TW200930900A - Cylinder stop position variable mechanism and substrate treating apparatus comprising the same - Google Patents

Cylinder stop position variable mechanism and substrate treating apparatus comprising the same Download PDF

Info

Publication number
TW200930900A
TW200930900A TW097132202A TW97132202A TW200930900A TW 200930900 A TW200930900 A TW 200930900A TW 097132202 A TW097132202 A TW 097132202A TW 97132202 A TW97132202 A TW 97132202A TW 200930900 A TW200930900 A TW 200930900A
Authority
TW
Taiwan
Prior art keywords
limiter
substrate
stop position
cylinder
stopper
Prior art date
Application number
TW097132202A
Other languages
English (en)
Chinese (zh)
Inventor
Daisuke Hayashi
Ryo Nonaka
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200930900A publication Critical patent/TW200930900A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
    • F15B—SYSTEMS ACTING BY MEANS OF FLUIDS IN GENERAL; FLUID-PRESSURE ACTUATORS, e.g. SERVOMOTORS; DETAILS OF FLUID-PRESSURE SYSTEMS, NOT OTHERWISE PROVIDED FOR
    • F15B15/00—Fluid-actuated devices for displacing a member from one position to another; Gearing associated therewith
    • F15B15/20—Other details, e.g. assembly with regulating devices
    • F15B15/24—Other details, e.g. assembly with regulating devices for restricting the stroke
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Fluid Mechanics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
  • Drying Of Semiconductors (AREA)
TW097132202A 2007-08-23 2008-08-22 Cylinder stop position variable mechanism and substrate treating apparatus comprising the same TW200930900A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007217119A JP2009054630A (ja) 2007-08-23 2007-08-23 シリンダ停止位置可変機構及びそれを備えた基板処理装置

Publications (1)

Publication Number Publication Date
TW200930900A true TW200930900A (en) 2009-07-16

Family

ID=40111755

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097132202A TW200930900A (en) 2007-08-23 2008-08-22 Cylinder stop position variable mechanism and substrate treating apparatus comprising the same

Country Status (6)

Country Link
US (1) US20090049981A1 (ja)
EP (1) EP2028378A3 (ja)
JP (1) JP2009054630A (ja)
KR (1) KR20090020499A (ja)
CN (1) CN101373729A (ja)
TW (1) TW200930900A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI664694B (zh) * 2016-06-23 2019-07-01 日商愛發科股份有限公司 Holding device
TWI773669B (zh) * 2016-04-28 2022-08-11 美商應用材料股份有限公司 一種用於處理腔室的改進側注射噴嘴設計

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5316636B2 (ja) 2009-02-27 2013-10-16 井関農機株式会社 作業車両
CN102087478B (zh) * 2009-12-04 2012-10-17 无锡华润上华半导体有限公司 掩模版扫描装置
CN101894780B (zh) * 2010-07-07 2012-07-04 无锡华晶电子设备制造有限公司 转向装置
US8895452B2 (en) 2012-05-31 2014-11-25 Lam Research Corporation Substrate support providing gap height and planarization adjustment in plasma processing chamber
KR101517488B1 (ko) * 2013-12-18 2015-05-15 피에스케이 주식회사 실린더 유닛 및 그것을 구비한 리프트 핀 어셈블리
CN106714987B (zh) * 2014-09-26 2019-04-02 盛美半导体设备（上海）有限公司 清洗半导体硅片的装置和方法
EP3361316A1 (de) 2017-02-14 2018-08-15 VAT Holding AG Pneumatische stifthubvorrichtung und pneumatischer hubzylinder
CN107610997A (zh) * 2017-07-20 2018-01-19 江苏鲁汶仪器有限公司 一种具有晶圆位置检测装置的气相腐蚀腔体
CN116884823A (zh) * 2017-12-15 2023-10-13 朗姆研究公司 等离子体室中使用的环形结构和系统
CN108962794B (zh) * 2018-07-20 2020-08-21 北京北方华创微电子装备有限公司 一种升针方法及应用其的顶针升降装置
KR102680985B1 (ko) * 2022-06-16 2024-07-04 세메스 주식회사 회수 용기 승강 조립체 및 기판 처리 장치

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB716177A (en) * 1949-05-31 1954-09-29 Bendix Aviat Corp Improvements in or relating to hydraulic control apparatus
FR1175541A (fr) * 1957-05-20 1959-03-27 Ernault Batignolles H Dispositif de sécurité pour un organe mobile de machine
EP0078496B1 (de) * 1981-10-30 1985-03-27 Robert Bosch Gmbh Pneumatikzylinder
DE3544681A1 (de) * 1985-03-01 1986-09-04 Festo KG, 7300 Esslingen Positioniergeraet
JP3131938B2 (ja) 1993-12-31 2001-02-05 東京エレクトロン株式会社 熱処理装置及び熱処理方法
JP3922852B2 (ja) 1999-11-16 2007-05-30 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP4431928B2 (ja) 2001-02-20 2010-03-17 Ｓｍｃ株式会社 多段行程型シリンダ
WO2003060973A1 (fr) * 2002-01-10 2003-07-24 Tokyo Electron Limited Dispositif de traitement
US20040255442A1 (en) * 2003-06-19 2004-12-23 Mcdiarmid James Methods and apparatus for processing workpieces
DE102006043928B4 (de) * 2006-09-14 2012-08-09 Bosch Rexroth Pneumatics Gmbh Druckmittelzylinder mit verstellbarem Hub

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI773669B (zh) * 2016-04-28 2022-08-11 美商應用材料股份有限公司 一種用於處理腔室的改進側注射噴嘴設計
TWI664694B (zh) * 2016-06-23 2019-07-01 日商愛發科股份有限公司 Holding device

Also Published As

Publication number Publication date
CN101373729A (zh) 2009-02-25
JP2009054630A (ja) 2009-03-12
US20090049981A1 (en) 2009-02-26
EP2028378A3 (en) 2010-05-05
EP2028378A2 (en) 2009-02-25
KR20090020499A (ko) 2009-02-26

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