TW201105809A - An arrangement for holding a substrate in a material deposition apparatus - Google Patents
An arrangement for holding a substrate in a material deposition apparatus Download PDFInfo
- Publication number
- TW201105809A TW201105809A TW099109979A TW99109979A TW201105809A TW 201105809 A TW201105809 A TW 201105809A TW 099109979 A TW099109979 A TW 099109979A TW 99109979 A TW99109979 A TW 99109979A TW 201105809 A TW201105809 A TW 201105809A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- shadow mask
- deposition
- support structure
- mask
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 132
- 239000000463 material Substances 0.000 title claims abstract description 108
- 230000008021 deposition Effects 0.000 title claims abstract description 104
- 238000000034 method Methods 0.000 claims abstract description 33
- 238000005137 deposition process Methods 0.000 claims description 16
- 230000008569 process Effects 0.000 claims description 9
- 239000000696 magnetic material Substances 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 4
- 238000003698 laser cutting Methods 0.000 claims description 2
- 238000001259 photo etching Methods 0.000 claims 1
- 238000000151 deposition Methods 0.000 description 76
- 238000005019 vapor deposition process Methods 0.000 description 9
- 238000007740 vapor deposition Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000012071 phase Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000011368 organic material Substances 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 244000025254 Cannabis sativa Species 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 230000003796 beauty Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000009432 framing Methods 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- 108010025899 gelatin film Proteins 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP09157249 | 2009-04-03 | ||
| EP10154410 | 2010-02-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201105809A true TW201105809A (en) | 2011-02-16 |
Family
ID=42285443
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW099109979A TW201105809A (en) | 2009-04-03 | 2010-03-31 | An arrangement for holding a substrate in a material deposition apparatus |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8808402B2 (enExample) |
| EP (1) | EP2425034B1 (enExample) |
| JP (1) | JP5642153B2 (enExample) |
| KR (1) | KR101629995B1 (enExample) |
| CN (1) | CN102482759B (enExample) |
| TW (1) | TW201105809A (enExample) |
| WO (1) | WO2010113102A1 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI470110B (zh) * | 2012-09-07 | 2015-01-21 | Manz Taiwan Ltd | 用於化學沉積設備的夾固裝置 |
| TWI851709B (zh) * | 2019-04-11 | 2024-08-11 | 美商應用材料股份有限公司 | 用於光學裝置的多深度膜 |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2425034B1 (en) * | 2009-04-03 | 2016-07-13 | OSRAM OLED GmbH | An arrangement for holding a substrate in a material deposition apparatus |
| CN103203551B (zh) * | 2012-01-16 | 2015-08-12 | 昆山允升吉光电科技有限公司 | 去除掩模板辅助图形的方法 |
| KR102112751B1 (ko) * | 2013-02-01 | 2020-05-19 | 삼성디스플레이 주식회사 | 레이저 빔을 이용한 마스크 제조 방법 및 마스크 제조 장치 |
| KR102060366B1 (ko) * | 2013-04-17 | 2019-12-31 | 삼성디스플레이 주식회사 | 유기 발광층 형성장치 및 그것을 이용한 유기 발광층의 제조 방법 |
| JP6078818B2 (ja) * | 2013-07-02 | 2017-02-15 | 株式会社ブイ・テクノロジー | 成膜マスク及び成膜マスクの製造方法 |
| KR101537967B1 (ko) * | 2013-12-30 | 2015-07-20 | 주식회사 에스에프에이 | 기판과 마스크의 어태치 장치 및 방법 |
| CN106784394B (zh) * | 2013-12-30 | 2018-10-09 | Sfa工程股份有限公司 | 用于附着玻璃与掩模的设备及方法、以及用于装载基板的系统及方法 |
| JP6418440B2 (ja) * | 2014-06-03 | 2018-11-07 | Ｔｉａｎｍａ Ｊａｐａｎ株式会社 | メタルマスク及びメタルマスクの製造方法並びにメタルマスクを用いた成膜方法 |
| US10644239B2 (en) | 2014-11-17 | 2020-05-05 | Emagin Corporation | High precision, high resolution collimating shadow mask and method for fabricating a micro-display |
| TWI564408B (zh) * | 2015-02-02 | 2017-01-01 | 鴻海精密工業股份有限公司 | 蒸鍍遮罩、蒸鍍方法及蒸鍍遮罩之製造方法 |
| KR20160097444A (ko) | 2015-02-06 | 2016-08-18 | 삼성디스플레이 주식회사 | 표시 장치 |
| JP2017008342A (ja) * | 2015-06-17 | 2017-01-12 | 株式会社ブイ・テクノロジー | 成膜マスク及び成膜マスクの製造方法 |
| KR101638344B1 (ko) * | 2015-12-04 | 2016-07-11 | 주식회사 유아이디 | 스퍼터링용 원판패널 고정 장치 및 방법 |
| TWI721170B (zh) * | 2016-05-24 | 2021-03-11 | 美商伊麥傑公司 | 蔽蔭遮罩沉積系統及其方法 |
| KR102377183B1 (ko) | 2016-05-24 | 2022-03-21 | 이매진 코퍼레이션 | 고정밀 섀도 마스크 증착 시스템 및 그 방법 |
| US10386731B2 (en) | 2016-05-24 | 2019-08-20 | Emagin Corporation | Shadow-mask-deposition system and method therefor |
| CN109642313B (zh) * | 2016-05-24 | 2021-03-09 | 埃马金公司 | 高精准度蔽荫掩模沉积系统及其方法 |
| KR101797927B1 (ko) * | 2016-06-01 | 2017-11-15 | (주)브이앤아이솔루션 | 정전척 |
| DE102017106160B4 (de) | 2017-03-22 | 2025-03-20 | VON ARDENNE Asset GmbH & Co. KG | Substratträger, Transportanordnung, Vakuumanordnung und Verfahren |
| KR102378672B1 (ko) * | 2017-05-17 | 2022-03-24 | 이매진 코퍼레이션 | 고정밀 섀도 마스크 증착 시스템 및 그 방법 |
| JP6998139B2 (ja) * | 2017-06-28 | 2022-01-18 | 株式会社ジャパンディスプレイ | 蒸着マスク |
| KR102411538B1 (ko) * | 2017-09-04 | 2022-06-22 | 삼성디스플레이 주식회사 | 표시 장치의 제조장치 및 표시 장치의 제조방법 |
| US11613802B2 (en) * | 2020-04-17 | 2023-03-28 | Rockwell Collins, Inc. | Additively manufactured shadow masks for material deposition control |
| KR102787867B1 (ko) * | 2020-07-03 | 2025-04-01 | 삼성디스플레이 주식회사 | 표시 장치의 제조 장치 및 표시 장치의 제조 방법 |
| CN117467930A (zh) * | 2023-05-18 | 2024-01-30 | 武汉华星光电半导体显示技术有限公司 | 掩模版及显示面板 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3801390A (en) * | 1970-12-28 | 1974-04-02 | Bell Telephone Labor Inc | Preparation of high resolution shadow masks |
| US4615781A (en) * | 1985-10-23 | 1986-10-07 | Gte Products Corporation | Mask assembly having mask stress relieving feature |
| JP3024641B1 (ja) * | 1998-10-23 | 2000-03-21 | 日本電気株式会社 | シャドウマスク及びその製造方法並びにシャドウマスクを用いた有機ｅｌディスプレイの製造方法 |
| KR100490534B1 (ko) | 2001-12-05 | 2005-05-17 | 삼성에스디아이 주식회사 | 유기 전자 발광 소자의 박막 증착용 마스크 프레임 조립체 |
| KR100467553B1 (ko) * | 2002-05-21 | 2005-01-24 | 엘지.필립스 엘시디 주식회사 | 고분자 유기전기발광 디스플레이 소자와 그 제조방법 |
| CN100539783C (zh) * | 2003-09-16 | 2009-09-09 | 大宇电子Service株式会社 | 有机电致发光显示器及其制造方法 |
| JP2005232474A (ja) | 2004-02-17 | 2005-09-02 | Dainippon Screen Mfg Co Ltd | 蒸着用マスク |
| US20060011137A1 (en) * | 2004-07-16 | 2006-01-19 | Applied Materials, Inc. | Shadow frame with mask panels |
| JP4375232B2 (ja) * | 2005-01-06 | 2009-12-02 | セイコーエプソン株式会社 | マスク成膜方法 |
| JP2006216289A (ja) | 2005-02-02 | 2006-08-17 | Seiko Epson Corp | マスク及び有機エレクトロルミネッセンス装置の製造方法 |
| JP4616667B2 (ja) * | 2005-03-01 | 2011-01-19 | 京セラ株式会社 | マスク構造体およびそれを用いた蒸着方法、並びに有機発光素子の製造方法 |
| US7674148B2 (en) * | 2006-02-10 | 2010-03-09 | Griffin Todd R | Shadow mask tensioning method |
| KR20080045886A (ko) * | 2006-11-21 | 2008-05-26 | 삼성전자주식회사 | 유기막 증착용 마스크 및 그 제조방법, 이를 포함하는유기전계 발광표시장치의 제조방법 |
| KR101266489B1 (ko) * | 2006-12-26 | 2013-05-23 | 삼성디스플레이 주식회사 | 쉐도우 마스크 장치 및 이를 이용한 유기 전계발광표시장치의 제조 방법 |
| JP2008240088A (ja) | 2007-03-28 | 2008-10-09 | Seiko Epson Corp | 蒸着装置、蒸着方法、電気光学装置及び電子機器 |
| JP2010196126A (ja) * | 2009-02-26 | 2010-09-09 | Canon Inc | 真空蒸着装置の重石板およびそれを用いた真空蒸着装置 |
| EP2425034B1 (en) * | 2009-04-03 | 2016-07-13 | OSRAM OLED GmbH | An arrangement for holding a substrate in a material deposition apparatus |
| WO2011111134A1 (ja) * | 2010-03-09 | 2011-09-15 | シャープ株式会社 | 蒸着マスク、蒸着装置及び蒸着方法 |
-
2010
- 2010-03-29 EP EP10713005.6A patent/EP2425034B1/en active Active
- 2010-03-29 WO PCT/IB2010/051356 patent/WO2010113102A1/en not_active Ceased
- 2010-03-29 US US13/262,776 patent/US8808402B2/en active Active
- 2010-03-29 JP JP2012502857A patent/JP5642153B2/ja not_active Expired - Fee Related
- 2010-03-29 CN CN201080015151.4A patent/CN102482759B/zh active Active
- 2010-03-29 KR KR1020117026030A patent/KR101629995B1/ko not_active Expired - Fee Related
- 2010-03-31 TW TW099109979A patent/TW201105809A/zh unknown
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI470110B (zh) * | 2012-09-07 | 2015-01-21 | Manz Taiwan Ltd | 用於化學沉積設備的夾固裝置 |
| TWI851709B (zh) * | 2019-04-11 | 2024-08-11 | 美商應用材料股份有限公司 | 用於光學裝置的多深度膜 |
| US12084761B2 (en) | 2019-04-11 | 2024-09-10 | Applied Materials, Inc. | Multi-depth film for optical devices |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2010113102A9 (en) | 2012-03-29 |
| KR101629995B1 (ko) | 2016-06-13 |
| EP2425034B1 (en) | 2016-07-13 |
| US8808402B2 (en) | 2014-08-19 |
| CN102482759B (zh) | 2014-11-12 |
| WO2010113102A1 (en) | 2010-10-07 |
| US20120178190A1 (en) | 2012-07-12 |
| CN102482759A (zh) | 2012-05-30 |
| JP5642153B2 (ja) | 2014-12-17 |
| EP2425034A1 (en) | 2012-03-07 |
| KR20120007022A (ko) | 2012-01-19 |
| JP2012522891A (ja) | 2012-09-27 |
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