TW201044939A - Method for manufacturing multilayer printed wiring board - Google Patents

Abstract

Disclosed is a method for exposing an inner layer in a multilayer printed wiring board. In the method, a first wiring pattern (3) is formed on at least one side (2a) of a first insulating layer (2); an alkali-soluble ink layer (13) is formed on an exposure region (11) for exposing the first wiring pattern (3) on the first insulating layer (2); a second insulating layer (4) is formed on the ink layer formation side of the first insulating layer (2) in such a manner that the ink layer (13) is exposed from the second insulating layer (4); a metal layer such as a copper foil (14) is formed on the second insulating layer (4); a second wiring pattern (5) is formed by patterning the metal layer; and the first insulating layer (2) and the first wiring pattern (3) in the exposure region (11) are exposed by dissolving and removing the ink layer (13) using an alkali solution.

Description

201044939 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a method of manufacturing a multilayer printed wiring board in which one of the inner layers is partially exposed. [Prior Art] Ο 〇 In recent years, multi-layer printed wiring boards have required structural layers to be different in size, light weight, and high functionality. For example, in order to improve the degree of freedom in machine design, there is a flexible, rigid-type printed wiring board that uses a flexible substrate cable to connect multiple layers of rigidity without a connector. The substrates are mutually connected to form an integrated structure. In addition, it is required to have a low profile as a package application, and it is required to form a so-called cavity ((10)) structure. Further, the recent flexible/rigid composite printed wiring board has the following trend, that is, not only the flexible portion is used as a line between the rigid substrates, but also actively used as a component mounting portion or an LCD module. LCD connection or connector connection. • A general flexible/rigid composite printed wiring board is formed by applying a cover layer or the like to a flexible substrate having a wiring pattern formed on one surface or both sides of an insulating film such as a polyimide film. Insulation coating, and as a part of the second section, 'layered prepreg (P N) and mi, or insulating sheet with copper foil. _Flexible 14 The entire surface is covered by a cover layer and serves as a cable connecting the rigid parts. In the case of the flexible-rigid composite printed wiring board using the flexible portion as the connector connecting portion, a slidable terminal portion is protruded from one side of the rigid portion. Such a terminal portion is not covered by the film of the cover layer, but exposes the wiring pattern of the flexible substrate. When a flexible-rigid composite printed wiring board as a component mounting portion or an LCD connecting portion is used, in the manufacturing step, the line pattern of the flexible substrate must be partially exposed. The wiring pattern exposed in this manner must be a method of manufacturing a functional or flexible flexible printed wiring board which is a function of a component mounting portion, an LCD connecting portion, and a connector connecting portion, and has the following method, for example. A flexible sheet has a bonding sheet or a prepreg having an opening portion corresponding to a portion corresponding to the opening of the flexible portion, and a layer of glass epoxy resin is laminated on the bonding sheet or the prepreg. The copper-clad plate or the copper of the xy) is poured into the multilayered layer, and a rigid portion in which a prepreg or the like is laminated is formed, and the pre-dip body is formed without the laminated pre-dip due to the opening σ portion, and only the flexible substrate is formed. Flexible section. When the method of laminating a bonding sheet, a prepreg, a copper foil or the like, the heating and pressurization are carried out, the resin constituting the bonding sheet or the prepreg cannot be prevented from flowing out to the opening β. In particular, when the wiring pattern is exposed to the sturdy It shape, the resin is adhered to the wiring pattern portion, and electrical defects are generated. In order to avoid the flow of the resin, it is usually bonded to the bonding sheet, the prepreg, and the steel. In the case of laminating, a resin film having a high softening property called a cushioning material is embedded in the opening of the bonding sheet or the prepreg to prevent the resin from flowing. However, in the prevention method, the wiring pattern of the flexible portion is simultaneously etched at the time of formation of the outer portion wiring pattern of the rigid portion of 201044939. Therefore, for example, an additional wiring pattern covering the flexible portion with a mask tape or the like is required. The steps are not only complicated, but also require the accuracy of attaching the mask tape. In addition, as another manufacturing method of the flexible-rigid composite printed wiring board, there is also a part in which a flexible portion is formed by covering with a polyimide-based film such as a polyimide film. A method of manufacturing a flexible-rigid composite printed wiring board by laminating a part other than the multilayered polyimide tape and exposing the flexible portion. However, this method is also required to attach the precision of the polyimide tape, and when the polyimide film which is exposed to high temperature and high pressure at the time of lamination is peeled off, the residue of the adhesive is generated. In particular, when the residue of the adhesive adheres to the wiring pattern exposed in the flexible portion, a problem occurs in the subsequent plating step of the wiring pattern, and the reliability of connection as a terminal is lowered. In addition, in the flexible-rigid composite printed wiring board, as a method of preventing the resin from flowing into the flexible portion, for example, the following Patent Document 2 and Patent Document 2 include the formation of the stopper resin into the flexible portion. The method of the embankment. Similarly, in the same manner, when the circuit is exposed to the flexible portion, the complicated steps as described above are required. A flexible-rigid composite printed wiring board is formed by screen printing on a flexible portion of a flexible/rigid composite printed wiring board that is bent at a predetermined portion to form heat-resistant (four) and bend A part of the guest outside the predetermined portion is stratified to form a rigid portion to remove the heat-resistant film. In the patent document 丨 ^ _ Τ ϋ . 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 However, the premise is that the flexible-rigid composite printed wiring board is not formed with a wiring pattern in advance in the curved portion. Further, it is a physical peeling method in which a heat-sensitive film is peeled off by hand. In the method of manufacturing such a flexible-rigid composite printed wiring board, since the heat-resistant film and the adjacent prepreg enter each other after forming the rigid portion, the heat-resistant medium is extremely difficult to be peeled off, and the prepreg is formed. The boundary of the heat-resistant film may be generated, or damage or cracking may occur in the insulating layer, and the above-mentioned situation cannot be completely prevented from being peeled off. Further, the method for producing the flexible-rigid composite printed wiring board is a method in which the heat-resistant film is physically peeled off, which is complicated. Further, when the method of manufacturing the flexible-rigid composite printed wiring board is applied to the case where the wiring pattern is formed in the f-curved portion, the step of forming the heat-resistant film due to high temperature and high pressure is different from the flat surface in which the wiring pattern is not formed. Further, since it adheres firmly to the uneven surface formed by the wiring pattern, it is extremely difficult to peel off the heat resistant medium without damaging the wiring pattern and leaving no residue between the wiring patterns. Further, Patent Document 4 listed below discloses a self-peelable adhesive tape laminated on a removable portion. In Patent Reading 4, the money is used as a self-peeling type adhesive tape by generating ultraviolet rays on the surface of the adhesive tape by ultraviolet irradiation, so that the self-peelable adhesive tape attached to the replaceable portion can be easily removed from the adhesive surface by ultraviolet irradiation. Separation. However, in Patent Document 4, it is necessary to peel off the self-peelable adhesive tape by hand, and the procedure is complicated. When the exposed wiring pattern is formed, the self-peeling type is peeled off without causing damage to the wiring pattern. Adhesive tape is extremely difficult. Further, in the 'rigid multilayer substrate', there is a method for exposing the inner layer. 201044939. (For example, Patent Document 5 and Patent Document 6). These techniques are complicated by the fact that after the prepreg is laminated, the prepreg is ground by a reaming process to expose the internal circuit to the internal circuit to be exposed. In the case where the wiring pattern is formed in the portion where the road is to be formed as described above, the wiring pattern damage or the prepreg is generated when the film or the tape provided to prevent the resin of the prepreg from flowing into the portion to be exposed is peeled off. End peeling, cracking, or a defect in the film or tape residue on the wiring pattern or between the wiring patterns.

Patent Document 1 Patent Document 2 Patent Document 3 Patent Document 4 Patent Document 5 Patent Document 6 曰本特开2001-15917号 曰本特开2006-228887号 曰本特开2001-15917号曰本特开 2006 Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. 2003-179361. SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object thereof is to provide a method in which flexibility is In a multilayer printed wiring board such as a rigid composite printed wiring board or a rigid multilayer wiring board, when an inner layer region in which a part of an inner layer region such as a wiring pattern is exposed or which exhibits a function as a cable is exposed, the exposed inner layer region or It is manufactured in a state in which the region adjacent to the exposed region is damaged or in a state where no residue is generated in the exposed region. A method of producing a first multilayer printed wiring board according to the present invention is characterized in that a wiring pattern is formed on at least one surface of a first insulating layer; and 201044939 includes a portion of the wiring pattern on the first insulating layer to form an ink layer which is soluble in solubility. Forming a second insulating layer on the ink layer forming side of the first insulating layer, exposing the second insulating layer from the second insulating layer, and forming a metal layer on the second insulating layer; After the layer is patterned to form the second wiring pattern, the ink layer is dissolved and removed by an alkaline solution to expose one of the first insulating layers and the wiring pattern thereon. Further, the method for producing a second multilayer printed wiring board according to the present invention is characterized in that a wiring pattern is formed on at least one surface of a first insulating layer having flexibility, and a wiring layer is disposed on a wiring pattern forming surface of the first insulating layer; Forming an alkali-soluble ink layer on a portion of the cover layer; forming a second insulating layer on the cover layer such that the ink layer is exposed from the second insulating layer, and forming a metal on the second insulating layer After the metal layer is patterned to form a wiring pattern, the ink layer is dissolved and removed in an alkaline solution to expose a portion of the coating layer. In the method for producing the first and second multilayer printed wiring boards of the present invention, the inner layer is exposed to be used for component assembly or connection, and an ink layer is formed on the inner layer to form an insulating layer or a metal layer. The solution dissolves and removes the ink layer on the inner layer so that the exposed inner layer or the insulating layer adjacent to the exposed region is not damaged, and the residue of the ink layer is not generated. [Embodiment] 8 The multi-layer printing system of 201044939 is the same or the following, and the manufacturing method of the wire board to which the present invention is applied will be described in detail with reference to the drawings. In addition, in the drawings, the same reference numerals are used for the same components. First, as the first embodiment of the method for manufacturing the first multilayer printed wiring board according to the first aspect of the present invention, the two-sided multilayer printed wiring board is hereinafter referred to as s ^, ν ( (hereinafter simply referred to as The manufacturing method of the multilayer printed wiring board), the stopper, the soil I w 〇 ice pole, will be described, but the multilayer printed wiring board manufactured by the manufacturing method will be described before the description of the manufacturing method.

As shown in Fig. 1, a multilayer printed wiring board has a ith wiring pattern 3 formed on one surface 2a of the core substrate 2 as a first insulating layer, and has a buildup and an insulating property thereon. The second insulating layer 4' formed by the prepreg layer is then formed on the second insulating layer 4 to form the second wiring pattern 5. A third wiring pattern 6 is formed on the other surface of the core substrate 2, and a third insulating layer 7 formed of a second prepreg layer having an adhesive property and an insulating property is laminated thereon, and then the third insulating layer is formed thereon. The fourth wiring pattern 8 is formed on the layer 7. In the multilayer printed wiring board, a via 2c for electrically connecting the first wiring pattern 3 and the third wiring pattern 6 is formed on the core substrate 2. Further, in the multilayer printed wiring board 1, a via 9 and a through hole 1 are formed, and the via 9 is electrically connected to the first wiring pattern 3 and the second wiring pattern 5, and the via 1 is electrically connected The ith wiring pattern 3, the second wiring pattern 5, the third wiring pattern 6, and the fourth wiring pattern 8 are connected. The multilayer printed wiring board 1 has an exposed region 11 which is formed by laminating a second insulating layer 4 not including one of the second wiring patterns 3 on the core substrate 2, thereby making a part of the core substrate 2 The first wiring pattern 3 of 201044939 is exposed to the formed 柘1, Xia Φ Γ3·U. So 'this multilayer printed wiring! The two are concave, for example, in the exposed region η: when the electronic component is mounted on the pattern 3, low profile can be achieved. The multilayer printed wiring board 1 can be manufactured in the following manner. First, as shown in Fig. 2, the core substrate 2 provided with the steel foil 12 on both sides of the rain raft is prepared. The core substrate 2 has heat resistance, mechanical strength, and electrical characteristics of the superior I " for example, a resin such as polyimide or a resin can be used. * As shown in FIG. 3, the first wiring pattern 3 and the third wiring pattern are formed as follows: the channel is connected to the first wiring pattern 3 and the third wiring pattern. For example, there is a core base from Fig. 2... another way to make a hole in the channel 2 substrate 2 by a laser. A method of opening the copper box Μ and the core 刀 hole of the knives, and forming a channel portion by etching After the copper foil 12 is removed, the 丨+ + i W is used exclusively for the core substrate 2 to perform a dual use of the surface of the hole formed by the methods, using an electroless copper plating method or electrolysis 2c. m is formed to form the channel f. After the through hole is formed by a drill or the like, copper plating is performed to form a through hole. Secondly, the copper foil 12, c on the wiring pattern 3, and the first one are not subjected to the formation. - engraving, for example, by: subtracting the second of the -face " upper, 12 by Substractive, thereby forming the first arrangement in the 杪3 wiring pattern 6 as well, for example, by subtracting The method is formed by etching the copper drop 12 on the other surface 2b of the two earth plates 2. The "secondary" is as shown in Fig. 4, 3 to expose the first wiring pattern of the exposed region 11 201 044 939, alkali-soluble coating ink to form the ink layer 13. The ink layer 13 is formed by printing a base-soluble ink of the present invention in an exposed region by a printing method such as screen printing or film printing, and drying and hardening it under appropriate conditions. It is preferred to form the oil black layer by hardening by three-dimensional cross-linking. Here, the ink referred to in the present invention is alkali-soluble and capacitive, meaning that the ink is not only soluble in an alkaline solution before hardening, but also soluble in an alkaline solution after hardening, preferably after hardening. The ink is not dissolved in a weakly alkaline solution for developing a dry film resist, but is soluble in an alkaline solution for removing a dry film resist which is cured by exposure. The cured product of bismuth has the following characteristics: heat, and due to its very softness, it is bent and cracked. Further, at least one of a half esterified product containing a tetracarboxylic acid, a tetracarboxylic dianhydride, and a tetracarboxylic dianhydride can be used as the ink which is specifically dissolved and can be dissolved in an alkaline solution after hardening. A polyol having more than 3 kinds of radicals in a molecule, and a filler, and soluble in an alkaline solution. By the ink, at least one of a tetraester of tetracarboxylic acid, tetradecanoic dianhydride, and tetracarboxylic dianhydride is reacted with a polyol having three or more radicals in one molecule. Three-dimensional cross-linking 'to obtain a polyester polycarboxylic acid polymer having a higher acid value, so the ink 'is improved by the inclusion of a filler, the shape of the layer, and the heat resistance.

: It is soluble in an alkaline solution and is resistant. Therefore, even if it is a thick film, it does not produce a filler, and it can be favorably maintained. Any of those generally used as an epoxy hardener or a poly-compater can be used. Tetrabasic acid dianhydride, -Sf, 3,3,4,4-diphenyltetracarboxylic acid di-field, anhydride, oxy-4,4-diphthalic acid dianhydride, 11 201044939 ρ酸二轩, 2,2-bis(4-(3,4-diylphenoxy)phenyl)propane dianhydride, 12,3,4-butanetetracarboxylic dianhydride, and 5·(2 , 5-dioxatetraindole-3-f-butyl)_3-p-yl-3-cyclohexyl-1,2-di-p-acid liver, etc., one or a mixture of these may be used. The tetracarboxylic acid can be obtained, for example, by reacting the above tetracarboxylic dianhydride with water to ring-open an acid anhydride group, thereby obtaining a tetracarboxylic acid which can form an acid dianhydride in the molecule. The half esterified product of tetracarboxylic dianhydride can be obtained by reacting the above tetracarboxylic dianhydride with an alcohol to ring-open an acid anhydride group. The ink may contain all of the tetracarboxylic acid, the tetracarboxylic dianhydride, the semi-esterified tetracarboxylic acid, or one or more of these, and when used as an early liquid type ink, Since the reaction between the acid and the polyol can also be carried out in the chamber f, the pot life is extended. (From the viewpoint of the sound, it is preferable to use a half-acetate of a tetracarboxylic acid or a tetracarboxylic dianhydride, preferably. In order to use a semi-esterified product of tetracarboxylic dianhydride: - aspect, the ink component has 3 in one molecule;: multiple means: for example, glycerol can be used, 'diglycerol, polyglycerol, erythritol pentaerythritol, and second armor.乙丙烧尊容 ^ " into epoxy E-alcohols; polymerized on these alcohols and added to the right-selling 'Ethylene-propylene Institute and other epoxy pottery polyphenols. People with dicarboxylic acid The polyester bond of the ester bond _> ^ 哔頬, containing the polycaprolactone polyol, etc.. Poly 0 plus agent, preferably inorganic materials, such as stone, synthetic mica, hydroxide nucleation矽, slip, oxidation, barium sulphate, etc. (10) In addition, in addition to τ μ, +., and components in the ink, 'Alkali 12 can also be used appropriately. a coloring agent such as a shake imparting agent such as 39 (Aerosil), a linaloside, a phthalocyanine blue, a phthalocyanine green, or a cerium oxide, and a special additive.

Ink layer 1 λ, _L. 5, it is formed in substantially the same thickness as the prepreg layer 4 of the first wiring pattern of the first wiring pattern in the second step. 〇 可溶性 Soluble resin, Aerotech Fluoride leveling agent, defoamer Metal deactivator or antioxidant. The "man" is formed on the side of the ink layer 13 on the core substrate 2 as shown in Fig. 5 so that the ink layer 13 faces the outer side to form the first prepreg layer. That is, the ink layer 13 is from the first! The first pre-duplex layer 4 is formed in such a manner that the prepreg layer 4 is exposed. Specifically, the first prepreg layer 4' is disposed on the other side of the core substrate 2 on the portion where the ink layer 13 is not formed on one surface 2aJi of the core two sheets 2 on which the ink layer 13 is formed. The second prepreg layer 7 is provided. The i-th prepreg layer 4 is formed in advance at a position corresponding to the ink layer 13 by a press or the like by a metal mold to form an opening for the ink layer 13 to be inserted. . In order to prevent the opening 4a from being in the 4th position or the positional shift of the ink layer 13, the resin in the first prepreg layer 4 may not overlap the ink layer 13 even if it flows to the ink layer 13 side in the subsequent lamination step. To the extent, it is formed to be larger than the ink layer 13. When the i-th prepreg layer 4 is formed on the i-th wiring pattern 3, the ink layer 13 is inserted into the opening 4a, and the first prepreg layer 4 is provided on the first wiring pattern 3. Further, in the case of laminating on the core substrate 2, a bonding sheet may be used instead of the prepreg, or an insulating substrate in which the prepreg is cured may be used. If it is a function as an insulating layer, a thermoplastic resin may be used. Wait.曰, 13 201044939 Next, as shown in Fig. 5, in the flute, the wiring pattern 5 is consumed 14 and the second layer 4 is placed on the body layer 4 as the second wiring pattern. In the method, the first prepreg copper (10) wire to which the copper two-layer printed wiring board is attached may be used instead of the configuration of the layer 4 and the arrangement of the copper foil Μ β ^ n _ 7 and the steel pig 15 And the first prepreg layer and the ink layer U are opposite to each other... The copper-insulated substrate is preliminarily provided with a second opening facing the surface. Secondly, using the laminated layer, the 15th Huai" 'sport layer 4, the second pre-dip The body layer 7 and the copper foil 14 are heated by the enthalpy, and the i-th pre-element of the state 2 is added to the side of the plate 2 to be semi-hardened and then hardened, and the fourth and second prepreg layers 7 are melted and flowed. And the layers are subsequently formed into a layered body, thereby forming a layered body 16 composed of a multilayer structure as shown in Fig. 6. When heating and pressurizing, the first prepreg layer 4 is melted: ...by the ink layer 13, preferably the cured ink layer, the following: The resin constituting the first prepreg layer 4 flows into the exposed area U, so that US The first wiring pattern 3 is adhered to the resin, or the exposed region 11 is formed by the person as shown in Fig. 7. The channel 9 and the through hole 1 are formed. The channel 9 can be formed in a down manner: using a drill or laser processing, Formed from the copper crucible 14 forming the second wiring pattern 5 up to the ith wiring pattern 3

^ I ', ,, and the hole' is subjected to copper plating on the entire surface of the formed hole by an electroless copper plating method or an electrolytic copper plating method. The through hole 10 can be formed by forming a through hole of the copper foil 丨 5 forming the fourth wiring pattern 8 from the steel case 14 in which the second wiring pattern 5 is formed by using a drill or laser processing. 201044939 Hole 'Remove the 诵 诵; — The burr remaining in the hole, and the copper surface of the Beton hole is made of copper by electroless copper plating or electrolytic copper plating + 壬. As shown in Fig. 8, the second wiring pattern 5 and the fourth wiring pattern 8 are formed by a subtractive method. Specifically, first, on the entire surface of the copper foil 14 and the copper foil 15, W Λ - difficult dry film resists 17, 18 are used for forming a desired wiring pattern, and a mask is used for dry film resistance. (4) Exposure of 17,18. Then, the dry film resist of the unexposed portion is dissolved by a solution of sodium hydride or the like

After the solution is removed, Nankada*, L 〇] uses a bismuth telluride or a vaporized copper solution to carry out the general method: </ RTI> The second wiring pattern 5 and the fourth wiring pattern g 8 are formed. When the etching is performed, the copper foil 14 on the ink layer 13 is dissolved and removed, but the ink layer 13 remains, so that the first wiring pattern 3 formed in the exposed region 免受 can be protected from the etching liquid which is etched. The human being, the alkaline film resists 17 and 18 on the second wiring pattern 5 and the fourth wiring pattern 8 are removed by an alkaline solution such as sodium hydroxide, and the ink layer 13 is also removed by dissolution of the test solution. Therefore, a portion of the core substrate 2 and the first wiring pattern 3 are obtained in an exposed region (i is exposed to the outside of the multilayer printed wiring board b of FIG. 1 when the ink layer 13 cannot be completely removed by this step) In addition, it is immersed in an alkaline solution to completely: remove/from the ink layer 13. The oil black layer 13 is dissolved and removed by using the test solution in the above manner without peeling by hand or by physical means. The ink layer 13 is completely and completely removed. Further, the removal of the dry film resists I?, 18 and the removal of the ink layer 13 can also be carried out in different steps. The multilayer printed wiring board as described above丨In the manufacturing method, the ink layer 13 and the ink layer 13 which is preferably cured are formed in the exposed region n where the first wiring layer 15 is exposed in the first wiring layer 15 and 201044939. Therefore, even if the first prepreg layer 4 is heated, Pressurizing, or using the ink layer 13 Since the resin constituting the second prepreg layer 4 flows into the exposed region u, the second wiring pattern 3 can be protected, and electrical defects can be prevented. Further, in the method of manufacturing the multilayer printed wiring board 1, the ink layer 13 is formed. Since the ink layer 13 is formed by the alkali-soluble ink, the ink layer 13 can be easily removed completely by the alkaline solution. Therefore, even if the exposed region 11 has a fine shape, the exposed region and the second wiring pattern 3 can be appropriately protected, thereby preventing it from being prevented. The exposed area 11 produces a residue of the ink layer 13.

In the manufacturing method of the agricultural multilayer printed wiring board 1, since the first wiring pattern 3 is formed in the exposed region 11, the exposed region 丨丨 becomes uneven. If the ink layer 13 is pressed by the laminate, the ink layer 13 is pressed against the concave surface of the exposed region u. Although the ink layer 13 will be "closed" to the exposed area, the ink layer 13 can be dissolved and completely removed by the alkaline liquid. Therefore, it is possible to prevent the residue of the ink layer 13 from occurring on the first pattern 3 or the first wiring pattern 如图3 as shown in the figure of the multilayer printed wiring board, and the upper pattern 2 of the exposed area. It becomes a connection terminal for mounting the electronic component 19. In this case, the thickness of the multilayer printed wiring board 1 in the line = 11 is smaller than the portion in which the second upper structure is provided, so that the height does not become even if the first wiring pattern member 19 is formed. If the height is too high, the two-side printed wiring board 1 can be realized. In the multilayer printed wiring board 1 described above, the core substrate 2: ^1 line pattern 'but is not limited thereto' and may be only for the core substrate.

Medium?::, two wiring patterns. Further, the multilayer printed wiring is wound on the core substrate 2 by φ. The L 4 and the second wiring patterns 5, &quot; can be formed into a layer which further forms an insulating layer and a wiring pattern | 16 201044939 to form three or more layers. Similarly, as shown in the following description of Fig. 10, an exposed region may be formed on the other surface 2b of the core substrate 2, and an insulating layer and a wiring pattern may be further formed to form three or more layers. In the multilayer printed wiring board j, when the insulating layer and the wiring pattern are further formed on one surface 2a and the other surface 2b of the core-substrate 2, and the respective surfaces 2a and 2b are formed into three or more layers, not only the core substrate 2 but also the core substrate 2 can be formed. The wiring pattern is exposed, and other wiring patterns located inside the two surfaces 2&amp;, 2b may be exposed. 〇 〇 Next, in the second embodiment, the multilayer printed wiring board 20 shown in Fig. 1A is formed of ink, and the exposed region 21 is formed not only on one side 2&amp; side but also on the other side 2b side of the core substrate 2. In the multilayer printed wiring board 20, the same components as those of the above-described multilayer printed wiring board are denoted by the same reference numerals, and detailed description thereof will be omitted. In the above-described layer printed wiring board 2, the second insulating layer* is formed on the exposed region u on the side of the inner surface 2a of the core substrate 2, whereby the two wiring patterns 3 are exposed, and the other wiring layers are provided. The third insulating layer 7 is not formed on the exposed region 21 on the side of the flute surface η of the core substrate 2, whereby one of the third line patterns 6 is exposed. ®Haveline: 1 A method of manufacturing an IP brush wiring board 2, in the same manner as the above-described multilayer printed wiring pattern *B manufacturing method, the first wiring pattern 3 and the third matching surface shape L: layer: 3 shown in FIG. The ink layer 22 is formed on the other side 2b of the core substrate 2. Oil First; the first prepreg layer 4 (as the second insulating layer) of the prepreg layer and the preferred third layer of the third insulating layer are formed of substantially the same thickness, and it is preferable to make the ink layer Η. Solidified overall. 17 201044939 'The first prepreg layer having the large mouth portions 4a, 7a formed at the position corresponding to 22 is next, and the ink layer 13 and the second prepreg (four) 7 are inserted for each ink layer i 3 . 'The ink layers 13, 22 are disposed on the i-th wiring pattern 3 and the third wiring pattern 6 so as to face the outer side, and the copper (14) is placed on each of the prepreg layers 4, 7. Further, similarly to the method of manufacturing the multilayer printed wiring board 1, the heating and pressurization are carried out as shown in Fig. 12.

The multi-layered laminate 23 of the body. At this time, by forming the ink layer A 22, it is possible to prevent the resin from flowing into the respective exposed regions 1 1 and 21 from the prepreg layer 4 and the second prepreg layer 7.

Next, as shown in FIG. 13, the through holes 10 and the vias 9 are formed in the same manner as in the above-described method of manufacturing the multilayer printed wiring board ι, and the second wiring patterns 5 and 帛4 are formed by etching the copper cases 14, 15. Wiring pattern 8. Then, the ink layers 丨3 and 22 formed in the exposed regions 11 and 21 are also removed when the dry film resists 17 and 18 used for forming the second wiring pattern 5 and the fourth wiring pattern 8 are removed by the alkaline solution. It is dissolved and removed. When the second wiring pattern 5 and the fourth wiring pattern 8 are formed, the ink layers 13 and 22 are formed in the exposed regions u and 21, whereby the first wiring pattern 3 and the third wiring pattern exposed in the exposed regions can be protected. 6 is protected from the etchant. In the manufacturing method of the multilayer printed wiring board 20 as described above, the exposed area where the second wiring pattern 3 is exposed can be simultaneously formed on both sides of one side 2a and the other side 2b of the core substrate 2 by using an alkali-soluble ink. 11 and the exposed region 21 of the third wiring pattern 6 are exposed. Both of the exposed region 11 and the exposed region 21 can obtain the same effects as the method of manufacturing the multilayer printed wiring board 1 described above. 18 201044939 Next, in the third embodiment, it is explained that the ink of the thickness of the ink layer shown in Fig. 14 can be manufactured by using the test. Specifically, in the printed wiring board 30 of the core substrate 31 of the guest layer, the first wiring pattern 32 is formed on the surface 31a as the first insulating layer 2, and the case 32 is formed. The adjacent third insulating layer 33 protects the first wiring pattern, and the second insulating layer/line pattern 32 is insulated from each other, and has a third insulating layer 35, and a second wiring pattern 34 is formed on the third surface. And the laminated layer 34, the second wiring pattern 34 protecting the second wiring pattern is insulated from each other, and the third insulating layer is L π 1 , the name, and the layer 35 The third wiring pattern 36 is formed on the upper surface. In the other surface of the core 2, a fourth wiring pattern 37 is formed, and the fourth insulating layer 38' that protects the wiring (four) 37 and insulates the adjacent fourth wiring patterns 37 from each other is formed on the fourth insulating layer 38. a line pattern 39, and a fifth insulating layer 4A that protects the fifth wiring pattern 39 and insulates the adjacent first wiring pattern 39 from each other, and forms a sixth wiring pattern 41 on the fifth insulating layer 4? . In the multilayer printed wiring board 30, a channel 31e electrically connecting the ith wiring pattern 32 and the fourth wiring pattern 37, and a channel 42 electrically connecting the ith wiring (four) 32 and the third wiring pattern 36 are formed on the core substrate 31, Electrically connecting the fifth wiring pattern 39 and the channel 43 of the sixth wiring pattern 41, and electrically connecting the ith wiring pattern 32, the second wiring pattern 34, the third wiring pattern #36, the fourth wiring pattern 37, and the 帛5 wiring The pattern 39 and the through hole 44 of the sixth wiring pattern 41. In the multilayer printed wiring board 30, not only the portion of the first wiring pattern 32 formed on the core substrate 31 is exposed in the second exposed region 45, 19 201044939 and in the first place. Further, in the exposed region 46, a portion of the second wiring pattern 34 formed on the third insulating layer 35 is also exposed. The multilayer printed wiring board 30 can be manufactured as follows. First, as shown in Fig. 15, a multi-layer P brush wiring board having a first exposed region 45 is manufactured. This can be manufactured in the same manner as the above-described multilayer printed wiring, and the detailed description is omitted. As shown in FIG. 16, the alkali-soluble/earth P is applied to the first exposed region 45 and the second exposed region 46 by screen printing or the like to form/receive the ink layer 47, preferably. In order to harden the ink layer 47 as a whole. When the ink layer 47 is heated and pressurized in the subsequent step as the second dielectric layer 35 as the third insulating layer, the uncured resin and the second prepreg layer 35 contained in the second insulating layer 33 can be prevented. The resin flows through the second exposed region 45 and the second exposed region 46. Therefore, as shown in FIG. 16, the ink layer 47 is formed on the second insulating layer 33 by a thickness substantially the same as the thickness of the second prepreg layer 35 laminated on the second insulating layer 33 in the next step in the next step. The periphery of the opening portion 33a. Next, as shown in Fig. 17, a second prepreg layer 35 as a third insulating layer is provided on the second insulating layer 33 so that the ink layer 47 faces the outside. In other words, the second prepreg layer 35 is provided so that the ink layer 47 is exposed from the second prepreg layer 35. More specifically, the second prepreg layer in which the opening 35a of the ink insertable layer 47 is formed is used. 35 is provided in such a manner that the ink layer 47 is inserted into the opening 35a. Further, a copper foil 48 on which the third wiring pattern 36 is formed is provided on the second prepreg layer 35. On the other hand, on the fourth insulating layer 38, a fourth 20 201044939 as the fifth insulating layer, a body layer 4G, and a steel for forming the sixth wiring pattern 41 are provided thereon to make the second pre-sub-layer 35. The fourth prepreg layer 40 and the copper foil 48 are pressed toward the core to the substrate 3 1 side, and the layers are pressurized by heating, and the layers are integrated. When heating and pressurizing, the ink layer 47 is formed by the first exposed region 45 and the second exposed region 46, and it is preferable to form the cured ink layer 47' even if the second insulating layer 33 and the second prepreg layer are formed. 35 softening, still Ο ❾ ^ The resin constituting the second insulating layer 33 and the second prepreg layer h flows into the second 区域 = region 45 and the second exposed region 46 ′, thereby preventing formation of the first immersion 2 field 45 The wiring pattern 32 or the pattern 34 formed on the second exposed region 46 adheres to the resin, or the second exposed region 45 and the second outgoing region 46 are blocked by the resin. In the same manner, the manufacturing method is the same as the manufacturing method. The third wiring pattern 36 and the sixth distribution frame are formed by subtracting the copper box 48'49. When the third wiring = and the sixth wiring pattern 41 are formed, the ink layer is left in the second wiring pattern and the second wiring pattern 41. Therefore, the first wiring pattern 32 formed in the first exposed region 45 can be secured and formed on the second wiring pattern 32. The younger brother reveals the influence of the wiring pattern 34 of the brother of the area 46. In the wet etching, the etching is performed next to the alkaline-dissolved wiring pattern 36 and the sixth wiring pattern 41 such as sodium hydroxide, and the third film is also used to dissolve and remove the ink using the test solution. The agent 'obtained the second line diagram exposed in the first exit area 45. As shown in FIG. 14, the second wiring pattern 34 is exposed in the extractable area 46. The second printed wiring board 30 is printed on the second side. 21 201044939 The method of manufacturing the multilayer printed wiring board 30 is such that different first wiring patterns 32 and second wiring patterns 34 formed on the core substrate 31 and the second insulating layer 33 can be formed by using ink. The same steps are exposed, which simplifies the manufacturing steps. Further, in the method of manufacturing the multilayer printed wiring board 3, since the ink layer 47 is not removed by physical means, the ink layer 47 is dissolved and removed, so that the first exposed region 45 and the second exposed region 46 can be prevented from being exposed. The first wiring pattern 32 and the second wiring pattern 34 are damaged, or the second insulating layer 33 or the third insulating layer 35 is peeled off, and the second insulating layer 33 or the first adjacent to the first exposed region 45 and the second exposed region 46 The end faces of the first exposed region 45 and the second exposed region 46 of the insulating layer 35 are flat. Further, the method of manufacturing the multilayer printed wiring board 3 () is formed by the first exposed region 45! In the wiring pattern 32, the second wiring pattern 34 is formed in the second exposed region 46, and each of the second wiring patterns 34 is uneven. When the ink layer 47 is pressed against the uneven surface of the first exposed region 45 and the second exposed region 46 by the buildup, The ink layer 47 will be the same as the first! The exposed area "and the second exposed area 4..., but the ink layer can be completely removed using the test solution

In the case of the CJ 47, it is possible to prevent the first wiring pattern 32 from being generated, and the ink layer is generated from the tamping tea 32 or the second wiring pattern 34, the jth wiring pattern 帛32, or the 帛2 wiring pattern 34. In the fourth embodiment, a method of manufacturing the flexible printed circuit board 50 as shown in Fig. 18 by using the first and fourth inventions will be described. The flexible-rigid composite printed wiring board is 5 turns, and the wax is connected by the flexible portion 51' having flexibility! The rigid portion 52 and the second rigid portion 53 are formed. The flexible portion 51 is flexible. The two first insulating layers are optional. The first rigid portion 52 and the second rigid portion of the first and second insulating portions 52 are formed on one surface 54a of the substrate 54. The first wiring _an pattern 55 of 53 forms a first frost film 56 that protects the second wiring pattern 55 and insulates the adjacent first _ wiring pattern 55 from each other, and the other surface 54b is shaped as a female | | The second cover film 57. The flexible portion 51 has a region 58 on the one surface 54a side of the flexible substrate 54 by exposing the first prepreg layer 60 on the first frost film 56 to expose the first cover film 56. And the region 58 is adjacent to the opposite side, and the other surface 5 has a region where the second cover film 57 is exposed by not covering the second pre-substrate layer 63 on the second cover film 57. 59. ❾

G The first rigid portion 52 laminates the first line pattern 55, the first cover film 56, the second insulating layer 60 formed of the first prepreg layer, and the second wiring pattern 6 on one surface 54a of the switchable substrate 54. Further, the 刚性i rigid portion 52 laminates the third wiring pattern 62 on the other surface 54b of the flexible substrate 54, the second covering film 57, the third insulating layer 63 formed of the second prepreg layer, and the fourth Wiring pattern 64. In the i-th rigid portion 52, a channel Μ between the first wiring pattern 帛55 and the third wiring pattern 62 is electrically connected to the flexible substrate 54, and the first wiring pattern 55 and the second wiring are electrically connected to each other. In addition, the rigid portion 52 of the pattern has an exposed region 67 in which the first wiring pattern 55 is exposed. Similarly to the rigid portion 52, the second rigid portion 53 is formed by laminating the first wiring pattern 55, the first coating film 56, and the second prepreg layer on the surface 5 of the flexible substrate 54. The insulating layer 6A and the second wiring pattern 61 are laminated on the other surface 54b with the third wiring pattern 62, the second coating film 57, the third insulating layer 63 formed of the second prepreg layer, and the fourth wiring pattern. 64. In the second rigid portion 53, a through hole 68 electrically connecting the ith wiring pattern 23 201044939 55, the second wiring pattern 61, the third wiring pattern 62, and the fourth 64 is formed. The flexible-rigid composite printing unit is manufactured by the following method. First, as shown in FIG. 19, in the same manner as the above-described method of manufacturing the multilayer printed wiring board i, a flexible substrate having copper on both sides is prepared to form a channel = after the surface 54a of the flexible substrate 54 is formed. The first wiring pattern 55 is formed by the subtractive method, and the third wiring pattern t is formed on the other surface 54b. Next, as shown in FIG. 20, the opening portion 56a is formed by pressing or the like on one of the five objects. The i-cover film 56 is laminated in a region corresponding to the exposed region Μ. On the other side 54b, the film 57 is also covered by pressing or the like. Next, as shown in Fig. 21, the vicinity of the opening portion 56a of the first cover film 56 is substantially the same as the thickness of the i-th prepreg layer 60 laminated on the first cover film 56 in the next step. The ink layer eg is formed around the opening portion 56a, and the region corresponding to the region 5&quot; of the uncovered layer 60 on the cover film 56 is also laminated on the cover film 56! The thickness of the prepreg layer 6 is substantially the same as the thickness of the first ink layer 7 which is soluble by screen printing or the like. The area 'in the region corresponding to the region where the second prepreg layer is not laminated> on the second cover film 57 is substantially the same as the thickness of the second pre-substrate layer 63 laminated on the second cover film 57 in the lower step. The thickness of the third layer is determined by the ink layer 71. Preferably, the ink layers 69, 70, 71 are hardened as a whole. Eight people are shown on the first cover 臈 56 as shown in FIG. The i-th oil 24 201044939 ink layer 69 and the second ink layer 7〇 face the outer side, and the i-th prepreg layer 6〇 is provided. That is, the first ink film 69 and the second ink layer are provided on the first cover film 56. The first prepreg layer 60 is disposed so that the layer 70 is exposed from the first prepreg layer 60. More specifically, the first cover film 56 is provided corresponding to the first ink layer 69 and the second ink layer 70. The first prepreg layer 60 having the openings 6A and 60b is formed at the position. The second prepreg is provided on the second cover film 57 at the position corresponding to the third ink layer 71. The bulk layer 63 is formed to form the second prepreg layer 63 facing the outer side of the third ink layer 71. The first prepreg layer 60, the first ink layer 69, and the second ink layer are formed. The copper foil 72 on which the second wiring pattern 61 is formed is provided on the 70th, and the copper foil 73 on which the fourth wiring pattern 64 is formed is provided on the second prepreg layer 63 and the third ink layer 71. Next, the multilayer printed wiring is formed. In the same manner as in the production method of the crucible, heating and pressurization are performed, and as shown in Fig. 23, the laminated body 74 is formed. ❹ * When the heating and pressurization are performed, even the i-th prepreg layer 6〇 and the second pre-thin layer are formed. The resin of 63 is fused and flowed, and the resin inflow region 58 and 59 which constitute the i-th prepreg layer and the second prepreg layer 63 are prevented by the first ink layer 69' of the ink layer 70 and the third ink layer 71. Or exposing the region (7), thereby preventing the resin from being adhered on the exposed i-th wiring pattern 55, or the regions 58 and 59 of the layer pre-layer layer or the exposed region 67 being blocked by the resin. Next, the channel 9 of the multilayer printed wiring board 1 and The through hole 1 is as shown in FIG. 24, and a channel 66 and a through hole 68 are formed in the laminated body 74. As shown in FIG. 25, the copper foil 72 is etched by a subtractive method and 25 201044939 wiring pattern 61' In the subtractive method, the copper wire 73 is also engraved to form the first wiring pattern 64. The second wiring is formed. In the case of the pattern 61, the first (fourth) layer is formed into the ink layer 69, whereby the first wiring pattern 55 which is formed in the exposed region 67' can be protected from the engraving liquid. Secondly, the use of the liquid for inspection can be utilized. When the second wiring pattern 61 and the fourth wiring are formed, 76 are removed, the i-th ink layer 69, the:::7〇帛3 oil (four) 71 is also (four) dissolved (four) solution removing agent 75, 76, the first In the case of a yoshida tongue anti-71, it can be manufactured as = second ink layer 7〇, as shown in the third ink layer, by not accumulating two wiring boards 5〇, such as “the area of the prepreg layer 63 59 /曰The 6-inch region 58 and the unstacked second portion W are connected to the first flexible portion 53 having the exposed region 67. As described above, the rigid portion 52 and the second rigid portion are formed by using the ink in accordance with the flexibility-rigidity, and the method of manufacturing the first wiring board 50 is formed! Ink layer 69. In the exposed region 6 where the line pattern 55 is not exposed, the first prepreg layer 6 is exposed to expose the first cover film 56. In this state, the second ink layer 7 is formed in the second field 58 of the second prepreg layer 6 without lamination. The exposed exposed region 59 is formed into a third lower portion, and the ink layer 71 is removed by dissolving the second coating film 57 solution. Next, the formation of the /2 ink layer 7 〇 and the third ink layer are formed in the exposed region 67 by the alkalinity. Therefore, the exposed region and the internal first wiring pattern 55 can be exposed, and the flexible portion 51 serves as a connection terminal for the electronic component. Since the first wiring pattern is laminated with the prepreg layer, the flexible cover can be maintained by the first cover film 56 and the second cover 26 201044939 film 57, so that the flexible portion 5] can be used as a cable. . Further, in the method of manufacturing the flexible-rigid composite printed wiring board 5, the second ink layer 70 and the third ink layer 71 are formed, whereby even when the laminated body 74 is formed, even the first! The prepreg layer 6〇 and the second prepreg layer are heated and pressurized, and can also be prevented, and the resin inflow region 58 of the first pre-sublayer layer 6〇 and the second prepreg layer 63 is formed. In the region 59, the flexible portion 51 can maintain the flexibility 1 of the flexible substrate 54, and the i-th is formed.

The G ink layer 69' prevents the resin of the first prepreg layer 6 from flowing into the exposed region 67 when the laminated body 74 is formed. Therefore, in the exposed region 67, it is possible to prevent the resin from adhering to the exposed i-th wiring pattern 55, whereby electrical defects may be caused. Further, in the manufacturing method layer of the flexible-rigid composite printed wiring board 5: the first ink layer 69 is removed by the test solution, and the second ink is removed from the third ink layer 7 instead of by physical means. By means of the means, the first ink layer 6 damages the i-th rigid second layer 7° and the third ink layer 71, and the first wiring layer 60 and the exposed portion of the region 67 are not removed. 2 cover film 56, second cover 臈 57, first prepreg! The cover film layer 34 is peeled off. Further, the end faces of the second cover film 587 and the second insulating layer 6A adjacent to the region 58 and the adjacent portions of the frost adjacent to the region 59 are flattened to the end faces of the third insulating layer 63 and the exposed regions 67. Further, the end face of the film 56 and the end face of the second insulating layer 60 are formed in the middle of the composite printed wiring board 5, so that the formation of the first line pattern 55 is performed by lamination pressing. On the other hand, the first ink layer 69 is pressed against the uneven surface of the exposed region 67 27 201044939, and the first ink layer 69 is adhered to the exposed region 67, but the first ink layer 69 can utilize the alkali. Since the dissolution of the solution is completely removed, it is possible to prevent connection failure due to the residue of the first ink layer 69 between the first wiring pattern 55 or the first wiring pattern 55. Further, since the second ink layer 7'' of the third ink layer 71 is also dissolved by the alkaline solution, the second ink layer 70 and the third ink layer 71 are prevented from being damaged by the regions 58 and 59. The flexibility of the portion 51 is lowered. Further, in the above-described flexible-rigid composite printed wiring board 5, the exposed region 67 in which the i-th wiring pattern 55 is exposed is formed in the first rigid portion 52, but the exposure may not be formed in the i-th rigid portion 52. The region 67 is a flexible-rigid composite printed wiring board in which the flexible portion 5 i is formed by the region 58 and the region 59 by the method of the present invention. Further, in the above-described flexible-rigid composite printed wiring board, the exposed surface of the third wiring pattern 62 may be formed in the same manner as the multilayer printed wiring board 20 shown in FIG. region. Next, as the fifth embodiment, the multilayer printed wiring board 80 shown in Fig. 26 can be produced using an alkali-soluble ink. The multilayer printed wiring board Ο 80 is composed of a rigid portion 8A for arranging electronic components and the like, and flexible terminal portions 82 and 83 projecting from both sides of the rigid portion 8A. The multilayer printed wiring board 80' electrically connects the flexible terminal portions 82, 83 to other electronic components, and electrically connects the electronic components mounted on the rigid portion 81 with other electronic components. Figure 27 is a cross-sectional view showing the line χ-χ in Figure 26. In the rigid portion 8 1 , the first wiring pattern 85 is formed on the replaceable substrate 84 , and a cover film for protecting the ith wiring pattern “and the first wiring pattern” from each other is laminated on the flexible substrate 28 201044939 84 . 86. The insulating layer 87' formed by prepreg is laminated on the cover film 86, and the second wiring pattern I is formed thereon. The surface of the (four) portion 81 is exposed as a terminal except for the second wiring pattern (4). All of the electronic component mounting regions 90 are covered by a solder resist 89. The terminal portions 82 and 83 are also formed with a 丄 丄 wiring pattern 85 on the flexible substrate. But not the first! The cover film 86 and the insulating layer 87 are laminated on the wiring pattern 85, and the flexible terminal portions 82 and 83 have portions exposing the U-ray pattern 85. Here, the 帛1 wiring pattern 85 and the second wiring pattern 必须88 must be turned on by via holes or vias, but are omitted here. Further, since the flexible terminal portion 曰83 is also the same as the flexible terminal portion 820, the drawings are omitted. Specifically, the structure of the flexible terminal portion 82 of the multilayer printed wiring board 80 can be formed by forming a first wiring pattern not only over the product portion 92 but also over the product outer portion 93 as shown in FIG. The 85 area f is stamped by taking z_z as a cut surface. The configuration of Fig. 28 can be manufactured by the same method as the method of forming the exposed region 67 described in the fourth embodiment, and the same effects can be obtained. The multilayer printed wiring board 8 shown in Fig. 26 can be manufactured in the following manner. First, as shown in Fig. 29, a flexible substrate 84' having a copper case 1' on one side is prepared, and the second wiring pattern 85 is formed by a subtractive method using the copper foil 1' as shown in Fig. 3A. Next, as shown in Fig. 31, an opening is finally formed by pressing or the like. The cover film 86 of the crucible is laminated on a region corresponding to the regions 91, 91 which are the exposed portions of the flexible terminal portions 82, 83. Eight times, as shown in Fig. 32, the alkali-soluble ink layer 102 and the second ink layer 1 () 3 are formed to cover the cover film 86 by screen printing or the like (as a description of flexibility) Terminal section § 2, part 83) and its surroundings. Therefore, the ink layer 102 and the second ink layer 1〇3 are laminated to the prepreg layer 1(1' on the cover film 86 in the next step and formed to have the same thickness as the thickness of the insulating layer. In order to harden the whole, the 'pre-coat layer 101 is disposed on the cover film 86 on the cover film 86 so that the ink layer and the second ink layer 103 face the outer side. The upper prepreg layer ι〇ι is disposed as the first layer. The ink layer 102 and the second ink layer 1G3 are exposed from the prepreg layer (8). Further, the prepreg layer 101 and the first ink layer 1 and 2 are exposed. 2 The copper foil 1〇4 in which the 帛2 wiring pattern 88 is formed is disposed on the ink layer 103. &amp; Next, 'heating and pressurizing' is performed, and as shown in Fig. 34, a laminated body i 05 in which copper/white 4 is laminated is formed. When the resin constituting the first prepreg layer 101 is melted and flows during heating and pressurization, the resin constituting the i-th prepreg layer (8) may be prevented from flowing into the exposed region 91 by the i-th ink layer 1〇2 and the second ink yf 1G3. Thereby, it is possible to prevent the resin from sticking to the wiring pattern of the portion, or the wiring pattern is blocked by the resin. Next, 'in the laminated body 105, The channel ι 6 shown in Fig. 35 is formed in the same manner as the channel 9 of the above-described multilayer printed wiring board. The second wiring pattern 85 is electrically connected to the ith wiring pattern 85 by the channel 〇6. The copper foil 104., the person as shown in Fig. 36 does not use the anti-agent 1〇7 transmission reduction method to the copper 30 201044939 wiring pattern 88. The first wiring layer 102 and the second oil are formed in the second wiring. When the first wiring pattern foil 104 of the region 91 is etched to form the second pattern 88, the ink layer 103 is exposed in the region 9, whereby the protrusion can be protected from the etching liquid. 2, when the wiring pattern 88 is formed, the resist J 1 〇 7 ' is used, and the first ink layer 102 and the second ink layer 1 〇 3 are also removed by the alkaline solution. The resist is removed. 1〇7, the first ink layer I 〇2 and the second, tL S a 1 〇

In the ink layer 103', as shown in Fig. 37, the first wiring pattern 85 is a wiring board exposed in the exposed region 91. As shown in Fig. 38, the second wiring pattern 88 is covered with the solder resist 89 except for the electronic component mounting region 90. The formation method of the solder resist 89 is a method of hardening the surface of the electronic component mounting region 90 by screen printing, and then hardening it by UV (ultraviolet rays) or heating, or After the solder resist material is formed in a comprehensive manner by coating, screen printing, or the like, the UV light is irradiated to a region other than the electronic component mounting region 90 using a mask or the like to be hardened, and secondly, an alkaline solution such as sodium carbonate is used. A method of removing the unirradiated portion of the uv and then further hardening it by heating. After the formation of the solder resist 89, if necessary, after plating with gold plating or the like, as shown, the portion of the outer portion 93 of the product is punched through the metal mold in the form of z 1 1 and Z2-Z2 _ sections in the drawing, that is, Complete the multi-layer printed wiring board 8图 of Figure 26~28. Further, the multilayer printed wiring board manufactured by the method of the present invention can be further used as a wiring board having a plurality of rigid portions and having rigid portions connected by a flexible portion 31 201044939 cable portion. EXAMPLES Hereinafter, examples and comparative examples of a multilayer printed wiring board will be described. &lt;Examples&gt; In the examples, a multilayer printed wiring board was produced as follows. First, a two-sided copper-clad flexible substrate having a copper foil having a thickness of 9 &quot; m is prepared on both sides of the polyimide, and a wiring pattern is formed on both surfaces by a usual subtractive method. Next, on both sides of the flexible substrate, a region corresponding to the exposed region of the exposed wiring pattern is opened by a stamping of 12 5 # m thick polyimine film, and an adhesive having 25 &quot; m The cover film of the layer was thermally pressed and covered in a vacuum to form an inner substrate. Next, an alkali-soluble ink (manufactured by Shanrong Chemical Co., Ltd., trade name: ser-451B) was printed on the exposed area of the wiring pattern by screen printing, and dried and hardened at i5〇c&gt;c, 2〇. And forming an ink layer. The dried and hardened printed film (oil layer) has a thickness of 60 to 〇1. Next, by inserting the ink layer, the thickness of the opening is formed by pressing the same position and shape as the ink layer, and the immersion epoxy resin-based glass cloth substrate prepreg is disposed on the inner substrate. On both sides, a copper layer was laminated on both outer sides, and a laminate was formed in a vacuum at a pressure of g/cm 2 at a pressure of 90 90 at 90°. The appearance of the laminated body after pressing is flat. Next, a dry film anti-contact agent is deposited on a copper pig layer provided on the outer layer of the laminate, exposed, developed, and ejected with a jet of a vaporized iron aqueous solution, thereby forming a wiring pattern in the copper box. At this time, the ink layer remains after completely removing the copper foil corresponding to the unexposed portion of the disk dry film anti-32 201044939 etchant. Next, the laminate was immersed in a 3 wt% aqueous sodium hydroxide solution set at 50 °C. Thereby, the ink layer is dissolved and removed, and the internal wiring pattern is revealed. In this embodiment, there is no case where the resin constituting the glass cloth substrate prepreg impregnated with the epoxy resin flows into the wiring pattern, and the end surface of the boundary between the cover film and the ink of the glass cloth substrate prepreg impregnated with the epoxy resin. There is no damage, and it becomes a very steep shape. It is not considered to have any residue on the wiring pattern and between the wiring patterns. &lt;Comparative example&gt; In the comparative example, an ink made by Sun Ink Manufacturing Co., Ltd. (trade name: Solder Shield SSZ-100SCB) was used instead of the alkali-soluble ink to form an ink layer. A multilayer printed wiring board was produced in the same manner as in the examples except for this point. In the comparative example, since the ink is not alkali-soluble, the ink layer is not removed. The internal wiring pattern does not appear. When the ink layer is carefully peeled off by hand, since the ink layer bites into the prepreg, the residue of the ink layer is generated at the boundary of the prepreg with the ink. Further, conversely, one portion of the prepreg is carried away by a portion of the peeled ink layer, and a crack is generated in the prepreg. Further, when the wiring pattern after peeling was observed with a microscope, it was found that the number of lines between the wiring patterns was broken. From the examples and comparative examples, it can be seen that when the multilayer printed wiring board in which the wiring pattern formed inside is formed is produced, the present invention using an alkali-soluble ink can be extremely simple and does not cause Wiring 33 201044939 A multilayer printed wiring board is produced in a state where the pattern or the cover film or the prepreg layer is damaged. The present invention is useful when a multilayer printed wiring board such as a flexible-rigid composite multilayer wiring board or a rigid multilayer wiring board is manufactured, and a part of an inner layer region such as a wiring pattern or an inner layer region exhibiting a cable function is exposed. . BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing a multilayer printed wiring board according to a first embodiment of the present invention, which is manufactured by a method for producing a multilayer printed wiring board of the present invention. Fig. 2' is a cross-sectional view showing a state of a double-sided copper-clad core substrate. 3 is a cross-sectional view showing a state in which a second wiring pattern and a third wiring pattern are formed on a core substrate. Fig. 4' is a cross-sectional view showing a state in which an ink layer is formed in an exposed region.

Fig. 5 is a cross-sectional view showing a state in which a prepreg layer and a copper foil are placed on a core substrate. W Fig. 6' is a cross-sectional view showing a state in which a core substrate, a prepreg layer, and a copper foil are laminated. Fig. 7' is a cross-sectional view showing a state in which a channel and a through hole are formed. Fig. 8' is a cross-sectional view showing a state in which a wiring pattern of an outer layer is formed. Fig. 9' is a cross-sectional view showing a state in which an electric component is formed in a wiring pattern formed in an exposed region. Fig. 10 is a cross-sectional view showing a multilayer printed wiring board of a second embodiment manufactured by the method of manufacturing a multilayer printed wiring board to which the present invention is applied. Fig. 1 is a cross-sectional view showing a state in which an ink layer is formed in an exposed region in the method of manufacturing a multilayer printed wiring board according to the second embodiment. Fig. 12 is a cross-sectional view showing a state in which a core substrate, a prepreg layer, and a copper foil are laminated in a method of manufacturing a multilayer printed wiring board according to the second embodiment. Fig. 1 is a cross-sectional view showing a state in which a wiring pattern of an outer layer is formed in the method of manufacturing a multilayer printed wiring board according to the second embodiment. Fig. 1 is a cross-sectional view showing a multilayer printed wiring board according to a third embodiment manufactured by a method of manufacturing a multilayer printed wiring board to which the present invention is applied. Fig. 15 is a cross-sectional view showing a state in which the first exposed region is exposed in the method of manufacturing the multilayer printed wiring board of the third embodiment. Fig. 16' is a cross-sectional view showing a state in which an ink layer is formed in the first exposed region and the second exposed region. Fig. 17' is a cross-sectional view showing a state in which a laminate is formed in the same production method. Fig. 18 is a cross-sectional view showing a flexible-rigid composite printed wiring board according to a fourth embodiment manufactured by a method of manufacturing a multilayer printed wiring board to which the present invention is applied. Fig. 19 is a cross-sectional view showing a state in which a first wiring pattern and a third wiring pattern are formed on a flexible substrate in the method of manufacturing a multilayer printed wiring board according to the fourth embodiment. Fig. 20 is a cross-sectional view showing a state in which a first cover film and a second cover film 35 201044939 are laminated on a flexible substrate in the method of manufacturing a multilayer printed wiring board according to the fourth embodiment. Fig. 21 is a cross-sectional view showing a state in which the first to third ink layers are formed on the flexible substrate in the method of manufacturing the multilayer printed wiring board of the fourth embodiment. Fig. 22 is a cross-sectional view showing a state in which a cover film, a prepreg layer, and a copper foil are placed on a flexible substrate in the method of manufacturing a multilayer printed wiring board according to the fourth embodiment. Fig. 23 is a cross-sectional view showing a state in which a flexible substrate, a cover film, a prepreg layer, and a copper foil are laminated in a U-layer manufacturing method of the multilayer printed wiring board according to the fourth embodiment. Fig. 24 is a cross-sectional view showing a state in which a channel and a through hole are formed in the method of manufacturing a multilayer printed wiring board according to the fourth embodiment. Fig. 25 is a cross-sectional view showing a state in which a wiring pattern of an outer layer is formed in the method of manufacturing a multilayer printed wiring board according to the fourth embodiment. Fig. 26 is a plan view showing a multilayer printed wiring board according to a fifth embodiment of the present invention, which is manufactured by the method for producing a multilayer printed wiring board of the present invention. Figure 27 is a cross-sectional view of the line χ-χ in Figure 26. Fig. 28 is a cross-sectional view showing a state before the pressing of the multilayer printed wiring board, the main seventh, and the + mountain clothing 'flexible terminal portion of the fifth embodiment. Figure 29 is a cross-sectional view of a flexible substrate having a copper foil on one side. Fig. 30 is a cross-sectional view showing a state in which an ith wiring pattern is formed in a copper case of a flexible substrate. Fig. 31 is a cross-sectional view showing a state in which a cover film is laminated in a method of manufacturing a multilayer printed wiring board according to a fifth embodiment. [Claim 32] FIG. 32 is a cross-sectional view showing a state in which the first and second ink layers are formed on the flexible substrate in the method of manufacturing the multilayer printed wiring board of the fifth embodiment. Fig. 33 is a cross-sectional view showing a state in which the prepreg layer and the copper foil are placed on the cover film in the method of manufacturing the multilayer printed wiring board according to the fifth embodiment. Fig. 34 is a cross-sectional view showing a laminated body in which a prepreg and a copper foil are laminated in a method of manufacturing a multilayer printed wiring board according to a fifth embodiment. Fig. 35 is a cross-sectional view showing a state in which a channel is formed in a laminate in the method of manufacturing a multilayer printed wiring board according to the fifth embodiment. Fig. 3 is a cross-sectional view showing a state in which a second wiring pattern is formed in the method of manufacturing a multilayer printed wiring board according to the fifth embodiment. 7 is a cross-sectional view showing a state in which the second layer, the second ink layer, and the resist are removed by an alkaline solution in the method for producing a multilayer printed wiring board according to the fifth embodiment. [Fig. 38] Fig. 38 is a cross-sectional view showing a state in which green paint is formed on the second wiring pattern in the method of manufacturing the multilayer printed wiring board of the fifth embodiment. Fig. 39 is a cross-sectional view showing a state in which the outer portion of the product is removed by the method of manufacturing the multilayer printed wiring board according to the fifth embodiment. [Description of main component symbols] 1 multilayer printed wiring board 2 first insulating layer (core substrate) 37 one of the core substrates, the other surface of the core substrate, the first wiring pattern, the second insulating layer (first prepreg layer), the first pre- Opening of the dip layer, second wiring pattern, third wiring pattern, third insulating layer (second prepreg layer), opening of the second prepreg layer, fourth wiring pattern, via hole, exposed area, copper pig ink layer, copper foil, copper foil layer Body Dry Film Resin Dry Film Resist Electronic Part Multilayer Printed Wiring Board Exposed Area 38 201044939 22 Ink Layer 23 Multilayer Laminate 30 Multilayer Printed Wiring Board 31 First Insulation Layer (Core Substrate) 31a One Side of Core Board 31b Core The other surface 31c of the substrate, the channel 32, the first wiring pattern O 33, the second insulating layer (first prepreg layer) 33a, the opening portion 34 of the first prepreg layer, the second wiring pattern 35, the third insulating layer (second prepreg layer) 35a second prepreg layer opening portion 36 third wiring pattern 37 fourth wiring pattern 38 fourth insulating layer (third prepreg layer) O 39 fifth wiring pattern 40 5 Insulation layer (4th prepreg layer) 41 6th wiring pattern 42 Channel 43 Channel 44 Through hole 45 First exposed area 46 Second exposed area 39 201044939 47 Ink layer 48 Copper pig 49 Copper pig 50 Flexible-rigid composite printing Wiring board 51 Flexible portion 52 of the flexible-rigid composite printed wiring board 50 First rigid portion 53 of the flexible-rigid composite printed wiring board 50 Second rigid portion 54 of the flexible-rigid composite printed wiring board 50 1 Insulation layer (flexible substrate) 54a One side of the flexible substrate 54b The other side of the flexible substrate 55 First wiring pattern 56 First cover film 5 6a Opening portion of the first cover film 57 Second cover film 58 area 59 region 60 second insulating layer (first prepreg layer) 60a opening portion 60b of first prepreg layer opening portion 60c of first prepreg layer opening portion of first prepreg layer 61 second wiring pattern 62 third wiring Pattern 63 third insulating layer (second prepreg layer) 63a opening

y 40 201044939 64 4th wiring pattern 65 Channel 66 Channel 67 Exposure area 68 69 70 71 Ο 72 73 74 Through hole 1st ink layer 2nd ink layer 3rd ink layer Copper pig copper pig laminate 75 Resist 76 80 81 82 〇83 84 85 86 87 88 89 90 Resist multilayer printed wiring board Multi-layer printed wiring board 80 rigid part Multi-layer printed wiring board 80 flexible terminal part Multi-layer printed wiring board 80 flexible terminal part flexibility Substrate first wiring pattern covering film insulating layer second wiring pattern solder resist electronic component mounting region 41 201044939 91 exposed region 92 product portion 93 product outer 100 copper foil 101 prepreg layer 102 first ink layer 103 second ink layer 104 copper Pig 105 laminate 106 channel 107 anti-agent 42

Claims (1)

201044939 VII. Patent Application Range 1· A method for manufacturing a multilayer printed wiring board, characterized in that a wiring pattern is formed on at least one side of a first insulating layer; and a part of the wiring pattern is formed on the first insulating layer An alkali-soluble ink layer; a second insulating layer formed on the ink layer forming side of the first insulating layer, wherein the ink layer is exposed from the second insulating layer, and a metal is formed on the second insulating layer After the metal layer is patterned to form a second wiring pattern, the ink layer is removed by alkali I1 kinetic solution to expose one of the second insulating layer and the wiring pattern thereon. 2. The manufacturing method of the multilayer printed wiring board according to the first aspect of the patent scope, and the formation of the intermediate ink layer, the entire ink layer is cured. The method for manufacturing a multilayer printed wiring board according to the first aspect of the patent application, wherein the alkaline solution is simultaneously removed to form the second compound, and the complex pattern is formed on the second insulating layer. The anti-button agent and the ink layer. 4. The manufacturing method of the multilayer printed wiring board of the first item of the U.S., the second insulating layer and the metal layer are formed as follows: the first ink layer is exposed to the first layer. The prepreg on the surface on which the oil layer is formed on the insulating layer and the metal foil disposed on the prepreg are heated, and the layers are integrated by lamination. • 士中: The manufacturer of the multi-layer printed wiring board of the cofferdam, the second insulating layer and the metal layer are formed as follows: the ink layer forming surface of the first insulating layer is the ink The way the layer is exposed 43 201044939 Insulation Layer Insulation Layer The insulating substrate to which the metal is smelted is placed and heated to integrate it. A method of manufacturing a multilayer printed wiring board is based on the first aspect of the invention, wherein a part of the i-th and a wiring pattern thereon are exposed by the method of the first aspect of the patent application. In the case of a second manufacturer of the second insulation pattern formed on the second wiring pattern, the insulating layer and the wiring pattern are formed in order to form a multilayer structure, in which a new ink layer on the insulating layer comprising a portion of the second wiring pattern; wherein the new insulating layer is formed by exposing the new insulating layer to the new deep edge of the new ink bank edge Forming a new metal layer on the new insulating layer; patterning the new metal layer to form a new wiring pattern, and removing the new ink layer by an alkaline solution &amp; to remove a portion of the second insulating layer from the second wiring The pattern is exposed. 8. The manufacturer of the multilayer printed wiring board of the patent scope of the invention, wherein the first insulating layer has flexibility; a after the wiring pattern on the first insulating layer is formed, the ink layer The shape (1) is covered with a coating layer on the second insulating layer other than the exposed portion of the first insulating layer and the wiring pattern. The manufacturing method of the multilayer printed wiring board of claim 8, wherein the second ink layer is formed on one portion of the cover layer, and the second insulating layer is insulated from the second insulating layer by the second ink layer The ink layer on the layer is formed by exposing the second insulating layer, and the second oil layer 44 201044939 on the cover layer and the ink layer on the fi insulating layer are dissolved and removed by the alkaline solution, thereby A portion of the cover layer is exposed. The manufacturing method of the multilayer printed wiring board of claim 9, wherein the exposed portions of the cover layer are formed on opposite sides of the first insulating layer so as to face each other. In the method of manufacturing a multilayer printed wiring board according to the first aspect of the invention, the wiring pattern exposed on the first insulating layer is a connection terminal of an electronic component. The manufacturing method of the multilayer printed wiring board of claim 8, wherein the second insulating layer exposed by the removal of the ink layer is cut. In the method of manufacturing a multilayer printed wiring board according to the 12th aspect of the invention, the wiring pattern exposed on the first insulating layer is a connection terminal of the electronic component. M. A method of manufacturing a multilayer printed wiring board, wherein a wiring pattern is formed on at least one side of a flexible first insulating layer; a coating layer is disposed on a wiring pattern forming surface of the first insulating layer; Forming a soluble ink layer on the upper portion; forming a second insulating layer on the cover layer from the second insulating layer, and forming a metal layer on the second insulating layer; &quot; After the metal layer is patterned to form a wiring pattern, the ink layer is removed by an alkaline solution to expose one of the cover layers. 15. In the manufacture of a multilayer printed wiring board according to item 14 of the scope of the patent application, the formation of the ink layer is to harden the ink layer as a whole. 16' Manufacturing of a multilayer printed wiring board such as Shen Qing Patent Range No. 15 201044939 The method wherein, on both sides of the first insulating layer, the exposed portions of the cover layer are formed so as to face each other. VIII. Schematic (e.g., next page) 46