TW200913085A - The pick-up equipment of semiconductor wafer and pick-up method - Google Patents

Abstract

The pick-up equipment of semiconductor wafer is to restrain the force applied on a semiconductor dice when holding sheet comes off, and is easy to pick up the semiconductor dice. This equipment is consisted of the platform 20 with a tightly adhering surface 22, an opening 41, larger than the picked semiconductor dice 15, installed on the tightly adhering surface 22, a cover 23, whose surface is moved along the tightly adhering surface, to open/close the opening 41. On picking up the semiconductor dice 15, the surface of cover 23 is forced to tightly adhere to a holding sheet 12 in order not to make the semiconductor dice 15 protruded the surface of the cover 23 via the closed opening 41. Under the situation that the picked semiconductor dice 15 is absorbed by a clip 18, the cover 23 is enabled to slide and sequentially open the opening 41. At the opened opening 41, the holding sheets are sequentially absorbed and come off.

Description

200913085 九法发明说明: Technical Field of the Invention The present invention relates to the construction and pick-up of a semiconductor die pick-up device. [Prior Art] A semiconductor die is cut from a 6-inch or 8-inch wafer. It is manufactured in a predetermined size. In order to avoid the dispersion of the cut semiconductor grains during cutting, the adhesive tape is adhered to the back surface, and the wafer is cut from the surface side by slicing or the like. The holding tape is cut into a number of deep productions, but is not cut to form a state in which the respective semiconductor crystal grains are held. Then, the (four) cut semiconductor dies are picked up from the holding sheets and sent to the next process such as die bonding. In the past, the method of picking up the semiconductor die from the adhesive holding tape, using the method of pushing up the needle (10), for example, refer to the patent reading Η). The method is to attract the semiconductor crystal by the collet, and only 4* U 攸The lower side of the holding sheet toward the surrounding pull-up is pushed up by the push-up pin to push the tensile force of the holding piece from the semiconductor S # 曰, the body 曰Β 亲 亲 亲 亲 亲 亲 亲 亲Picking up semiconductor crystal However, 'the method of using the push pin on the semiconductor die will cause the semiconductor die to rupture, so it is difficult: 'In recent years, the thin semiconductor die has been picked up. The proposal does not use the method of pushing and picking up. You can keep the film of the U-stick. For example, the semiconductor beta file that you want to pick up in the patent literature is as follows: · It will be placed on a multi-puppet. The suction of the stage 6 200913085 On the pilot hole, in the state in which the collet is adsorbed and held by the semiconductor die, the via hole is vacuumed, and the holding piece is attracted to each of the suction holes to be deformed, and the semiconductor die is peeled off correspondingly (4) After the holding piece of the hole is partially moved or rotated by the stage, the conductor crystal grains remaining in the portion which has not been peeled off are peeled off (refer to Figs. 1 to 4 of Patent Document 1).

The surface of the semiconductor chip is narrower than the width of the semiconductor die to be picked up: = the surface of the stage around the protrusion is provided with a suction hole; when the semiconductor crystal is picked up, the semiconductor die to be picked up is placed on the protrusion Protruding = out, while sucking the air between the holding piece and the surface of the stage from the suction hole, causing the second to move horizontally with respect to the surface of the stage to peel off from the semiconductor die (Fig. 9 to Fig. 1 of the patent document 1) ). [Patent Document 1] Japanese Patent No. 3209736 [Disclosure] Patent Document 1 holds a suction suction hole, but the air is sucked in from the separation suction hole. Because of the peeling, but the attraction is peeled off, the residue is shown in Fig. 1, Fig. 2). The method of retaining a portion of the holding sheet in the semiconductor die, while maintaining the suction hole as a vacuum, to remove the holding tape from the semiconductor die, covers the surface of the attracting hole after the conductor die is peeled off. Therefore, the holding piece on the upper side cannot be pulled from the periphery of the suction hole. The holding piece located directly above the suction hole can not attract the semiconductor die by the vacuum of the suction hole in the vicinity of the hole (refer to the patent literature). On the other hand, the stage is moved to perform the peeling residue: in the case where the area of the residual portion is small, the force is also small, and the damage of the semiconductor crystal grain can be suppressed. 7 200913085 However, if the suction hole is to be reduced The resulting lead hole - the semiconductor to be picked up:: the heart 'need to attract the suction hole to hold the piece, to hold the piece (four) force right to add to the semiconductor die with a large suction force. Especially due to the recent years: 'The time will be greater than the above, the method of the patent document, if =: deformation situation. Such as r

V suppresses the force applied to the semiconductor die, and there is a problem that the case of == peeling is not possible. ° + Another method in which the conductor grain damage is highlighted by the neighboring moon, and the method of sucking the sheet is sucked between the holding piece and the surface of the stage by a small suction hole disposed only at a wide periphery, and (4) suppressing attraction And the second applied to the semiconductor die =, the protruding portion continues to move, because the semiconductor has been peeled off from the semiconductor die = the cover is located in the portion of the suction portion of the protruding portion of the suction hole, so the displacement of the protrusion = the attraction of air The amount is gradually reduced (refer to Fig. 9 of Patent Document i, the length of the peeling line of the holding sheet is determined by the movement *), so the force required to peel off the holding piece does not change according to the position of the direction of the heart. The cross-sectional area of the side surface of the portion and the holding piece perpendicular to the moving direction of the protruding portion is not edged and moved, so that the flow path area through which the air leaks into the gap does not change due to the sudden change/movement. 'If the movement of the protruding portion causes the two holes to be peeled off, and the thickness is gradually reduced, the vacuum between the protruding portion and the film and the sheet is lowered, and the peeling force is gradually lowered. As a result, in the half 8 200913085, the conductor grain Direction of movement toward the protrusion Holding the sheet, there is a possibility that the peeling force of the sheet which cannot be picked up smoothly can be smoothly picked up. Although the pulling force of the sheet can be increased, the pulling force of the sheet is held to keep the semiconductor crystal grain connected, and the moving direction of the "4 vertical 1" is highlighted. There is a problem that the semiconductor (III) is damaged by the contact of the semiconductor (III), so there is a problem that the p-body is unclear. 4 The direction of movement is limited. The object of the present invention is to provide: The power of the semiconductor die is easy. When the peeling of the film is stripped, it is suppressed from being applied to the pick-up device. Li Weiyue "a semiconductor die that picks up the semiconductor die. The semiconductor die of the present invention is picked up, and the semiconductor device is adhered to the holding piece: Picking up with the absorbing and holding of the clip is characterized by: and borrowing: 2 = holding the surface of the opposite side of the semiconductor die adhered to the surface of the conductor tightly "the opening of the opening" is set at the close surface 'greater than the semi-rigid ^ I sighed on the stage so that its surface slides along the close surface, and the Kawasaki attracts the opening; after picking up the semi-conducting 梏η, / π1, the surface of the cover is close to the semiconductor die that is taken care of. The surface of the cover that attracts the opening is slippery In the state of the semiconductor die picked up, the cover is sequentially opened to open the attraction opening, so that the holding piece is sequentially attracted to the opened phase port', and the semiconductor film is removed from the semiconductor wafer according to (4). The semiconductor die pick-up device may be disposed on the stage, and the cover may be slid on the contact surface and protrude from the close surface to pick up the semiconductor die f: the surface of the cover that is in close contact with the retaining piece protrudes from the close surface Sliding the cover can also pick up the semiconductor die so that the direction of the end of the picked semiconductor crystal 200913085 is in the direction of the end of the cover, from one end side of the picked semiconductor die toward the other end side. The cover is slid to sequentially open the adsorption opening, and the holding piece is sequentially sucked from the end side of the picked semiconductor die to open the suction opening, and the semiconductor die from the household wire is sequentially peeled and held~ Unaccounted for The flat γ 4 , ι u 邳 may be substantially the same width as the picked semiconductor die and extend from the inside to the outside of the stage, and the rectangular plate having the width of the cover and the width of the opening may be on the stage. Inner end face and edge opening The corner portion of the extending direction has a notch at the corner, and the stage can also have a guiding hole on the abutting surface around the suction opening; and when the semiconductor die is picked up, the periphery of the semiconductor die taken by the suction hole is sucked The cover is held to slide the cover; and the sliding surface of the opening and the opening is provided, and a sealing mechanism for restricting the entry of air from the outside of the stage is provided. In the semiconductor die pick-up device of the present invention, a sliding mechanism for sliding the cover may be provided, and the driving portion may be attached to the base portion on the side of the contact surface 2 of the stage to provide the i-th connection provided inside the stage. The rod (4) is driven in the direction in which the surface i is retracted; the guide is disposed on the inside of the stage 1 and extends substantially parallel to the j-direction and extends toward the extension of the suction opening; the slide, * 丄, month 1000, connected with a cover, - sliding The ground is mounted on the guide; and the second link is rotated, and the bite is freely attached to the carrier. The internal 'connects the slider to the first link, and the first far reversed #对对面; The movement in the direction is converted into the action of the slider in the direction of the guide rail. When the j-conductor die is picked up, the cover is slid along the contact surface by the drive unit moving forward and backward toward the contact surface. 10 200913085 In the semiconductor die pick-up device of the present invention, the sliding mechanism for sliding the cover may include a driving portion that is attached to a base portion on a side opposite to the contact surface of the stage, and is disposed inside the stage. The third link is driven in the direction of advancing and retreating the pressing surface; the piston is disposed inside the stage and advances and retreats to the pressing surface; and the stopper is disposed inside the stage to restrict the movement of the piston in the advancing and retreating direction of the abutting surface; a spring that connects the first link and the piston to the direction of advancing and retreating to the abutting surface, and is compressed when the piston abuts against the stopper; the guide is mounted to the piston, (extending substantially parallel to the abutting surface and extending toward the suction opening) The direction is extended; the sliding member is connected with a cover slidably mounted on the guide rail; and the second connecting rod is rotated to be mounted on the piston as the ground, and the sliding member is connected with the first connecting rod, and when the piston abuts the square, the stopper When the second link is moved in the direction of the advancement and retreat of the contact surface, the action of the third link is reversed to the direction of the guide rail; when the semiconductor die is picked up, the first link is moved forward and backward by the drive portion. After the cover is protruded from the close surface The semiconductor die pick-up device of the present invention may further include a sliding system for sliding the cover, and includes a driving portion that is attached to the base portion on the side opposite to the contact surface of the stage, and is provided on the stage. The inner i-th link is driven in the direction of advancing and retreating the abutting surface; the guide rail, S is placed inside the stage, extends toward the extending direction of the suction opening, and has an inclined surface inclined toward the abutting surface; the sliding member is connected with the cover, And slidably attached to the inclined surface of the guide rail; and the second link is rotatably mounted inside the stage, and the slider 盥, 'Le 1 link is connected, the first

The movement of the connecting rod to the advancing and retracting direction of the adjoining surface is performed by AF to change the direction of the horse sliding member in the direction of the guide rail; when picking up the semiconductor crystal grain, the bamboo shooter is driven by the driving portion to advance the first connecting cup toward the close surface. The cover edge is slid from the edge of the abutting surface of the abutting hole 35 to the surface of the sliding surface of the semiconductor chip of the present invention. The inclined surface of the semiconductor die pick-up rail of the present invention: the guiding cam surface of the convex body is attached to the side of the abutting surface from the opening The direction of extension is inclined toward the abutting surface, and is flat; == along the suction surface, parallel to the kidney station; and the male and female cam links are provided with curved surfaces or rollers for extending along the guide rail; second and parallel faces The shape moves. Cam surface

The semiconductor die pick-up device of the present invention is driven in the lower direction of the semiconductor chip pick-up device. The upper holder of the stage moves to the holding sheet in the advancing and retracting direction, and the holding piece of the crystal is adhered to the semiconductor die to hold the sheet.疋When the wafer is held along the body of the wafer,! Α ^ *moving, in picking up the semi-conductive piece, the direction of the swaying mechanism is used to make the surface of the cover close to the surface of the cover of the semiconductor device from the closing of the suction opening In order to avoid the device being mounted on the m semiconductor die, the method of picking up the semiconductor die == the method of picking up the semiconductor die of the holding piece, the picking device is to hold the holding piece of the body grain. 3The surface is tightly attached to the opposite side of the surface of the semiconductor die with the semi-conductive tape picked up by the sticker = the cover 2 is placed on the close surface, which is larger than the half-closed suction opening of the pick-up; and: , the surface of the surface slides along the abutting surface, and opens to the right. & and the same clip, adsorbs and holds the semiconductor crystal; characterized in that the step = 'steps' to make the surface of the cover adhere to the holding piece so that the picked-up is away Step: crystal π:: 'closes the surface of the cover of the closed opening; and keeps the strip stripped with the clip to pick up the semiconductor die picked up, so that 12 200913085 sequentially opens the attracting opening' so that the holding piece is sequentially attracted to the opened 4-port and from the semiconductor die picked up Prepared from the holding piece. Ming's semiconductor die picking method can also be used to mount the semiconductor die 2 cover on the stage, so that it slides along the close surface and is close to the large surface, and the film peeling step is maintained, and the cover surface is closed from the tight The face suddenly makes it slide. W in the invention of the semiconductor die picking method, the positioning step, the direction of the "the end of the conductor die - so as to maintain the sheet separation step along the "end 2" side of the cover, from the pick One end side of the semiconductor die 2 and the other end side slide the cover to sequentially open the adsorption opening π, and sequentially suck the holding piece from the end side of the picked-up half-body die to the opened suction opening. The semiconductor crystal grains are sequentially peeled off from the holding sheets. The present invention is applied to a semiconductor die pick-up device which can suppress the force applied to the semiconductor (9) and easily pick up at the peeling of the holding sheet. [Embodiment] Hereinafter, a preferred embodiment of the present invention will be described with reference to the drawings. In the description of the semiconductor die pick-up of the present invention, the wafer and wafer conformer will be described first. As shown in Fig. 1, the wafer 1 1 μ μ > the circle 11 is adhered to the back side with an adhesive holding sheet #2'. The holding sheet 12 is attached to the metal ring 13. The wafer η is operated in a state where the holding sheet 12 is attached to the metal ring 13 as described above. Further, in Fig. 2, the wafer U is cut by the dicing saw or the like from the surface side in the cutting step to become each of the semiconductors (four) 15. Between each semiconductor die 15 is formed a cut-off risk, / gap 14, which is generated when the cut 13 200913085 is broken. The body grains 15 cut into the gap M reach one of the holding sheets 12 and are cut off from the semiconductor, and the semiconductor wafers are held, but the holding sheets 12 are still held by the holding sheets 12. As described above, the holding piece 12 and the ring are attached as shown in Fig. 3, and are mounted on the wafer holder 1''.曰^ Companion body and particle 15, which has an annular expansion ring i with a flange portion. 』 Zhang Huan! The ring factory member 17 on the flange of 6. The ring member is advanced and retracted at the flange of the broadcast ring 16 in the diffuser driving portion = the inner diameter of the ring 16 not shown is larger than the semiconductor die 15 ==. The wiped sheet 16 has a predetermined thickness and is convex: 曰: 'expanded to the side away from the retaining piece and + the side of the mountain-expanded wave b', the 安 茫 丨 向 向 向 向 向 向 向 向 向 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 Further, when the outer circumference of the holding sheet is a curved surface structure = "sheet", it is possible to maintain the surface of the holding sheet 10 by the circular driving portion (not shown). The direction is moved. 51 Hold/, the holding piece U of the semiconductor die 15 is fixed in the horizontal direction, and the lining of the clothing is substantially planar. Fig. 4 is a diagram showing the configuration of the semiconductor die picking device 1 (9). Further, the conductor holds the semiconductor crystal, and the heart drops to the ring 0. In this state, the ring member 17 inflames the ring 13 between the flange of the expansion ring 16 and the flange of the expansion ring 16. When the upper portion of the retaining piece 12 and the flange face have an upper portion of the flange surface, the retaining portion 4 extends along the surface of the expanding ring 16 to extend the difference between the upper surface of the expanding ring 16 and the flange surface. Since 14 200913085 , the tension on the expansion ring is fixed on the expansion ring]6, and is generated from the center of the holding piece and 'because the tension is accompanied by the adhesive point on the holding piece】 2 half of the holding Θ 12 extension 'so the ms conductor 曰The gap between the 15 uncles is enlarged. The 保持 letter holder 10 is installed to move the crystal plane. In the horizontal direction, drive the Qiu 79 n port along the horizontal direction of the holding piece ^ P 2 °, and the motor and the cymbal set by the inside can be driven by the flat direction, also _p - round holder] 0 in water f circle Hold the holder 10 along the guide "Ma 4 money source to make the crystal T丨卞% χ γ direction move. The upper portion of the μ is provided for adsorbing the mobile semiconductor, and the holder 18 is provided with the same clip 18 for adsorbing the semiconductor. The suction hole 19 of the colloidal day and the granule 15 is connected to the vacuum skirt 71 at the adsorption hole. Pulling and attaching the surface, each setting stage 20, the stage 20 is held by the lower side of the stage, the lower side of the holding table 10 is held in the up and down direction (ie, the direction of advance and retreat): the driving direction of the moving machine is as shown in the figure 5 no, Gong A. Λ曰, D 八备·· The cylindrical frame 21 has a tight surface 22 for adhering to the holding surface 12 on the upper surface; the base portion 24,: i. is placed in close contact with the frame 21 The opposite side of the face 22; and the driving base portion 24, drives the link mechanism of the armor portion 24 of the armored portion. The stage 20 is shown in a stage fixing portion not shown. An opening 41 is formed in the stage 20, and the opening 41 extends from the inside of the stage 2 toward the outside, and is substantially the same as the semiconductor die 15 to be picked up, and the length thereof is higher than that picked up. The semiconductor die 15 is long. In the opening 41, a cover 23 having a rectangular plate is formed so that the surface thereof is formed to be in the same direction as the second surface, and the cover 23 is slidable in the extending direction of the opening 41. Further, since the cover 23 is embedded in the opening 41, it is substantially the same width as the opening 41, 15 200913085 且 and has substantially the same width as the width of the semiconductor die 15 to be picked up. The length of the cover 23 is longer than the semiconductor die 15 to be picked up. As long as the opening is formed on the abutting surface 22 so as to be substantially the same width as the semiconductor die 15 to be picked up, it may be disposed in the inner material section I, and a slit that connects the stage 2 is provided in the step portion. The side surface of the lid 23 and the side surface of the opening constitute a sliding surface. A sealing member 65 is provided between the side surface 23b of the cover 23 and the side surface of the opening for restricting the air from the outside of the stage of the opening 41 to the sliding surface of (10). The sealing member 65 is disposed on the outer side of the stage sill so as to set a gap between the side surface 23h of the differential cover 233 and the side surface 41b of the opening, and is attached to the stage 20 to the outside of the sealing member 65 by a sealing pressure. Be covered; As shown in FIG. 5, the 'sealing member 65 is set to have a front end that protrudes toward the bottom surface from the bottom surface of the cover. When the signage field 23 slides on the outer side of the stage 20, the moon is compressed by the cover 23 to prevent air. Man loading station 2. Inside. The bottom surface of the sealing member and the side surface member 65 may be made of an elastic material such as rubber. As shown in Fig. 4, inside the σ and σ 20, a sliding mechanism for moving is provided. The sliding structure is composed of the following members: the first link 26 is offset from the driving portion 25 of the carrier base 24, and the pair of pressing faces 22 are in the advancing and retracting direction 骢釭·τ a from eight 3 冢 躯 躯 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , ,贴...MM"==body 21' is mounted parallel to the guide 31. Charm, β-piece 32, sliding freely 2 the other end of the link 29 V into 0' is mounted on the slider 32' The first engaging groove 29a engages the slider 32 with the second link 29 16 200913085; and the lock 33 connects the cover 23 to the vacuum device 71 by a slider, and the frame 21 is connected and the interior thereof is Vacuum. The first link 2 can be brought into close contact with each other. ° As long as the surface 22 moves forward and backward, for example, it can be combined with a small form of @4^, and it can be composed of electromagnetic force to make the i-th link 26 Brother 1 can only work 26, and can also move directly in the up and down direction by means of ❻26. Referring to Figure 4, the current aH n , the action of the phase sliding mechanism. By the brother 1 link 26 to the close 1 2 5 to make the card # % m direction When entering, the first link 26 The card 26a also rises to the close surface 22, and then rises and is located at the card holder 0, although the engagement groove 26a' is stuck. The pin 27 in the 26a is also raised with the pin 27. The pin 27 rises and the belly μ slot 26a The pin 28 of the second link 21 of the upper upper 幵 fashion has a pin 27 as the center ^ π the heart 29 is fixed to the frame, and is placed in the first groove 29a inward. # a 唣抨29 The card moves toward the outside of the cutting table 20 (the opening of the opening 41 is moved by the second link 2Q & the extension direction). The moving pin 30 of the engaging groove 29a of the lever 29 is also facing the magazine # △ and the lower jaw 29a. The slider 32 is moved along the outer side of the stage 20, and the side is moved by the guide 31 of the pin 30. When the pin 3 is moved outside the carrier A slider 32, 丌Ik along the guide rail 31 is oriented toward the stage 2 〇 veneer 22, and the outer side of A is substantially parallel to the shape of the 连杆° 5 groove center U-shaped, and can absorb the card generated by the second-side slider 2 The direction of movement of the groove W and the direction of the swaying direction of the rescue caused by the pin are shifted by 1 difference. Moreover, the slider 32 moves along the guide surface 22 and is not parallel to the tightness. Pin 30 amps Between the sliders 32, the guides 1 i 23 and the sliders 32 and the like 31 are parallel to the abutment surface 22 to open the pen h toward the stage, and the outer 1 moves '^. When the cover 23 is closed, the drive unit 25 is closed. #笸], αα goes to the kidneys, and the second link 29 and the slider 32 descend in the direction in which the face 22 and the face 22 are separated, and the second link 29 and the slider 32 move in the opposite direction to the above-described operation in the direction of the above-mentioned operation, and the cover is turned inward. The outer side of the movement "1 ^ 20 is as described above, and the sliding mechanism moves the second link 29 close to the face shape to the sliding type by moving the second link 26 22 in the forward and backward directions. In the direction of the movement, it is possible to configure the mechanism to be housed inside the cylindrical casing 2i. 々® 4 does not have a 'semiconductor die pick-up device 1 100, and has a control unit 70 for searching for a computer contained inside c, respectively connected to a vacuum 奘 ^ 运 运 运 运 运 驱动 驱动 驱动 驱动 驱动 驱动 驱动 驱动 驱动 驱动 驱动 驱动 驱动And the wafer holder horizontal direction driving unit 72 is driven by the driving portions 25, 72, the collet 18, and the vacuum device 7. Further, in Fig. 4, "the control unit 70 is connected to the drive unit 2572, the second system is connected to the control unit 7. The second clamp 18 and the vacuum device 71 are connected to the upper and lower direction drive mechanisms. The command of the control unit control unit 70 drives the stage up and down. The operation of picking up the semiconductor die 15 by the semiconductor die 攸 holding sheet U will be described with reference to Figs. 6 to 10 . The same reference numerals will be used for the same parts, and the description will be omitted. As shown in Fig. 6 (4), the control unit 7 starts the positioning step of the wafer holder horizontal direction driving unit shown in Fig. 4. ', 10 moves in the water + direction to the load. The waiting control unit 70 of the stage 20 stops the wafer holder 1 after the wafer holder i is positioned and the position of the waiting position of the U m stage 2 is positioned. The display of the upper and lower ancient & moving to the '△ mouth up and down direction drive mechanism to make the table 2 〇 〇 2 〇 of the close surface 22 盥芸 2] 主 main two jump up to the surface of the carrier 23 close to the holding piece 12 below. 18 200913085 After the surface of the close surface 22 and the cover 23 are in close contact with the surface, the control unit 70 stops the loading of the stage 2, and then the control unit 70, and then hunts the horizontal direction of the wafer holder 10 Horizontal side ~* Adjust the day and day to keep the 1U water ten direction position

The inner end face 23a of the stage of the u 3 is the end (5) of the semiconductor die 15 to be picked up. The side of the grain 15 is aligned with the side of the granule 15 so that the + conductor crystal ant is on the side 23b of the 盍23. Since the semiconductor button 7 ς width to be picked up is approximately the same as the width of the thousand V body pull 15 , if the face 23b is caused by the rain on both sides of the semiconductor crystal side grain 15 ... 3, the semiconductor crystal can be performed. Η ,... The positioning of the side coffee. At this time, the hunting ring is held by the expansion ring 16 of the wafer holder 10 and the cover U is located at the closing opening 41, so the cover f is again, because the carrier is located at the junction The inner end surface 23a and the position of the inner side end surface 4U of the opening 41 of the opening 41 are located at the initial position, that is, at a position closer to the position where the sealing member protrudes from the same surface as the bottom surface of the singular 23. Fig. 6(b) is a close-fitting surface 22 of the stage 20, which is placed on the surface of the substrate 20, and the semiconductor die 2 is shown in Fig. 6 (8). The day grain 15 and the lid 23 will cover the semiconductor die. 7(8) to 10(b) are also slightly larger than the cover 23, as shown in Fig. 6(b). Since the semiconductor die is the same as the cover, the semiconductor die is substantially fine. μ > The side end face 23a is in the same manner, and the position in the stage is located on both sides (10) of the cover 23. Further, since the conductor die 15 is slid by the opening 41 and the cover 23, the length of the semi-u lunar direction is larger than half. The other end of the body 15 is located at the position of the cover 23 of 19 200913085. After the positioning of the cutting table 20 and the positioning of the semiconductor die 15 are completed, the second=..., the tightening. Then, the control unit 70 causes the collet 18 1 to be positioned on the step 15 to start the vacuum, so that the semi-conducting portion of the adsorption surface is to vacuum the half-guided and attached holes 19 to be picked up, V body day The daily particle 5 adsorption is maintained at this position. As shown in Fig. 7 $ _ 1 λ Fig. 1 ,, the control unit 70 starts the sheet peeling step as shown in Fig. 7 . _ μι 〇 7 〇 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空Since the restriction surface 23b is entered by the sealing means, the side of the _, W-milk-盍23 can maintain a good vacuum state. Then, by the driving unit 25, the ± control unit 70 causes the first link % to move closer to the link 29, and the second to the second is moved. The engagement of the second link 29 is connected to the lock core to move to (4), and the pin wind 23 is opened to the outside of the stage 2〇. As shown in Fig. 7, 芸2 3, 典述你+. From the opening "...: the inner side surface of the cover 23 is detached from the inner end surface 41a of the carrier, and the opening 41 is formed by the semiconductor to be picked up. 2n is the same-width opening 42. The N portion of the frame 21 of the mouth is vacuumed by the vacuum device 71. The opening portion 42 attracts the holding piece 12 to the inside of the opening portion 42. Further, the sealing member 65 is compressed by the cover 23, and the gap between the 盍23 and the opening 41 is immersed from the outside of the stage 02 to the inner side of the yoke. Therefore, the inside of the casing 21 is kept high. The Κ Κ 具 具 具 具 具 具 具 具 具 具 具 保持 保持 保持 保持 保持 保持 保持 保持 保持 保持 保持 保持 保持 保持 保持 保持 保持 保持 保持 保持 保持 保持 保持As a result, this deformation causes the peeling to proceed from the side of one of the semiconductor crystal grains 15 to #! ς ^ 15a. Holding one of the conductor dies 15 of the sheet 1 媸μ /0, & 疋 疋 and the 15a side is peeled off, the air enters from the gap between the semiconductor die 15 20 200913085 and the holding piece 12 due to the peeling of the holding piece 5 } A pressure difference is generated between the + conductor die 15 side of the holding piece U and the inner side of the vacuum opening portion 42, so that the holding piece 12 is further attracted into the opening portion 42 of the vacuum state. Then, the air enters the peeling line 53 substantially parallel to the end surface 23a of the lid, and the holding sheet n is peeled off from the side 15a side of the semi-conductive moon granule 15 to the peeling line 53. On the other hand, since the semiconductor die 15 is adsorbed and held by the collet 18, its position does not change. 41::: The command of the control unit 7〇 causes the cover 23 to slide in the direction of the opening, that is, the outside of the stage, and the inner end surface of the stage of the cover 23 moves to the outside of the stage 2°. The opening portion 42 is then opened; the outer side of 42° becomes larger. Then, with the sliding of the cover 23, the holding pieces 12 are sequentially sucked, and the holding piece 12 is pulled, and the inside is peeled off from the semiconductor die 15. Slide 23 to the stage 2 in sequence. Move outside. After that, V: the opening portion 42 after the cover is peeled off, the opening portion 42 is opened in the opening portion 42 so that the holding piece 12 is attracted to the holding piece V. The opening portion 42 is covered by the holding piece 12, because the cover 23 The sliding of the holding piece is stopped: the opening is opened, so that the opening is opened in the opening portion 42 and the attraction of the opening portion 42 is caused to be peeled off as shown in Fig. 9 in order, and no unpeeled portion is generated. Step_, 1 = '_ portion 7 () by the driving portion 25 to make the cover 23 further into the other end = moving to the inner end surface of the stage ... beyond the semiconductor die is also attracted to the opening two positions. As a result, the other end of the holding piece 12 air is peeled from the other 15 from the semiconductor die 15, and the b side enters between the semiconductor die 15 and the holding piece 12, 21 200913085 makes the semiconductor die 15 completely from the holding piece 12 Stripped. Then, since the 23^ of the cover 23 is no longer changed, the opening portion 42 is opened by the size of the (4) opening portion 42, and the state of the air formed when the π 12 cover lid 23 is stopped is maintained. The suction from the periphery of the opening portion 42 in this state is as shown in Fig. 10, and the film 15 is lifted up, and the semiconductor body 2i and the vacuum are sucked by the collet 18 are moved. Then, the control unit 7 〇 blocks the air dust. As a result, the holding piece 12 =: and the inside of the frame body 21 is restored to the large 2 by the tension control portion toward the periphery - the lower portion of the i-th link 26 is moved to the inside of the stage by the driving portion 25, so that the cover is made 23 becomes the closed state. After the connection is closed, the enclosure 7 is always pressed by the cover 23 and returned to its initial state by its elastic force. In the sealing member, as described above, in the present embodiment, the lid 23 is sequentially slid from the one end side of the semiconductor toward the other end side, and the sheet 12 is held in the opening portion 42 of the door 5 to carry out the holding sheet 12. The peeling door: 'The mouth is attracted to the opening part of the opening--the cover piece is covered, because the part of the two K 42 retaining piece 12 has not been peeled off, because the moon is in the direction of the body: the opening is open... (4), the play piece 12 king body The effect of peeling. ', hold again, the length of the strip that is stripped in the early time multiplied by the movement of the cover 23 per unit time is less than the force required to peel off the semiconductor. It is the force required to hold the film 12 off, so it can reduce the power of the semiconductor film 15 by reducing the thickness of the film. Further, in the present embodiment, since the surface of the cover 23 is substantially flush with the contact surface 22, the adjacent semiconductor die 15 is not caught when the cover 23 is slid, and the sliding of the cover 23 can be prevented to cause the semiconductor die. Since the damage occurs, even in the case where adjacent semiconductor crystal grains 15 are present in the periphery, the effect of easily picking up the semiconductor crystal grains 15 can be exhibited. Further, in the present embodiment, the width of the opening 41 and the cover 23 is substantially the same as the width of the semiconductor die 15 to be picked up, but the width of the opening 4 i and the cover 23 may be made larger than the width of the cover 23 to be picked up. The width is large. In this case, since the holding piece 12 is also attracted from the side surface side of the semiconductor die 15 into the opening opening portion 42, the suction of the holding piece 12 toward the opening opening portion 42 and the semiconductor crystal to be picked up can be more effectively performed. Peeling of the granules 15. Furthermore, in this embodiment, it is described that the inner end surface 2 of the stage 23 of the cover 23 is "consistent with one end 15a of the semiconductor die 15 to be picked up, but as long as it is to be picked up: the conductor die 15 is located not from the cover 23. The protruding position of the surface may also be such that the direction of the inner end surface 23& of the yoke 23 is opposite to the direction of the one end 15a of the semiconductor die μ to be picked up, and the one end 15a of the semiconductor die to be picked is positioned at The direction in which the opening 41 of the inner side end surface 23a of the cover 23 extends is the sliding direction of the cover 23. In this case, after the cover is slid to form the opening portion 42, the semiconductor die 15 to be picked up The holding piece 12 between the adjacent semiconductor crystal grains is sucked toward the inside of the semiconductor die 15. Therefore, at one end 15a of the semiconductor die 15, the angle of the holding piece i2° 2 is pulled obliquely downward, so that the smoothing can be performed more smoothly Starting to peel off the holding piece 23 200913085, the moving mechanism is only for the advancement and retraction of the holding piece 12 from the up and down direction of the stage to the horizontal direction (in the direction of the holding piece 12, moving up and down) does not have a horizontal back Gap, etc. Therefore, the mechanism is not good, and the position in the direction of the surface of the +-conductor die 12 taken by the positional stability U in the direction of the lane is maintained by the wafer and the two holding pieces are performed. When the positioning in the horizontal direction is carried, the horizontal drive unit 72 is applied to the stage 2. The cover 23 and the adhesive sheet 2 are stable in position, and the effect of displacement is reduced during positioning. In the present embodiment, the conductor die 15 can be applied to the semiconductor when the control piece 12 is peeled off. The sliding speed will be maintained, for example, in a thin and low-intensity semi-conducting; 4 force-matching sliding speed of the semiconductor die cover 23缕樨 缕樨 & * _ day granules, can make the force: reduce the amount of peeling per unit time, less peeling force, or make the opening of the opening 42 to reduce the force of the force to reduce the father, to reduce The strength of the semi-conductive one 15 is easy to peel off the holding piece. Moreover, in the case of the thick and strong semiconductor crystal grain, the area of the peeling and the strength of the large unit time can be increased, and the sliding speed is increased, so that A shrinkage time, in this case, can also be configured to have thickness a semiconductor die ~ thick sound of the detector, etc., means 'to pick up the pick, and to output the thickness data to the control unit 70, the thickness of the semiconductor die 15 measured according to the thickness detecting means The sliding speed changes. In this case, the thickness of the semiconductor die 15 can also be determined according to the sliding speed relationship diagram (memory stored in the control unit 7). In the case of driving the motor or the like, the control (4) can change the sliding speed of the cover 23 by changing the number of rotations of the motor. 24 200913085. If the driving unit 25 performs the first... advance and retreat by the electromagnetic force? The force pulse changes by changing the interval of the pulses to change the advance and retreat speed of the first 26' to change the sliding speed of the cover 23. Referring to Figure η, the same part of the embodiment of the present invention will be described using the same symbol: =. In the present embodiment, the inner end surface of the stage of the cover 23 is replaced by a notch 61 at a corner between each side surface 23b in the direction in which the opening 41 of the opening 41 is extended. As shown in (10), by the notch 61, when the cover is "closed", the contact surface 22 of the stage is brought into close contact with the holding piece 12, so that the surface of the cover 23 is picked up. The end of the semiconductor die 15 is connected to the end of the semiconductor die 15 directly below the corners of the frame 21 side. Further, after the control unit 70 activates the vacuum to be vacuumed, even if the cover 23_(4) body is in contact with the end face opening 63 of the opening inner side end surface 41a of the opening 〇, the suction hole is located at the semiconductor die. " 'First peel the part of the corner. After 1 : first: the angle of the retaining form is the same, so that the cover 23 is directed toward the opening 4 4 and the implementation described above, from the end 15 of the semiconductor die 15 = : The embodiment of the slide on the outside of the stage, except for the previous one: the disintegration... Invar first from the effect of the semiconductor ~, the part of the corner of the ... 2 virtual semi-conducting ... peeled off the holding piece U, after the ,, 佐Between 15, the air entering the material "" is kept away from the holding piece 12' so that the sliding of the cover 23 can be smoothly performed Into "25200913085 holding the release sheet 12 'to play the previously described embodiment the holding piece easily into the right foot 4 of the peeling effect than 12. Further, in the present embodiment, the notch is provided on the cover 23, and the holding piece 12' which can be separated from the corner portion of the semiconductor die 15 can be formed even if the cover μ is in the closed state, but the inner end surface of the stage of the opening 41 can also be provided. The corner portion of the side surface is provided with a hole that protrudes toward the outer side of the opening 41 and penetrates the abutting surface 22. With such a configuration, even if the lid 23 is in the closed state, the semiconductor crystal grains 15 can be attracted (at the same angle. First, the holding sheet 12 is peeled off from the corners of the semiconductor crystal grains 15), and the holding sheets 12 are sequentially peeled off. In the same manner as in the embodiment of the present invention, the same reference numerals will be used, and the same reference numerals are used to omit the description. The present embodiment is provided on the side of the guide rail 23 1 t. The inclined cam surface 271. The side surface of the guide surface 231 of the close surface of the guide rail 231 is provided to be inclined along the 'monthly direction of the cover 23 (the direction in which the opening 41 extends) toward the close surface 22 obliquely upward; the cam surface 271; and continuous to the cam The surface 271 is in the sliding direction of the cover 23 (the parallel surface 272 extending parallel to the abutting surface. Further, the slider 232 has a curved surface 273 (sliding contact with the cam surface 271) on the surface in contact with the guide rail 231. Further, the opening 41 The peripheral contact surface 22 is provided with a suction hole 64. The operation of this embodiment will be described with reference to Figs. 13 and 14. In the present embodiment, the cover 23 is picked up toward the semiconductor die 15 and is not placed on the holding piece 12. The direction of the semiconductor crystal grains 1 5 slides. At this time, The semiconductor die 15 located in the range of movement of 23 is picked up, and the semiconductor die 15 outside the moving periphery of the cover 23 does not have to be picked up. As shown in Fig. 13, the drive is driven by the command of the control unit 7 The portion 25 operates, and after the second link 29 moves to the outside of the stage of the 200913085, the curved surface 273 of the slider 232 will abut against the cam surface 2". Then, the cover 23 is further slid and the cam of the guide 231 is tightened by 1:273. The veneer 22 is gradually raised upwards. As a result, the transmissive pin 33 is attached to the slider called the cover & the second side moves to open the opening to form an opening „42, and at the same time, the semiconductor die 15 to be picked up is followed by the cover 23 The protruding piece is protruded from the supporting piece: two sides: liter. On the other hand, a suction hole 64 is provided below the X-conductor (located in the sliding direction of the cover 23) of the semiconductor die 15 to be picked up, and the holding blade of the 4-blade [2] The suction body 64 is attracted to the contact surface η. Since the sealing member 65 is in contact with the bottom surface of the film 23 to block the air entering the frame, the frame body 21 is kept in a vacuum state by the cover. The sliding opening of the opening portion 42 attracts the holding piece 12 to be peeled off from the semiconductor die. The hunting of the semiconductor die 15 is caused by the rise of the cover 23, and the holding piece 12 adjacent to the opening "is fixed to the holding surface 12 of the close surface & one end 15a side of the conductor die 15 by the suction hole 64. It is pulled obliquely downward toward the abutting surface 22. The pulling force of the holding piece 12 is peeled off from the semiconductor die 15 by the pulling force obliquely downward and the holding piece to the inside of the opening opening portion 42. The connector is as shown in Fig. After the second link 29 is further moved outside the stage, the π member 232 is fully mounted on the cam surface 271, and moves parallel to the contact surface 22 along the parallel surface 272 continuous from the cam (7). In this case, since the parallel faces are closer to the abutting faces 22 than the treads 271, the cover 23 slides parallel to the abutting faces 22 after projecting more closely from the abutting faces 22 than the one shown in Fig. 13. Moreover, the inner side end surface 23a of the cover 23 reaches the position beyond the other end 1 of the semiconductor die 15, and then the semiconductor die 15 on the other end 15b side is peeled off, and the semi-27 200913085 conductor die 15 is completely maintained. When the sheet 12 is peeled off and the tension of the sheet 12 is raised to the outer end 15a of the table, the present embodiment is used, and since the 盍2 3 is slid from the side of the contact surface, the semiconductor wafer 15 can be peeled off. The use of the opening and opening 42 of the opening portion 42 makes it easier to peel off the holding sheet 12. f

In the above, although the 5 brother listening slider 232 is provided with a curved surface 273 (the side of the abutting surface of the guide rail 231 abuts against the cam surface 271 and moves the slider 232 along the cam surface 271), but the inclination of the cam surface 271 If the angle is large, the roller contacting the cam surface 271 may be attached to the slider 232. Further, in the present embodiment, it is described that the cover 23 is protruded obliquely upward by the cam surface 271 and the parallel surface 272 provided on the side surface of the contact surface of the guide rail 231, and then slides parallel to the contact surface 22, but the guide rail 231 As long as the cover surface 23 can protrude and slide from the contact surface 22, it can be any shape on the contact surface of the guide rail 231 as shown in FIG. 15, and the side surface is formed to extend from the inside of the stage along the opening 41. The direction is the slope that rises close to the surface. Another embodiment of the present invention will be described with reference to Figs. 16 to 17 . The same reference numerals are used for the same parts as those of the embodiment of the present invention, and the description thereof will be omitted. As shown in Fig. 16 (b), the present embodiment is provided with a sliding mechanism for sliding the cover 23 inside the stage 20, similarly to the embodiment described with reference to Fig. The sliding mechanism is composed of a member in which the first link 326 is slidably attached to the driving surface 25 of the base portion 24 of the stage 20 and is slidably driven in the advancing and retracting direction. The frame 21 of the table advances and retreats to the abutting surface 22; the stopper 321a is disposed inside the frame 2, 28 200913085 /, the flange 371 of the piston 370 is engaged to restrict the piston 37 to the abutting surface a The action of the advancing and retracting direction; the spring 373 connects the second link 326 and the piston 37〇 in the direction of advancing and retreating the tight-fitting surface 22; the guide 331 is mounted on the piston 37〇, substantially parallel to the abutting surface 22 and extending The opening direction of the opening 41; the slider 332 is connected to the cover 23 and slidably attached to the guide rail 331; and the second link 329 is rotatably attached to the piston η by the lock 328. Slide 332 盥 first! i 浐 浐 μ α α 326 弟 弟 # , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The action is converted into the action of the slider 3 3 2 along the direction of the guide 311 > t * ¥ rail. X, the frame 21 is connected to the vacuum device 71 shown in Fig. 4 to enable the internal vacuum. The rod 329 is inserted into the first connecting rod-like engaging groove 326a by the pin 327 disposed at the end, and is disposed at the pin 33G of the engaging groove gamma living material 332 at the other end, connecting the sliding member 332 and the first The connecting rod 326. Inside the driving portion 25, the motor for operating the sliding mechanism is applied to the rotating shaft of the motor 381, and the axe is attached to the thin wheel 383 provided in the i-th link 326. The roller 326c at the front end of the shaft 326b of the cam 383 connector 26. Fig. 16(a) is a plan view showing a corner portion of the abutting surface 22, m. 141. As shown in Fig. 16 (a), this embodiment At a corner portion of the side surface 41a of the stage inner surface 41a" of the opening 41 of the opening 41, the suction hole 364 which protrudes toward the outer side of the surface of the opening and penetrates the surface 22 is provided. The through hole 364 communicates with the inside of the frame 21 even if the cover 23 is closed. Next, the description of this embodiment can be made in the private direction of #向&车1_曰~, action. In the present embodiment, the cover 23 is detached from the body granule 15 and is slid in the direction in which the semiconductor die 15 is not placed on the holding piece 12 * 彳 12 is not placed + at this time 'If the movement is located at the cover 23 Scope 29 200913085 The semi-conducting ns#. 曰曰y, 5 have been picked up, and the semiconductor die 15 outside the moving range of the cover 23 can be 兀v; Similarly to the embodiment previously described with reference to Fig. ,, the control step 7η μ ^ + 4 70 starts the clamping step 'adjusting the position of the wafer holder 1 水平 in the horizontal direction, and the store side, the inner side 23a of the stage 23 is located Consistent with the semiconductor crystal to be picked up, the position of the side end (5) of the conductor die 15 is adjusted and the half face is adjusted to the side 23b of the cover 23. Then, after the end of the step #, as shown in Fig. 16 - is located in the same side of the cover 23, the inner side of the day, the end of the day, the end of the position, the side 23, the position of ==, the side is the cover The position of the other end of the two-body die 15 placed on the cover 23 is as shown in Fig. 7 to Fig. 18, and the control unit 7〇 starts to hold the sheet peeling step. The control unit 70 does not have the inside of the casing 21 of the stage 20 by the vacuum device 71 shown in FIG. 4, and the actuator 25 makes the first litr 32; the second receiver's control unit 7 Drive... the cup 326 is advanced toward the facing surface 22. The following drive unit 25 drives the operation of the slide mechanism. .浐8"I 17 No, the motor 381 of the drive unit 25 rotates according to the control unit 70. The cam 383 of the shaft of the motor 381 rotates. The cam 383 is in the shape of a circle, and the cam surface of the two sides of the cam surface _ the front end of the ^1 link like 383 cam surface will cause the roller 326c to face; the upper cam can shaft ~ ... the whole link to the tight body / rise after 'borrow It is connected to the side of the abutting surface 22 by a spring :: the rising link is pushed up and the whole of the piston 370 is tightened. After the entire living base is raised toward the close surface 22, the guide rail 33i on the side of the close surface 22 30 200913085 is also raised toward the close surface of the piston 37. When the guide is raised, the slider M2 mounted to slide along the upper surface of the guide rail 331 also rises toward the abutment surface 22. Next, the cover 23 attached to the slider is aligned with the rise of the slider 332, and the surface thereof protrudes upward from the contact surface 22. Since the spring 373 has a strength that is not bent by the force of pushing the cover 23 from the abutting surface 22, even if the cover 23 is pushed up from the abutting surface 22, the distance between the piston 370 and the first link 326 is hardly Will change. Therefore, the rise of the first link only causes the cover 23 to protrude from the abutting surface 22 without slipping. = The surface protrudes from the abutting surface. The cover 23 picks up the half-guided m-day grain 15 to be picked up. +7* 41 m On the other hand, 'the inner side end face 4 1 a of the stage of the opening 41 and the side surface 4 1 b are prepared by the β-grass· π; the 1 丨 pilot hole 364' is located at the female half of the guide The holding piece 12 near 15a is attracted and fixed to the mouthpiece by the rise of the cymbal 23, and is adhered to the semiconductor to be picked up: the holding piece 12 of the granule 15 is pulled obliquely downward toward the affixing surface 22, which is obliquely downward The pulling force in the direction causes a gap between the turns 15a of one of the semiconductor crystal grains 15 and the holding piece 12. Then, the air enters the gap, and the pressure difference between the above-mentioned frame 21 and the renting knife and the working milk/two causes the holding piece 12 to start to peel off from the semiconductor die-mountain end (5). The holding piece 12 is inserted into a peeling line which is slightly in the sliding direction from the semiconductor die μ k 1 5a. Then, the hunting unit 7 further rotates the motor 351, and the first link 326 and the piston 37 are further raised in the direction of the close contact 22 by the cam 383 rotating with the horse, and then protrude from the piston. The two sides of the flange claws collide with the stopper 32u provided in the frame 21. As a result, the pistons 37...321 "cannot continue to advance toward the abutment surface 22, and the projections of the cover 23 from the surface 31 of the 200913085 are also stopped. As shown in FIG. 18, the cam 383 is further rotated, and after the i-th link 326 is pushed up against the abutting surface 22, the spring 373 between the piston 37A and the first link 326 which cannot move toward the abutting surface 22 is located. The motor 381 and the cam 383 are initially compressed in the advancing and retracting direction of the abutting surface 22. After the elastic cyanine (7) is compressed, the piston 370 is prevented from coming into contact with each other, and the first link 326 is advanced to the abutting surface 22. Therefore, the pin 328 of the piston 37 is not lifted against the abutting surface 22: only the second link 329 (4) located in the engaging groove 326a of the first link 326 rises in the direction of the abutting surface 22. As a result, the second link milk was opened on the wire shaft with the pin 3 2 8 as the center. This rotation operation causes the engagement groove 329a at the other end of the second link 329 to move to the outside of the load port 7n + AL and the human mouth 20, and the slider 332 of the lock 33G located inside the card is fixed and connected to the slide. The piece 3 is moved to the outside of the stage 20. After the cover 23 is moved, the inner side surface 4la of the inner side of the stage of the cover 23 is separated, and the opening of the open platform is opened to form the same as the semiconductor day-to-day granule 15 to be picked up - the width of the opening (the afternoon conductor) The inside is vacuum-loaded; the frame portion U of the stage 2 is sucked into the holding piece 12 therein. ^ is a vacuum (4), so the opening opening portion 42 is slid out of the stage 2〇"23 The slide opening is maintained. The order opening is opened. Second, the cover 23 is sucked into the inside of the semiconductor die, and the holding piece 12 is sequentially moved toward the stage with the sliding of the cover 23. Further, the 'peel line 53 is opened. 42. The peeled holding piece is moved to the outside side. Then, the opening is attracted to the opening portion 4, but even if the holding piece 12 is made to cover the opening portion 42 by the holding piece 12, 32 200913085 because the 盍 23 is facing the holding piece 12 yet Since the peeling portion is slid, the suction of the pair of holding pieces 12 does not stop, and the entire holding piece 12 can be sequentially sucked by the opening portion 42 and peeled off, and the unpeeled portion is not generated. The rotation of the cam 383 causes the i-th link 26 to be pushed up, and the cover 23 is As explained in Fig. 4, the inner side surface 23a of the cover slid to the outer side of the semiconductor die 15 to be picked up, and the 钿15b is adjacent to the outer side of the stage 2, and the semiconductor die 15 is picked up. After the cam 383 is further rotated, the shaft 326b of the first link 326 is lowered by the % of the cam 383, and the cover 23 is closed to the carrier. * 23a contacts the opening of the opening 41 The position of the inner side surface 4u. As a result, the compression force of the spring 373 is opened. Thereafter, the & wheel 383 is further rotated, and after the shaft 326b is lowered, the piston 370 and the i-th link 326 and the second link 329 are lowered. The surface of the surface 23 is lowered to substantially the same position as the surface of the abutting surface 22, and the initial position is restored. The smear of the semiconductor is contacted by the sliding mechanism of the cover 23 by the sliding mechanism of the cover 23, by holding the sheet. When the one end 15a of the semiconductor crystal & granule 15 to be picked up is the end of the peeling of the holding piece 12, the cover is moved to the π to move the holding piece 2 to the opening portion 42. The effect of retaining the sheet 12 is more easily peeled off. [Simple description of the drawing] Fig. 1 shows the sticking 2 is an explanatory view showing a semiconductor die adhered to a holding piece. Fig. 3 is an explanatory view showing a configuration of a wafer holder. 33 200913085 FIG. 4 is an embodiment of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 5 is a perspective view showing a stage of a semiconductor die pick-up device according to an embodiment of the present invention. Fig. 6 is a view showing a cover of a semiconductor die pick-up device according to an embodiment of the present invention. (Explanation of the state before the sliding) Fig. 7 is an explanatory view showing a state in which the cover of the semiconductor die pick-up device according to the embodiment of the present invention starts to slide. Fig. 8 is an explanatory view showing a state in which the lid of the semiconductor chip pick-up device of the embodiment of the present invention continues to slide. Fig. 9 is an explanatory view showing a state in which the lid of the semiconductor chip pick-up device of the embodiment of the present invention is finished sliding. Fig. 10 is an explanatory view showing a state in which the semiconductor die is picked up by the semiconductor die pick-up device according to the embodiment of the present invention, and the cover is returned to the closed position. Figure 11 is an explanatory view showing the configuration of a semiconductor die pick-up device according to another embodiment of the present invention. Fig. 1 is an explanatory view showing a configuration of a semiconductor die picking farm according to another embodiment of the present invention. Fig. 1 is an explanatory view showing a state in which the disk of the semiconductor chip pickup device of the other embodiment of the present invention starts to slide. Fig. 14 is an explanatory view showing a state in which the lid of the semiconductor die pick-up device according to another embodiment of the present invention is finished sliding. Fig. 15 is an explanatory view showing a configuration of a semiconductor die attaching device 34 200913085 according to another embodiment of the present invention. Fig. 16 is an explanatory view showing the configuration of a semiconductor die pick-up device according to another embodiment of the present invention. Fig. 1 is an explanatory view showing a protruding operation of a cover of a semiconductor die pick-up device according to another embodiment of the present invention. Fig. 18 is an explanatory view showing a sliding operation of a cover of a semiconductor die pick-up device according to another embodiment of the present invention. [Description of main component symbols] I 0 : Wafer holder II · Wafer 12 : Holding sheet 13 : Ring 1 4 : Cutting gap 1 5 : Semiconductor crystal grain 1 5 a : - End 15b : Other end 1 6 : Expansion ring 1 7 : Ring press 18 : Collet 1 9 : Adsorption hole 20 : Stage 21 : Frame 22 : Adhering surface 23a ' 41a : Carrier inner end surface 35 200913085 23 : Cover 23b : Side 24 : Base portion 2 5 Drive unit 26, 326: first link 26a, 29a' 326a, 329a: engagement groove 27, 28, 30, 33, 327, 328, 330: pin '29, 329: second link 31, 231, 331: guide rails 32, 232, 332: slider 41: opening 4 1 b: side surface 42: opening opening portion 51: gap 53: peeling line 61: notch 63: notch hole 64, 364: suction hole 65: sealing member 66: Sealing press 70: control unit 71: vacuum device 7 2 • wafer holder horizontal direction driving unit 100: semiconductor die picking device 36 200913085 271: cam surface 272: parallel surface 273: curved surface 321a: stopper 326b: shaft 326c : Roller 3 70 : Piston 3 7 1 : Flange 3 73 : Spring 3 8 1 : Motor 383 : Cam

Claims (1)

200913085 X. Patent application scope: 1 · A semiconductor die pick-up device picks up a semiconductor die adhered to a holding piece by suction and holding of a collet, and is characterized in that: the carrier includes a semiconductor attached to the holding piece The surface on the opposite side of the crystal grain is in close contact with the surface; and the suction opening, δ is placed on the close surface, larger than the semiconductor die picked up; the cover is placed on the stage so that: a: surface vl sage &;, '典典 disaster, the clothing 甶 sliding close to the surface, close the suction open to take the half V body grain, so that the cover surface is close to the holding piece so that the picked semiconductor die does not close the cover of the suction opening The surface is protruded, and the cover is slid and the suction opening is sequentially opened in a state in which the semi-conducted smear and the ton of the granules are picked up by the collet, so that the holding piece is sequentially π 丨 匕 匕 open the suction opening, The holding sheets are sequentially peeled off from the picked semiconductor grains. 2. For example, in the patent application, the 1st yak V body die picking device, and the cover is disposed on the stage so as to slide along the abutting surface and protrude from the close surface to pick up the semiconductor die Slide the cover against the protruding surface. 3 _ as in the scope of the patent application, the semiconductor chip pick-up device that is in close contact with the surface of the cover of the holding sheet, which is aligned with the direction of one end 38 200913085 of the semiconductor die picked up when picking up the semiconductor die In the direction of one of the covers, in the direction of her, from the end side of the semiconductor raft that is picked up to the other end side, the side of the grain surface of the day is taken to make the 盍 move and sequentially open the suctioned semi-guided S private 4 ^ One end side of the 导体 仗 导体 导体 导体 吸引 吸引 吸引 吸引 吸引 吸引 之一 之一 之一 之一 之一 之一 之一 之一 之一 之一 之一 之一 之一 之一 之一 之一 之一 之一 之一 之一 之一 之一 之一 之一 之一 之一 之一 之一 之一 之一 之一 之一 之一 之一 之一 之一 之一The invention relates to any of the above-mentioned inventions, wherein the < 牛¥ attraction opening system and the picked semiconductor die extend substantially linearly with the inside of the stage toward the outside. , and the cover is a rectangular plate having a width equal to the width of the opening. 5. The semiconductor die pick-up device of claim 4, wherein the first cover is provided with a notch at a corner between the inner end surface of the stage and the side surface extending in the direction in which the opening extends. The semiconductor die pick-up device according to any one of the items 1 to 3, wherein the carrier has a suction hole on the contact surface around the suction opening, when the semiconductor die is taken. The cover is slid by attracting the edge of the semiconductor wafer around the picked-up semiconductor die. 7. The semiconductor die pick-up device of claim 4, wherein the sliding surface of the cover and the suction opening is provided with a sealing mechanism for restricting air from entering the inner side from the outer side of the stage. 8. The semiconductor die pick-up device of claim 1 or 3, wherein the 39 200913085 has a sliding mechanism for sliding the cover, and the sliding mechanism includes: a driving portion that is mounted in close proximity to the stage. The base portion on the opposite side of the surface drives the third link provided inside the stage to move in the direction in which the contact surface advances and retreats; the guide rail is disposed inside the stage and extends substantially parallel to the contact surface and extends toward the extension of the suction opening. The sliding member is connected with a cover and slidably mounted on the guide rail; and the 苐2 connecting rod is rotatably accommodated inside the sigma, and the sliding member is connected with the first link, and the first connecting rod is slanted to the kidney. The action of the advancing and retracting direction of the surface is in the direction of the guide rail; and the 1 link is directed toward the base portion, and the direction is driven to pick up the half V body die, and the first pressing surface is advanced by the driving portion 'Slide the cover along the tight side. Semiconductor wafer pick-up 9. According to the second or first garment of the patent application, there is a sliding mechanism for sliding the cover, and the sliding mechanism comprises: the driving portion is mounted in the opposite side to the mounting surface of the stage 々^ placed on the stage (4), the first link is in close contact with (4) W], the piston 'is placed inside the stage, and advances and retreats to the close surface; the stopper is placed in the direction of the stage; 1 The connecting rod and the piston are connected to the inside of the adjoining surface, and the piston is restrained from advancing and retreating, 200913085 is compressed when the piston abuts against the stopper; the guide rail is mounted on the piston, substantially parallel to the abutting surface And extending toward the extending direction of the suction bow opening; the sweat slider is connected with a cover and slidably mounted to the guide; and the second link is rotatably mounted to the piston to connect the slider to the first link. When the piston abuts against the stopper, the action of the f丨 link on the advancing and retracting direction of the abutting surface is converted into the action of the sliding member in the direction of the guide rail; when the semiconductor die is picked up, the third connecting rod is driven by the driving portion Retreat towards the close surface Protrudes from the adherence surface, along the surface of the slide close. A semiconductor wafer pick-up device according to claim 2 or 3, comprising: a sliding mechanism for sliding the cover, the sliding mechanism comprising: a driving portion mounted on a side opposite to the abutting surface of the stage The base portion moves the third link provided inside the stage on the facing surface; the 冋 drive rail is disposed inside the stage, and has an inclined surface that is inclined toward the close surface toward the suction; The sliding member is attached to the inclined surface of the guide with a cover and slidingly slidable; the second connector is rotatably swayed in the inside of the stage, and the slider is connected to the first link, The action of the first link pair in the forward and backward direction of the close contact surface is converted into the action of the slider in the direction of the inclined surface of the guide rail; when picking up the semiconductor die, the funer is driven by the catcher The first link is moved toward and from the facing surface of the 41, 2009, 305, and the cover is slid from the close surface u. Wherein, the semiconductor die pick-up, the inclined surface of the guide rail of the sliding mechanism, the surface extends from the inside of the stage along the suction opening, the cam surface, the parallel surface on the side of the close surface, continuous to the cam surface, parallel The second link that is inclined toward the facing surface and extends in the extending direction; and the second link that faces the suction opening has a shape in which the cam surface and the parallel surface of the curved surface are moved. For adhering to the guide surface 12, as in the scope of the patent application, to the conductor die picking device, which has: a half of the carrier of any one of the items drives the sling movement up and down; and the stage is held The wafer is held in the advance and retreat direction of the wafer holder with the horizontal direction of the driver die. The film is attached with a semi-conductive film. When the semiconductor die is picked up, the carrier is moved by the carrier: the cover is moved; The surface is in close contact with the holding piece, and the driving mechanism is configured to position the semiconductor die by the wafer holding device from the door driving portion so as not to be picked up to protrude from the surface of the cover closing the suction opening. 13 · A semiconductor The die device picks up and adheres to the method: the method of picking up the +-conductor die of the semiconductor die by the semiconductor die, the semiconductor die picking up the semiconductor carrier, which is held by the semiconductor carrier and containing the adhered particles The surface of the film is attached to the opposite side of the surface of the semi-conducting 俨 衍 紧 螫 螫 螫 螫 螫 螫 螫 螫 螫 螫 螫 螫 螫 螫 螫 螫 螫 螫 42 42 42 42 42 42 42 42 42 42 42 42 42 42 42 42 42 42 42 42 42 42 42 42 grain i, disposed on the stage such that the surface slides along the abutting surface and the switch attracts the opening; and the collet absorbs and holds the semiconductor die; and is characterized in that the positioning step is performed so that the cover surface is in close contact with the holding piece so that The semiconductor die picked up does not protrude from the surface of the cover that closes the suction opening; and the film peeling step is performed, and the cover is slid and the suction opening is sequentially opened in a state in which the picked-up semiconductor die is adsorbed by the collet, so that the holding piece is held The semiconductor wafer pick-up method according to claim 13 of the invention, wherein the semiconductor die pick-up device is covered, It is disposed on the stage so as to slide along the abutting surface and protrude from the abutting surface, and maintain the sheet peeling step, so that the surface of the cover protrudes from the abutting surface to slide it. 15·If the patent scope is 13 or The semiconductor chip picking method of item 14, wherein the positioning step is such that the direction of one end of the picked semiconductor die is such that the film is peeled in the direction of one end of the cover The step is to slide the cover from one end side of the semiconductor die to the other end side to open the opening. The suction piece is sequentially attracted from the end side of the picked semiconductor die to the opened attraction. The openings are sequentially peeled off from the semiconductor wafers picked up.