JP3310037B2 - Manufacturing method of printed wiring board - Google Patents
Manufacturing method of printed wiring boardInfo
- Publication number
- JP3310037B2 JP3310037B2 JP31693A JP31693A JP3310037B2 JP 3310037 B2 JP3310037 B2 JP 3310037B2 JP 31693 A JP31693 A JP 31693A JP 31693 A JP31693 A JP 31693A JP 3310037 B2 JP3310037 B2 JP 3310037B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- circuit
- rigid
- hard
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、プリント配線板の製造
方法に係り、特に硬質プリント配線ユニット部とフレキ
シブル部とから成る折り曲げ使用可能なプリント配線板
の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a printed wiring board, and more particularly to a method of manufacturing a bent printed wiring board comprising a hard printed wiring unit and a flexible portion.
【０００２】[0002]
【従来の技術】従来から、可撓性を要求される配線の接
続部や機器の筐体を兼用させた回路構成、もしくは配線
ないし回路ユニットの積層化やコンパクト化として、次
のような構成のプリント配線板が知られている。たとえ
ば、図４に要部構成を断面的に示すごとく、フレキシブ
ル配線基板１面に、適宜離隔して硬質のプリント配線板
ユニット２，２′を積層一体化し、前記離隔部を成すフ
レキシブル配線基板１′によって、折り曲げ可能に構成
したプリント配線板が知られている。なお、図４におい
て、1aはフレキシブル配線基板１の配線導体、2a，2a′
は硬質のプリント配線板ユニット２，２′の配線導体、
３はスルホール接続をそれぞれ示す。2. Description of the Related Art Conventionally, a circuit configuration which also serves as a connection portion of a wiring requiring flexibility and a housing of a device, or a laminated or compact wiring or a circuit unit has the following configuration. Printed wiring boards are known. For example, as shown in a sectional view of a main part in FIG. 4, rigid printed wiring board units 2 and 2 'are laminated and integrated on the surface of the flexible wiring board 1 at appropriate intervals to form the flexible wiring board 1 forming the separation section. ', There is known a printed wiring board configured to be bendable. In FIG. 4, reference numeral 1a denotes a wiring conductor of the flexible wiring board 1, and 2a and 2a '.
Are the wiring conductors of the hard printed wiring board units 2 and 2 ',
3 shows through-hole connections, respectively.
【０００３】そして、この種のプリント配線板は、一般
的に次のようにして製造されている。図５〜図７は製造
工程順に、その実施態様を模式的に示したもので、先
ず、図５に断面的に示すごとく、予め用意しておいた所
要のフレキシブル配線基板１、一主面に所要の配線導体
（配線パターン）2aを形成し、他主面に外層回路形成用
の銅箔2bが張り合わされ、かつ回路形成領域（硬質のプ
リント配線板ユニット２，２′に対応する）および非回
路形成領域２″の切断・分離を可能にするため切り離し
用溝2cが、前記配線導体（配線パターン）2a形成面に形
設された硬質なプリント配線板、および窓4a付き絶縁性
接着剤シート４を位置決め，積層・配置する。ここで、
前記絶縁性接着剤シート４の窓4aは、前記硬質なプリン
ト配線板の非回路形成領域２″に対応するものである。[0003] This type of printed wiring board is generally manufactured as follows. 5 to 7 schematically show the embodiments in the order of the manufacturing process. First, as shown in cross section in FIG. A required wiring conductor (wiring pattern) 2a is formed, a copper foil 2b for forming an outer layer circuit is laminated on the other main surface, and a circuit forming area (corresponding to the hard printed wiring board units 2 and 2 ') and non- A separating groove 2c is formed on the surface on which the wiring conductor (wiring pattern) 2a is formed to enable cutting and separation of the circuit forming area 2 ". 4 is positioned, laminated and arranged, where
The window 4a of the insulating adhesive sheet 4 corresponds to the non-circuit forming area 2 ″ of the hard printed wiring board.
【０００４】次に、前記位置決め，配置・積層した積層
体に、加圧，加熱処理を施して一体化した後、表面層を
成す外層回路形成用銅箔2bについて、いわゆるフォトエ
ッチング処理を施して、所要の外層回路を形成する一
方、スルホール加工を行う。その後、いわゆる外形加工
線に沿って外形加工してから、前記回路形成領域（換言
すると硬質のプリント配線板ユニット２，２′）および
非回路形成領域２″の切断・分離を可能にするための切
り離し用溝2cに対応した溝を硬質なプリント配線板の外
側に形設して、前記非回路形成領域２″を選択的に切り
離し・剥離することにより、前記図４に図示したような
構成の、折り曲げ可能なプリント配線板が得られる。[0004] Next, after the laminated body thus positioned, arranged and laminated is subjected to pressure and heat treatments to be integrated, a so-called photo-etching treatment is applied to the outer layer circuit forming copper foil 2b forming the surface layer. The through hole processing is performed while forming the required outer layer circuit. Thereafter, after the outer shape is processed along a so-called outer shape processing line, the circuit forming area (in other words, the hard printed wiring board units 2 and 2 ') and the non-circuit forming area 2 "are cut and separated. A groove corresponding to the separation groove 2c is formed on the outside of the hard printed wiring board, and the non-circuit formation region 2 ″ is selectively separated and separated, thereby obtaining a structure as shown in FIG. Thus, a bendable printed wiring board is obtained.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、前記構
成を採るプリント配線板の製造方法においては、工程が
煩雑化し、生産性が劣るという不都合が認められる。す
なわち、加圧，加熱処理により積層・一体化した際、図
６に要部を断面的に示すごとく、本来、剥離・離脱をで
きるだけ容易に成し得るこが所望される硬質プリント配
線板の非回路形成領域２″に、絶縁性接着剤シート４の
溶融した一部が流出し、前記非回路形成領域２″がフレ
キシブル配線基板１面に接着・一体化する現象が認めら
れる。このため、最終工程での非回路形成領域２″を選
択的に切り離し・剥離する作業が困難となり、結果的に
折り曲げ可能なフレキシブルエリアが設計値に較べて短
縮し、または硬質のプリント配線板ユニット２，２′と
非回路形成領域２″との切り離し面が、図７に要部を斜
視的に示すように、凹凸化し易いなどの問題がある。つ
まり、フレキシブル配線基板１′領域および硬質プリン
ト配線板ユニット２，２′領域が所定の寸法・精度で配
置・一体化し、かつ所望の折り曲げ機能を備えたプリン
ト配線板を得ることは実質的に至難といえる。さらに、
加えてフレキシブル配線基板１′領域面が、前記流出し
た接着剤の非回路形成領域２″に対する部分的な接着に
よって凹凸化していると、フォトエッチングによる外層
回路の形成でのマスキングや、ソルダレジストインクの
コーテングなど悪影響を及ぼす。However, in the method of manufacturing a printed wiring board having the above configuration, there are disadvantages that the steps are complicated and the productivity is poor. That is, when laminated and integrated by pressurization and heat treatment, as shown in a sectional view of a main part in FIG. 6, a rigid printed wiring board which is originally desired to be easily peeled and separated as easily as possible is required. A phenomenon is observed in which a portion of the insulating adhesive sheet 4 that has melted flows out into the circuit forming region 2 ″ and the non-circuit forming region 2 ″ adheres to and is integrated with the surface of the flexible wiring board 1. For this reason, it is difficult to selectively separate and peel off the non-circuit formation region 2 ″ in the final step. As a result, the flexible area that can be bent is shortened as compared with the design value, or the rigid printed wiring board unit As shown in a perspective view of a main part in FIG. 7, there is a problem that a separation surface between the non-circuit forming region 2 ″ and the non-circuit formation region 2 ″ is easily made uneven. In other words, it is substantially difficult to obtain a printed wiring board having the flexible wiring board 1 'area and the rigid printed wiring board unit 2 and 2' areas arranged and integrated with predetermined dimensions and accuracy and having a desired bending function. It can be said that. further,
In addition, if the surface of the flexible wiring board 1 'is made uneven by the partial adhesion of the leaked adhesive to the non-circuit forming area 2 ", masking in the formation of the outer layer circuit by photoetching, solder resist ink, etc. Adverse effects such as coating.
【０００６】本発明は上記事情に対処してなされたもの
で、繁雑な工程や格別な設備・熟練技術など要せずに容
易に、信頼性の高いリジッド−フレックス型プリント配
線板を得ることが可能な製造方法の提供を目的とする。SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and it is possible to easily obtain a highly reliable rigid-flex type printed wiring board without requiring complicated steps, special facilities and skill. The aim is to provide a possible manufacturing method.
【０００７】[0007]
【課題を解決するための手段】 本発明に係るプリント
配線板の製造方法は、第１の主面に配線パターンが形成
され第２の主面に金属箔が張り合わされた硬質プリント
配線板に、前記第１の主面側から前記金属箔に達する程
度の回路形成領域から非回路形成領域の切り離し分離可
能な溝を穿設する工程と、前記硬質プリント配線板の回
路形成領域に対応する部分に絶縁性接着剤層を介在さ
せ、前記硬質プリント配線板の非回路形成領域に対応す
る部分には、非接着体片を、前記硬質プリント配線板と
積層すべきフレキシブル配線基板の対向面のいずれか一
方に貼着することにより介在させて、前記硬質プリント
配線板を前記フレキシブル配線基板面上に積層・配置す
る工程と、前記硬質プリント配線板と前記フレキシブル
配線基板を積層・配置した積層体を加熱加圧により一体
化する工程と、前記一体化した積層体の硬質プリント配
線板の前回路形成領域を切り離し分離可能な溝部で切り
離し、硬質プリント配線板の前記非回路形成領域を剥離
する工程とを具備したことを特徴とする。すなわち、本
発明はリジッド−フレックス型のプリント配線板を製造
において、フレキシブル配線基板面とリジッド型回路形
成領域面との対向面間を接着一体化する接着剤のフロー
により、前記リジッド型非回路形成領域面が、フレキシ
ブル配線基板面に接着するのを全面的に回避するため、
非接着体片を介在させておくことを骨子とする。According to a method of manufacturing a printed wiring board according to the present invention , a wiring pattern is formed on a first main surface.
Hard print with metal foil laminated on the second main surface
As the wiring board reaches the metal foil from the first main surface side,
A step of drilling a disconnect separable grooves of the non-circuit forming area from the circuit formation region in degrees, is interposed an insulating adhesive layer in the portion corresponding to the circuit formation region of the rigid printed wiring board, the rigid printed wiring Corresponding to the non-circuit formation area of the board
The non-adhesive piece is attached to the hard printed wiring board
Any one of the opposing surfaces of the flexible wiring board to be laminated
The rigid print is interposed by attaching to the
Laminate and arrange the wiring board on the flexible wiring board surface
And the rigid printed wiring board and the flexible
A step of integrating the laminated body in which the wiring substrates are laminated and arranged by heating and pressing, and separating the front circuit formation region of the rigid printed wiring board of the integrated laminated body by a separable groove to separate the rigid printed wiring board. Peeling off the non-circuit formation region . That is, the present invention relates to a method for manufacturing a rigid-flex type printed circuit board, in which the rigid type non-circuit forming section is formed by the flow of an adhesive for bonding and integrating the opposing surfaces of the flexible wiring board surface and the rigid type circuit forming region surface. In order to completely prevent the area surface from adhering to the flexible wiring board surface,
The main point is that a non-adhesive piece is interposed.
【０００８】[0008]
【作用】本発明に係るプリント配線板の製造方法によれ
ば、接着・一体化ないし接着剤の流入を所望しない領
域、換言すると、リジッド型非回路形成領域とフレキシ
ブル配線基板とが対向する領域面間を埋めるように、対
向するするいずれかの面に、非接着体片を選択的に貼着
している。このため、フレキシブル配線基板面とリジッ
ド型回路形成領域面との対向面間を接着一体化する接着
剤の溶融・流出（流入）は容易、かつ確実に防止され
る。つまり、接着剤の溶融・流出を所望しない領域を非
接着体片で仮に埋め立て、その領域への接着剤流入が防
止されるため、リジッド型非回路形成領域の切り離し剥
離が容易に行い得る。しかも、前記非接着体片は仮固定
により位置ズレを生じることもなく、また、前記切り離
し面は直線的（非凹凸面）を成しているので、折り曲げ
性を呈するフレキシブル配線基板領域およびリジッド型
回路形成領域が、高精度に配置・一体化したプリント配
線板を常に得ることが可能となる。According to the method of manufacturing a printed wiring board according to the present invention, the area where the bonding / integration or the inflow of the adhesive is not desired, in other words, the area where the rigid non-circuit forming area and the flexible wiring board face each other. A non-adhesive piece is selectively adhered to one of the opposing surfaces so as to fill the gap. For this reason, melting and outflow (inflow) of the adhesive for bonding and integrating the opposing surfaces of the flexible wiring board surface and the rigid type circuit formation region surface are easily and reliably prevented. In other words, a region where the adhesive is not desired to be melted or flown out is temporarily buried with a non-adhesive piece to prevent the adhesive from flowing into that region, so that the rigid non-circuit forming region can be easily separated and separated. In addition, the non-adhesive pieces do not shift due to the temporary fixing, and the separating surface is linear (non-concavo-convex surface). It is possible to always obtain a printed wiring board in which the circuit forming region is arranged and integrated with high precision.
【０００９】[0009]
【実施例】以下、図１ (a)〜 (c)，図２ (a)〜 (b)，お
よび図３ (a)〜 (c)を参照して本発明の実施例を説明す
る。An embodiment of the present invention will be described below with reference to FIGS. 1 (a) to 1 (c), 2 (a) to 2 (b), and 3 (a) to 3 (c).
【００１０】実施例１ 図１ (a)〜 (c)は、本発明に係るプリント配線板の製造
方法において、各種の出発素材を位置決めして、積層・
配置した態様を模式的に示した断面図であり、次のよう
に行われる。先ず、一主面に所要の配線導体（配線パタ
ーン）5aが形成され、他主面に銅箔5bを張り合わせた、
たとえば厚さ 0.2mmのガラスエポキシ系の硬質プリント
配線板５を用意し、この硬質プリント配線板５の配線導
体5a形成面の非回路形成領域５″に、その領域５″面よ
りやや大ききめの非接着体片６、たとえば厚さ 100μm
ポリエチレンテレフタレートフィルム片を貼着する（図
１(a) 。Embodiment 1 FIGS. 1A to 1C show a method of manufacturing a printed wiring board according to the present invention, in which various starting materials are positioned and laminated.
It is sectional drawing which showed the arrangement | positioning aspect typically and is performed as follows. First, a required wiring conductor (wiring pattern) 5a is formed on one main surface, and a copper foil 5b is laminated on the other main surface.
For example, a glass-epoxy hard printed wiring board 5 having a thickness of 0.2 mm is prepared. A non-circuit forming area 5 ″ on the surface of the hard printed wiring board 5 on which the wiring conductor 5a is formed is slightly larger than the area 5 ″. Non-adhesive piece 6, for example, 100 μm thick
A piece of polyethylene terephthalate film is attached (FIG. 1 (a)).
【００１１】次いで、前記硬質プリント配線板５に選択
的に貼着した非接着体片６側から、たとえばビクトリア
金型によって、前記非接着体片６を貫挿して硬質プリン
ト配線板５の銅箔5b、もしくはその近傍に達する切り離
し用の溝（スリット）5cを穿設加工（図１(b) した後、
前記大きめ部分（切り離し用の溝5c外側）の非接着体片
６を剥がし取る。Next, the non-adhesive piece 6 is inserted from the non-adhesive piece 6 side selectively adhered to the hard printed wiring board 5 by, for example, a Victoria mold to form a copper foil of the hard printed wiring board 5. After drilling 5b or a slit (slit) 5c reaching the vicinity thereof (Fig. 1 (b),
Peel off the non-adhesive piece 6 in the larger portion (outside the separating groove 5c).
【００１２】一方、前記硬質プリント配線板５の非回路
形成領域５″に対応する部分が、選択的に窓開け加工さ
れた絶縁性接着剤シート７、たとえばポリイミドプリプ
レグシート、およびフレキシブル配線基板８を用意し、
図１ (c)に示すごとく、フレキシブル配線基板８面上
に、前記絶縁性接着剤シート７、および非接着体片６を
貼着した硬質プリント配線板５を位置決めして積層・配
置する。On the other hand, a portion corresponding to the non-circuit formation region 5 ″ of the hard printed wiring board 5 is made of an insulating adhesive sheet 7, for example, a polyimide prepreg sheet and a flexible wiring board 8 which are selectively opened. Prepare,
As shown in FIG. 1 (c), the rigid printed wiring board 5 on which the insulating adhesive sheet 7 and the non-adhesive pieces 6 are adhered is positioned and laminated and arranged on the surface of the flexible wiring board 8.
【００１３】このようにして、積層体を形成した後、た
とえば70〜 180℃，25〜35kg／cm2程度の条件で、加熱
加圧することにより、一体化した積層体を得る。この一
体化した積層体について、表面の外層回路形成用の銅箔
5bをフォトエッチング処理して、前記硬質プリント配線
板５の回路形成領域（硬質配線板ユニット）５′に対応
する部分に、所要の外層回路を形成する一方、硬質プリ
ント配線板５の非回路形成領域５″に対応する部分など
不要部分をエッチング除去する。After the laminate is formed in this manner, the laminate is obtained by applying heat and pressure at, for example, about 70 to 180 ° C. and about 25 to 35 kg / cm 2 . Copper foil for forming the outer layer circuit on the surface of this integrated laminate
5b is photo-etched to form a required outer layer circuit in a portion corresponding to the circuit forming area (hard wiring board unit) 5 'of the hard printed wiring board 5, while forming a non-circuit formation of the hard printed wiring board 5 Unnecessary portions such as a portion corresponding to the region 5 ″ are removed by etching.
【００１４】前記所要の外層回路を形成し、回路形成領
域５′および外層回路から成るいわゆる硬質プリント配
線板ユニット（５′）を構成した後、外形加工などを行
ない、さらに一主面が露出した前記硬質プリント配線板
５の非回路形成領域５″を、フレキシブル配線基板８面
から引き剥がすことにより、所望通りに寸法精度および
外観など良好なリジッド−フレックス型のプリント配線
板が得られる。この最終的な、フレキシブル配線基板８
面から非回路形成領域５″の引き剥がし工程は、フレキ
シブル配線基板８面と非回路形成領域５″面との間に非
接着体片６が介在し、接着剤が介在ないし流入していな
いため、容易に剥離・除去し得る。ここで、前記非接着
体片６は仮固定された形であるため、離脱・除去を簡単
に行い得るし、また前記仮固定によって、加熱加圧によ
る積層一体化の過程で位置ズレなど起こすこともなかっ
た。After the required outer layer circuit is formed and a so-called hard printed wiring board unit (5 ') comprising the circuit forming area 5' and the outer layer circuit is formed, external processing is performed, and one main surface is further exposed. By peeling off the non-circuit forming area 5 ″ of the hard printed wiring board 5 from the surface of the flexible wiring board 8, a rigid-flex type printed wiring board having good dimensional accuracy and appearance as desired can be obtained. Flexible wiring board 8
In the step of peeling off the non-circuit formation region 5 ″ from the surface, the non-adhesive pieces 6 are interposed between the surface of the flexible wiring board 8 and the non-circuit formation region 5 ″, and no adhesive is interposed or flows. And can be easily peeled and removed. Here, since the non-adhesive body piece 6 is in a temporarily fixed form, it can be easily removed and removed, and the temporary fixing causes a positional shift or the like in the process of laminating and integrating by heating and pressing. There was no.
【００１５】実施例２ 図２(a),(b) は他の実施態様例を模式的に示した断面図
で、上記実施例１では硬質プリント配線板５の非回路形
成領域５″面に、非接着体片６を選択的に貼着したが、
この実施例では、前記硬質プリント配線板５の非回路形
成領域５″に対応するフレキシブル配線基板８面に、非
接着体片６を選択的に貼着した他は、同様に行ったとこ
ろ、実施例１の場合と同様に、寸法精度および外観など
良好なリジッド−フレックス型のプリント配線板が得ら
れた。Embodiment 2 FIGS. 2 (a) and 2 (b) are cross-sectional views schematically showing another embodiment. In Embodiment 1, the rigid printed wiring board 5 has a non-circuit forming area 5 ″ on its surface. , The non-adhesive piece 6 was selectively adhered,
In this embodiment, except that the non-adhesive piece 6 was selectively adhered to the surface of the flexible wiring board 8 corresponding to the non-circuit formation area 5 ″ of the hard printed wiring board 5, As in the case of Example 1, a rigid-flex type printed wiring board having good dimensional accuracy and appearance was obtained.
【００１６】実施例３ 図３ (a)〜 (c)は、さらに他の実施態様例を模式的に示
した断面図で、上記実施例２の変形例に相当する。先
ず、最終的に露出させたいフレキシブル配線基板８面
（折り曲げ作用を呈する領域）８′に、非接着体片６を
選択的に貼着した後（図３(a))、前記選択的に貼着した
非接着体片６に対応する部分（領域）を、予め窓開け加
工した絶縁性接着剤シート７，両面に配線導体5aを備え
た硬質プリント配線板５，および銅箔5bを（図３(b))に
示すごとく、位置決めして積層・配置する。Embodiment 3 FIGS. 3A to 3C are cross-sectional views schematically showing still another embodiment, and correspond to a modification of the above-described embodiment 2. FIG. First, the non-adhesive piece 6 is selectively adhered to the surface (the area exhibiting the bending action) 8 'of the flexible wiring board 8 to be finally exposed (FIG. 3 (a)). A portion (region) corresponding to the attached non-adhesive piece 6 is provided with an insulative adhesive sheet 7 previously opened with windows, a hard printed wiring board 5 having wiring conductors 5a on both sides, and a copper foil 5b (FIG. 3). As shown in (b)), they are positioned and stacked / arranged.
【００１７】このようにして、積層体を形成した後、た
とえば70〜 180℃，25〜35kg／cm2程度の条件で、加熱
加圧することにより、一体化した積層体を得る。この一
体化した積層体について、表面の外層回路形成用の銅箔
5bをフォトエッチング処理して、前記硬質プリント配線
板５の回路形成領域（硬質配線板ユニット）５′に対応
する外層回路を形成する一方、非接着体片６に対応する
部分（硬質プリント配線板５の非回路形成領域５″に対
応）など不要部分をエッチング除去する。After the laminate is formed in this manner, the laminate is integrated by heating and pressing at, for example, about 70 to 180 ° C. and about 25 to 35 kg / cm 2 . Copper foil for forming the outer layer circuit on the surface of this integrated laminate
5b is photo-etched to form an outer layer circuit corresponding to the circuit forming area (hard wiring board unit) 5 'of the hard printed wiring board 5 and a portion (hard printed wiring board) corresponding to the non-adhesive piece 6 Unnecessary portions such as the non-circuit formation region 5 ″ of No. 5) are removed by etching.
【００１８】前記所要の外層回路を形成し、回路形成領
域５′および外層回路から成るいわゆる硬質プリント配
線板ユニット（５′）を構成した後、外形加工などを行
ってから、さらに露出した非接着体片６を、フレキシブ
ル配線基板８面から引き剥がすことにより、所望通りに
寸法精度および外観など良好なリジッド−フレックス型
のプリント配線板が得られる。ここで、前記非接着体片
６は仮固定された形であるため、離脱・除去を簡単に行
い得るし、また前記仮固定によって、加熱加圧による積
層一体化の過程で位置ズレなど起こすこともなかった。After the required outer layer circuit is formed and a so-called hard printed wiring board unit (5 ') comprising the circuit forming area 5' and the outer layer circuit is formed, external processing is performed, and then the exposed non-adhesive circuit is formed. By peeling the body piece 6 from the surface of the flexible wiring board 8, a rigid-flex type printed wiring board having excellent dimensional accuracy and appearance as desired can be obtained. Here, since the non-adhesive body piece 6 is in a temporarily fixed form, it can be easily removed and removed, and the temporary fixing causes a positional shift or the like in the process of laminating and integrating by heating and pressing. There was no.
【００１９】なお、本発明は上記の例示に限定されるも
のでなく、発明の趣旨の範囲内でいろいろの変形を採り
得る。たとえば前記では、接着剤層シートとしてポリイ
ミドプリプレグシートを例示したが、エポキシプリプレ
グシートあるいはポリイミドプリプレグシートとエポキ
シプリプレグシートとの組み合わせなどてもよく、要は
被接着体に対する親和性など考慮して選択すればよい。It should be noted that the present invention is not limited to the above example, and various modifications can be made within the scope of the invention. For example, in the above, a polyimide prepreg sheet is exemplified as the adhesive layer sheet.However, an epoxy prepreg sheet or a combination of a polyimide prepreg sheet and an epoxy prepreg sheet may be used. I just need.
【００２０】[0020]
【発明の効果】以上説明したように、本発明に係るプリ
ント配線板の製造方法によれば、フレキシブル配線基板
面とリジッド型回路形成領域面との対向面間を接着一体
化する接着剤は、不所望な領域に溶融・流出（流入）す
ることが容易、かつ確実に防止される。つまり、リジッ
ド型非回路形成領域の切り離し剥離する領域に、製造工
程で溶融する接着剤が流入するという問題は、全面的に
解消（回避）ないし防止されるので、リジッド型非回路
形成領域の切り離し剥離を容易に行い得るし、また、そ
の切り離し面は直線的（非凹凸面）を成しているので、
折り曲げ性を呈するフレキシブル配線基板領域およびリ
ジッド型回路形成領域とも、高精度に配置・一体化した
プリント配線板として機能しえる。As described above, according to the method of manufacturing a printed wiring board according to the present invention, the adhesive for bonding and integrating between the opposing surfaces of the flexible wiring board surface and the rigid type circuit formation region surface is as follows: Melting / outflow (inflow) to an undesired area is easily and reliably prevented. In other words, the problem that the adhesive that melts in the manufacturing process flows into the region where the rigid non-circuit formation region separates and peels is completely eliminated (avoided) or prevented. Since the peeling can be easily performed and the separation surface is linear (non-uneven surface),
Both the flexible wiring board region and the rigid circuit forming region exhibiting the bending property can function as a printed wiring board which is arranged and integrated with high precision.
【図１】本発明に係るプリント配線板の製造方法の実施
態様を模式的に示すもので、(a)は硬質プリント配線板
の非回路形成領域面に非接着体片を選択的に貼着した断
面図、 (b)は非接着体片を貼着した硬質プリント配線板
に切り離し用の溝を穿設した断面図、 (c)は各素材を位
置合わせ積層・配置した断面図。FIG. 1 schematically shows an embodiment of a method for manufacturing a printed wiring board according to the present invention, in which (a) selectively adheres a non-adhesive piece to a non-circuit forming area surface of a hard printed wiring board. (B) is a cross-sectional view of a rigid printed wiring board to which a non-adhesive piece is stuck, and a cut-away groove is formed in the hard printed-wiring board.
【図２】本発明に係るプリント配線板の製造方法の、他
の実施態様を模式的に示すもので、 (a)はフレキシブル
配線基板面の、プリプレク硬質プリント配線板の非回路
形成領域に対応した位置に非接着体片を選択的に貼着し
た断面図、 (b)は各素材を位置合わせ積層・配置した断
面図。FIG. 2 schematically shows another embodiment of the method for manufacturing a printed wiring board according to the present invention, in which (a) corresponds to a non-circuit forming area of a prepreg rigid printed wiring board on a flexible wiring board surface. A cross-sectional view in which a non-adhesive body piece is selectively adhered to the position shown in FIG.
【図３】本発明に係るプリント配線板の製造方法の、さ
らに他の実施態様を模式的に示すもので、 (a)はフレキ
シブル配線基板面の、硬質プリント配線板の非回路形成
領域に対応した位置に非接着体片を選択的に貼着した断
面図、 (b)は各素材を位置合わせ積層・配置した断面
図、 (c)は積層・一体化後、外層回路を形成した断面
図。FIG. 3 schematically shows still another embodiment of the method for manufacturing a printed wiring board according to the present invention, wherein (a) corresponds to a non-circuit forming area of a hard printed wiring board on a flexible wiring board surface. Cross-sectional view where non-adhesive pieces are selectively adhered to the positions shown in the figure. .
【図４】リジッド−フレキシブル型プリント配線板の構
造例を示す断面図。FIG. 4 is a cross-sectional view showing a structural example of a rigid-flexible type printed wiring board.
【図５】従来のリジッド−フレキシブル型プリント配線
板の製造方法の実施態様における各素材を位置合わせ積
層・配置した状態を模式的に示す断面図。FIG. 5 is a cross-sectional view schematically showing a state in which respective materials are aligned, laminated, and arranged in an embodiment of a conventional method for manufacturing a rigid-flexible printed wiring board.
【図６】従来のリジッド−フレキシブル型プリント配線
板の製造方法で積層・一体化したときの要部を示す断面
図。FIG. 6 is a cross-sectional view showing a main part when laminated and integrated by a conventional method for manufacturing a rigid-flexible printed wiring board.
【図７】従来のプリント配線板の製造方法の実施態様に
おいて、硬質プリント配線板の非回路形成領域を切り離
し剥離したときの状態を模式的に示す斜視図。FIG. 7 is a perspective view schematically showing a state in which a non-circuit formation region of a hard printed wiring board is cut off and peeled off in an embodiment of a conventional method for manufacturing a printed wiring board.
１，８…フレキシブル配線基板 １′，８′…フレキ
シブル配線基板の被剥離部（折り曲げ可能な部分）
1a…フレキシブル配線基板の配線導体 ２，２′，
５′…硬質なプリント配線板ユニット ２″，５″…
非回路形成領域 2a，2a′，5a…硬質なプリント配線板ユニットの配線導
体 2b，5b…外層回路形成用銅箔 2c，5c…切り離
し用の溝 ３…スルホール接続 ４，７…絶縁性接
着剤シート 4a…絶縁性接着剤シートの窓 ６…非
接着体片1, 8: Flexible wiring board 1 ', 8': Stripped part (bendable part) of flexible wiring board
1a: Wiring conductor of flexible wiring board 2, 2 ',
5 ': rigid printed wiring board unit 2 ", 5" ...
Non-circuit forming area 2a, 2a ', 5a: Wiring conductor of rigid printed wiring board unit 2b, 5b: Copper foil for forming outer layer circuit 2c, 5c: Separation groove 3: Through hole connection 4, 7: Insulating adhesive Sheet 4a: Window of insulating adhesive sheet 6: Non-adhesive piece
Claims (2)
２の主面に金属箔が張り合わされた硬質プリント配線板
に、前記第１の主面側から前記金属箔に達する程度の回
路形成領域から非回路形成領域の切り離し分離可能な溝
を穿設する工程と、 前記硬質プリント配線板の回路形成領域に対応する部分
に絶縁性接着剤層を介在させ、前記硬質プリント配線板
の非回路形成領域に対応する部分には、非接着体片を、
前記硬質プリント配線板と積層すべきフレキシブル配線
基板の対向面のいずれか一方に貼着することにより介在
させて、前記硬質プリント配線板を前記フレキシブル配
線基板面上に積層・配置する工程と、 前記硬質プリント配線板と前記フレキシブル配線基板を
積層・配置した積層体を加熱加圧により一体化する工程
と、 前記一体化した積層体の硬質プリント配線板の前回路形
成領域を切り離し分離可能な溝部で切り離し、硬質プリ
ント配線板の前記非回路形成領域を剥離する工程とを具
備したことを特徴とするプリント配線板の製造方法。A first main surface on which a wiring pattern is formed;
Hard printed wiring board with metal foil bonded to the main surface of 2
In a step of drilling the first from the degree of times <br/> circuit forming region reaches the metal foil from the main surface side of the non-circuit forming region detach separable grooves circuit of the rigid printed wiring board An insulating adhesive layer is interposed in a portion corresponding to the formation region, and the hard printed wiring board is
In the portion corresponding to the non-circuit formation area,
Flexible wiring to be laminated with the hard printed wiring board
Interposed by sticking to one of the opposing surfaces of the substrate
Then, the rigid printed wiring board is
A step of laminating and arranging on a wire substrate surface, a step of laminating and laminating the laminated body in which the rigid printed wiring board and the flexible wiring board are laminated and arranged, and a rigid printed wiring of the laminated body thus laminated. detached in separable groove disconnect before circuit formation region of the plate, a rigid pre
Peeling off the non-circuit formation region of the printed wiring board.
２の主面に金属箔が張り合わされた硬質プリント配線板Hard printed wiring board with metal foil bonded to the main surface of 2
の非回路形成領域に、該非回路形成領域よりも大きい非Of the non-circuit formation region is larger than the non-circuit formation region.
接着体片を貼着する工程と、A step of attaching an adhesive piece; 前記非接着体片の上から、前記硬質プリント配線板の金From above the non-adhesive piece, the metal of the hard printed wiring board
属箔に達する程度の回路形成領域から非回路形成領域のFrom the circuit forming area to the metal foil to the non-circuit forming area
切り離し分離可能な溝を穿設する工程と、A step of drilling a detachable groove, 前記非接着体片の前記溝の外側にはみ出た部分を除去すRemoving a portion of the non-adhesive piece protruding outside the groove;
る工程と、Process, 前記硬質プリント配線板の回路形成領域に対応する部分A portion corresponding to the circuit forming area of the hard printed wiring board
に絶縁性接着剤層を介在させて、前記硬質プリント配線An insulating adhesive layer is interposed in the hard printed wiring.
板をフレキシブル配線基板面上に積層・配置する工程Process of laminating and arranging boards on the flexible wiring board surface
と、When, 前記硬質プリント配線板と前記フレキシブル配線基板をThe hard printed wiring board and the flexible wiring board
積層・配置した積層体を加熱加圧により一体化する工程The process of integrating the stacked and arranged laminates by heating and pressing
と、When, 前記一体化した積層体の硬質プリント配線板の前回路形Pre-circuit type of the rigid printed wiring board of the integrated laminate
成領域を切り離し分離可能な溝部で切り離し、硬質プリCut off with a separable groove to separate
ント配線板の前記非回路形成領域を剥離する工For separating the non-circuit forming area of the printed circuit board 程とを具In the process
備したことを特徴とするプリント配線板の製造方法。A method for manufacturing a printed wiring board, comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31693A JP3310037B2 (en) | 1993-01-05 | 1993-01-05 | Manufacturing method of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31693A JP3310037B2 (en) | 1993-01-05 | 1993-01-05 | Manufacturing method of printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06204663A JPH06204663A (en) | 1994-07-22 |
| JP3310037B2 true JP3310037B2 (en) | 2002-07-29 |
Family
ID=11470507
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31693A Expired - Fee Related JP3310037B2 (en) | 1993-01-05 | 1993-01-05 | Manufacturing method of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3310037B2 (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100688826B1 (en) | 2005-01-20 | 2007-03-02 | 삼성전기주식회사 | Manufacturing method of rigid flexible printed circuit board |
| JP2007088249A (en) * | 2005-09-22 | 2007-04-05 | Daisho Denshi:Kk | Method of manufacturing flex-rigid printed wiring board |
| JP4745128B2 (en) * | 2006-05-25 | 2011-08-10 | シャープ株式会社 | Build-up board manufacturing method, build-up board, and electronic apparatus using build-up board |
| AT10029U1 (en) * | 2007-02-16 | 2008-07-15 | Austria Tech & System Tech | METHOD FOR PRODUCING A RIGID FLEXIBLE PCB AND RIGID FLEXIBLE PCB |
| WO2009141927A1 (en) * | 2008-05-23 | 2009-11-26 | イビデン株式会社 | Printed wiring board and method for manufacturing the same |
| FI122216B (en) * | 2009-01-05 | 2011-10-14 | Imbera Electronics Oy | Rigid-flex module |
| JPWO2010140214A1 (en) * | 2009-06-02 | 2012-11-15 | ソニーケミカル＆インフォメーションデバイス株式会社 | Manufacturing method of multilayer printed wiring board |
| US9764532B2 (en) * | 2014-07-01 | 2017-09-19 | Isola Usa Corp. | Prepregs including UV curable resins useful for manufacturing semi-flexible PCBs |
| CN104619131B (en) * | 2015-02-13 | 2017-12-01 | 广州杰赛科技股份有限公司 | Asymmetric rigid-flexible combined circuit board and preparation method thereof |
| CN114786370A (en) * | 2022-04-25 | 2022-07-22 | 黄石西普电子科技有限公司 | Manufacturing method of six-layer rigid-flex board |
-
1993
- 1993-01-05 JP JP31693A patent/JP3310037B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06204663A (en) | 1994-07-22 |
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