TW201013799A - Manufacturing process for semiconductor article - Google Patents

Manufacturing process for semiconductor article Download PDF

Info

Publication number
TW201013799A
TW201013799A TW98129988A TW98129988A TW201013799A TW 201013799 A TW201013799 A TW 201013799A TW 98129988 A TW98129988 A TW 98129988A TW 98129988 A TW98129988 A TW 98129988A TW 201013799 A TW201013799 A TW 201013799A
Authority
TW
Taiwan
Prior art keywords
adhesive
semiconductor
adhesive layer
semiconductor article
peeling
Prior art date
Application number
TW98129988A
Other languages
English (en)
Chinese (zh)
Inventor
Taro Inada
Original Assignee
Denki Kagaku Kogyo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denki Kagaku Kogyo Kk filed Critical Denki Kagaku Kogyo Kk
Publication of TW201013799A publication Critical patent/TW201013799A/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G03F1/64—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
TW98129988A 2008-09-08 2009-09-07 Manufacturing process for semiconductor article TW201013799A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008229177 2008-09-08

Publications (1)

Publication Number Publication Date
TW201013799A true TW201013799A (en) 2010-04-01

Family

ID=41797106

Family Applications (1)

Application Number Title Priority Date Filing Date
TW98129988A TW201013799A (en) 2008-09-08 2009-09-07 Manufacturing process for semiconductor article

Country Status (3)

Country Link
JP (1) JPWO2010026938A1 (ja)
TW (1) TW201013799A (ja)
WO (1) WO2010026938A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012093518A (ja) * 2010-10-26 2012-05-17 Asahi Kasei E-Materials Corp ペリクル
JP6554864B2 (ja) * 2015-03-30 2019-08-07 大日本印刷株式会社 ペリクル接着剤除去装置及びペリクル接着剤除去方法
JP2017090719A (ja) * 2015-11-11 2017-05-25 旭化成株式会社 ペリクル
JP2020160466A (ja) * 2020-06-12 2020-10-01 旭化成株式会社 ペリクル
WO2022024668A1 (ja) * 2020-07-29 2022-02-03 日東電工株式会社 付着粘着剤の除去方法、構造体および感圧接着シート

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57178330A (en) * 1981-04-28 1982-11-02 Toshiba Corp Manufacture of semiconductor device
JPS6075835A (ja) * 1983-10-03 1985-04-30 Hitachi Ltd ペリクル
JPS62156957U (ja) * 1986-03-25 1987-10-05
JPH0264540A (ja) * 1988-08-31 1990-03-05 Asahi Kasei Denshi Kk 発塵の防止されたペリクル
JPH1026833A (ja) * 1996-07-11 1998-01-27 Nitto Denko Corp レジスト除去用粘着テ―プとレジスト除去方法
JP2004047975A (ja) * 2002-05-17 2004-02-12 Semiconductor Energy Lab Co Ltd 積層体の転写方法及び半導体装置の作製方法
JP4047103B2 (ja) * 2002-08-29 2008-02-13 リンテック株式会社 貼着体

Also Published As

Publication number Publication date
JPWO2010026938A1 (ja) 2012-02-02
WO2010026938A1 (ja) 2010-03-11

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