TWI374513B - - Google Patents

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Publication number
TWI374513B
TWI374513B TW97136281A TW97136281A TWI374513B TW I374513 B TWI374513 B TW I374513B TW 97136281 A TW97136281 A TW 97136281A TW 97136281 A TW97136281 A TW 97136281A TW I374513 B TWI374513 B TW I374513B
Authority
TW
Taiwan
Prior art keywords
cover
semiconductor die
stage
semiconductor
suction opening
Prior art date
Application number
TW97136281A
Other languages
English (en)
Chinese (zh)
Other versions
TW201001614A (en
Inventor
Okito Umehara
Shinichi Sasaki
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of TW201001614A publication Critical patent/TW201001614A/zh
Application granted granted Critical
Publication of TWI374513B publication Critical patent/TWI374513B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
TW97136281A 2008-06-30 2008-09-22 Semiconductor die pickup apparatus and semiconductor die pickup method TW201001614A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008169897A JP4215818B1 (ja) 2008-06-30 2008-06-30 半導体ダイのピックアップ装置及びピックアップ方法

Publications (2)

Publication Number Publication Date
TW201001614A TW201001614A (en) 2010-01-01
TWI374513B true TWI374513B (OSRAM) 2012-10-11

Family

ID=40361329

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97136281A TW201001614A (en) 2008-06-30 2008-09-22 Semiconductor die pickup apparatus and semiconductor die pickup method

Country Status (3)

Country Link
JP (1) JP4215818B1 (OSRAM)
TW (1) TW201001614A (OSRAM)
WO (1) WO2010001497A1 (OSRAM)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5284040B2 (ja) * 2008-11-04 2013-09-11 キヤノンマシナリー株式会社 チップ剥離方法、チップ剥離装置、および半導体装置製造方法
JP5184303B2 (ja) * 2008-11-04 2013-04-17 キヤノンマシナリー株式会社 チップ剥離方法、チップ剥離装置、および半導体装置製造方法
JP4397429B1 (ja) 2009-03-05 2010-01-13 株式会社新川 半導体ダイのピックアップ装置及びピックアップ方法
JP4927979B2 (ja) * 2010-09-28 2012-05-09 株式会社新川 半導体ダイのピックアップ装置及びその装置を用いた半導体ダイのピックアップ方法
KR20140124871A (ko) 2011-02-28 2014-10-27 샌디스크 세미컨덕터 (상하이) 컴퍼니, 리미티드 비균일 진공 프로파일 다이 부착 팁
JP2013065712A (ja) * 2011-09-16 2013-04-11 Hitachi High-Tech Instruments Co Ltd ダイボンダ及びボンディング方法
JP2013065731A (ja) * 2011-09-19 2013-04-11 Hitachi High-Tech Instruments Co Ltd ダイボンダ及びボンディング方法
KR200468690Y1 (ko) * 2012-08-31 2013-08-29 세메스 주식회사 다이 이젝팅 장치
JP6349496B2 (ja) * 2014-02-24 2018-07-04 株式会社新川 半導体ダイのピックアップ装置及びピックアップ方法
KR102220346B1 (ko) * 2019-09-06 2021-02-25 세메스 주식회사 다이 픽업 모듈 및 이를 포함하는 다이 본딩 장치
TWI767611B (zh) * 2021-03-15 2022-06-11 萬潤科技股份有限公司 散熱膠墊貼合方法及設備

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003224088A (ja) * 2002-01-29 2003-08-08 Nec Electronics Corp 半導体チップピックアップ装置
JP2003264203A (ja) * 2002-03-11 2003-09-19 Hitachi Ltd 半導体装置の製造方法
JP4457715B2 (ja) * 2003-04-10 2010-04-28 パナソニック株式会社 チップのピックアップ装置およびピックアップ方法
JP3999744B2 (ja) * 2004-01-05 2007-10-31 芝浦メカトロニクス株式会社 半導体チップのピックアップ装置
US7240422B2 (en) * 2004-05-11 2007-07-10 Asm Assembly Automation Ltd. Apparatus for semiconductor chip detachment

Also Published As

Publication number Publication date
JP2010010519A (ja) 2010-01-14
JP4215818B1 (ja) 2009-01-28
TW201001614A (en) 2010-01-01
WO2010001497A1 (ja) 2010-01-07

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees