TW201001614A - Semiconductor die pickup apparatus and semiconductor die pickup method - Google Patents
Semiconductor die pickup apparatus and semiconductor die pickup method Download PDFInfo
- Publication number
- TW201001614A TW201001614A TW97136281A TW97136281A TW201001614A TW 201001614 A TW201001614 A TW 201001614A TW 97136281 A TW97136281 A TW 97136281A TW 97136281 A TW97136281 A TW 97136281A TW 201001614 A TW201001614 A TW 201001614A
- Authority
- TW
- Taiwan
- Prior art keywords
- cover
- semiconductor die
- stage
- semiconductor
- opening
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 194
- 238000000034 method Methods 0.000 title claims description 16
- 238000003825 pressing Methods 0.000 claims abstract description 6
- 239000013078 crystal Substances 0.000 claims description 39
- 230000002093 peripheral effect Effects 0.000 claims description 26
- 235000012431 wafers Nutrition 0.000 claims 3
- 239000004020 conductor Substances 0.000 description 16
- 230000000694 effects Effects 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 238000005520 cutting process Methods 0.000 description 5
- 239000008187 granular material Substances 0.000 description 5
- 241000283690 Bos taurus Species 0.000 description 4
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- 235000013353 coffee beverage Nutrition 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000010902 straw Substances 0.000 description 2
- 241000251468 Actinopterygii Species 0.000 description 1
- 240000000560 Citrus x paradisi Species 0.000 description 1
- 244000241257 Cucumis melo Species 0.000 description 1
- 235000015510 Cucumis melo subsp melo Nutrition 0.000 description 1
- 241000254158 Lampyridae Species 0.000 description 1
- 241001479548 Maranta leuconeura Species 0.000 description 1
- 241001494479 Pecora Species 0.000 description 1
- 241001354471 Pseudobahia Species 0.000 description 1
- FJJCIZWZNKZHII-UHFFFAOYSA-N [4,6-bis(cyanoamino)-1,3,5-triazin-2-yl]cyanamide Chemical compound N#CNC1=NC(NC#N)=NC(NC#N)=N1 FJJCIZWZNKZHII-UHFFFAOYSA-N 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 239000008280 blood Substances 0.000 description 1
- 210000004369 blood Anatomy 0.000 description 1
- 244000309464 bull Species 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 235000015114 espresso Nutrition 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 210000003734 kidney Anatomy 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
- H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
- H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008169897A JP4215818B1 (ja) | 2008-06-30 | 2008-06-30 | 半導体ダイのピックアップ装置及びピックアップ方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201001614A true TW201001614A (en) | 2010-01-01 |
| TWI374513B TWI374513B (OSRAM) | 2012-10-11 |
Family
ID=40361329
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW97136281A TW201001614A (en) | 2008-06-30 | 2008-09-22 | Semiconductor die pickup apparatus and semiconductor die pickup method |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4215818B1 (OSRAM) |
| TW (1) | TW201001614A (OSRAM) |
| WO (1) | WO2010001497A1 (OSRAM) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI475606B (zh) * | 2011-02-28 | 2015-03-01 | 晟碟半導體（上海）有限公司 | 非均勻真空分佈晶粒附著尖端 |
| TWI508220B (zh) * | 2012-08-31 | 2015-11-11 | Semes Co Ltd | 晶粒射出裝置 |
| TWI560764B (en) * | 2014-02-24 | 2016-12-01 | Shinkawa Kk | Pick up device and pick up method of semiconductor die |
| CN115083949A (zh) * | 2021-03-15 | 2022-09-20 | 万润科技股份有限公司 | 散热胶垫贴合方法及设备 |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5284040B2 (ja) * | 2008-11-04 | 2013-09-11 | キヤノンマシナリー株式会社 | チップ剥離方法、チップ剥離装置、および半導体装置製造方法 |
| JP5184303B2 (ja) * | 2008-11-04 | 2013-04-17 | キヤノンマシナリー株式会社 | チップ剥離方法、チップ剥離装置、および半導体装置製造方法 |
| JP4397429B1 (ja) | 2009-03-05 | 2010-01-13 | 株式会社新川 | 半導体ダイのピックアップ装置及びピックアップ方法 |
| JP4927979B2 (ja) * | 2010-09-28 | 2012-05-09 | 株式会社新川 | 半導体ダイのピックアップ装置及びその装置を用いた半導体ダイのピックアップ方法 |
| JP2013065712A (ja) * | 2011-09-16 | 2013-04-11 | Hitachi High-Tech Instruments Co Ltd | ダイボンダ及びボンディング方法 |
| JP2013065731A (ja) * | 2011-09-19 | 2013-04-11 | Hitachi High-Tech Instruments Co Ltd | ダイボンダ及びボンディング方法 |
| KR102220346B1 (ko) * | 2019-09-06 | 2021-02-25 | 세메스 주식회사 | 다이 픽업 모듈 및 이를 포함하는 다이 본딩 장치 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003224088A (ja) * | 2002-01-29 | 2003-08-08 | Nec Electronics Corp | 半導体チップピックアップ装置 |
| JP2003264203A (ja) * | 2002-03-11 | 2003-09-19 | Hitachi Ltd | 半導体装置の製造方法 |
| JP4457715B2 (ja) * | 2003-04-10 | 2010-04-28 | パナソニック株式会社 | チップのピックアップ装置およびピックアップ方法 |
| JP3999744B2 (ja) * | 2004-01-05 | 2007-10-31 | 芝浦メカトロニクス株式会社 | 半導体チップのピックアップ装置 |
| US7240422B2 (en) * | 2004-05-11 | 2007-07-10 | Asm Assembly Automation Ltd. | Apparatus for semiconductor chip detachment |
-
2008
- 2008-06-30 JP JP2008169897A patent/JP4215818B1/ja not_active Expired - Fee Related
- 2008-08-13 WO PCT/JP2008/064516 patent/WO2010001497A1/ja not_active Ceased
- 2008-09-22 TW TW97136281A patent/TW201001614A/zh not_active IP Right Cessation
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI475606B (zh) * | 2011-02-28 | 2015-03-01 | 晟碟半導體（上海）有限公司 | 非均勻真空分佈晶粒附著尖端 |
| US9038264B2 (en) | 2011-02-28 | 2015-05-26 | Sandisk Semiconductor (Shanghai) Co., Ltd. | Non-uniform vacuum profile die attach tip |
| TWI508220B (zh) * | 2012-08-31 | 2015-11-11 | Semes Co Ltd | 晶粒射出裝置 |
| TWI560764B (en) * | 2014-02-24 | 2016-12-01 | Shinkawa Kk | Pick up device and pick up method of semiconductor die |
| CN115083949A (zh) * | 2021-03-15 | 2022-09-20 | 万润科技股份有限公司 | 散热胶垫贴合方法及设备 |
| CN115083949B (zh) * | 2021-03-15 | 2025-07-22 | 万润科技股份有限公司 | 散热胶垫贴合方法及设备 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2010010519A (ja) | 2010-01-14 |
| JP4215818B1 (ja) | 2009-01-28 |
| WO2010001497A1 (ja) | 2010-01-07 |
| TWI374513B (OSRAM) | 2012-10-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW201001614A (en) | Semiconductor die pickup apparatus and semiconductor die pickup method | |
| TWI381985B (zh) | Pickup device for semiconductor grain and picking method | |
| TW200913085A (en) | The pick-up equipment of semiconductor wafer and pick-up method | |
| CN103155125B (zh) | 半导体芯片拾取装置及使用该装置的半导体芯片拾取方法 | |
| TWI257651B (en) | Peeling device for chip detachment | |
| JP2009064938A (ja) | 半導体ダイのピックアップ装置及びピックアップ方法 | |
| US20140251546A1 (en) | Peeling device, peeling system and peeling method | |
| EP1617463A3 (en) | Film peeling method and film peeling device | |
| WO2015125385A1 (ja) | 半導体ダイのピックアップ装置及びピックアップ方法 | |
| TWI353957B (OSRAM) | ||
| US20130039733A1 (en) | Pick and place tape release for thin semiconductor dies | |
| TWI234826B (en) | Apparatus for picking up semiconductor chips and method of picking up semiconductor chips | |
| JP5227117B2 (ja) | 半導体チップのピックアップ装置及びピックアップ方法 | |
| JP2009099865A (ja) | 保護テープの除去装置と除去方法 | |
| WO2008053673A1 (fr) | Dispositif de collecte de puce à semiconducteur | |
| JPWO2007026497A1 (ja) | 半導体チップのピックアップ装置及びピックアップ方法 | |
| JP2007103826A (ja) | 半導体チップのピックアップ装置 | |
| TW201027606A (en) | Chip-stripping method, chip-stripping device and fabricating method of semiconductor device | |
| JP5159649B2 (ja) | シート貼付装置および貼付方法 | |
| JP2008016680A (ja) | 半導体チップのピックアップ装置及びピックアップ方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |