US3876513A - Electrodeposition of bright cobalt plate - Google Patents
Electrodeposition of bright cobalt plate Download PDFInfo
- Publication number
- US3876513A US3876513A US384777A US38477773A US3876513A US 3876513 A US3876513 A US 3876513A US 384777 A US384777 A US 384777A US 38477773 A US38477773 A US 38477773A US 3876513 A US3876513 A US 3876513A
- Authority
- US
- United States
- Prior art keywords
- per liter
- concentration
- organic sulfide
- bath
- sulfide compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
- C25D3/14—Electroplating: Baths therefor from solutions of nickel or cobalt from baths containing acetylenic or heterocyclic compounds
- C25D3/18—Heterocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
Description
Claims (23)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US384777A US3876513A (en) | 1972-06-26 | 1973-08-01 | Electrodeposition of bright cobalt plate |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US26610572A | 1972-06-26 | 1972-06-26 | |
US384777A US3876513A (en) | 1972-06-26 | 1973-08-01 | Electrodeposition of bright cobalt plate |
Publications (1)
Publication Number | Publication Date |
---|---|
US3876513A true US3876513A (en) | 1975-04-08 |
Family
ID=26951637
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US384777A Expired - Lifetime US3876513A (en) | 1972-06-26 | 1973-08-01 | Electrodeposition of bright cobalt plate |
Country Status (1)
Country | Link |
---|---|
US (1) | US3876513A (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6045682A (en) * | 1998-03-24 | 2000-04-04 | Enthone-Omi, Inc. | Ductility agents for nickel-tungsten alloys |
US6444110B2 (en) | 1999-05-17 | 2002-09-03 | Shipley Company, L.L.C. | Electrolytic copper plating method |
US20060243599A1 (en) * | 2005-04-28 | 2006-11-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Electroplating additive for improved reliability |
US20090056994A1 (en) * | 2007-08-31 | 2009-03-05 | Kuhr Werner G | Methods of Treating a Surface to Promote Metal Plating and Devices Formed |
US20090056991A1 (en) * | 2007-08-31 | 2009-03-05 | Kuhr Werner G | Methods of Treating a Surface to Promote Binding of Molecule(s) of Interest, Coatings and Devices Formed Therefrom |
CN104342732A (en) * | 2013-07-23 | 2015-02-11 | 深圳中宇昭日科技有限公司 | Cobalt electroplating method for tungsten steel |
US9345149B2 (en) | 2010-07-06 | 2016-05-17 | Esionic Corp. | Methods of treating copper surfaces for enhancing adhesion to organic substrates for use in printed circuit boards |
EP3502320A1 (en) * | 2017-12-22 | 2019-06-26 | ATOTECH Deutschland GmbH | A method for increasing corrosion resistance of a substrate comprising an outermost chromium alloy layer |
US20190226107A1 (en) * | 2016-07-18 | 2019-07-25 | Basf Se | Composition for cobalt plating comprising additive for void-free submicron feature filling |
US11697885B2 (en) * | 2016-09-19 | 2023-07-11 | University Of Central Florida Research Foundation, Inc. | Production of nanoporous films |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2648627A (en) * | 1950-05-24 | 1953-08-11 | Wagner Brothers Inc | Bright nickel plating composition and process |
US2837472A (en) * | 1953-09-19 | 1958-06-03 | Dehydag Gmbh | Brighteners for electroplating baths |
US2900707A (en) * | 1954-08-06 | 1959-08-25 | Udylite Corp | Metallic protective coating |
US2921888A (en) * | 1956-10-26 | 1960-01-19 | Vertol Aircraft Corp | Electroplating titanium ano titanium alloys |
US2978391A (en) * | 1958-08-25 | 1961-04-04 | Harshaw Chem Corp | Nickel plating process and solution |
US3093557A (en) * | 1961-08-25 | 1963-06-11 | Westinghouse Electric Corp | Methods and electrolytes for depositing nickel and cobalt |
-
1973
- 1973-08-01 US US384777A patent/US3876513A/en not_active Expired - Lifetime
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2648627A (en) * | 1950-05-24 | 1953-08-11 | Wagner Brothers Inc | Bright nickel plating composition and process |
US2837472A (en) * | 1953-09-19 | 1958-06-03 | Dehydag Gmbh | Brighteners for electroplating baths |
US2900707A (en) * | 1954-08-06 | 1959-08-25 | Udylite Corp | Metallic protective coating |
US2921888A (en) * | 1956-10-26 | 1960-01-19 | Vertol Aircraft Corp | Electroplating titanium ano titanium alloys |
US2978391A (en) * | 1958-08-25 | 1961-04-04 | Harshaw Chem Corp | Nickel plating process and solution |
US3093557A (en) * | 1961-08-25 | 1963-06-11 | Westinghouse Electric Corp | Methods and electrolytes for depositing nickel and cobalt |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6045682A (en) * | 1998-03-24 | 2000-04-04 | Enthone-Omi, Inc. | Ductility agents for nickel-tungsten alloys |
US6444110B2 (en) | 1999-05-17 | 2002-09-03 | Shipley Company, L.L.C. | Electrolytic copper plating method |
US20030010646A1 (en) * | 1999-05-17 | 2003-01-16 | Barstad Leon R. | Electrolytic copper plating solutions |
US20060243599A1 (en) * | 2005-04-28 | 2006-11-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Electroplating additive for improved reliability |
US8323769B2 (en) | 2007-08-31 | 2012-12-04 | Atotech Deutschland Gmbh | Methods of treating a surface to promote metal plating and devices formed |
US20090056991A1 (en) * | 2007-08-31 | 2009-03-05 | Kuhr Werner G | Methods of Treating a Surface to Promote Binding of Molecule(s) of Interest, Coatings and Devices Formed Therefrom |
US20100075427A1 (en) * | 2007-08-31 | 2010-03-25 | Kuhr Werner G | Methods of treating a surface to promote metal plating and devices formed |
US20100071938A1 (en) * | 2007-08-31 | 2010-03-25 | Kuhr Werner G | Methods of treating a surface to promote metal plating and devices formed |
US20090056994A1 (en) * | 2007-08-31 | 2009-03-05 | Kuhr Werner G | Methods of Treating a Surface to Promote Metal Plating and Devices Formed |
US9345149B2 (en) | 2010-07-06 | 2016-05-17 | Esionic Corp. | Methods of treating copper surfaces for enhancing adhesion to organic substrates for use in printed circuit boards |
US9795040B2 (en) | 2010-07-06 | 2017-10-17 | Namics Corporation | Methods of treating copper surfaces for enhancing adhesion to organic substrates for use in printed circuit boards |
CN104342732A (en) * | 2013-07-23 | 2015-02-11 | 深圳中宇昭日科技有限公司 | Cobalt electroplating method for tungsten steel |
US20190226107A1 (en) * | 2016-07-18 | 2019-07-25 | Basf Se | Composition for cobalt plating comprising additive for void-free submicron feature filling |
US11697885B2 (en) * | 2016-09-19 | 2023-07-11 | University Of Central Florida Research Foundation, Inc. | Production of nanoporous films |
EP3502320A1 (en) * | 2017-12-22 | 2019-06-26 | ATOTECH Deutschland GmbH | A method for increasing corrosion resistance of a substrate comprising an outermost chromium alloy layer |
WO2019121178A1 (en) * | 2017-12-22 | 2019-06-27 | Atotech Deutschland Gmbh | A method for increasing corrosion resistance of a substrate comprising an outermost chromium alloy layer |
US10961634B2 (en) | 2017-12-22 | 2021-03-30 | Atotech Deutschland Gmbh | Method for increasing corrosion resistance of a substrate comprising an outermost chromium alloy layer |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: HOOKER CHEMICALS & PLASTICS CORP. Free format text: MERGER;ASSIGNOR:OXY METAL INDUSTRIES CORPORATION;REEL/FRAME:004075/0885 Effective date: 19801222 |
|
AS | Assignment |
Owner name: OCCIDENTAL CHEMICAL CORPORATION Free format text: CHANGE OF NAME;ASSIGNOR:HOOKER CHEMICAS & PLASTICS CORP.;REEL/FRAME:004126/0054 Effective date: 19820330 |
|
AS | Assignment |
Owner name: OMI INTERNATIONAL CORPORATION, 21441 HOOVER ROAD, Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:OCCIDENTAL CHEMICAL CORPORATION;REEL/FRAME:004190/0827 Effective date: 19830915 |
|
AS | Assignment |
Owner name: MANUFACTURERS HANOVER TRUST COMPANY, A CORP OF NY Free format text: SECURITY INTEREST;ASSIGNOR:INTERNATIONAL CORPORATION, A CORP OF DE;REEL/FRAME:004201/0733 Effective date: 19830930 |