TW201110327A - Semiconductor memory device and production method thereof - Google Patents

Semiconductor memory device and production method thereof Download PDF

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Publication number
TW201110327A
TW201110327A TW099130837A TW99130837A TW201110327A TW 201110327 A TW201110327 A TW 201110327A TW 099130837 A TW099130837 A TW 099130837A TW 99130837 A TW99130837 A TW 99130837A TW 201110327 A TW201110327 A TW 201110327A
Authority
TW
Taiwan
Prior art keywords
diffusion layer
layer
transistor
type diffusion
access transistor
Prior art date
Application number
TW099130837A
Other languages
English (en)
Chinese (zh)
Inventor
Fujio Masuoka
Shintaro Arai
Original Assignee
Unisantis Electronics Jp Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unisantis Electronics Jp Ltd filed Critical Unisantis Electronics Jp Ltd
Publication of TW201110327A publication Critical patent/TW201110327A/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/10—Integrated device layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B10/00—Static random access memory [SRAM] devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/17—Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
    • H10D62/351—Substrate regions of field-effect devices
    • H10D62/357—Substrate regions of field-effect devices of FETs
    • H10D62/364—Substrate regions of field-effect devices of FETs of IGFETs
    • H10D62/371—Inactive supplementary semiconductor regions, e.g. for preventing punch-through, improving capacity effect or leakage current
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
    • H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
    • H10D84/0165—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs the components including complementary IGFETs, e.g. CMOS devices
    • H10D84/017—Manufacturing their source or drain regions, e.g. silicided source or drain regions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
    • H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
    • H10D84/0165—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs the components including complementary IGFETs, e.g. CMOS devices
    • H10D84/0191—Manufacturing their doped wells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
    • H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
    • H10D84/0165—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs the components including complementary IGFETs, e.g. CMOS devices
    • H10D84/0195—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs the components including complementary IGFETs, e.g. CMOS devices the components including vertical IGFETs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/02—Manufacture or treatment characterised by using material-based technologies
    • H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe

Landscapes

  • Semiconductor Memories (AREA)
  • Static Random-Access Memory (AREA)
TW099130837A 2009-09-14 2010-09-13 Semiconductor memory device and production method thereof TW201110327A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009211300A JP5524547B2 (ja) 2009-09-14 2009-09-14 半導体記憶装置

Publications (1)

Publication Number Publication Date
TW201110327A true TW201110327A (en) 2011-03-16

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW099130837A TW201110327A (en) 2009-09-14 2010-09-13 Semiconductor memory device and production method thereof

Country Status (6)

Country Link
US (1) US8169030B2 (enExample)
EP (1) EP2296176B1 (enExample)
JP (1) JP5524547B2 (enExample)
KR (1) KR101160105B1 (enExample)
CN (1) CN102024815B (enExample)
TW (1) TW201110327A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
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TWI575526B (zh) * 2011-06-09 2017-03-21 半導體能源研究所股份有限公司 儲存裝置

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CN103370781A (zh) * 2012-02-15 2013-10-23 新加坡优尼山帝斯电子私人有限公司 半导体存储器件
CN103460373A (zh) * 2012-02-15 2013-12-18 新加坡优尼山帝斯电子私人有限公司 半导体存储器件
US8836051B2 (en) * 2012-06-08 2014-09-16 Unisantis Electronics Singapore Pte. Ltd. Method for producing semiconductor device and semiconductor device
KR101925012B1 (ko) * 2012-07-17 2018-12-05 에스케이하이닉스 주식회사 반도체 장치 및 그의 제조 방법
US9082838B2 (en) * 2012-09-28 2015-07-14 Unisantis Electronics Singapore Pte. Ltd. Method for producing a semiconductor device and semiconductor device
US8969949B2 (en) * 2013-03-10 2015-03-03 Taiwan Semiconductor Manufacturing Company, Ltd. Structure and method for static random access memory device of vertical tunneling field effect transistor
WO2015008387A1 (ja) * 2013-07-19 2015-01-22 ユニサンティス エレクトロニクス シンガポール プライベート リミテッド 半導体装置の製造方法、及び、半導体装置
JP2015032651A (ja) * 2013-08-01 2015-02-16 マイクロン テクノロジー， インク． 半導体装置
WO2015019444A1 (ja) * 2013-08-07 2015-02-12 ユニサンティス エレクトロニクス シンガポール プライベート リミテッド 半導体装置の製造方法、及び、半導体装置
US10361270B2 (en) * 2013-11-20 2019-07-23 Taiwan Semiconductor Manufacturing Co., Ltd. Nanowire MOSFET with different silicides on source and drain
JP5832057B1 (ja) 2014-02-24 2015-12-16 ユニサンティス エレクトロニクス シンガポール プライベート リミテッドＵｎｉｓａｎｔｉｓ Ｅｌｅｃｔｒｏｎｉｃｓ Ｓｉｎｇａｐｏｒｅ Ｐｔｅ Ｌｔｄ． 記憶装置、半導体装置、及び記憶装置、半導体装置の製造方法
WO2015129021A1 (ja) * 2014-02-28 2015-09-03 ユニサンティス エレクトロニクス シンガポール プライベート リミテッド 半導体装置、及び半導体装置の製造方法
JP6114425B2 (ja) * 2016-03-11 2017-04-12 ユニサンティス エレクトロニクス シンガポール プライベート リミテッドＵｎｉｓａｎｔｉｓ Ｅｌｅｃｔｒｏｎｉｃｓ Ｓｉｎｇａｐｏｒｅ Ｐｔｅ Ｌｔｄ． 半導体装置の製造方法、及び、半導体装置
EP3507802A4 (en) * 2016-08-31 2020-04-08 Micron Technology, Inc. DETECTION AMPLIFIER STRUCTURES
EP3507831B1 (en) 2016-08-31 2021-03-03 Micron Technology, Inc. Memory arrays
US11211384B2 (en) 2017-01-12 2021-12-28 Micron Technology, Inc. Memory cells, arrays of two transistor-one capacitor memory cells, methods of forming an array of two transistor-one capacitor memory cells, and methods used in fabricating integrated circuitry
US10290639B2 (en) * 2017-09-12 2019-05-14 Globalfoundries Inc. VNW SRAM with trinity cross-couple PD/PU contact and method for producing the same
US10559572B2 (en) 2018-06-29 2020-02-11 International Business Machines Corporation Vertical transistor contact for a memory cell with increased density
US10566453B2 (en) 2018-06-29 2020-02-18 International Business Machines Corporation Vertical transistor contact for cross-coupling in a memory cell
CN109326650B (zh) * 2018-10-10 2022-04-19 中国科学院微电子研究所 半导体器件及其制造方法及包括该器件的电子设备
US11640987B2 (en) * 2021-02-04 2023-05-02 Applied Materials, Inc. Implant to form vertical FETs with self-aligned drain spacer and junction
WO2022239196A1 (ja) * 2021-05-13 2022-11-17 ユニサンティス エレクトロニクス シンガポール プライベート リミテッド 半導体素子を用いたメモリ装置

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Also Published As

Publication number Publication date
KR101160105B1 (ko) 2012-06-26
US8169030B2 (en) 2012-05-01
US20110062523A1 (en) 2011-03-17
CN102024815B (zh) 2013-04-10
KR20110029101A (ko) 2011-03-22
JP2011061110A (ja) 2011-03-24
JP5524547B2 (ja) 2014-06-18
CN102024815A (zh) 2011-04-20
EP2296176B1 (en) 2014-08-20
EP2296176A1 (en) 2011-03-16

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