TW201001614A - Semiconductor die pickup apparatus and semiconductor die pickup method - Google Patents

Semiconductor die pickup apparatus and semiconductor die pickup method Download PDF

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Publication number
TW201001614A
TW201001614A TW097136281A TW97136281A TW201001614A TW 201001614 A TW201001614 A TW 201001614A TW 097136281 A TW097136281 A TW 097136281A TW 97136281 A TW97136281 A TW 97136281A TW 201001614 A TW201001614 A TW 201001614A
Authority
TW
Taiwan
Prior art keywords
cover
semiconductor die
stage
semiconductor
opening
Prior art date
Application number
TW097136281A
Other languages
English (en)
Chinese (zh)
Other versions
TWI374513B (https=
Inventor
Okito Umehara
Shinichi Sasaki
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of TW201001614A publication Critical patent/TW201001614A/zh
Application granted granted Critical
Publication of TWI374513B publication Critical patent/TWI374513B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7412—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H10P72/7414—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support the auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H10P72/742—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
TW097136281A 2008-06-30 2008-09-22 Semiconductor die pickup apparatus and semiconductor die pickup method TW201001614A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008169897A JP4215818B1 (ja) 2008-06-30 2008-06-30 半導体ダイのピックアップ装置及びピックアップ方法

Publications (2)

Publication Number Publication Date
TW201001614A true TW201001614A (en) 2010-01-01
TWI374513B TWI374513B (https=) 2012-10-11

Family

ID=40361329

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097136281A TW201001614A (en) 2008-06-30 2008-09-22 Semiconductor die pickup apparatus and semiconductor die pickup method

Country Status (3)

Country Link
JP (1) JP4215818B1 (https=)
TW (1) TW201001614A (https=)
WO (1) WO2010001497A1 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI475606B (zh) * 2011-02-28 2015-03-01 晟碟半導體（上海）有限公司 非均勻真空分佈晶粒附著尖端
TWI508220B (zh) * 2012-08-31 2015-11-11 細美事有限公司 晶粒射出裝置
TWI560764B (en) * 2014-02-24 2016-12-01 Shinkawa Kk Pick up device and pick up method of semiconductor die
CN115083949A (zh) * 2021-03-15 2022-09-20 万润科技股份有限公司 散热胶垫贴合方法及设备

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5184303B2 (ja) * 2008-11-04 2013-04-17 キヤノンマシナリー株式会社 チップ剥離方法、チップ剥離装置、および半導体装置製造方法
JP5284040B2 (ja) * 2008-11-04 2013-09-11 キヤノンマシナリー株式会社 チップ剥離方法、チップ剥離装置、および半導体装置製造方法
JP4397429B1 (ja) * 2009-03-05 2010-01-13 株式会社新川 半導体ダイのピックアップ装置及びピックアップ方法
JP4927979B2 (ja) 2010-09-28 2012-05-09 株式会社新川 半導体ダイのピックアップ装置及びその装置を用いた半導体ダイのピックアップ方法
JP2013065712A (ja) * 2011-09-16 2013-04-11 Hitachi High-Tech Instruments Co Ltd ダイボンダ及びボンディング方法
JP2013065731A (ja) * 2011-09-19 2013-04-11 Hitachi High-Tech Instruments Co Ltd ダイボンダ及びボンディング方法
KR102220346B1 (ko) * 2019-09-06 2021-02-25 세메스 주식회사 다이 픽업 모듈 및 이를 포함하는 다이 본딩 장치

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003224088A (ja) * 2002-01-29 2003-08-08 Nec Electronics Corp 半導体チップピックアップ装置
JP2003264203A (ja) * 2002-03-11 2003-09-19 Hitachi Ltd 半導体装置の製造方法
JP4457715B2 (ja) * 2003-04-10 2010-04-28 パナソニック株式会社 チップのピックアップ装置およびピックアップ方法
JP3999744B2 (ja) * 2004-01-05 2007-10-31 芝浦メカトロニクス株式会社 半導体チップのピックアップ装置
US7240422B2 (en) * 2004-05-11 2007-07-10 Asm Assembly Automation Ltd. Apparatus for semiconductor chip detachment

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI475606B (zh) * 2011-02-28 2015-03-01 晟碟半導體（上海）有限公司 非均勻真空分佈晶粒附著尖端
US9038264B2 (en) 2011-02-28 2015-05-26 Sandisk Semiconductor (Shanghai) Co., Ltd. Non-uniform vacuum profile die attach tip
TWI508220B (zh) * 2012-08-31 2015-11-11 細美事有限公司 晶粒射出裝置
TWI560764B (en) * 2014-02-24 2016-12-01 Shinkawa Kk Pick up device and pick up method of semiconductor die
CN115083949A (zh) * 2021-03-15 2022-09-20 万润科技股份有限公司 散热胶垫贴合方法及设备
CN115083949B (zh) * 2021-03-15 2025-07-22 万润科技股份有限公司 散热胶垫贴合方法及设备

Also Published As

Publication number Publication date
WO2010001497A1 (ja) 2010-01-07
JP2010010519A (ja) 2010-01-14
JP4215818B1 (ja) 2009-01-28
TWI374513B (https=) 2012-10-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees