TW200932079A - Methods of treating a surface to promote binding of molecule(s) of interest, coatings and devices formed therefrom - Google Patents
Methods of treating a surface to promote binding of molecule(s) of interest, coatings and devices formed therefrom Download PDFInfo
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- TW200932079A TW200932079A TW097133437A TW97133437A TW200932079A TW 200932079 A TW200932079 A TW 200932079A TW 097133437 A TW097133437 A TW 097133437A TW 97133437 A TW97133437 A TW 97133437A TW 200932079 A TW200932079 A TW 200932079A
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- substrate
- organic
- coating
- molecule
- layer
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- 230000002000 scavenging effect Effects 0.000 description 1
- 150000003333 secondary alcohols Chemical class 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 239000011669 selenium Substances 0.000 description 1
- 239000013545 self-assembled monolayer Substances 0.000 description 1
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- 238000009662 stress testing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- IIACRCGMVDHOTQ-UHFFFAOYSA-N sulfamic acid Chemical compound NS(O)(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-N 0.000 description 1
- 150000003871 sulfonates Chemical class 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
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- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 150000003509 tertiary alcohols Chemical class 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 229960002180 tetracycline Drugs 0.000 description 1
- 229930101283 tetracycline Natural products 0.000 description 1
- 235000019364 tetracycline Nutrition 0.000 description 1
- 150000003522 tetracyclines Chemical class 0.000 description 1
- 150000007944 thiolates Chemical class 0.000 description 1
- 229930192474 thiophene Natural products 0.000 description 1
- 238000001269 time-of-flight mass spectrometry Methods 0.000 description 1
- 238000001196 time-of-flight mass spectrum Methods 0.000 description 1
- 229910001428 transition metal ion Inorganic materials 0.000 description 1
- 230000002485 urinary effect Effects 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/044—Forming conductive coatings; Forming coatings having anti-static properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/056—Forming hydrophilic coatings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/06—Coating with compositions not containing macromolecular substances
- C08J7/065—Low-molecular-weight organic substances, e.g. absorption of additives in the surface of the article
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/12—Chemical modification
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
- C23C18/1837—Multistep pretreatment
- C23C18/1844—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1886—Multistep pretreatment
- C23C18/1893—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
- C23C18/2066—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/121—Metallo-organic compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P20/00—Technologies relating to chemical industry
- Y02P20/50—Improvements relating to the production of bulk chemicals
- Y02P20/582—Recycling of unreacted starting or intermediate materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Chemically Coating (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
- Electrodes Of Semiconductors (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US96946807P | 2007-08-31 | 2007-08-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200932079A true TW200932079A (en) | 2009-07-16 |
Family
ID=40387851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097133437A TW200932079A (en) | 2007-08-31 | 2008-09-01 | Methods of treating a surface to promote binding of molecule(s) of interest, coatings and devices formed therefrom |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20090056991A1 (enExample) |
| EP (1) | EP2188818A4 (enExample) |
| JP (1) | JP2010538160A (enExample) |
| CN (1) | CN101842856B (enExample) |
| TW (1) | TW200932079A (enExample) |
| WO (1) | WO2009029871A1 (enExample) |
Families Citing this family (56)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012005722A1 (en) * | 2010-07-06 | 2012-01-12 | Zettacore, Inc. | Methods of treating metal surfaces and devices formed thereby |
| CN107072072B (zh) | 2010-07-06 | 2019-10-25 | 纳美仕有限公司 | 处理铜表面以增强对印刷电路板中使用的有机衬底的粘着力的方法 |
| CN102386072B (zh) | 2010-08-25 | 2016-05-04 | 株式会社半导体能源研究所 | 微晶半导体膜的制造方法及半导体装置的制造方法 |
| US8647535B2 (en) | 2011-01-07 | 2014-02-11 | International Business Machines Corporation | Conductive metal and diffusion barrier seed compositions, and methods of use in semiconductor and interlevel dielectric substrates |
| FI123323B (fi) * | 2011-06-14 | 2013-02-28 | Teknologian Tutkimuskeskus Vtt | Piilokuvioiden muodostaminen huokoisille substraateille |
| GB201116025D0 (en) * | 2011-09-16 | 2011-10-26 | Surface Innovations Ltd | Method |
| KR101331521B1 (ko) * | 2011-09-23 | 2013-11-21 | 중앙대학교 산학협력단 | 그래핀 박막의 제조 방법 |
| US8802568B2 (en) * | 2012-09-27 | 2014-08-12 | Sensirion Ag | Method for manufacturing chemical sensor with multiple sensor cells |
| US10103297B2 (en) | 2012-12-10 | 2018-10-16 | Daktronics, Inc. | Encapsulation of light-emitting elements on a display module |
| EP2929524B1 (en) * | 2012-12-10 | 2017-03-22 | Daktronics, Inc. | Encapsulation of light-emitting elements on a display module |
| CN103364940B (zh) * | 2013-05-03 | 2016-08-03 | 南京晶奥微光电技术有限公司 | 一种pcb板上电润湿显示单元及其制备方法 |
| JP5946802B2 (ja) * | 2013-08-05 | 2016-07-06 | イーサイオニック コーポレーション | プリント配線板 |
| EP3092278A4 (en) * | 2014-01-07 | 2017-10-04 | Orthobond, Inc. | Surface adhesive for devices |
| JP5916159B2 (ja) * | 2014-08-27 | 2016-05-11 | 田中貴金属工業株式会社 | 金属パターンの形成方法及び導電体 |
| BR112017015636A2 (pt) | 2015-01-20 | 2018-03-13 | Basf Coatings Gmbh | processo para produção de laminados orgânico-inorgânicos flexíveis. |
| JP6069736B2 (ja) * | 2015-02-20 | 2017-02-01 | ナミックス株式会社 | プリント配線板 |
| JP6069735B2 (ja) * | 2015-02-20 | 2017-02-01 | ナミックス株式会社 | プリント配線板を製造する方法 |
| CN104961918A (zh) * | 2015-07-11 | 2015-10-07 | 刘帅 | 改性lds添加剂及含该添加剂的天然橡胶组合物 |
| CN104961916A (zh) * | 2015-07-11 | 2015-10-07 | 刘帅 | 改性lds添加剂及含该添加剂的lcp组合物 |
| CN104961914A (zh) * | 2015-07-11 | 2015-10-07 | 刘帅 | 共改性lds添加剂及含该添加剂的tpee组合物 |
| CN104945673A (zh) * | 2015-07-11 | 2015-09-30 | 刘帅 | 改性lds添加剂及含该添加剂的丁苯橡胶组合物 |
| CN105037809A (zh) * | 2015-07-11 | 2015-11-11 | 刘帅 | 共改性lds添加剂及含该添加剂的pa66组合物 |
| CN104987536A (zh) * | 2015-07-11 | 2015-10-21 | 刘帅 | 改性lds添加剂及含该添加剂的tpo组合物 |
| CN104945662A (zh) * | 2015-07-11 | 2015-09-30 | 刘帅 | 共改性lds添加剂及含该添加剂的peek组合物 |
| CN104961920A (zh) * | 2015-07-11 | 2015-10-07 | 刘帅 | 改性lds添加剂及含该添加剂的tpae组合物 |
| CN104945663A (zh) * | 2015-07-11 | 2015-09-30 | 刘帅 | 改性lds添加剂及含该添加剂的peek组合物 |
| CN104961915A (zh) * | 2015-07-11 | 2015-10-07 | 刘帅 | 共改性lds添加剂及含该添加剂的pc组合物 |
| CN105037806A (zh) * | 2015-07-11 | 2015-11-11 | 刘帅 | 共改性lds添加剂及含该添加剂的丁苯橡胶组合物 |
| CN104987533A (zh) * | 2015-07-11 | 2015-10-21 | 刘帅 | 改性lds添加剂及含该添加剂的聚砜组合物 |
| CN105037807A (zh) * | 2015-07-11 | 2015-11-11 | 刘帅 | 共改性lds添加剂及含该添加剂的tpae组合物 |
| CN104961919A (zh) * | 2015-07-11 | 2015-10-07 | 刘帅 | 改性lds添加剂及含该添加剂的聚芳酯组合物 |
| CN104987535A (zh) * | 2015-07-11 | 2015-10-21 | 刘帅 | 共改性lds添加剂及含该添加剂的聚芳酯组合物 |
| CN104961921A (zh) * | 2015-07-11 | 2015-10-07 | 刘帅 | 改性lds添加剂及含该添加剂的abs组合物 |
| CN104945664A (zh) * | 2015-07-11 | 2015-09-30 | 刘帅 | 改性lds添加剂及含该添加剂的tpee组合物 |
| CN104961923A (zh) * | 2015-07-11 | 2015-10-07 | 刘帅 | 共改性lds添加剂及含该添加剂的abs组合物 |
| CN104961922A (zh) * | 2015-07-11 | 2015-10-07 | 刘帅 | 共改性lds添加剂及含该添加剂的lcp组合物 |
| CN104945672A (zh) * | 2015-07-11 | 2015-09-30 | 刘帅 | 共改性lds添加剂及含该添加剂的热塑性pi组合物 |
| CN104945674A (zh) * | 2015-07-11 | 2015-09-30 | 刘帅 | 改性lds添加剂及含该添加剂的pp组合物 |
| CN104987534A (zh) * | 2015-07-11 | 2015-10-21 | 刘帅 | 改性lds添加剂及含该添加剂的热塑性pi组合物 |
| CN104945665A (zh) * | 2015-07-11 | 2015-09-30 | 刘帅 | 共改性lds添加剂及含该添加剂的天然橡胶组合物 |
| CN104945669A (zh) * | 2015-07-11 | 2015-09-30 | 刘帅 | 共改性lds添加剂及含该添加剂的pps组合物 |
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-
2008
- 2008-08-29 WO PCT/US2008/074895 patent/WO2009029871A1/en not_active Ceased
- 2008-08-29 JP JP2010523176A patent/JP2010538160A/ja active Pending
- 2008-08-29 US US12/201,974 patent/US20090056991A1/en not_active Abandoned
- 2008-08-29 EP EP08799022A patent/EP2188818A4/en not_active Withdrawn
- 2008-08-29 CN CN2008801136020A patent/CN101842856B/zh not_active Expired - Fee Related
- 2008-09-01 TW TW097133437A patent/TW200932079A/zh unknown
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| US20090056991A1 (en) | 2009-03-05 |
| CN101842856B (zh) | 2013-10-09 |
| EP2188818A1 (en) | 2010-05-26 |
| CN101842856A (zh) | 2010-09-22 |
| WO2009029871A1 (en) | 2009-03-05 |
| EP2188818A4 (en) | 2013-01-09 |
| JP2010538160A (ja) | 2010-12-09 |
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