CN102482759B - 用于将衬底保持在材料沉积设备中的装置 - Google Patents

用于将衬底保持在材料沉积设备中的装置 Download PDF

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Publication number
CN102482759B
CN102482759B CN201080015151.4A CN201080015151A CN102482759B CN 102482759 B CN102482759 B CN 102482759B CN 201080015151 A CN201080015151 A CN 201080015151A CN 102482759 B CN102482759 B CN 102482759B
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China
Prior art keywords
substrate
shadow mask
support structure
deposition
mask
Prior art date
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CN201080015151.4A
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English (en)
Chinese (zh)
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CN102482759A (zh
Inventor
约翰内斯·克里内
埃尔温·艾林
卡勒-海因茨·霍豪斯
沃尔夫冈·格尔根
安德烈亚斯·洛维奇
马克·菲利彭斯
理查德·沙伊歇尔
安斯加尔·菲舍尔
马丁·穆勒
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Ams Osram International GmbH
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Osram Opto Semiconductors GmbH
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Publication of CN102482759A publication Critical patent/CN102482759A/zh
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
CN201080015151.4A 2009-04-03 2010-03-29 用于将衬底保持在材料沉积设备中的装置 Active CN102482759B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
EP09157249 2009-04-03
EP09157249.5 2009-04-03
EP10154410 2010-02-23
EP10154410.4 2010-02-23
PCT/IB2010/051356 WO2010113102A1 (en) 2009-04-03 2010-03-29 An arrangement for holding a substrate in a material deposition apparatus

Publications (2)

Publication Number Publication Date
CN102482759A CN102482759A (zh) 2012-05-30
CN102482759B true CN102482759B (zh) 2014-11-12

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080015151.4A Active CN102482759B (zh) 2009-04-03 2010-03-29 用于将衬底保持在材料沉积设备中的装置

Country Status (7)

Country Link
US (1) US8808402B2 (enExample)
EP (1) EP2425034B1 (enExample)
JP (1) JP5642153B2 (enExample)
KR (1) KR101629995B1 (enExample)
CN (1) CN102482759B (enExample)
TW (1) TW201105809A (enExample)
WO (1) WO2010113102A1 (enExample)

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EP2425034B1 (en) * 2009-04-03 2016-07-13 OSRAM OLED GmbH An arrangement for holding a substrate in a material deposition apparatus
CN103203551B (zh) * 2012-01-16 2015-08-12 昆山允升吉光电科技有限公司 去除掩模板辅助图形的方法
TWI470110B (zh) * 2012-09-07 2015-01-21 Manz Taiwan Ltd 用於化學沉積設備的夾固裝置
KR102112751B1 (ko) * 2013-02-01 2020-05-19 삼성디스플레이 주식회사 레이저 빔을 이용한 마스크 제조 방법 및 마스크 제조 장치
KR102060366B1 (ko) * 2013-04-17 2019-12-31 삼성디스플레이 주식회사 유기 발광층 형성장치 및 그것을 이용한 유기 발광층의 제조 방법
JP6078818B2 (ja) * 2013-07-02 2017-02-15 株式会社ブイ・テクノロジー 成膜マスク及び成膜マスクの製造方法
KR101537967B1 (ko) * 2013-12-30 2015-07-20 주식회사 에스에프에이 기판과 마스크의 어태치 장치 및 방법
CN106784394B (zh) * 2013-12-30 2018-10-09 Sfa工程股份有限公司 用于附着玻璃与掩模的设备及方法、以及用于装载基板的系统及方法
JP6418440B2 (ja) * 2014-06-03 2018-11-07 Ｔｉａｎｍａ Ｊａｐａｎ株式会社 メタルマスク及びメタルマスクの製造方法並びにメタルマスクを用いた成膜方法
US10644239B2 (en) 2014-11-17 2020-05-05 Emagin Corporation High precision, high resolution collimating shadow mask and method for fabricating a micro-display
TWI564408B (zh) * 2015-02-02 2017-01-01 鴻海精密工業股份有限公司 蒸鍍遮罩、蒸鍍方法及蒸鍍遮罩之製造方法
KR20160097444A (ko) 2015-02-06 2016-08-18 삼성디스플레이 주식회사 표시 장치
JP2017008342A (ja) * 2015-06-17 2017-01-12 株式会社ブイ・テクノロジー 成膜マスク及び成膜マスクの製造方法
KR101638344B1 (ko) * 2015-12-04 2016-07-11 주식회사 유아이디 스퍼터링용 원판패널 고정 장치 및 방법
TWI721170B (zh) * 2016-05-24 2021-03-11 美商伊麥傑公司 蔽蔭遮罩沉積系統及其方法
KR102377183B1 (ko) 2016-05-24 2022-03-21 이매진 코퍼레이션 고정밀 섀도 마스크 증착 시스템 및 그 방법
US10386731B2 (en) 2016-05-24 2019-08-20 Emagin Corporation Shadow-mask-deposition system and method therefor
CN109642313B (zh) * 2016-05-24 2021-03-09 埃马金公司 高精准度蔽荫掩模沉积系统及其方法
KR101797927B1 (ko) * 2016-06-01 2017-11-15 (주)브이앤아이솔루션 정전척
DE102017106160B4 (de) 2017-03-22 2025-03-20 VON ARDENNE Asset GmbH & Co. KG Substratträger, Transportanordnung, Vakuumanordnung und Verfahren
KR102378672B1 (ko) * 2017-05-17 2022-03-24 이매진 코퍼레이션 고정밀 섀도 마스크 증착 시스템 및 그 방법
JP6998139B2 (ja) * 2017-06-28 2022-01-18 株式会社ジャパンディスプレイ 蒸着マスク
KR102411538B1 (ko) * 2017-09-04 2022-06-22 삼성디스플레이 주식회사 표시 장치의 제조장치 및 표시 장치의 제조방법
CN113646668A (zh) * 2019-04-11 2021-11-12 应用材料公司 用于光学装置的多深度膜
US11613802B2 (en) * 2020-04-17 2023-03-28 Rockwell Collins, Inc. Additively manufactured shadow masks for material deposition control
KR102787867B1 (ko) * 2020-07-03 2025-04-01 삼성디스플레이 주식회사 표시 장치의 제조 장치 및 표시 장치의 제조 방법
CN117467930A (zh) * 2023-05-18 2024-01-30 武汉华星光电半导体显示技术有限公司 掩模版及显示面板

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Also Published As

Publication number Publication date
WO2010113102A9 (en) 2012-03-29
KR101629995B1 (ko) 2016-06-13
EP2425034B1 (en) 2016-07-13
TW201105809A (en) 2011-02-16
US8808402B2 (en) 2014-08-19
WO2010113102A1 (en) 2010-10-07
US20120178190A1 (en) 2012-07-12
CN102482759A (zh) 2012-05-30
JP5642153B2 (ja) 2014-12-17
EP2425034A1 (en) 2012-03-07
KR20120007022A (ko) 2012-01-19
JP2012522891A (ja) 2012-09-27

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Effective date of registration: 20160526

Address after: Regensburg, Germany

Patentee after: OSRAM OPTO SEMICONDUCTORS GMBH

Address before: Regensburg, Germany

Patentee before: Osram Opto Semiconductors GmbH