blank portion 38b of the first insulation pattern 34A and the first bent pattern portion 48a of the second insulation pattern 34B is opposed to the first blank pattern 38B. The third blank portion 38c of the insulating pattern 34A and the second bent pattern portion 48b of the second insulating pattern 34B are opposed to each other, and like the first laminated conductive sheet 12A, the first insulating pattern 34A and the second insulating pattern 34B are opposed to each other. By combining with the pattern 34B, a plurality of small lattices 18 are formed. As a result, the small lattice 18 constituting the surrounding first large lattice 16A and the small lattice 18 constituting the second large lattice 16B cannot be distinguished from each other, and the visibility is improved.
Also in the second laminated conductive sheet 12B, although not shown, the arrangement state of the first connection part 40a and the second connection part 40b, the arrangement of the first terminal wiring pattern 42a and the second terminal wiring pattern 42b in the terminal wiring part 114 The state and the arrangement state of the first terminals 116a and the second terminals 116b are the same as those of the first laminated conductive sheet 12A described above.

  Accordingly, also in the second laminated conductive sheet 12B, when the second laminated conductive sheet 10B is applied to, for example, a projected capacitive touch panel 100, the response speed can be increased, and the large size of the touch panel 100 can be achieved. Sizing can be promoted. In addition, the boundary between the first large lattice 16A of the first conductive sheet 10A and the second large lattice 16B of the second conductive sheet 10B becomes inconspicuous, and there is no inconvenience such as local thickening of the line. Becomes better.

Next, a conductive sheet for a touch panel according to a third embodiment (hereinafter referred to as a third laminated conductive sheet 12C) will be described with reference to FIGS.
As shown in FIG. 13, the third laminated conductive sheet 12C has substantially the same configuration as the first laminated conductive sheet 12A described above, but the shape of the first insulation pattern 34A and the second insulation in the first insulation portion 28A. The shape of the second insulating pattern 34B in the portion 28B is different.

  That is, as shown in FIG. 14, the first insulating pattern 34A is configured by arranging four wavy line portions 50 (first wavy line portion 50a to fourth wavy line portion 50d) in parallel along the y direction. . Each of the four wavy line portions 50 has a configuration in which two sides constituting the small lattice 18 are continuously arranged. Of the four wavy line portions 50, the small lattice 18 is coupled to both ends of the first wavy line portion 50a and the second wavy line portion 50b arranged on the outer side, and the third wavy line portion 50c and the fourth wavy line portion arranged on the inner side. The small lattice 18 is not coupled to each end of the wavy line portion 50d. The positions of the small lattices 18 formed at both ends of the first wavy line portion 50a and the second wavy line portion 50b are the same as in the case of the long straight line portion of the first insulating pattern 34A in the first laminated conductive sheet 12A. Yes (see FIG. 1).

The directions of the waves of the adjacent first wavy line portion 50a and the third wavy line portion 50c are the same direction (the same pattern), and the directions of the waves of the adjacent second wavy line portion 50b and the fourth wavy line portion 50d are also the same direction ( The same pattern). On the other hand, the directions of the waves of the first wavy line portion 50a and the second wavy line portion 50b arranged on the outside are opposite to each other (reverse pattern), and the third wavy line portion 50c and the fourth wavy line portion 50d arranged on the inner side. Both directions of the waves are also reversed (reverse pattern).
The first insulating pattern 34A includes a first blank portion 38a between the adjacent third wavy line portion 50c and the fourth wavy line portion 50d, so that the first wavy line portion 50a and the third wavy line portion 50c are adjacent to each other. A second blank portion 38b is disposed therebetween, and a third blank portion 38c is disposed between the adjacent second wavy line portion 50b and the fourth wavy line portion 50d.

On the other hand, as shown in FIG. 15, the second insulating pattern 34B includes a first collective pattern portion 36a that fits in the first blank portion 38a of the first insulating pattern 34A and a second blank portion 38b of the first insulating pattern 34A. And a sixth wavy line portion 50f that fits in the third blank portion 38c of the first insulating pattern 34A. The first collective pattern portion 36a is coupled between the first bent pattern portion 48a and the second bent pattern portion 48b, and two or more small lattices 18 (for example, six small lattices) are arranged to connect the vertices. Configured.
In addition, the directions of the first wavy line portion 50a and the third wavy line portion 50c in the first insulating pattern 34A and the wave direction of the fifth wavy line portion 50e in the second insulating pattern 34B are both reversed (reverse pattern). The directions of the waves of the second wavy line portion 50b and the fourth wavy line portion 50d in the first insulating pattern 34A and the sixth wavy line portion 50f in the second insulating pattern 34B are opposite to each other (reverse pattern).

  For example, when the first conductive sheet 10A is laminated on the second conductive sheet 10B to form the third laminated conductive sheet 12C, as shown in FIG. 16, the first laminated conductive sheet 12A (see FIG. 7) and Similarly, the first connection portion 22A of the first conductive pattern 26A and the second connection portion 22B of the second conductive pattern 26B are opposed to each other with the first transparent base 14A (see FIG. 5A) therebetween, and the first conductive pattern The first insulating portion 28A of 26A and the second insulating portion 28B of the second conductive pattern 26B are opposed to each other with the first transparent base 14A interposed therebetween. Although the line widths of the first conductive pattern 26A and the second conductive pattern 26B are the same, the positions of the first conductive pattern 26A and the second conductive pattern 26B in FIG. The line width of the first conductive pattern 26A is widened, and the line width of the second conductive pattern 26B is thinned and exaggerated.

In particular, when the portion where the first insulating pattern 34A of the first insulating portion 28A and the second insulating pattern 34B of the second insulating portion 28B are opposed to each other is viewed from above, the first blank portion 38a of the first insulating pattern 34A and the second The first insulating pattern 34B of the second insulating pattern 34B is opposed to the second blank portion 38b of the first insulating pattern 34A and the fifth wavy line portion 50e of the second insulating pattern 34B is opposed to the first insulating pattern 34B. The third blank portion 38c of the pattern 34A and the sixth wavy line portion 50f of the second insulating pattern 34B are opposed to each other, and the first insulating pattern 34A and the second insulating pattern 34B are the same as the first laminated conductive sheet 12A described above. In combination, the plurality of small lattices 18 are formed. As a result, the small lattice 18 constituting the surrounding first large lattice 16A and the small lattice 18 constituting the second large lattice 16B cannot be distinguished from each other, and the visibility is improved.
Also in the third laminated conductive sheet 12C, although not shown, the arrangement state of the first connection part 40a and the second connection part 40b, the arrangement of the first terminal wiring pattern 42a and the second terminal wiring pattern 42b in the terminal wiring part 114 The state and the arrangement state of the first terminals 116a and the second terminals 116b are the same as those of the first laminated conductive sheet 12A described above.

  Accordingly, also in the third laminated conductive sheet 12C, when the third laminated conductive sheet 12C is applied to, for example, the projected capacitive touch panel 100, the response speed can be increased, and the large size of the touch panel 100 can be achieved. Sizing can be promoted. In addition, the boundary between the first large lattice 16A of the first conductive sheet 10A and the second large lattice 16B of the second conductive sheet 10B becomes inconspicuous, and there is no inconvenience such as local thickening of the line. Becomes better.

Next, a conductive sheet for a touch panel (hereinafter referred to as a fourth laminated conductive sheet 12D) according to a fourth embodiment will be described with reference to FIGS.
As shown in FIGS. 17 and 18A, the fourth laminated conductive sheet 12D is configured by laminating the first conductive sheet 10A on the second conductive sheet 10B in the same manner as the first laminated conductive sheet 12A and the like described above. ing. The first conductive sheet 10A has a first conductive portion 13A formed on one main surface of the first transparent base 14A, and the second conductive sheet 10B is formed on one main surface of the second transparent base 14B. The second conductive portion 13B is provided.
As shown in FIGS. 17 and 19, each of the first conductive portions 13A extends in the first direction (x direction) and is arranged in a second direction (y direction) orthogonal to the first direction. And two or more first conductive patterns 26A configured by the lattice, and first dummy patterns 20A arranged around each first conductive pattern 26A.

The first conductive pattern 26A is configured by connecting two or more first large lattices 16A in series in the first direction, and each first large lattice 16A is configured by combining two or more small lattices 18 respectively. Yes. Further, the above-described first dummy pattern 20A that is not connected to the first large lattice 16A is formed around the side 32 of the first large lattice 16A.
Between the adjacent first large lattices 16A, a first connection portion 22A for electrically connecting the first large lattices 16A is formed. When the direction bisecting the first direction and the second direction is the third direction (m direction), and the direction orthogonal to the third direction is the fourth direction (n direction), the first connecting portion 22A is A medium lattice 24 having a size in which n (n is a real number larger than 1) small lattices 18 are arranged in the fourth direction is arranged. Of the side 32 orthogonal to the fourth direction of the first large lattice 16A, a portion adjacent to the middle lattice 24 is formed with a first notch 60A from which one side of the small lattice 18 is missing. In the example of FIG. 19, the medium lattice 24 has a size in which three small lattices 18 are arranged in the fourth direction.
In addition, a first insulating portion 28A that is electrically insulated is disposed between adjacent first conductive patterns 26A.

Here, the first dummy pattern 20A includes a plurality of first auxiliary lines 62A (the third direction is defined as the axial direction) arranged along the side 32 orthogonal to the third direction among the sides 32 of the first large lattice 16A. A plurality of first auxiliary lines 62A (the fourth direction is defined as the axial direction) arranged along the side 32 orthogonal to the fourth direction among the sides 32 of the first large lattice 16A, and the first The insulating portion 28A has a pattern in which two first L-shaped patterns 64A each formed by combining two first auxiliary lines 62A in an L shape are arranged to face each other.
The length of each first auxiliary line 62A in the axial direction has a length of 4/5 or less, preferably 1/2 or less, of one side along the inner circumference of the small lattice 18. Each first auxiliary line 62A is formed at a position separated from the first large lattice 16A by a predetermined distance. The predetermined distance is a length obtained by subtracting the length in the axial direction of the first auxiliary line 62A from the length of one side along the inner periphery of the small lattice 18. For example, if the length of the first auxiliary line 62A in the axial direction is 4/5 or 1/2 of one side along the inner periphery of the small lattice 18, the predetermined distance is equal to the inner periphery of the small lattice 18. It becomes 1/5 or 1/2 of one side along.

As shown in FIG. 17, the first conductive sheet 10 </ b> A configured as described above has an open end of the first large lattice 16 </ b> A existing on one end side of each first conductive pattern 26 </ b> A as a first connection portion. 22A is not present. The end portion of the first large lattice 16A existing on the other end portion side of each first conductive pattern 26A is electrically connected to the first terminal wiring pattern 42a by the fine metal wire 15 through the first connection portion 40a. Yes.
That is, in the first conductive sheet 10A applied to the touch panel 100, the first conductive patterns 26A described above are arranged at portions corresponding to the sensor unit 112, as shown in FIG. A plurality of first terminal wiring patterns 42a derived from the first connection portion 40a are arranged.

On the other hand, as shown in FIGS. 17 and 20, the second conductive portions 13B of the second conductive sheet 10B extend in the second direction (y direction) and are arranged in the first direction (x direction). , Two or more second conductive patterns 26B configured by a large number of lattices, and second dummy patterns 20B arranged around each second conductive pattern 26B.
The second conductive pattern 26B is configured by connecting two or more second large lattices 16B in series in the second direction, and each second large lattice 16B is configured by combining two or more small lattices 18 respectively. Yes. Further, the above-described second dummy pattern 20B that is not connected to the second large lattice 16B is formed around the side 46 of the second large lattice 16B.
Between the adjacent second large lattices 16B, second connection portions 22B that electrically connect the second large lattices 16B are formed. The second connection portion 22B is configured by arranging a medium lattice 24 having a size in which n (n is a real number larger than 1) small lattices 18 are arranged in the third direction. Of the side 46 orthogonal to the third direction of the second large lattice 16B, a portion adjacent to the middle lattice 24 is formed with a second notched portion 60B in which one side of the small lattice 18 is missing.
Further, a second insulating portion 28B that is electrically insulated is disposed between the adjacent second conductive patterns 26B.

The second dummy pattern 20B includes a plurality of second auxiliary lines 62B (the fourth direction is defined as the axial direction) arranged along the side 46 orthogonal to the fourth direction among the sides 46 of the second large lattice 16B. Among the sides 46 of the second large lattice 16B, a plurality of second auxiliary lines 62B (the third direction is an axial direction) arranged along the side 46 orthogonal to the third direction, and the second insulating portion 28B. , Two second L-shaped patterns 64B each having two second auxiliary lines 62B combined in an L-shape are arranged opposite to each other.
The length in the axial direction of each second auxiliary line 62B is 4/5 or less, preferably 1/2 or less, of one side along the inner circumference of the small lattice 18, like the first auxiliary line 62A described above. Has a length. Each of the second auxiliary lines 62B is formed at a position separated from the second large lattice 16B by a predetermined distance. This predetermined distance is also the length obtained by subtracting the length in the axial direction of the second auxiliary line 62B from the length of one side along the inner periphery of the small lattice 18 in the same manner as the first auxiliary line 62A described above. is there. For example, if the length of the second auxiliary line 62B in the axial direction is 4/5 or 1/2 of one side along the inner periphery of the small lattice 18, the predetermined distance is equal to the inner periphery of the small lattice 18. It becomes 1/5 or 1/2 of one side along.

As shown in FIG. 17, the second conductive sheet 10 </ b> B configured as described above has an open end of the second large lattice 16 </ b> B existing on one end side of each second conductive pattern 26 </ b> B as a second connection portion. 22B does not exist. On the other hand, the second large lattice 16B existing on the other end side of each odd-numbered second conductive pattern 26B and the second end existing on one end side of each even-numbered second conductive pattern 26B. The end portions of the large lattice 16B are electrically connected to the second terminal wiring patterns 42b formed by the thin metal wires 15 through the second connection portions 40b.
That is, in the second conductive sheet 10B applied to the touch panel 100, a large number of second conductive patterns 26B are arranged at portions corresponding to the sensor portions 112, and the terminal wiring portions 114 are led out from the respective second connection portions 40b. A plurality of second terminal wiring patterns 42b are arranged.
For example, when the first conductive sheet 10A is laminated on the second conductive sheet 10B to form the fourth laminated conductive sheet 12D, the first conductive pattern 26A and the second conductive pattern 26B intersect as shown in FIG. Specifically, the first connection portion 22A of the first conductive pattern 26A and the second connection portion 22B of the second conductive pattern 26B serve as the first transparent substrate 14A (see FIG. 18A). The first insulating portion 28A of the first conductive portion 13A and the second insulating portion 28B of the second conductive portion 13B are opposed to each other with the first transparent base 14A interposed therebetween.

When the fourth laminated conductive sheet 12D is viewed from above, as shown in FIG. 21, the second large portion of the second conductive sheet 10B is filled so as to fill the gaps of the first large lattice 16A formed in the first conductive sheet 10A. The lattice 16B is arranged. At this time, a combination pattern 66 is formed between the first large lattice 16A and the second large lattice 16B because the first dummy pattern 20A and the second dummy pattern 20B face each other. As shown in FIG. 22, in the combination pattern 66, the first axis 68A of the first auxiliary line 62A matches the second axis 68B of the second auxiliary line 62B, and the first auxiliary line 62A and the second auxiliary line 62B does not overlap, and one end of the first auxiliary line 62A coincides with one end of the second auxiliary line 62B, so that one side of the small lattice 18 is formed. That is, the combination pattern 66 is a form in which two or more small lattices 18 are combined, and has the same pattern as the inside of the first large lattice 16A and the second large lattice 16B. As a result, when the fourth laminated conductive sheet 12D is viewed from the upper surface, a large number of small lattices 18 are spread as shown in FIG. Further, as shown in FIG. 18A, the projection distance Lf between the side 32 of the first large lattice 16A and the long side 46 of the second large lattice 16B is substantially the same as the length of one side of the small lattice 18, and the parasitic capacitance It is advantageous for reduction of
Also in the fourth laminated conductive sheet 12D, although not shown, the arrangement state of the first connection part 40a and the second connection part 40b, the arrangement of the first terminal wiring pattern 42a and the second terminal wiring pattern 42b in the terminal wiring part 114 The state and the arrangement state of the first terminals 116a and the second terminals 116b are the same as those of the first laminated conductive sheet 12A described above.

Therefore, also in the fourth laminated conductive sheet 12D, when the fourth laminated conductive sheet 12D is applied to, for example, the projected capacitive touch panel 100, the response speed can be increased, and the large touch panel 100 can be obtained. Sizing can be promoted. In addition, the boundary between the first large lattice 16A of the first conductive sheet 10A and the second large lattice 16B of the second conductive sheet 10B becomes inconspicuous, and there is no inconvenience such as local thickening of the line. Becomes better.
As shown in FIG. 18B, the first conductive portion 13A is formed on one main surface of the first transparent base 14A, and the second conductive portion 13B is formed on the other main surface of the first transparent base 14A. Good.
In the above-described example, the first conductive sheet 10A and the second conductive sheet 10B are applied to the projected capacitive touch panel 100. In addition, a surface capacitive touch panel, a resistive film type, and the like are used. Of course, it can be applied to other touch panels.

  Next, as a method of forming the first conductive portion 13A and the second conductive portion 13B, for example, a photosensitive layer having an emulsion layer containing a photosensitive silver halide salt on the first transparent substrate 14A and the second transparent substrate 14B. By exposing the material and performing development processing, the first conductive portion 13A and the second conductive portion 13B may be formed by forming a metallic silver portion and a light transmissive portion in the exposed portion and the unexposed portion, respectively. Good. In addition, you may make it carry | support a conductive metal to a metal silver part by giving a physical development and / or a plating process to a metal silver part further.

  On the other hand, as shown in FIGS. 5B and 18B, the first conductive portion 13A is formed on one main surface of the first transparent base 14A, and the second conductive portion 13B is formed on the other main surface of the first transparent base 14A. In accordance with a normal manufacturing method, when one main surface is first exposed and then the other main surface is exposed, a first conductive portion 13A and a second conductive portion 13B having a desired pattern are obtained. May not be possible. In particular, as shown in FIG. 1 and the like, the first dummy pattern 20A formed around the side 32 of the first large lattice 16A, the first insulating pattern 34A disposed in the first insulating portion 28A, and FIG. As shown in FIG. 19, the second dummy pattern 20B formed around the long side 46 of the second large lattice 16B, the second insulating pattern 34B arranged in the second insulating portion 28B, or the first dummy pattern 20B as shown in FIG. A pattern in which a large number of first auxiliary lines 62A are arranged along the side 32 of the large lattice 16A, a first L-shaped pattern 64A disposed in the first insulating portion 28A, and a second large lattice as shown in FIG. It is difficult to uniformly form a pattern in which a large number of second auxiliary lines 62B are arranged along the side 46 of 16B and the second L-shaped pattern 64B arranged in the second insulating portion 28B.

Therefore, the following manufacturing method can be preferably employed.
That is, the photosensitive silver halide emulsion layer formed on both surfaces of the first transparent substrate 14A is collectively exposed to form the first conductive portion 13A on one main surface of the first transparent substrate 14A. The second conductive portion 13B is formed on the other main surface of the transparent substrate 14A.

A specific example of this manufacturing method will be described with reference to FIGS.
First, in step S1 of FIG. 23, a long photosensitive material 140 is prepared. As shown in FIG. 24A, the photosensitive material 140 includes a first transparent substrate 14A and a photosensitive silver halide emulsion layer (hereinafter referred to as a first photosensitive layer 142a) formed on one main surface of the first transparent substrate 14A. And a photosensitive silver halide emulsion layer (hereinafter referred to as a second photosensitive layer 142b) formed on the other main surface of the first transparent substrate 14A.

  In step S2 of FIG. 23, the photosensitive material 140 is exposed. In this exposure processing, the first photosensitive layer 142a is irradiated with light toward the first transparent substrate 14A to expose the first photosensitive layer 142a along the first exposure pattern, and the second photosensitive layer. The layer 142b is subjected to a second exposure process in which light is irradiated toward the first transparent substrate 14A to expose the second photosensitive layer 142b along the second exposure pattern (double-sided simultaneous exposure). In the example of FIG. 24B, the first photosensitive layer 142a is irradiated with the first light 144a (parallel light) through the first photomask 146a while the long photosensitive material 140 is conveyed in one direction, and the second photosensitive material 140a. The layer 142b is irradiated with the second light 144b (parallel light) through the second photomask 146b. The first light 144a is obtained by converting the light emitted from the first light source 148a into parallel light by the first collimator lens 150a, and the second light 144b is emitted from the second light source 148b. It is obtained by converting the light into parallel light by the second collimator lens 150b in the middle. In the example of FIG. 24B, the case where two light sources (first light source 148 a and second light source 148 b) are used is shown, but the light emitted from one light source is divided through the optical system to generate the first light. The first photosensitive layer 142a and the second photosensitive layer 142b may be irradiated as the 144a and the second light 144b.

  Then, in step S3 of FIG. 23, the exposed photosensitive material 140 is developed to produce the first laminated conductive sheet 12A, for example, as shown in FIG. 5B. The first laminated conductive sheet 12A includes a first transparent base 14A and a first conductive portion 13A (first conductive pattern 26A, etc.) along a first exposure pattern formed on one main surface of the first transparent base 14A. And a second conductive portion 13B (second conductive pattern 26B, etc.) along the second exposure pattern formed on the other main surface of the first transparent substrate 14A. Note that the exposure time and development time of the first photosensitive layer 142a and the second photosensitive layer 142b vary depending on the type of the first light source 148a and the second light source 148b, the type of the developer, and the like. However, the exposure time and the development time are adjusted so that the development rate becomes 100%.

  In the manufacturing method according to the present embodiment, as shown in FIG. 25, in the first exposure process, a first photomask 146a is placed in close contact with the first photosensitive layer 142a, for example, and the first photomask 146a. The first photosensitive layer 142a is exposed by irradiating the first light 144a from the first light source 148a disposed opposite to the first photomask 146a. The first photomask 146a includes a glass substrate made of transparent soda glass and a mask pattern (first exposure pattern 152a) formed on the glass substrate. Therefore, the first exposure process exposes a portion of the first photosensitive layer 142a along the first exposure pattern 152a formed on the first photomask 146a. A gap of about 2 to 10 μm may be provided between the first photosensitive layer 142a and the first photomask 146a.

  Similarly, in the second exposure process, for example, the second photomask 146b is disposed in close contact with the second photosensitive layer 142b, and the second photomask 146b from the second light source 148b disposed to face the second photomask 146b. The second photosensitive layer 142b is exposed by irradiating the second light 144b toward. Similarly to the first photomask 146a, the second photomask 146b includes a glass substrate formed of transparent soda glass and a mask pattern (second exposure pattern 152b) formed on the glass substrate. Yes. Accordingly, the second exposure process exposes a portion of the second photosensitive layer 142b along the second exposure pattern 152b formed on the second photomask 146b. In this case, a gap of about 2 to 10 μm may be provided between the second photosensitive layer 142b and the second photomask 146b.

  In the first exposure process and the second exposure process, the emission timing of the first light 144a from the first light source 148a and the emission timing of the second light 144b from the second light source 148b may be made simultaneously or different. Also good. At the same time, the first photosensitive layer 142a and the second photosensitive layer 142b can be exposed simultaneously by one exposure process, and the processing time can be shortened.

By the way, when both the first photosensitive layer 142a and the second photosensitive layer 142b are not spectrally sensitized, when the photosensitive material 140 is exposed from both sides, the exposure from one side affects the image formation on the other side (back side). Will be affected.
That is, the first light 144a from the first light source 148a that has reached the first photosensitive layer 142a is scattered by the silver halide grains in the first photosensitive layer 142a, passes through the first transparent substrate 14A as scattered light, Part of it reaches the second photosensitive layer 142b. Then, the boundary portion between the second photosensitive layer 142b and the first transparent substrate 14A is exposed over a wide range, and a latent image is formed. Therefore, in the second photosensitive layer 142b, the exposure with the second light 144b from the second light source 148b and the exposure with the first light 144a from the first light source 148a are performed, and the first stacked conductive layer is subjected to subsequent development processing. In the case of the sheet 12A, in addition to the conductive pattern (second conductive portion 13B) by the second exposure pattern 152b, a thin conductive layer by the first light 144a from the first light source 148a is formed between the conductive patterns. A desired pattern (pattern along the second exposure pattern 152b) cannot be obtained. The same applies to the first photosensitive layer 142a.

In order to avoid this, as a result of intensive studies, the thickness of the first photosensitive layer 142a and the second photosensitive layer 142b is set to a specific range, and the amount of silver applied to the first photosensitive layer 142a and the second photosensitive layer 142b is specified. By doing so, it was found that the silver halide itself absorbs light and can limit light transmission to the back surface. In the present embodiment, the thickness of the first photosensitive layer 142a and the second photosensitive layer 142b can be set to 1 μm or more and 4 μm or less. The upper limit is preferably 2.5 μm. Further, the coating silver amount of the first photosensitive layer 142a and the second photosensitive layer 142b was regulated to 5 to 20 g / m ² .

  In the above-described double-sided exposure method, image defects due to exposure inhibition due to dust adhering to the film surface becomes a problem. It is known to apply a conductive material to the film as a dust prevention, but metal oxides remain after processing, impairing the transparency of the final product, and conductive polymers are storable. There is a problem. Thus, as a result of intensive studies, it was found that the silver halide with a reduced amount of binder provided the necessary conductivity for antistatic, and the volume ratio of silver / binder in the first photosensitive layer 142a and the second photosensitive layer 142b was defined. . That is, the silver / binder volume ratio of the first photosensitive layer 142a and the second photosensitive layer 142b is 1/1 or more, and preferably 2/1 or more.

  As described above, by setting and defining the thickness of the first photosensitive layer 142a and the second photosensitive layer 142b, the amount of coated silver, and the volume ratio of silver / binder, the first photosensitive layer 142a can be formed as shown in FIG. The reached first light 144a from the first light source 148a does not reach the second photosensitive layer 142b. Similarly, the second light 144b from the second light source 148b that reaches the second photosensitive layer 142b is changed to the first photosensitive layer. As a result, when the first laminated conductive sheet 12A is formed in the subsequent development processing, as shown in FIG. 5B, one main surface of the first transparent substrate 14A is formed by the first exposure pattern 152a. Only a conductive pattern (pattern constituting the first conductive portion 13A) is formed, and a conductive pattern (second conductive portion 13B) by the second exposure pattern 152b is formed on the other main surface of the first transparent substrate 14A. Will be configured to pattern) only is formed, it is possible to obtain a desired pattern.

  Thus, in the manufacturing method using the above-described double-sided batch exposure, it is possible to obtain the first photosensitive layer 142a and the second photosensitive layer 142b that have both conductivity and suitability for double-sided exposure. The same pattern or different patterns can be arbitrarily formed on both surfaces of the first transparent substrate 14A by the exposure process on the first transparent substrate 14A, whereby the electrodes of the touch panel 100 can be easily formed, The touch panel 100 can be thinned (low profile).

The above-described example is a manufacturing method for forming the first conductive pattern 26A and the second conductive pattern 26B using the photosensitive silver halide emulsion layer. Other manufacturing methods include the following manufacturing methods. .
That is, the photoresist film on the copper foil formed on the first transparent substrate 14A and the second transparent substrate 14B is exposed and developed to form a resist pattern, and the copper foil exposed from the resist pattern is etched. The first conductive pattern 26A and the second conductive pattern 26B may be formed.
Alternatively, the first conductive pattern 26A and the second conductive pattern 26B are formed by printing a paste containing metal fine particles on the first transparent substrate 14A and the second transparent substrate 14B and performing metal plating on the paste. Also good.
Alternatively, the first conductive pattern 26A and the second conductive pattern 26B may be printed and formed on the first transparent substrate 14A and the second transparent substrate 14B by a screen printing plate or a gravure printing plate.
Alternatively, the first conductive pattern 26A and the second conductive pattern 26B may be formed by inkjet on the first transparent substrate 14A and the second transparent substrate 14B.

Next, in the first conductive sheet 10A and the second conductive sheet 10B according to this embodiment, a method using a silver halide photographic light-sensitive material that is a particularly preferable aspect will be mainly described.
The manufacturing method of the first conductive sheet 10A and the second conductive sheet 10B according to the present embodiment includes the following three modes depending on the mode of the photosensitive material and the development process.
(1) A mode in which a photosensitive silver halide black-and-white photosensitive material not containing physical development nuclei is chemically developed or thermally developed to form a metallic silver portion on the photosensitive material.
(2) An embodiment in which a photosensitive silver halide black-and-white photosensitive material containing physical development nuclei in a silver halide emulsion layer is dissolved and physically developed to form a metallic silver portion on the photosensitive material.
(3) A photosensitive silver halide black-and-white photosensitive material containing no physical development nuclei and an image receiving sheet having a non-photosensitive layer containing physical development nuclei are overlapped and developed by diffusion transfer, and the metallic silver portion is non-photosensitive image-receiving sheet. Form formed on top.

The aspect (1) is an integrated black-and-white development type, and a light-transmitting conductive film such as a light-transmitting conductive film is formed on the photosensitive material. The resulting developed silver is chemically developed silver or heat developed silver, and is highly active in the subsequent plating or physical development process in that it is a filament with a high specific surface.
In the above aspect (2), the light-transmitting conductive film such as a light-transmitting conductive film is formed on the photosensitive material by dissolving silver halide grains close to the physical development nucleus and depositing on the development nucleus in the exposed portion. A characteristic film is formed. This is also an integrated black and white development type. Although the development action is precipitation on the physical development nuclei, it is highly active, but developed silver is a sphere with a small specific surface.
In the above aspect (3), the silver halide grains are dissolved and diffused in the unexposed area and deposited on the development nuclei on the image receiving sheet, whereby a light transmitting conductive film or the like is formed on the image receiving sheet. A conductive film is formed. This is a so-called separate type in which the image receiving sheet is peeled off from the photosensitive material.

In either embodiment, either negative development processing or reversal development processing can be selected (in the case of the diffusion transfer method, negative development processing is possible by using an auto-positive type photosensitive material as the photosensitive material). .
The chemical development, thermal development, dissolution physical development, and diffusion transfer development mentioned here have the same meanings as are commonly used in the industry, and are general textbooks of photographic chemistry such as Shinichi Kikuchi, “Photochemistry” (Kyoritsu Publishing) (Published in 1955), C.I. E. K. It is described in "The Theory of Photographic Processes, 4th ed." Edited by Mees (Mcmillan, 1977). Although this case is an invention related to liquid processing, a technique of applying a thermal development system as another development system can also be referred to. For example, the techniques described in Japanese Patent Application Laid-Open Nos. 2004-184893, 2004-334077, and 2005-010752, and Japanese Patent Application Nos. 2004-244080 and 2004-085655 can be applied. it can.

Here, the configuration of each layer of the first conductive sheet 10A and the second conductive sheet 10B according to the present embodiment will be described in detail below.
[First Transparent Base 14A, Second Transparent Base 14B]
Examples of the first transparent substrate 14A and the second transparent substrate 14B include a plastic film, a plastic plate, and a glass plate.
Examples of the raw material for the plastic film and the plastic plate include polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN); polyolefins such as polyethylene (PE), polypropylene (PP), polystyrene, and EVA; Resin; In addition, polycarbonate (PC), polyamide, polyimide, acrylic resin, triacetyl cellulose (TAC) and the like can be used.
As the first transparent substrate 14A and the second transparent substrate 14B, PET (melting point: 258 ° C.), PEN (melting point: 269 ° C.), PE (melting point: 135 ° C.), PP (melting point: 163 ° C.), polystyrene (melting point: 230 ° C.), polyvinyl chloride (melting point: 180 ° C.), polyvinylidene chloride (melting point: 212 ° C.), TAC (melting point: 290 ° C.) or the like, preferably a plastic film having a melting point of about 290 ° C. or less, or a plastic plate, In particular, PET is preferable from the viewpoints of light transmittance and processability. Since the conductive films such as the first conductive sheet 10A and the second conductive sheet 10B used for the first laminated conductive sheet 12A to the third laminated conductive sheet 12C are required to be transparent, the first transparent substrate 14A and the first conductive sheet 14A The transparency of the two transparent substrate 14B is preferably high.

[Silver salt emulsion layer]
Conductive layers of the first conductive sheet 10A and the second conductive sheet 10B (the first large lattice 16A, the first connecting portion 22A, the first insulating pattern 34A of the first insulating portion 28A, the second large lattice 16B, the second connecting portion 22B). The silver salt emulsion layer serving as the second insulating pattern 34B, the conductive portion such as the small lattice 18 in the second insulating portion 28B) contains additives such as a solvent and a dye in addition to the silver salt and the binder.
Examples of the silver salt used in the present embodiment include inorganic silver salts such as silver halide and organic silver salts such as silver acetate. In the present embodiment, it is preferable to use silver halide having excellent characteristics as an optical sensor.
Silver coating amount of silver salt emulsion layer (coating amount of silver salt) is preferably from 1 to 30 g / ^{m 2} in terms of silver, more preferably 1 to 25 g / ^{m 2,} more preferably 5 to 20 g / ^{m 2} . By setting the coated silver amount within the above range, a desired surface resistance can be obtained when the first laminated conductive sheet 12A to the third laminated conductive sheet 12C are used.
Examples of the binder used in the present embodiment include gelatin, polyvinyl alcohol (PVA), polyvinyl pyrrolidone (PVP), starch and other polysaccharides, cellulose and derivatives thereof, polyethylene oxide, polyvinyl amine, chitosan, polylysine, and polyacryl. Examples include acid, polyalginic acid, polyhyaluronic acid, carboxycellulose and the like. These have neutral, anionic, and cationic properties depending on the ionicity of the functional group.
The content of the binder contained in the silver salt emulsion layer of the present embodiment is not particularly limited, and can be appropriately determined as long as dispersibility and adhesion can be exhibited. The binder content in the silver salt emulsion layer is preferably ¼ or more, more preferably ½ or more in terms of the silver / binder volume ratio. The silver / binder volume ratio is preferably 100/1 or less, and more preferably 50/1 or less. The silver / binder volume ratio is more preferably 1/1 to 4/1. Most preferably, it is 1/1 to 3/1. By setting the silver / binder volume ratio in the silver salt emulsion layer within this range, even when the amount of coated silver is adjusted, variation in resistance value is suppressed, and the first laminated conductive sheets 12A to 3A having uniform surface resistance are provided. A laminated conductive sheet 12C can be obtained. The silver / binder volume ratio is converted from the amount of silver halide / binder amount (weight ratio) of the raw material to the amount of silver / binder amount (weight ratio), and the amount of silver / binder amount (weight ratio) is further converted to the amount of silver. / It can obtain | require by converting into binder amount (volume ratio).

<Solvent>
The solvent used for forming the silver salt emulsion layer is not particularly limited. For example, water, organic solvents (for example, alcohols such as methanol, ketones such as acetone, amides such as formamide, dimethyl sulfoxide, etc. Sulphoxides such as, esters such as ethyl acetate, ethers, etc.), ionic liquids, and mixed solvents thereof.
The content of the solvent used in the silver salt emulsion layer of the present embodiment is in the range of 30 to 90% by mass with respect to the total mass of the silver salt and binder contained in the silver salt emulsion layer, and 50 to 80 It is preferably in the range of mass%.

<Other additives>
There are no particular restrictions on the various additives used in the present embodiment, and known ones can be preferably used.
[Other layer structure]
A protective layer (not shown) may be provided on the silver salt emulsion layer. In the present embodiment, the “protective layer” means a layer made of a binder such as gelatin or a high molecular polymer, and is formed on a silver salt emulsion layer having photosensitivity in order to exhibit an effect of preventing scratches and improving mechanical properties. It is formed. The thickness is preferably 0.5 μm or less. The coating method and forming method of the protective layer are not particularly limited, and a known coating method and forming method can be appropriately selected. An undercoat layer, for example, can be provided below the silver salt emulsion layer.

Next, each step of the manufacturing method of the first conductive sheet 10A and the second conductive sheet 10B will be described.
[exposure]
In the present embodiment, the case where the first conductive pattern 26A and the second conductive pattern 26B are applied by a printing method is included, but the first conductive pattern 26A and the second conductive pattern 26B are formed by exposure and development, etc., except for the printing method. To do. That is, exposure is performed on a photosensitive material having a silver salt-containing layer provided on the first transparent substrate 14A and the second transparent substrate 14B or a photosensitive material coated with a photolithography photopolymer. The exposure can be performed using electromagnetic waves. Examples of the electromagnetic wave include light such as visible light and ultraviolet light, and radiation such as X-rays. Furthermore, a light source having a wavelength distribution may be used for exposure, or a light source having a specific wavelength may be used.

[Development processing]
In this embodiment, after the emulsion layer is exposed, development processing is further performed. The development processing can be performed by a normal development processing technique used for silver salt photographic film, photographic paper, printing plate-making film, photomask emulsion mask, and the like. The developer is not particularly limited, but a PQ developer, MQ developer, MAA developer and the like can also be used. Commercially available products include, for example, CN-16, CR-56, CP45X, and FD prescribed by FUJIFILM Corporation. -3, Papitol, a developer such as C-41, E-6, RA-4, D-19, D-72, etc. formulated by KODAK, or a developer included in the kit can be used. A lith developer can also be used.
The development processing in the present invention can include a fixing processing performed for the purpose of removing and stabilizing the silver salt in the unexposed portion. For the fixing process in the present invention, a fixing process technique used for silver salt photographic film, photographic paper, film for printing plate making, emulsion mask for photomask, and the like can be used.
The fixing temperature in the fixing step is preferably about 20 ° C. to about 50 ° C., more preferably 25 to 45 ° C. The fixing time is preferably 5 seconds to 1 minute, more preferably 7 seconds to 50 seconds. The replenishing amount of the fixing solution is preferably 600 ml / ^{m 2} or less with respect to the processing of the photosensitive material, more preferably 500 ml / ^{m 2} or less, 300 ml / ^{m 2} or less is particularly preferred.
The light-sensitive material that has been subjected to development and fixing processing is preferably subjected to water washing treatment or stabilization treatment. In the water washing treatment or the stabilization treatment, the washing water amount is usually 20 liters or less per 1 m ^{2 of the} light-sensitive material, and can be replenished in 3 liters or less (including 0, ie, rinsing with water).
The mass of the metallic silver contained in the exposed portion after the development treatment is preferably a content of 50% by mass or more, and 80% by mass or more with respect to the mass of silver contained in the exposed portion before exposure. More preferably. If the mass of silver contained in the exposed portion is 50% by mass or more based on the mass of silver contained in the exposed portion before exposure, it is preferable because high conductivity can be obtained.
The gradation after the development processing in the present embodiment is not particularly limited, but is preferably more than 4.0. When the gradation after the development processing exceeds 4.0, the conductivity of the conductive metal portion can be increased while keeping the light transmissive property of the light transmissive portion high. Examples of means for setting the gradation to 4.0 or higher include the aforementioned doping of rhodium ions and iridium ions.
Although the conductive sheet is obtained through the above steps, the surface resistance of the obtained conductive sheet is 0.1 to 100 ohm / sq. It is preferable that it exists in the range. The lower limit is 1 ohm / sq. 3 ohm / sq. 5 ohm / sq. 10 ohm / sq. It is preferable that The upper limit is 70 ohm / sq. Hereinafter, 50 ohm / sq. The following is preferable. By adjusting the surface resistance in such a range, position detection can be performed even with a large touch panel having an area of 10 cm × 10 cm or more. Further, the conductive sheet after the development treatment may be further subjected to a calendar treatment, and can be adjusted to a desired surface resistance by the calendar treatment.

[Physical development and plating]
In the present embodiment, for the purpose of improving the conductivity of the metallic silver portion formed by the exposure and development processing, physical development and / or plating treatment for supporting the conductive metal particles on the metallic silver portion is performed. May be. In the present invention, the conductive metal particles may be supported on the metallic silver portion by only one of physical development and plating treatment, or the conductive metal particles are supported on the metallic silver portion by combining physical development and plating treatment. Also good. In addition, the thing which performed the physical development and / or the plating process to the metal silver part is called "conductive metal part".
“Physical development” in the present embodiment means that metal particles such as silver ions are reduced by a reducing agent on metal or metal compound nuclei to deposit metal particles. This physical phenomenon is used for instant B & W film, instant slide film, printing plate manufacturing, and the like, and the technology can be used in the present invention.
Further, the physical development may be performed simultaneously with the development processing after exposure or separately after the development processing.
In the present embodiment, the plating treatment can use electroless plating (chemical reduction plating or displacement plating), electrolytic plating, or both electroless plating and electrolytic plating. For the electroless plating in the present embodiment, a known electroless plating technique can be used, for example, an electroless plating technique used in a printed wiring board or the like can be used. Plating is preferred.

[Oxidation treatment]
In the present embodiment, it is preferable to subject the metallic silver portion after the development treatment and the conductive metal portion formed by physical development and / or plating treatment to oxidation treatment. By performing the oxidation treatment, for example, when a metal is slightly deposited on the light transmissive portion, the metal can be removed and the light transmissive portion can be made almost 100% transparent.

[Conductive metal part]
As described above, the line width of the conductive metal portion of the present embodiment is preferably 1 μm or more, 3 μm or more, 4 μm or more, or 5 μm or more, and the upper limit is preferably 15 μm, 10 μm or less, 9 μm or less, or 8 μm or less. . When the line width is less than the above lower limit value, the conductivity becomes insufficient, so that when used for a touch panel, the detection sensitivity becomes insufficient. On the other hand, when the above upper limit is exceeded, moire caused by the conductive metal portion becomes noticeable, or visibility is deteriorated when used for a touch panel. In addition, by being in the said range, the moire of an electroconductive metal part is improved and visibility becomes especially good. The line interval (here, the interval between the opposing sides of the small lattice 18) is preferably 30 μm or more and 500 μm or less, more preferably 50 μm or more and 400 μm or less, and most preferably 100 μm or more and 350 μm or less. The conductive metal portion may have a portion whose line width is wider than 200 μm for the purpose of ground connection or the like.
The conductive metal portion in the present embodiment preferably has an aperture ratio of 85% or more, more preferably 90% or more, and most preferably 95% or more from the viewpoint of visible light transmittance. The aperture ratio refers to the second insulation in the first large lattice 16A, the first connecting portion 22A, the first insulating pattern 34A of the first insulating portion 28A, the second large lattice 16B, the second connecting portion 22B, and the second insulating portion 28B. The ratio is the ratio of the light-transmitting portions excluding the conductive portions such as the pattern 34B and the small lattice 18 to the whole. For example, the aperture ratio of a square lattice having a line width of 15 μm and a pitch of 300 μm is 90%.

[Light transmissive part]
The “light transmissive part” in the present embodiment means a part having translucency other than the conductive metal part in the first conductive sheet 10A and the second conductive sheet 10B. As described above, the transmittance in the light transmissive portion is the transmission indicated by the minimum value of the transmittance in the wavelength region of 380 to 780 nm excluding contributions of light absorption and reflection of the first transparent substrate 14A and the second transparent substrate 14B. The rate is 90% or more, preferably 95% or more, more preferably 97% or more, even more preferably 98% or more, and most preferably 99% or more.
Regarding the exposure method, a method through a glass mask or a pattern exposure method by laser drawing is preferable.

[First conductive sheet 10A and second conductive sheet 10B]
The thickness of the first transparent substrate 14A and the second transparent substrate 14B in the first conductive sheet 10A and the second conductive sheet 10B according to the present embodiment is preferably 5 to 350 μm, and more preferably 30 to 150 μm. Further preferred. If it is the range of 5-350 micrometers, the transmittance | permeability of a desired visible light will be obtained and handling will also be easy.
The thickness of the metallic silver portion provided on the first transparent substrate 14A and the second transparent substrate 14B depends on the coating thickness of the silver salt-containing layer coating applied on the first transparent substrate 14A and the second transparent substrate 14B. Can be determined as appropriate. The thickness of the metallic silver portion can be selected from 0.001 mm to 0.2 mm, but is preferably 30 μm or less, more preferably 20 μm or less, and further preferably 0.01 to 9 μm. And most preferably 0.05 to 5 μm. Moreover, it is preferable that a metal silver part is pattern shape. The metallic silver part may be a single layer or a multilayer structure of two or more layers. When the metallic silver portion is patterned and has a multilayer structure of two or more layers, different color sensitivities can be imparted so as to be sensitive to different wavelengths. Thereby, when the exposure wavelength is changed and exposed, a different pattern can be formed in each layer.
As the thickness of the conductive metal part, the thinner the display panel, the wider the viewing angle of the display panel, and the thinner the display is required for improving the visibility. From such a viewpoint, the thickness of the layer made of the conductive metal carried on the conductive metal part is preferably less than 9 μm, more preferably 0.1 μm or more and less than 5 μm, and more preferably 0.1 μm or more. More preferably, it is less than 3 μm.
In the present embodiment, the thickness of the layer made of conductive metal particles is formed by controlling the coating thickness of the silver salt-containing layer described above to form a metallic silver portion having a desired thickness, and further by physical development and / or plating treatment. Therefore, even the first conductive sheet 10A and the second conductive sheet 10B having a thickness of less than 5 μm, preferably less than 3 μm, can be easily formed.
In addition, in the manufacturing method of the first conductive sheet 10A and the second conductive sheet 10B according to the present embodiment, a process such as plating is not necessarily performed. In the manufacturing method of the first conductive sheet 10A and the second conductive sheet 10B according to the present embodiment, a desired surface resistance can be obtained by adjusting the coating silver amount of the silver salt emulsion layer and the silver / binder volume ratio. It is. In addition, you may perform a calendar process etc. as needed.

(Hardening after development)
It is preferable to perform a film hardening process by immersing the film in a hardener after the silver salt emulsion layer is developed. Examples of the hardener include dialdehydes such as glutaraldehyde, adipaldehyde, 2,3-dihydroxy-1,4-dioxane, and those described in JP-A-2-141279 such as boric acid. .

[Laminated conductive sheet]
An antireflection film 126 may be applied to the laminated conductive sheet. In this case, the first to third configuration examples shown in FIGS. 8A to 8C described above can be preferably employed.
The antireflection film 126 is formed, for example, by forming a hard coat layer 122 and an antireflection layer 124 on the first laminated conductive sheet 12A (see the first configuration example and the second configuration example), or on the first laminated conductive sheet 12A. The transparent film 130, the hard coat layer 122, and the antireflection layer 124 are formed (see the third configuration example).

Hereinafter, a preferred aspect of the antireflection film 126 will be described mainly with reference to the third configuration example.
<Transparent film 130>
Since the transparent film 130 is used on the viewer side surface of the display device 108, the transparent film 130 is required to be a colorless film having high light transmittance and excellent transparency. As such a transparent film 130, it is preferable to use a plastic film. Examples of the polymer forming the plastic film include cellulose acylate (eg, cellulose triacetate such as TAC-TD80U and TD80UF manufactured by Fuji Film Co., Ltd., cellulose diacetate, cellulose acetate propionate, cellulose acetate butyrate), polyamide, and polycarbonate. , Polyester (eg, polyethylene terephthalate, polyethylene naphthalate), polystyrene, polyolefin, norbornene resin (Arton: trade name, manufactured by JSR Corporation), amorphous polyolefin (ZEONEX: trade name, manufactured by Nippon Zeon Co., Ltd.) , (Meth) acrylic resin (Acrypet VRL20A: trade name, manufactured by Mitsubishi Rayon Co., Ltd., including ring structures described in JP-A Nos. 2004-70296 and 2006-171464 Acrylic-based resin). Among these, cellulose triacetate, cellulose acetate propionate, cellulose acetate butyrate, polyethylene terephthalate, and polyethylene naphthalate are preferable, and cellulose triacetate is particularly preferable.
<Hard coat layer 122>
In order to impart the physical strength of the antireflection film 126 to the antireflection film 126, it is preferable to provide a hard coat layer 122. The hard coat layer 122 may be composed of two or more layers.

  The refractive index of the hard coat layer 122 is preferably in the range of 1.48 to 1.90, more preferably 1.50 to 1.80, from the optical design for obtaining an antireflection film. More preferably, it is 1.52-1.65. In this embodiment, since there is at least one low refractive index layer on the hard coat layer 122, when the refractive index is too small, the antireflection property is lowered, and when it is too large, the color of reflected light is strong. Tend to be.

  From the viewpoint of imparting sufficient durability and impact resistance to the antireflection film 126, the hard coat layer 122 has a thickness of usually about 0.5 to 50 μm, preferably 1 to 20 μm, More preferably, it is 2-15 micrometers, Most preferably, it is 3-10 micrometers. Further, the strength of the hard coat layer 122 is preferably 2H or more, more preferably 3H or more, and most preferably 4H or more in a pencil hardness test. Furthermore, in the Taber test according to JISK5400, the smaller the amount of wear of the test piece before and after the test, the better.

  The hard coat layer 122 is preferably formed by a crosslinking reaction or a polymerization reaction of an ionizing radiation curable compound. For example, it can be formed by applying a composition containing an ionizing radiation-curable polyfunctional monomer or polyfunctional oligomer on the transparent film 130 and causing the polyfunctional monomer or polyfunctional oligomer to undergo a crosslinking reaction or a polymerization reaction. . The functional group of the ionizing radiation-curable polyfunctional monomer or polyfunctional oligomer is preferably a light, electron beam, or radiation polymerizable group, and among them, a photopolymerizable functional group is preferable. Examples of the photopolymerizable functional group include unsaturated polymerizable functional groups such as a (meth) acryloyl group, a vinyl group, a styryl group, and an allyl group. Among them, a (meth) acryloyl group is preferable. As specific compounds, the monomers described in paragraphs [0087] and [0088] of JP-A-2006-30740 can be used, and the curing method described in paragraph [0089] of the same publication is used. Can do. In the case of photopolymerization, the photopolymerization initiators described in paragraphs [0090] to [0093] of the same publication can be used.

  The hard coat layer 122 contains matte particles having an average particle diameter of 1.0 to 10.0 μm, preferably 1.5 to 7.0 μm, such as inorganic compound particles or resin particles, for the purpose of imparting internal scattering properties. May be. As these particles, the particles described in paragraph [0114] of JP-A-2006-30740 can be used.

For the binder of the hard coat layer 122, for the purpose of controlling the refractive index of the hard coat layer 122, a high refractive index monomer or inorganic fine particles having a size that does not cause light scattering (the primary particle diameter is 10 to 200 nm), or both Can be added. In addition to the effect of controlling the refractive index, the inorganic fine particles also have an effect of suppressing curing shrinkage due to a crosslinking reaction. As the inorganic fine particles, compounds described as inorganic fillers in paragraph [0120] of JP-A-2006-30740 can be used.
<Antireflection layer 124>

The antireflection film 126 is a film in which the antireflection layer 124 is formed on the hard coat layer 122 (which may include a transparent film 130 as a lower layer), and uses optical interference. Therefore, the antireflection layer 124 is used. Preferably has the refractive index and optical thickness described below. The antireflection layer 124 may be a single layer, but when a lower reflectance is required, a plurality of antireflection layers 124 are stacked. In the lamination of the plurality of antireflection layers 124, optical interference layers having different refractive indexes may be alternately laminated, or two or more optical interference layers having different refractive indexes may be laminated. Specifically, an embodiment in which only a low refractive index layer is provided on the hard coat layer 122, an embodiment in which a high refractive index layer and a low refractive index layer are provided in this order on the hard coat layer 122, and an intermediate refractive index on the hard coat layer 122 A mode in which a layer, a high refractive index layer, and a low refractive index layer are provided in this order is commonly used. Note that low, medium, and high in the refractive index layer are expressions of the relative magnitude relationship of the refractive index. The refractive index of the low refractive index layer is preferably set lower than the refractive index of the hard coat layer 122 described above. When the refractive index difference between the low refractive index layer and the hard coat layer 122 is too small, the antireflection property is lowered, and when it is too large, the color of the reflected light tends to be strong. The difference in refractive index between the low refractive index layer and the hard coat layer 122 is preferably 0.01 or more and 0.40 or less, and more preferably 0.05 or more and 0.30 or less.
The refractive index and thickness of each layer preferably satisfy the following.

  That is, the refractive index of the low refractive index layer is preferably 1.20 to 1.46, more preferably 1.25 to 1.42, and particularly preferably 1.30 to 1.38. preferable. Further, the thickness of the low refractive index layer is preferably 50 to 150 nm, and more preferably 70 to 120 nm.

  In order to produce the antireflection film 126 by laminating a low refractive index layer on a high refractive index layer, the refractive index of the high refractive index layer is preferably 1.55 to 2.40, more preferably. Is 1.60 to 2.20, more preferably 1.65 to 2.10, and most preferably 1.80 to 2.00.

  When the antireflective film 126 is formed by laminating a medium refractive index layer, a high refractive index layer, and a low refractive index layer in order from the transparent film 130 (or the touch panel 100), the refractive index of the high refractive index layer is 1.65. It is preferably ˜2.40, more preferably 1.70 to 2.20. The refractive index of the middle refractive index layer is adjusted to be a value between the refractive index of the low refractive index layer and the refractive index of the high refractive index layer. The refractive index of the middle refractive index layer is preferably 1.55-1.80. In addition, the thickness of the high refractive index layer and the middle refractive index layer can be set to an optical thickness corresponding to the range of the refractive index.

[Low refractive index layer]
The above-described low refractive index layer is preferably cured after the formation of the layer. The haze of the low refractive index layer is preferably 3% or less, more preferably 2% or less, and most preferably 1% or less.

A preferred composition for forming the low refractive index layer of the present invention is preferably a composition containing at least one of the following.
(1) A composition containing a fluorine-containing polymer having a crosslinkable or polymerizable functional group,
(2) a composition comprising as a main component a hydrolysis-condensation product of a fluorine-containing organosilane material;
(3) a composition containing a monomer having two or more ethylenically unsaturated groups and inorganic fine particles having a hollow structure;
Is mentioned.

(1) Fluorine-containing compound having a crosslinkable or polymerizable functional group As the fluorine-containing compound having a crosslinkable or polymerizable functional group, co-polymerization of a fluorine-containing monomer and a monomer having a crosslinkable or polymerizable functional group Coalescence can be mentioned.
Among the above-mentioned copolymers, a copolymer having a main chain composed only of carbon atoms and comprising a fluorine-containing vinyl monomer polymer unit and a polymer unit having a (meth) acryloyl group in the side chain is particularly characterized. P-1 to P-40 described in paragraphs [0043] to [0047] of Kaikai 2004-45462 can be used. Further, as a fluorine-containing polymer into which a silicone component is introduced for improving scratch resistance and slipperiness, a graft polymer having a polymer unit containing a polysiloxane moiety in the side chain and a fluorine atom in the main chain is disclosed in JP The compounds described in Tables 1 and 2 of paragraphs [0074] to [0076] of 2003-222702 can be used, and the ethylenically unsaturated group-containing fluorine containing a structural unit derived from a polysiloxane compound in the main chain As the polymer, compounds described in JP-A No. 2003-183322 can be used.

  As described in JP 2000-17028 A, a curing agent having a polymerizable unsaturated group may be used in combination with the above polymer. Moreover, combined use with a compound having a fluorine-containing polyfunctional polymerizable unsaturated group as described in JP-A No. 2002-145952 is also preferred. Examples of the compound having a polyfunctional polymerizable unsaturated group include the above-described monomers having two or more ethylenically unsaturated groups. Moreover, the hydrolysis-condensation product of the organolane described in Unexamined-Japanese-Patent No. 2004-170901 is also preferable, and the hydrolysis-condensation product of the organosilane containing a (meth) acryloyl group is especially preferable. These compounds are particularly preferred because they have a large combined effect for improving scratch resistance, particularly when a compound having a polymerizable unsaturated group is used in the polymer body.

  When the polymer itself does not have sufficient curability, necessary curability can be imparted by blending a crosslinkable compound. For example, when the polymer body contains a hydroxyl group, various amino compounds are preferably used as the curing agent. The amino compound used as the crosslinkable compound is, for example, a compound containing one or both of a hydroxyalkylamino group and an alkoxyalkylamino group in total, specifically, for example, a melamine compound, Examples include urea compounds, benzoguanamine compounds, glycoluril compounds, and the like. For curing these compounds, an organic acid or a salt thereof is preferably used.

(2) Hydrolyzed condensate of fluorine-containing organosilane material A composition containing a hydrolyzed condensate of a fluorine-containing organosilane compound as a main component is also preferable because of its low refractive index and high hardness on the coating film surface. A condensate of a tetraalkoxysilane with a hydrolyzable silanol-containing compound at one or both ends with respect to the fluorinated alkyl group is preferred. Specific compositions are described in JP-A Nos. 2002-265866 and 2002-317152.

(3) A composition containing a monomer having two or more ethylenically unsaturated groups and inorganic fine particles having a hollow structure As yet another preferred embodiment, a low refractive index layer comprising a low refractive index particle and a binder can be mentioned. . The low refractive index particles may be organic or inorganic, but particles having pores inside are preferable. Specific examples of the hollow particles include silica-based particles described in JP-A No. 2002-79616 (see, for example, paragraphs [0041] to [0049]). The particle refractive index is preferably 1.15 to 1.40, more preferably 1.20 to 1.30. Examples of the binder include monomers having two or more ethylenically unsaturated groups described in the section of the hard coat layer 122 described above.

  It is preferable to add the polymerization initiator described in the above-mentioned item of the hard coat layer 122 (for example, see paragraphs [0090] to [0093] of JP-A-2006-30740) to the low refractive index layer. When a radical polymerizable compound is contained, 1 to 10 parts by mass, preferably 1 to 5 parts by mass of a polymerization initiator can be used with respect to 100 parts by mass of the compound.

  In the low refractive layer, inorganic particles can be used in combination. In order to impart scratch resistance, fine particles having a particle size of 15% to 150%, preferably 30% to 100%, more preferably 45% to 60% of the thickness of the low refractive index layer can be used. .

  For the purpose of imparting antifouling properties, water resistance, chemical resistance, slipping properties, etc., a known polysiloxane-based or fluorine-based antifouling agent, slipping agent, etc. are appropriately added to the low refractive index layer. Can do.

[High refractive index layer / Medium refractive index layer]
As described above, the antireflection film 126 can be provided with a layer having a high refractive index between the low refractive index layer and the hard coat layer 122 to enhance the antireflection property.
The high refractive index layer and the medium refractive index layer are preferably formed from a curable composition containing high refractive inorganic fine particles and a binder. As the high refractive index inorganic fine particles that can be used here, high refractive index inorganic fine particles that can be contained to increase the refractive index of the hard coat layer 122 can be used. As the high refractive index inorganic fine particles, for example, particles of inorganic compounds such as silica particles and TiO ₂ particles; resin particles such as acrylic particles, crosslinked acrylic particles, polystyrene particles, crosslinked styrene particles, melamine resin particles, and benzoguanamine resin particles are preferable. Can be mentioned.

  The high refractive index layer and the medium refractive index layer are preferably formed in a dispersion liquid in which inorganic particles are dispersed in a dispersion medium, preferably a binder precursor necessary for matrix formation (for example, an ionizing radiation curable polyfunctional monomer or Polyfunctional oligomer, etc.), a photopolymerization initiator, etc. are added to form a coating composition for forming a high refractive index layer and a medium refractive index layer. For example, a coating composition for forming a high refractive index layer and a medium refractive index layer on a transparent film It is preferable to form the product by applying a product and curing it by a crosslinking reaction or a polymerization reaction of an ionizing radiation curable compound (for example, a polyfunctional monomer or a polyfunctional oligomer).

Furthermore, it is preferable to cause the binder of the high refractive index layer and the medium refractive index layer to undergo a crosslinking reaction or a polymerization reaction with the dispersant simultaneously with or after the coating of the layer.
The binder of the high refractive index layer and the medium refractive index layer produced in this way is, for example, a preferable dispersant described above and an ionizing radiation curable polyfunctional monomer or polyfunctional oligomer, which are crosslinked or polymerized to form a binder. It becomes a form in which the anionic group of the dispersant is incorporated. Furthermore, the binder of the high refractive index layer and the medium refractive index layer has a function of maintaining the dispersion state of the inorganic particles by the anionic group, and the crosslinked or polymerized structure imparts a film forming ability to the binder and contains inorganic particles. To improve the physical strength, chemical resistance and weather resistance of the high refractive index layer and medium refractive index layer.

The binder of the high refractive index layer is added in an amount of 5 to 80% by mass based on the solid content of the coating composition of the high refractive index layer.
The content of the inorganic particles in the high refractive index layer is preferably 10 to 90% by mass, more preferably 15 to 80% by mass, and particularly preferably 15 to 75% by mass with respect to the mass of the high refractive index layer. . Two or more kinds of inorganic particles may be used in combination in the high refractive index layer.
When the low refractive index layer is provided on the high refractive index layer, the refractive index of the high refractive index layer is preferably higher than the refractive index of the transparent film 130.

The film thickness when the high refractive index layer is used as the optical interference layer is preferably 30 to 200 nm, more preferably 50 to 170 nm, and particularly preferably 60 to 150 nm.
The haze of the high refractive index layer and the medium refractive index layer is preferably as low as possible. It is preferably 5% or less, more preferably 3% or less, and particularly preferably 1% or less.

  The preferred integrated reflectance of the antireflection film 126 provided with the low refractive index layer is preferably 3.0% or less, more preferably 2.0% or less, and most preferably 1.5% or less 0.3% or more. It is.

  From the viewpoint of improving antifouling properties, it is preferable to reduce the surface free energy on the surface of the low refractive index layer. Specifically, it is preferable to use a fluorine-containing compound or a compound having a polysiloxane structure for the low refractive index layer. Further, an antifouling layer containing the following compound may be provided on the low refractive index layer separately from the low refractive index layer.

  Examples of the additive having a polysiloxane structure include a reactive group-containing polysiloxane {for example, “KF-100T”, “X-22-169AS”, “KF-102”, “X-22-3701IE”, “X-22”. -164B "," X-22-5002 "," X-22-173B "," X-22-174D "," X-22-167B "," X-22-161AS "(product name), Shin-Etsu “AK-5”, “AK-30”, “AK-32” (trade name), manufactured by Toa Gosei Co., Ltd .; “Silaplane FM0725”, “Silaplane FM0721” (product) Name), manufactured by Chisso Corporation, etc.} is also preferable. Moreover, the silicone type compound of Table 2 and Table 3 of Unexamined-Japanese-Patent No. 2003-112383 can also be used preferably. These polysiloxanes are preferably added in the range of 0.1 to 10% by mass of the total solid content of the low refractive index layer, particularly preferably 1 to 5% by mass.

[Production Method of Antireflection Film 126]
The antireflection film 126 can be formed by the following coating method, but is not limited thereto.

(Preparation work for application)
First, a coating solution containing components for forming each layer such as the hard coat layer 122 and the antireflection layer 124 is prepared. Usually, since the coating solution is mainly an organic solvent system, it is necessary to suppress the water content to 2% or less and to seal it to suppress the volatilization amount of the solvent. The organic solvent to be used is selected according to the material used for each layer. In order to obtain the uniformity of the coating solution, a stirrer or a disperser is appropriately used.
The adjusted coating solution is preferably filtered before coating so as not to cause a coating failure. It is preferable to use a filter having a pore size as small as possible within a range in which the components in the coating solution are not removed, and the filtration pressure is appropriately selected at 1.5 MPa or less. The filtered coating solution is preferably ultrasonically dispersed immediately before coating to defoam and retain the dispersion.
The transparent film 130 may be subjected to a heat treatment for correcting the base deformation or a surface treatment for improving the coating property and the adhesiveness with the coating layer before coating. Specific methods for the surface treatment include corona discharge treatment, glow discharge treatment, flame treatment, acid treatment, alkali treatment, and ultraviolet irradiation treatment. In addition, as described in JP-A-7-333433, it is preferable to provide an undercoat layer.

  Further, it is preferable to provide a dust removing step as a pre-application step, and as a dust removing method used therefor, the method described in paragraph [0119] of JP 2010-32795 A can be used. In addition, it is particularly preferable to remove static electricity from the transparent film 130 before performing such a dust removal step in terms of increasing dust removal efficiency and suppressing dust adhesion. As such a static elimination method, the method described in paragraph [0120] of JP 2010-32795 A can be used. Further, the flatness of the transparent film 130 may be secured and the adhesiveness may be improved by the method described in paragraphs [0121] and [0123] of the above publication.

(Coating process)
Each layer of the antireflection film 126 can be formed by the following coating method, but is not limited to this method. Dip coating method, air knife coating method, curtain coating method, roller coating method, wire bar coating method, gravure coating method and extrusion coating method (die coating method) (US Pat. No. 2,681,294, International Publication No. 05/123274) A known method such as a microgravure coating method is used, and among these, a microgravure coating method and a die coating method are preferable. The micro gravure coating method is described in paragraphs [0125] and [0126] of JP 2010-32795 A, and the die coating method is described in paragraphs [0127] and [0128] of the above publication. These methods can also be used in the form. It is preferable in terms of productivity to apply at a speed of 20 m / min or more by using a die coating method.

(Drying process)
The antireflective film 126 is preferably applied on the transparent film 130 directly or via other layers and then conveyed in a web to a heated zone to dry the solvent.
Various knowledges can be used as a method for drying the solvent. Specific knowledge includes description techniques such as JP 2001-286817 A, 2001-314798, 2003-126768, 2003-315505, and 2004-34002.

  The conditions described in paragraph [0130] of JP 2010-32795 A can be used for the temperature condition of the drying zone, and the conditions described in paragraph [0131] of the same publication can be used for the condition of the drying air.

(Curing process)
The antireflection film 126 can pass through a zone for curing each coating film by ionizing radiation and / or heat as a web after the solvent is dried or at a later stage of drying to cure the coating film. The above-mentioned ionizing radiation is not particularly limited, and is appropriately selected from ultraviolet rays, electron beams, near-ultraviolet rays, visible light, near-infrared rays, infrared rays, X-rays and the like according to the type of curable composition forming the film. However, ultraviolet rays and electron beams are preferred, and ultraviolet rays are particularly preferred because they are easy to handle and high energy can be easily obtained.

  As the ultraviolet light source for photopolymerizing the ultraviolet curable compound, the light source described in paragraph [0133] of JP 2010-32795 A can be used, and the electron beam described in paragraph [0134] of the same publication is used. Lines can be used. The conditions described in paragraphs [0135] and [0138] of the same publication can be used for the irradiation conditions, irradiation light quantity, and irradiation time. Furthermore, for the film surface temperature, oxygen concentration, and oxygen concentration control method before and after irradiation, use the conditions and methods described in paragraphs [0136], [0137], and [0139] to [0144] of the same publication. Can do.

(Handling for continuous production)
In order to continuously manufacture the antireflection film 126, a process of continuously feeding a roll-shaped transparent film 130, a process of applying and drying a coating liquid, a process of curing a coating film, and the transparent having a cured layer. A step of winding the film 130 is performed.

  The above-described steps may be performed every time each layer is formed, or a plurality of coating units-drying chambers-curing units may be provided (so-called tandem method), and each layer may be formed continuously.

In order to produce the antireflection film 126, as described above, simultaneously with the microfiltration operation of the coating liquid, the coating process in the coating unit and the drying process performed in the drying chamber are performed in a high clean air atmosphere, and It is preferable that dust and dust on the transparent film 130 are sufficiently removed before the application. Air cleanliness in the coating and drying steps, based on the air cleanliness in US Federal Standard 209E standards, it is desirable class 10 is (0.5 [mu] m or more of the particles 353 / m ³ or less) or more, more preferably Is preferably Class 1 (particles of 0.5 μm or more 35.5 particles / m ³ or less) or more. Moreover, it is more preferable that the degree of air cleanliness is high also in the feeding and winding sections other than the coating-drying process.

  In order to maintain the sharpness of the image, the antireflection film 126 preferably adjusts the sharpness of the transmitted image in addition to adjusting the surface shape as smoothly as possible. The transmitted image definition of the antireflection film 126 is preferably 60% or more. The transmitted image definition is generally an index indicating the degree of blurring of an image reflected through the film, and the larger this value, the clearer and better the image viewed through the film. The transmitted image definition is preferably 70% or more, and more preferably 80% or more.

The antireflection film 126 can be used as a surface film on the viewing side of the display device 108. The display device 108 can be applied to various display devices such as various liquid crystal display devices, plasma displays, organic EL, and touch panels. Depending on the properties of the outermost surface of the display device 108 using the antireflection film 126, an adhesive layer is provided on the surface of the antireflection film 126 that does not have the coating layer of the transparent film 130 (hereinafter sometimes referred to as the back surface). Alternatively, the back surface of the transparent film 130 can be saponified and attached to the touch panel 100.
For the method of saponifying the back surface of the transparent film 130, the techniques described in paragraphs [0149] to [0160] of Japanese Patent Application Laid-Open No. 2010-32795 can be used.
In addition, this invention can be used in combination with the technique of the publication gazette and international publication pamphlet which are described in following Table 1 and Table 2. FIG. Notations such as “JP,” “Gazette” and “No. Pamphlet” are omitted.

  Hereinafter, the present invention will be described more specifically with reference to examples of the present invention. In addition, the material, usage-amount, ratio, processing content, processing procedure, etc. which are shown in the following Examples can be changed suitably unless it deviates from the meaning of this invention. Accordingly, the scope of the present invention should not be construed as being limited by the specific examples shown below.

(Silver halide photosensitive material)
An emulsion containing 10.0 g of gelatin per 150 g of Ag in an aqueous medium and containing silver iodobromochloride grains having an average equivalent sphere diameter of 0.1 μm (I = 0.2 mol%, Br = 40 mol%) was prepared. .
In this emulsion, K ₃ Rh ₂ Br ₉ and K ₂ IrCl ₆ were added so as to have a concentration of 10 ⁻⁷ (mol / mol silver), and silver bromide grains were doped with Rh ions and Ir ions. . After adding Na ₂ PdCl ₄ to this emulsion and further performing gold-sulfur sensitization using chloroauric acid and sodium thiosulfate, together with the gelatin hardener, the coating amount of silver was 10 g / m ^2. The first transparent substrate 14A and the second transparent substrate 14B (here, both polyethylene terephthalate (PET)) were applied. At this time, the volume ratio of Ag / gelatin was 2/1.
Coating was performed for 20 m with a width of 25 cm on a PET support having a width of 30 cm, and both ends were cut off by 3 cm so as to leave a central portion of the coating, thereby obtaining a roll-shaped silver halide photosensitive material.

(exposure)
The pattern of exposure is the pattern shown in FIGS. 1 and 4 for the first conductive sheet 10A of the first laminated conductive sheet 12A, and the pattern shown in FIGS. 4 and 6 for the second conductive sheet 10B. 297 mm) for the first transparent substrate 14A and the second transparent substrate 14B (Sample 1). The first conductive sheet 10A of the second laminated conductive sheet 12B is the pattern shown in FIGS. 9 and 10, and the second conductive sheet 10B is the pattern shown in FIGS. 9 and 11, and the A4 size (210 mm × 297 mm) The test was performed on the first transparent substrate 14A and the second transparent substrate 14B (Sample 2). The first conductive sheet 10A of the third laminated conductive sheet 12C has the pattern shown in FIGS. 13 and 14, and the second conductive sheet 10B has the pattern shown in FIGS. 13 and 15, and the A4 size (210 mm × 297 mm) This was performed on the first transparent substrate 14A and the second transparent substrate 14B (Sample 3). The arrangement pitch P of the small lattice 18 was 200 μm, and the arrangement pitch of the medium lattice 24 was 2 × P. The thickness of the conductive portion of the small lattice 18 was 2 μm, and the width was 10 μm. The exposure was performed using parallel light using a high-pressure mercury lamp as a light source through the photomask having the above pattern.

(Development processing)
・ Developer 1L formulation Hydroquinone 20 g
Sodium sulfite 50 g
Potassium carbonate 40 g
Ethylenediamine tetraacetic acid 2 g
Potassium bromide 3 g
Polyethylene glycol 2000 1 g
Potassium hydroxide 4 g
Adjusted to pH 10.3 and formulated 1L fixer ammonium thiosulfate solution (75%) 300 ml
Ammonium sulfite monohydrate 25 g
1,3-diaminopropane tetraacetic acid 8 g
Acetic acid 5 g
Ammonia water (27%) 1 g
Adjusted to pH 6.2 Processed photosensitive material using the above processing agent using Fujifilm's automatic processor FG-710PTS Processing conditions: development 35 ° C. for 30 seconds, fixing 34 ° C. for 23 seconds, washed water (5 L / Min) for 20 seconds.
Example 1
With respect to the produced samples 1 to 3, the line widths of the conductive portions (the first conductive pattern 26A and the second conductive pattern 26B) of the first conductive sheet 10A and the second conductive sheet 10B are 1 μm, and the length of one side of the small lattice 18 is The length of one side of 50 μm and the large lattice (the first large lattice 16A and the second large lattice 16B) was 3 mm.
(Example 2)
For Samples 1 to 3, the first conductive sheet and the second conductive sheet according to Example 2 were the same as Example 1 except that the line width of the conductive portion was 3 μm and the length of one side of the small lattice 18 was 50 μm. Two conductive sheets were produced.
(Example 3)
For Samples 1 to 3, the first conductive sheet and the third conductive sheet according to Example 3 were the same as Example 1 except that the line width of the conductive portion was 4 μm and the length of one side of the small lattice 18 was 50 μm. Two conductive sheets were produced.
Example 4
For Samples 1 to 3, the first conductive sheet and the second conductive sheet according to Example 4 were the same as Example 1 except that the line width of the conductive part was 5 μm and the length of one side of the small lattice 18 was 50 μm. Two conductive sheets were produced.
(Example 5)
For Samples 1 to 3, as in Example 1, except that the line width of the conductive portion was 8 μm, the length of one side of the small lattice 18 was 150 μm, and the length of one side of the large lattice was 5 mm, A first conductive sheet and a second conductive sheet according to Example 5 were produced.
(Example 6)
For Samples 1 to 3, as in Example 1, except that the line width of the conductive portion was 9 μm, the length of one side of the small lattice 18 was 150 μm, and the length of one side of the large lattice was 5 mm, A first conductive sheet and a second conductive sheet according to Example 6 were produced.
(Example 7)
For samples 1 to 3, the line width of the conductive portion was 10 μm, the length of one side of the small lattice 18 was 300 μm, and the length of one side of the large lattice was 6 mm. A first conductive sheet and a second conductive sheet according to Example 7 were produced.
(Example 8)
For Samples 1 to 3, as in Example 1, except that the line width of the conductive portion was 15 μm, the length of one side of the small lattice 18 was 400 μm, and the length of one side of the large lattice was 10 mm, A first conductive sheet and a second conductive sheet according to Example 8 were produced.
(Reference Example 1)
For Samples 1 to 3, the first conductive sheet according to Reference Example 1 is the same as Example 1 except that the line width of the conductive portion is 0.5 μm and the length of one side of the small lattice 18 is 40 μm. And the 2nd conductive sheet was produced.
(Reference Example 2)
For Samples 1 to 3, as in Example 1, except that the line width of the conductive portion was 20 μm, the length of one side of the small lattice 18 was 500 μm, and the length of one side of the large lattice was 10 mm, A first conductive sheet and a second conductive sheet according to Reference Example 2 were produced.

[Evaluation]
For Examples 1 to 8 and Reference Examples 1 and 2 described above, surface resistance, moire and visibility were evaluated. The evaluation results are shown in Table 3.
(Surface resistance measurement)
In order to evaluate the uniformity of the surface resistivity, the surface resistivity of the first conductive sheet 10A and the second conductive sheet 10B is measured with a Learstar GP (model number MCP-T610) in-line four probe probe (ASP) manufactured by Dia Instruments. It is an average value of values measured at arbitrary 10 locations.
(Measurement of transmittance)
In order to confirm transparency, the transmittance of the first conductive sheet 10A and the second conductive sheet 10B was measured using a spectrophotometer.
(Evaluation of moire)
For Reference Examples 1 and 2 and Examples 1 to 8, the first conductive sheet 10A is laminated on the second conductive sheet 10B to produce a laminated conductive sheet, and then the laminated conductive sheet is provided on the display screen 110 of the display device 108. The touch panel 100 was configured by pasting. Thereafter, the touch panel 100 is installed on the turntable, and the display device 108 is driven to display white. In this state, the rotating disk was rotated between a bias angle of −20 ° and + 20 °, and the moire was visually observed and evaluated.
Moire is evaluated at an observation distance of 1.5 m from the display screen of the liquid crystal display device. If moire does not appear, ○, if moire is seen only slightly at a level where there is no problem, moiré becomes apparent. The case where it did is made x.
(Visibility evaluation)
Prior to the above-described moire evaluation, when the touch panel 100 is installed on a turntable and the display device 108 is driven to display white, whether there is any line thickening or black spots, It was confirmed with the naked eye whether the boundary between the large lattice 16A and the second large lattice 16B is noticeable.

(Evaluation results)
The surface resistance of Examples 1 to 8 is 5 ohm / sq. Thus, it was found that the invention can be sufficiently applied to a projected capacitive touch panel having an A4 size. In Examples 1 to 8, all of the transmittance, moire and visibility were good.
Projection capacitive touch panels were produced using the laminated conductive sheets according to Examples 1 to 8 described above. When touched with a finger, it was found that the response speed was fast and the detection sensitivity was excellent. In addition, when two or more points were touched and operated, good results were obtained in the same manner, and it was confirmed that multi-touch could be supported.

  Note that the conductive sheet, the method of using the conductive sheet, and the capacitive touch panel according to the present invention are not limited to the above-described embodiments, and can of course have various configurations without departing from the gist of the present invention. It is.

DESCRIPTION OF SYMBOLS 10A ... 1st conductive sheet 10B ... 2nd conductive sheet 12A-12D ... 1st laminated conductive sheet-4th laminated conductive sheet 14A ... 1st transparent substrate 14B ... 2nd transparent substrate 16A ... 1st large lattice 16B ... 2nd large Lattice 18 ... Small lattice 20A ... First dummy pattern 20B ... Second dummy pattern 22A ... First connection portion 22B ... Second connection portion 26A ... First conductive pattern 26B ... Second conductive pattern 28A ... First insulating portion 28B ... First 2 insulation parts 32a-32d ... 1st side-4th side 34A ... 1st insulation pattern 34B ... 2nd insulation pattern 36a ... 1st aggregate pattern part 36b ... 2nd aggregate pattern part 38a-38d ... 1st blank part-1st 4 blank parts 44a-44d ... 1st short side-4th short side 46a-46d ... 1st long side-4th long side

Claims (26)

Two or more conductive first large lattices of fine metal wires are formed on one main surface of the substrate,
Two or more conductive second large lattices formed of fine metal wires are formed on the other main surface of the base body,
Each of the first large lattice and each of the second large lattices is configured by combining two or more small lattices,
A first non-connection pattern is formed around the side of the first large lattice by a fine metal wire that is not connected to the first large lattice,
Around the side of the second large lattice, a second non-connected pattern is formed by a thin metal wire that is not connected to the second large lattice,
When viewed from above, the second large lattice is arranged adjacent to the first large lattice,
Between the first large lattice and the second large lattice, a combination pattern is formed by the first non-connected pattern and the second non-connected pattern facing each other,
2. The conductive sheet according to claim 1, wherein the combination pattern is configured by combining two or more small lattices. The conductive sheet according to claim 1,
A conductive sheet, wherein a projection distance between a straight line portion on a side of the first large lattice and a straight line portion on a side of the second large lattice is set based on a size of the small lattice. The conductive sheet according to claim 1,
When the shortest distance between the side of the first large lattice and the side of the second large lattice facing the side is defined as the distance of the combination pattern defined as the width of the combination pattern,
The conductive sheet according to claim 1, wherein a width of the combination pattern has a length that is one or more times a length of a side of the small lattice. In the conductive sheet according to claim 3,
The conductive sheet according to claim 1, wherein a width of the combination pattern is twice to ten times a side of the small lattice. The conductive sheet according to claim 1,
Each of the first non-connection patterns has a shape in which two or more shapes obtained by removing a part of the small lattice are arranged along the side of the first large lattice,
The conductive sheet according to claim 2, wherein each of the second non-connection patterns has a shape in which two or more shapes obtained by removing a part of the small lattice are arranged along the side of the second large lattice. The conductive sheet according to claim 5,
The small lattice has a square shape;
Each of the first non-connection pattern and the second non-connection pattern has a shape in which two or more shapes obtained by removing one side of the small lattice are arranged. The conductive sheet according to claim 1,
A first connection portion is formed on one main surface of the base body by a fine metal wire that electrically connects the adjacent first large lattices,
A second connecting portion is formed on the other main surface of the base body by a fine metal wire that electrically connects the adjacent second large lattices;
Two or more of the first large lattices are arranged in the first direction through the first connection portion to constitute one first conductive pattern,
Two or more second large lattices are arranged in a second direction orthogonal to the first direction via the second connection portion to constitute one second conductive pattern,
Two or more first conductive patterns are arranged in the second direction;
Two or more second conductive patterns are arranged in the first direction;
The first connection portion and the second connection portion are opposed to each other with the base interposed therebetween,
A first insulating part that is electrically insulated is disposed between the adjacent first conductive patterns,
A second insulating part that is electrically insulated is disposed between the adjacent second conductive patterns,
The first connection portion and the second connection portion are opposed to each other with the base interposed therebetween,
The first insulating portion and the second insulating portion are opposed to each other with the base interposed therebetween,
The conductive sheet is characterized in that a combination pattern formed by facing the first connection portion and the second connection portion is configured by combining two or more small lattices. The conductive sheet according to claim 7,
The first insulating part is formed with a first insulating pattern made of fine metal wires that are not connected to the first large lattice.
The second insulating part is formed with a second insulating pattern made of fine metal wires that are not connected to the second large lattice.
The combination pattern of the first insulating pattern and the second insulating pattern formed by the first insulating portion and the second insulating portion facing each other is configured by combining two or more small lattices. Conductive sheet. The conductive sheet according to claim 8,
The first insulating pattern has a collective portion in which two or more small lattices are arranged,
The conductive sheet, wherein the second insulating pattern has a blank portion corresponding to the aggregate portion. The conductive sheet according to claim 8,
The first insulating pattern has a wavy line portion in which two sides constituting the small lattice are continuously arranged,
The conductive sheet according to claim 2, wherein the second insulating pattern includes two continuous sides constituting the small lattice and has a wavy line portion having a pattern opposite to the wavy line portion of the first insulating pattern. In the conductive sheet according to any one of claims 7 to 10,
When the arrangement pitch of the small lattices is P and the shortest distance between the adjacent first conductive patterns is defined as the width of the first insulating portion, the width of the first insulating portion is m × P (m is 1 or more). And the maximum length of the portion of the first insulating pattern in the width direction of the first insulating pattern is not more than m × P,
When the shortest distance between the adjacent second conductive patterns is defined as the width of the second insulating part, the width of the second insulating part is n × P (n is an integer of 1 or more), and the second Of the two insulating patterns, the maximum length of the portion in the width direction of the second insulating portion is nxP or less. The conductive sheet according to claim 1,
The conductive sheet is characterized in that the small lattice has a polygonal shape. The conductive sheet according to claim 1,
The conductive sheet, wherein the small lattice has a curved shape on at least one side. The conductive sheet according to claim 1,
The conductive sheet is characterized in that at least one side of the small lattice has an arc shape. A substrate;
Having a conductive portion formed on one main surface of the substrate,
Each of the conductive portions has two or more conductive patterns that extend in a first direction and are formed by fine metal wires arranged in a second direction orthogonal to the first direction;
The conductive pattern is composed of two or more large lattices connected in series in the first direction,
Each of the large lattices is configured by combining two or more small lattices,
A conductive sheet, wherein a first non-connecting pattern is formed around a side of the first large lattice by a fine metal wire that is not connected to the first large lattice. The conductive sheet according to claim 15, wherein
The conductive sheet according to claim 1, wherein the thin metal wire has a line width of 1 to 15 µm. Two or more conductive first large lattices of fine metal wires are formed on one main surface of the substrate,
Two or more conductive second large lattices formed of fine metal wires are formed on the other main surface of the base body,
Each of the first large lattice and each of the second large lattices is configured by combining two or more small lattices,
A first non-connection pattern is formed around the side of the first large lattice by a fine metal wire that is not connected to the first large lattice,
Around the side of the second large lattice, a second non-connected pattern is formed by a thin metal wire that is not connected to the second large lattice,
When viewed from above, the second large lattice is arranged adjacent to the first large lattice,
Between the first large lattice and the second large lattice, a combination pattern is formed by the first non-connected pattern and the second non-connected pattern facing each other,
The conductive sheet is configured to be combined so that the combination pattern is substantially the same as the inside of each of the first large lattices and each of the second large lattices. The conductive sheet according to claim 17,
A conductive sheet, wherein a projection distance between a straight line portion on a side of the first large lattice and a straight line portion on a side of the second large lattice is set based on a size of the small lattice. A conductive sheet of a touch panel disposed on a display panel of a display device,
A first conductive sheet having a first base and a first conductive portion formed on the main surface of the first base;
A second conductive sheet having a second base and a second conductive portion formed on the main surface of the second base;
The first conductive sheet is laminated on the second conductive sheet,
Each of the first conductive parts has two or more first conductive patterns that extend in a first direction and are formed of thin metal wires arranged in a second direction orthogonal to the first direction.
Each of the second conductive parts extends in a second direction and has two or more second conductive patterns formed of thin metal wires arranged in the first direction,
The first conductive pattern includes two or more first large lattices arranged in the first direction,
The second conductive pattern includes two or more second large lattices arranged in the second direction,
A first non-connection pattern is formed around the side of the first large lattice by a fine metal wire that is not connected to the first large lattice,
Around the side of the second large lattice, a second non-connected pattern is formed by a thin metal wire that is not connected to the second large lattice,
When viewed from above, the second large lattice is arranged adjacent to the first large lattice,
Between the first large lattice and the second large lattice, a combination pattern is formed by the first non-connected pattern and the second non-connected pattern facing each other,
2. The conductive sheet according to claim 1, wherein the combination pattern is configured by combining two or more small lattices. The conductive sheet according to claim 19,
The first conductive portion is further formed in a first terminal wiring pattern connected to an end portion of each first conductive pattern and a central portion in the length direction of one side of the first conductive sheet. A plurality of first terminals to which the first terminal wiring pattern is connected;
The second conductive portion is further formed at a center portion in the length direction of one side of the second conductive sheet and a second terminal wiring pattern connected to an end portion of each of the second conductive patterns. A conductive sheet having a plurality of second terminals to which the second terminal wiring pattern is connected. The conductive sheet according to claim 20, wherein
When the first conductive sheet and the second conductive sheet are viewed from above,
A conductive sheet, wherein a portion where the plurality of first terminals are arranged and a portion where the plurality of second terminals are arranged are adjacent to each other. The conductive sheet according to claim 20, wherein
The end portion of each first conductive pattern and the corresponding first terminal wiring pattern are connected via a first connection portion, respectively.
The end portions of the second conductive patterns and the corresponding second terminal wiring patterns are respectively connected via the second connection portions,
A plurality of the first connection parts are arranged linearly along the second direction,
The conductive sheet, wherein the plurality of second connection parts are arranged linearly along the first direction. A first conductive sheet having two or more conductive first large lattices of fine metal wires each formed by combining two or more small lattices;
A method of using a conductive sheet using a second conductive sheet having two or more conductive second large lattices, each of which is formed of a thin metal wire formed by combining two or more small lattices,
A first non-connection pattern is formed around the side of the first large lattice by a fine metal wire that is not connected to the first large lattice,
Around the side of the second large lattice, a second non-connected pattern is formed by a thin metal wire that is not connected to the second large lattice,
By combining the first conductive sheet and the second conductive sheet, the second large lattice is disposed adjacent to the first large lattice, and the first disconnected pattern and the second disconnected pattern Are combined so that the arrangement of the small lattices is formed. In the usage method of the electrically conductive sheet of Claim 23,
A first connecting portion is formed by a thin metal wire that electrically connects the adjacent first large lattices in the first conductive sheet, and two or more first large lattices are first connected via the first connecting portions. Arranged in a direction to constitute one first conductive pattern, and two or more first conductive patterns are arranged in a second direction orthogonal to the first direction,
A second connection portion is formed by a thin metal wire that electrically connects the adjacent second large lattices in the second conductive sheet, and two or more second large lattices are connected to the second connection portion via the second connection portions. One second conductive pattern is arranged in two directions, and two or more second conductive patterns are arranged in the first direction,
By combining the first conductive sheet and the second conductive sheet, the first connection portion and the second connection portion are combined so as to form an array of the small lattices. How to use a conductive sheet. In the usage method of the electrically conductive sheet of Claim 24,
An electrically insulated first insulating portion is disposed between the adjacent first conductive patterns in the first conductive sheet, and the first fine insulating wire is not connected to the first large lattice. A first insulation pattern is formed by
An electrically insulated second insulating portion is disposed between the adjacent second conductive patterns in the second conductive sheet, and the thin metal wire is not connected to the second large lattice on the second insulating portion. A second insulation pattern is formed by
By combining the first conductive sheet and the second conductive sheet, the first insulating pattern and the second insulating pattern are combined to form an array of the small lattices. How to use a conductive sheet.   A capacitive touch panel comprising the conductive sheet according to claim 1.

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