JP4215818B1 - 半導体ダイのピックアップ装置及びピックアップ方法 - Google Patents

半導体ダイのピックアップ装置及びピックアップ方法 Download PDF

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Publication number
JP4215818B1
JP4215818B1 JP2008169897A JP2008169897A JP4215818B1 JP 4215818 B1 JP4215818 B1 JP 4215818B1 JP 2008169897 A JP2008169897 A JP 2008169897A JP 2008169897 A JP2008169897 A JP 2008169897A JP 4215818 B1 JP4215818 B1 JP 4215818B1
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JP
Japan
Prior art keywords
semiconductor die
lid
contact surface
holding sheet
stage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008169897A
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English (en)
Japanese (ja)
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JP2010010519A (ja
Inventor
沖人 梅原
真一 佐々木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP2008169897A priority Critical patent/JP4215818B1/ja
Priority to PCT/JP2008/064516 priority patent/WO2010001497A1/ja
Priority to TW097136281A priority patent/TW201001614A/zh
Application granted granted Critical
Publication of JP4215818B1 publication Critical patent/JP4215818B1/ja
Publication of JP2010010519A publication Critical patent/JP2010010519A/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7412—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H10P72/7414—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support the auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H10P72/742—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
JP2008169897A 2008-06-30 2008-06-30 半導体ダイのピックアップ装置及びピックアップ方法 Expired - Fee Related JP4215818B1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008169897A JP4215818B1 (ja) 2008-06-30 2008-06-30 半導体ダイのピックアップ装置及びピックアップ方法
PCT/JP2008/064516 WO2010001497A1 (ja) 2008-06-30 2008-08-13 半導体ダイのピックアップ装置及びピックアップ方法
TW097136281A TW201001614A (en) 2008-06-30 2008-09-22 Semiconductor die pickup apparatus and semiconductor die pickup method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008169897A JP4215818B1 (ja) 2008-06-30 2008-06-30 半導体ダイのピックアップ装置及びピックアップ方法

Publications (2)

Publication Number Publication Date
JP4215818B1 true JP4215818B1 (ja) 2009-01-28
JP2010010519A JP2010010519A (ja) 2010-01-14

Family

ID=40361329

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008169897A Expired - Fee Related JP4215818B1 (ja) 2008-06-30 2008-06-30 半導体ダイのピックアップ装置及びピックアップ方法

Country Status (3)

Country Link
JP (1) JP4215818B1 (https=)
TW (1) TW201001614A (https=)
WO (1) WO2010001497A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010100775A1 (ja) * 2009-03-05 2010-09-10 株式会社新川 半導体ダイのピックアップ装置及びピックアップ方法
WO2012043057A1 (ja) * 2010-09-28 2012-04-05 株式会社新川 半導体ダイのピックアップ装置及びその装置を用いた半導体ダイのピックアップ方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5184303B2 (ja) * 2008-11-04 2013-04-17 キヤノンマシナリー株式会社 チップ剥離方法、チップ剥離装置、および半導体装置製造方法
JP5284040B2 (ja) * 2008-11-04 2013-09-11 キヤノンマシナリー株式会社 チップ剥離方法、チップ剥離装置、および半導体装置製造方法
KR20170122287A (ko) * 2011-02-28 2017-11-03 샌디스크 세미컨덕터 (상하이) 컴퍼니, 리미티드 비균일 진공 프로파일 다이 부착 팁
JP2013065712A (ja) * 2011-09-16 2013-04-11 Hitachi High-Tech Instruments Co Ltd ダイボンダ及びボンディング方法
JP2013065731A (ja) * 2011-09-19 2013-04-11 Hitachi High-Tech Instruments Co Ltd ダイボンダ及びボンディング方法
KR200468690Y1 (ko) * 2012-08-31 2013-08-29 세메스 주식회사 다이 이젝팅 장치
JP6349496B2 (ja) * 2014-02-24 2018-07-04 株式会社新川 半導体ダイのピックアップ装置及びピックアップ方法
KR102220346B1 (ko) * 2019-09-06 2021-02-25 세메스 주식회사 다이 픽업 모듈 및 이를 포함하는 다이 본딩 장치
TWI767611B (zh) * 2021-03-15 2022-06-11 萬潤科技股份有限公司 散熱膠墊貼合方法及設備

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003224088A (ja) * 2002-01-29 2003-08-08 Nec Electronics Corp 半導体チップピックアップ装置
JP2003264203A (ja) * 2002-03-11 2003-09-19 Hitachi Ltd 半導体装置の製造方法
JP4457715B2 (ja) * 2003-04-10 2010-04-28 パナソニック株式会社 チップのピックアップ装置およびピックアップ方法
JP3999744B2 (ja) * 2004-01-05 2007-10-31 芝浦メカトロニクス株式会社 半導体チップのピックアップ装置
US7240422B2 (en) * 2004-05-11 2007-07-10 Asm Assembly Automation Ltd. Apparatus for semiconductor chip detachment

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010100775A1 (ja) * 2009-03-05 2010-09-10 株式会社新川 半導体ダイのピックアップ装置及びピックアップ方法
KR100996151B1 (ko) * 2009-03-05 2010-11-24 가부시키가이샤 신가와 반도체 다이의 픽업 장치 및 픽업 방법
CN102308377A (zh) * 2009-03-05 2012-01-04 株式会社新川 半导体芯片的拾取装置及拾取方法
CN102308377B (zh) * 2009-03-05 2014-01-08 株式会社新川 半导体芯片的拾取装置及拾取方法
WO2012043057A1 (ja) * 2010-09-28 2012-04-05 株式会社新川 半導体ダイのピックアップ装置及びその装置を用いた半導体ダイのピックアップ方法
JP2012074491A (ja) * 2010-09-28 2012-04-12 Shinkawa Ltd 半導体ダイのピックアップ装置及びその装置を用いた半導体ダイのピックアップ方法
US9028649B2 (en) 2010-09-28 2015-05-12 Shinkawa Ltd. Semiconductor die pick-up apparatus and method of picking up semiconductor die using the same

Also Published As

Publication number Publication date
WO2010001497A1 (ja) 2010-01-07
TW201001614A (en) 2010-01-01
JP2010010519A (ja) 2010-01-14
TWI374513B (https=) 2012-10-11

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