TW200936251A - Coating machine and fixing method of a substrate - Google Patents

Abstract

A coating device capable of setting the attraction of adsorption substrates being able to restrain the working cycle of the coating device in long-term when does not generate uneven coating and a method of maintaining the substrate. The coating device comprises: a substrate maintaining device for generating attraction in attraction hole formed on surface of the worktable and adsorbing and maintaining the substrate on the surface of the worktable and a coating unit for moving relative to the substrate and ejecting the coating solution; the substrate maintaining device comprises a pressure adjusting part for adjusting the pressure attached to the substrate to adjust the attraction to the substrate; the pressure adjusting part can be adjusted into initial pressure and maintaining pressure; the initial pressure adsorbs the substrate just loaded on the surface of the worktable; the maintaining pressure maintains the state of the substrate maintaining in the surface of the worktable after the initial pressure adsorbing the substrate; the maintaining pressure is set to be less than the initial pressure.

Description

200936251 VI. Description of the Invention: [Technical Field] The present invention relates to a coating machine for coating a coating liquid on a substrate (3111^1; 1*31^) and a method for holding the same. [Prior Art] A flat panel display such as a liquid crystal display or a plasma display uses a resist liquid coated on a glass substrate. (referred to as coated substrate). The coated substrate is formed by a coating device that uniformly coats the photoresist. The coating device has a stage on which a substrate is carried, a coating unit that discharges a photoresist, and the coating unit is moved while discharging the photoresist from the coating unit. A photoresist film having a uniform thickness is formed on the substrate. In such a coating device, a means for holding a substrate on a platform is generally known to have an adsorption hole formed in a platform, and a negative pressure is generated in the adsorption hole to adsorb and hold the substrate on the platform ( For example, refer to Patent Document 1). Specifically, the suction pressure is connected to the negative pressure generating means, and the negative pressure generating means is set at a low pressure (high vacuum side) to generate a negative pressure in the adsorption hole. Further, when the substrate is supplied to the stage, the high-pressure exhaust is performed by the negative pressure generating means to rapidly generate the negative pressure in the adsorption hole, so that the adsorption time required for adsorbing the substrate on the stage is shortened, and the cycle time of the coating device is sought. (cyc 1 etime ) is improved. [Patent Document 1] Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. The negative pressure (the high vacuum side pressure is applied in a state in which such a large suction force occurs, there is a problem that coating unevenness occurs in the substrate portion corresponding to the adsorption hole. Therefore, if it is set ( When the pressure is set to the atmospheric pressure side, the negative pressure generated by the adsorption hole is weakened, so that the high pressure is not reduced in the negative pressure generating device, and the set pressure is generated in the adsorption hole for a long time. That is, the substrate is adsorbed to the platform. The time required is prolonged, and as a result, there is a problem that the cycle time of the coating device is prolonged. The present invention has been made in view of the above problems, and an object thereof is to provide a coating device and a substrate holding method thereof, even if it is set The attraction force of the adsorption substrate is such that the coating unevenness does not occur, and the cycle time of the coating device can be prevented from being prolonged. In order to solve the above problems, the coating device of the present invention comprises a platform for carrying the substrate; a substrate holding means for causing attraction to be formed on the surface of the platform, and holding the substrate on the surface of the platform; and moving relative to the substrate held on the surface of the platform a coating unit for discharging a coating liquid, wherein the substrate holding means has a pressure adjusting portion that can adjust an attractive force to the substrate, and the pressure adjusting portion can be adjusted to adsorb the surface just after being carried on the surface of the platform. The initial pressure of the substrate is maintained at a state in which the substrate is held by the surface of the table 4 200936251 after the substrate is adsorbed by the initial pressure, and the holding pressure is set to be smaller than the initial pressure according to the coating device. In the case of adsorbing the substrate carried on the platform, a negative pressure (a pressure smaller than atmospheric pressure) is generated in the suction hole and is rapidly adsorbed, and after the pressure reaches the initial pressure, the pressure adjustment portion is adjusted to the initial pressure. The small holding pressure can keep the adsorbed substrate on the platform. Therefore, in the case where the coating liquid is coated on the substrate by the coating unit, Since the cloth is placed on the substrate held by the pressure-holding adsorption which is smaller than the initial pressure, it is possible to suppress the coating of the portion corresponding to the suction hole as compared with the case where the film is applied by the initial stage of adsorption of the substrate supported on the stage. Further, since the initial pressure is generated at a high speed when the substrate is adsorbed by holding the substrate on the stage by holding the substrate at a lower pressure than the initial pressure, the problem of prolonging the cycle time of the coating device can be eliminated. Further, the substrate holding means may include: an attraction generating device that generates suction force in the suction hole; and a pipe that connects and connects the suction force generating device and the suction hole, and each of the pressure adjusting blades includes: A piping path that is adjusted to the initial pressure; and a piping path that adjusts C) to maintain the pressure. According to this configuration, the generation of the initial pressure and the generation of the holding pressure in the suction can be easily switched only by switching the piping path. Therefore, the switching responsiveness of the initial stage and the holding pressure can be improved. Further, it is configured such that a pressure gauge is attached to the pipe adjacent to the suction hole, and the holding pressure is set when the pressure gauge reaches the initial pressure. According to the configuration, the pressure gauge is placed in the vicinity of the suction hole of the pipe, and the singularity of the splicing portion of the splicing section is applied to the hole. The substrate holding substrate is fixed to the substrate, and the suction of the substrate is adsorbed to a holding pressure which is adjusted to be higher than the initial pressure of the plate at the initial pressure of the plate according to the base attached to the platform. The pre-warning problem arises. [The work of the invention is based on the above-described platform means for attracting the suction force of the substrate, and the substrate for holding the coating liquid while the protective liquid is held, and having a pressure adjusting portion capable of adjusting the attractive force, the substrate on the surface of the stage When the initial pressure is small and the holding pressure is small and the substrate holding plate of the coating device is held, the negative pressure production is brought to the initial pressure, and the front holding pressure is compared with the conventional coating. Uneven. Further, since the substrate is placed on the stage, the pressure of the substrate can be released, so that the coating device and the substrate are attracted to each other, and the suction portion of the substrate is not affected. The pressure loss is preferably measured in the suction hole. In the above-mentioned problem, the substrate holding method of the coating device of the substrate holding unit p of the coating device of the present invention is a coating unit that carries the surface of the substrate and adsorbs and holds the substrate on the surface of the platform. The pressure adjustment applied to the substrate holds the substrate after the pressure adjustment portion reaches the predetermined initial pressure. The method of 'transferring the pressure-adjusting portion to the pressure-adjusting portion and adjusting the pressure-adjusted portion to be adsorbed on the base of the platform can suppress the attraction even if it is smaller than the initial pressure. In the case where the cycle time is long, the cycle time of the coating device can be prolonged even if the degree is set. [Embodiment] The embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a perspective view schematically showing an embodiment of the present invention. Fig. 2 is a view showing a piping system of the coating device in the vicinity of the leg portion of the coating unit. As shown in FIG. 3, the coating device is a liquid substrate 2 formed by forming a coating film of a chemical liquid or a sputum (hereinafter referred to as a coating liquid) on a substrate raft; 1 〇之平 a 9〗 'With:

<Ten. 21, and a coating unit 3〇 configured to move in a specific direction. σ 1 is movable. In the following description, the coating unit 3 〇 is moved in the X-axis direction by a direction orthogonal to the X-axis direction on the horizontal plane, and is orthogonal to both the X-axis and the Υ-axis direction. The sleeves are lined up. The axial direction is advanced. The base 2 is provided with a flat opening 21 at its central portion. The platform 91 is the substrate 10 on which the loading is carried. Further, the substrate holding means 40 is disposed on the flat plate 13 21, and the substrate holding means 4 holds the substrate 10 while the substrate holding means 4 is held. With

The substrate 10 can be adsorbed and held at a flat A by causing attraction to occur in a plurality of suction holes 21a formed on the surface of the flat AQ. 0 21 surface. In other words, the substrate holding means 40 has a vacuum pump 81 (the attraction generating device of the present invention), and the vacuum pump 8 (see FIG. 3) is connected to the piping 5 of the suction hole 2U. The vacuum pump operates to generate a negative pressure (pressure less than the atmospheric pressure) via the pipe 50 to the suction hole 200936251 2 1 a ' to hold the substrate i 〇. Moreover, the substrate holding means 40 has the pressure adjusting portion 41. In the present embodiment, the pressure adjusting portion 41 can be adjusted to the initial pressure and the holding pressure. Here, the initial pressure refers to the case where the substrate i 刚 immediately after being carried on the surface of the stage 21 is adsorbed on the surface of the stage 21. The pressure 'high-speed exhaust by the vacuum pump 81' rapidly generates a negative pressure in the suction hole 21a and instantaneously adsorbs the pressure for the substrate 10. Further, the holding pressure means that after the initial pressure adsorption of the substrate 1 The pressing force for maintaining the state in which the substrate 1 is held on the surface of the stage 2 is a pressure that is smaller than the initial pressure and is not displaced by the substrate i 吸附 adsorbed on the stage 2 i. The pressure adjusting unit 41 is a pipe that is adjusted to the initial pressure ( The main pipe 51) and the pipe (the sub pipe 5 2) adjusted to maintain the pressure are constituted by respective pipe paths. Specifically, as shown in FIG. 3, the main pipe 51 adjusted to the initial pressure is provided with a main valve (mainvalve). 51a, the vacuum pump 81 and the suction hole 21a can be connected or shielded by the main valve 51a. Therefore, the vacuum recording 81 is operated in a state where the main valve 51a is fully opened to generate an initial pressure in the suction hole 21a. According to this, the initial pressure can be applied to the substrate 10 carried on the surface of the stage 21 and adsorbed. Further, the sub-pipe 5 2 adjusted to maintain the pressure is provided with a sub valve 52a and a sub-regulator (sub). The sub-valve 52a is the same as the main valve 51a. By the switch, the sub-valve 5 2 a, the second sub-pipe 52 communicates or shields the vacuum pump 81 from the suction hole 21 a. Moreover, the sub-regulator 5 2b In the present embodiment, the set pressure of the 俾 sub regulator 52b is set to the holding pressure. Therefore, the vacuum pump 8 1 is operated by fully opening the 200936251 sub valve 5 2 a. The pressure is controlled by the sub-regulator 52b, so it is sucking When the vacuum pump 81 is operated in a state where the main valve 51a and the sub-valve 52a are fully opened, the initial pressure is generated in the suction hole 21a by being sucked through the main pipe 51. A pressure gauge 53 is disposed in the pipe 50. The pressure gauge 53 is a portion of the pipe 50 in the vicinity of the suction hole 2 1 a disposed directly below the platform 2 1 in the measurement pipe 50. According to this, it is possible to suppress the influence of pressure loss or the like, and it is possible to accurately measure the pressure state of the suction hole 2丨a. Further, the substrate 21 is provided with a substrate elevating mechanism for moving the substrate 10 up and down. Specifically, a plurality of pin holes are formed on the surface of the stage 21, and a lift pin (not shown) capable of lifting and lowering in the z-axis direction is embedded in the pin hole. That is, if the substrate 10 is carried in a state where the ejector pin is protruded from the surface of the stage 21, the tip end portion of the ejector pin abuts against the substrate 10 and can hold the substrate 1〇, so that the ejector pin is lowered. The substrate 10 is carried on the surface of the platform 21 by being housed in the pin hole. Further, the base portion of the ejector pin can be held by the tip end portion of the plurality of ejector pins by abutting the tip end portion of the ejector lock in a state where the substrate is loaded on the surface of the stage 21, and the tip end portion of the ejector lock abuts against the base 1G. At a predetermined height position. According to the contact portion with the substrate 10, the contact portion can be suppressed as much as possible, and the substrate 10 can be smoothly replaced without being damaged. The coating unit 30 is coated with a coating liquid on the substrate 1 . The coating early 30 has a leg portion 31 coupled to the base 2 and an M 1 .s slit nozzle portion 34 extending in the Y-axis direction as shown in FIGS. 1 and 9 α - 圏2. In the state of crossing the base 2 in the γ red + and 1 sleeve directions, the X-axis direction can be moved, and the end portion of the 200936251 end portion is provided with an extension 31 which is slidably attached to a linear motor (1 inear mount). Specifically, 'the rail 22 in the X-axis direction in the γ-axis direction of the base 2, and the foot 22 in the foot. Moreover, the drive is controlled at the foot 31 by m〇t〇r) 33'. The linear motor 33 moves the coating unit 3A in the X-axis direction and can be stopped at an arbitrary position. The slit nozzle portion 34 to which the coating liquid is applied is attached to the leg portion 31 of the coating unit 3A as shown in Fig. 2 . Specifically, the rail portion 37 extending in the z-axis direction and the slider (sHder) 35 sliding along the rail 37 are disposed in the chat portion 31, and the slider 35 and the slit nozzle portion 34 are link. Further, the slider "" is attached with a ball screw (1) 311 screw) driven by the word motor 36 (refer to FIG. 4), and the servo motor 36 is driven to move the slider 35 in the Z-axis direction, and It can be stopped at any position. That is, the slit nozzle portion 34 is supported by the substrate 1 held by the stage 21, and is attached and detached. The slit nozzle portion 34 is a coating liquid. A coating film is formed on the substrate 1A. The slit nozzle portion 34 is disposed so as to have a columnar structure that extends in a unidirectional shape and is substantially orthogonal to the running direction of the coating unit 30. In the slit nozzle portion 34, the coating liquid supplied to the slit nozzle portion 34, which is formed by a slit nozzle 34a' extending in the longitudinal direction, is discharged by the slit nozzle 34a in the same length direction. Therefore, the coating unit 3 is moved in the X-axis direction while the coating liquid is discharged by the slit nozzle 34a, and a coating having a constant thickness is formed on the substrate 1A in the longitudinal direction of the slit nozzle 34a. Cloth film. Next, the composition of the control system of the above coating device is used. Figure 4 is a block diagram showing the control system arranged in the coating device of the coating device. As shown in Figure 4, the coating device is equipped with the above control A control device 90 for driving various units. The control device 90 includes a control main unit 91, a drive control unit 92, a pressure control unit 93, an input/output device control unit 94, and an external device control unit 9.5. The control main unit 91 A well-known CPU that performs logical operations; R〇jj (Read-Only Memory) that recalls various programs of the CPU in advance; and memorizes various kinds of data at a time during device operation (data) RAM (Random Access Memory); HDD (Hard Disk: Hard Disk) of various kinds of data such as a program or an OS (Ope rating system) that memorizes production programs, etc. The control main unit 91 includes a main control unit 91a, a determination unit 91b, and a storage unit 91c. The main control unit 91a is configured to perform a series of coating operations in accordance with a program stored in advance, and is driven and controlled by the drive control unit 92. The drive unit of the servo motor 36 and the linear motor 33 of the unit. The 〇 determination unit 91b determines whether or not the pressure state of the suction force is appropriate when the substrate 10 is adsorbed and held. That is, it is determined by the pressure gauge 53. Specifically, the detected pressure is stored in the memory unit 9 ic, which will be described later, and it is determined whether or not the detected pressure is the initial pressure. When the initial pressure is reached, it is transmitted through the following. The pressure control unit 93 controls the 俾 main valve 51 a to be in a closed state. According to this, the pipe 50 that communicates with the suction pump 2 1 a and the vacuum pump 8 1 is switched only to the sub-pipe 5 2, so that the pressure generated in the suction hole 21 a is adjusted to the hold set by the sub-regulator 52 b 200936251 . Further, when the pressure gauge 53 does not reach the initial pressure, the state of the main valve 5ia and the sub-valve 52a is maintained in a state of being intact. § The memory unit 91c is for storing various materials' and storing the calculation results at a time. Specifically, the memory has information such as initial pressure and holding pressure. The drive control unit 92 drives and controls the linear motor 33, the servo motor 36, and the like in accordance with a control signal from the control main unit 9A. Specifically, the movement of the coating unit 3 及 and the lifting operation of the slit nozzle portion 34 are driven and controlled by the control coil motor 3 3 and the servo motor 36.

G

The pressure control unit 93 detects the pressure in the pipe 50, and controls the pressure generated in the suction hole 21a based on the control signal from the control body unit 91.

force. Specifically, the pressure in the pipe 50 near the suction hole 2U is detected by a signal from the pressure gauge 53. When the initial pressure is displayed by the pressure gauge 53, and a signal for switching to the holding pressure is transmitted from the control main body portion 91, the main valve 5U is turned from the open state to the closed state by controlling the driving of the main valve 51a. The inside of the control pipe 50 (correctly in the vicinity of the suction hole 2U) becomes a holding pressure. The input/output device control unit 94 is a control input/output device such as a keyboard (keyb) 83, a touch panel 82, and the like. Further, the body 2 can be set by the keyboard 83 and the touch panel 82, and the setting of the initial waste "holding pressure" can be appropriately performed. Further, when the initial:: is adjusted to the holding pressure, it should be adjusted in the pipe 50 but does not become the holding pressure. The warning display is displayed on the touch panel and the operator is urged to control the body portion 91. The control external device control unit 95 performs drive control of the external device based on the signal from 200936251. In the present embodiment, the vacuum pump '81 is connected, and by driving the vacuum pump 81, a negative pressure is generated in the suction hole 21a. Next, the operation in the coating apparatus will be described with reference to the flowchart shown in Fig. 5 . First, the loading of the substrate 1 is performed in step S1. Specifically, in a state where a plurality of ejector pins are protruded from the surface of the stage 21, the substrate 1 is placed on the tip end portion of the ejector pin by a robot hand (not shown).基板 Next, the substrate 10 is carried on the stage 21 in step S2. Specifically, the ejector pin is lowered and the substrate 10 is carried on the surface of the stage 21 by the state in which the substrate 1 is carried at the tip end portion of the ejector pin. At this time, the substrate 1 is positioned at a predetermined position by a positioning means (not shown). Then, the substrate 10 is held on the stage 21 by steps S3 to S5. First, the substrate adsorption operation is performed in step S3, and the substrate ITO is adsorbed on the flat opening 1. Specifically, the vacuum pump 81 is driven and high-speed in a state where the main chamber 5 ia and the sub- 52a are opened. Exhaust, the attraction is generated in the suction hole 21a. In other words, the air in the inside of the pipe 5 is evacuated by the main pipe 51 by the vacuum pump, and the negative pressure is generated at the center of the suction hole m, and the substrate 1 is instantaneously adsorbed on the stage 21. And 'Pipe 5. Whether or not the internal pressure reaches the initial pressure is judged (step S4). Specifically, whether or not the pressure gauge 53 reaches the initial pressure is judged, and proceeds to the direction of NO in the case of the period pressure: 'the substrate adsorption operation continues to be advanced, and proceeds to YES, and the pressure gauge 53 reaches the initial pressure 200936251. The suction holding operation of the direction 'substrate is performed (step S5) o Specifically, the main valve 51a is switched from the open state to the closed state. In other words, the vacuum pump 81 and the suction hole 21a are blocked. The piping path of the suction hole 213 and the vacuum pump 81 is only the sub-pipe 52, and the pressure in the suction hole 21a is adjusted to the holding pressure set by the sub-regulator 52b. Therefore, the substrate crucible is held on the stage 21 by maintaining pressure adsorption. The pick-up is performed in step S6. In other words, the coating liquid is discharged while the coating unit 30 is traveling in a specific direction, and the ruthenium coating film is formed on the surface of the substrate 1 . Then, in step S7, the removal of the substrate 10 is performed, that is, after the coating film is formed on the surface of the substrate 1 by the coating operation in S6, the vacuum pump 81 is stopped, and the pressure in the suction hole 21a is returned. To atmospheric pressure. Further, by raising the ejector pin, the substrate 1 is held by the tip end portion of the ejector pin, and the delivery of the substrate 10 is performed on a robot (not shown), and the substrate 10 is discharged from the surface of the stage 21. According to the coating apparatus and the substrate holding method thereof, the negative pressure is generated in the suction hole 2ia and rapidly adsorbed when the substrate 10 is loaded on the stage 21, and the pressure of the adsorption substrate 10 reaches the initial stage. After the pressing, the pressure adjusting portion 41 is adjusted to a holding pressure smaller than the initial pressure, whereby the adsorbed substrate 10 can be held on the stage 21. Therefore, 'the coating liquid 30 is applied onto the substrate 10 by the coating unit 30' can be applied on the substrate 1Q held by the holding pressure holding smaller than the initial pressure, so that it is adsorbed as in the past. When the coating is carried out by the initial pressing of the substrate 10 placed on the stage 21, it is possible to suppress coating unevenness in the portion corresponding to the suction holes 21 &

Q [Illustration of the drawings] is a perspective view showing a coating apparatus relating to the embodiment of the present invention. 200936251 Further, even if it is kept at a lower level than the initial pressure (4), it is purely 1 〇 in the flat opening 21 When the substrate 1Q is adsorbed, the initial stage is generated at a high speed, so that the cycle time of the coating device can be released for a long period of time. In addition, in the above-described embodiment, an example is described in which the main pipe 51 and the brake s 5 2 are disposed, and the piping paths of the main pipe 51 and the sub pipe 5 2 are switched, and the initial house and the holding are switched. However, it is also possible to control only the adjustment of the regulator by switching the initial period and the holding pressure by the piping 50 having the main valve 5la and the ribs-plus-β-/. According to this configuration, compared with the above-described embodiment, (4) the initial pressure and the holding pressure are required to be connected to each other. Therefore, the space of the entire coating apparatus is shown in Fig. 2, which is a schematic view showing the vicinity of the foot of the coating unit. Fig. 5 is a block diagram showing a control system of the above coating apparatus. Fig. 5 is a flow chart showing the operation of the above coating apparatus. [Description of main components] 2: Abutment 1 0 : Substrate 21: Platform 200936251 21a: suction hole 2 2, 3 7 : rail 3 0 : coating unit 3 1 : leg 3 3 : linear motor 34: slit nozzle portion 3 4a: slit nozzle 3 5 : Slider 0 36: Servo motor 40: Substrate holding means 41: Pressure regulating unit 5 0 : Piping 5 1 : Main piping 5 1 a : Main valve 52 : Sub-pipe 5 2 a : Sub-valve Q 5 2b ·. 53: pressure gauge 81: vacuum pump 8 2 : touch panel 83 : keyboard 90 : control device 91 : control main body portion 91 a : main control portion 16 200936251 9 1 b : determination portion 9 1 c : memory portion 9 2 : drive Control unit 9 3 : Pressure control unit 94 : Input/output device control unit 9 5 : External device control unit

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Claims (1)

200936251. VII. Patent application scope: 1. A coating device comprising: a platform for carrying a substrate; a substrate holding means for attracting the suction substrate formed on the surface of the platform to be held on the surface of the platform; a coating unit for discharging a coating liquid on a substrate opposite to a surface of the platform, wherein the substrate holding means has a pressure adjusting portion that can adjust the force of the pressure, and the pressure adjusting portion can be adjusted to adsorb the surface of the platform The initial pressure of the substrate and the holding pressure in a state in which the substrate is held on the surface of the stage by the initial attachment are set to be smaller than the initial pressure. 2. The coating device of claim 1, wherein the holding means has: attracting an attraction force to the suction hole; and connecting and connecting the attraction generating device and the tube, the pressure regulating portions respectively The method includes: adjusting the initial ◎ diameter; and adjusting the piping path to the holding pressure. 3. Coating according to item 1 or item 2 of the patent application range is adjusted to the holding pressure in the case where the pipe connected to the suction hole is provided with a pressure gauge reaching the initial pressure. 4. A substrate holding method for a coating device, which is a substrate holding method including a coating device: a platform for supporting a substrate; and a substrate for holding and holding the substrate on a surface of the platform and holding the substrate held on the surface of the platform Relatively moving the boring hole and moving it, the attraction of a substrate is just carried by the pressure to hold the substrate, and the substrate protects the force to produce a pipe fitting device for accommodating the suction hole, wherein Pressure - the following components - the attraction generation section; and a > ' while discharging the 200936251 · coating liquid coating unit, characterized in that the substrate holding means has the attraction of the substrate by the pressure adjustment of the palette The pressure adjusting unit adjusts the pressure applied to the stage to a predetermined initial pressure by the pressure adjusting unit, and adjusts the holding of the substrate to the initial pressure. The substrate attached to the base surface is kept at a small pressure 19