TW200922428A - Bendable area design for flexible printed circuitboard - Google Patents

Bendable area design for flexible printed circuitboard Download PDF

Info

Publication number
TW200922428A
TW200922428A TW096142948A TW96142948A TW200922428A TW 200922428 A TW200922428 A TW 200922428A TW 096142948 A TW096142948 A TW 096142948A TW 96142948 A TW96142948 A TW 96142948A TW 200922428 A TW200922428 A TW 200922428A
Authority
TW
Taiwan
Prior art keywords
printed circuit
circuit board
flexible printed
groove
bending
Prior art date
Application number
TW096142948A
Other languages
English (en)
Chinese (zh)
Other versions
TWI333820B (enExample
Inventor
Chin-Wen Lo
Chia-Ning Kao
Original Assignee
Wintek Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wintek Corp filed Critical Wintek Corp
Priority to TW096142948A priority Critical patent/TW200922428A/zh
Priority to US12/141,221 priority patent/US8058560B2/en
Publication of TW200922428A publication Critical patent/TW200922428A/zh
Application granted granted Critical
Publication of TWI333820B publication Critical patent/TWI333820B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/055—Folded back on itself
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
TW096142948A 2007-11-14 2007-11-14 Bendable area design for flexible printed circuitboard TW200922428A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW096142948A TW200922428A (en) 2007-11-14 2007-11-14 Bendable area design for flexible printed circuitboard
US12/141,221 US8058560B2 (en) 2007-11-14 2008-06-18 Bendable area design for flexible printed circuitboard

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW096142948A TW200922428A (en) 2007-11-14 2007-11-14 Bendable area design for flexible printed circuitboard

Publications (2)

Publication Number Publication Date
TW200922428A true TW200922428A (en) 2009-05-16
TWI333820B TWI333820B (enExample) 2010-11-21

Family

ID=40622640

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096142948A TW200922428A (en) 2007-11-14 2007-11-14 Bendable area design for flexible printed circuitboard

Country Status (2)

Country Link
US (1) US8058560B2 (enExample)
TW (1) TW200922428A (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100155109A1 (en) * 2008-12-24 2010-06-24 Ibiden Co., Ltd. Flex-rigid wiring board and method for manufacturing the same
JP5573477B2 (ja) * 2010-08-09 2014-08-20 株式会社オートネットワーク技術研究所 電線保護構造部及び電線保護構造部の製造方法
JP6191224B2 (ja) * 2013-05-10 2017-09-06 日亜化学工業株式会社 配線基板及びこれを用いた発光装置
US9402303B2 (en) * 2013-06-03 2016-07-26 Apple Inc. Flexible printed circuit cables with slits
TWI503059B (zh) * 2014-04-29 2015-10-01 Chipmos Technologies Inc 軟性電路薄膜結構
KR102397909B1 (ko) * 2015-08-27 2022-05-16 삼성전자주식회사 기판 및 이를 포함하는 광원 모듈
WO2018045550A1 (en) * 2016-09-09 2018-03-15 Hong Kong R&D Centre for Logistics and Supply Chain Management Enabling Technologies Limited A radio frequency communication device and a method for using thereof
CN112867258B (zh) * 2016-12-27 2024-03-19 健鼎（无锡）电子有限公司 可挠性电路板的制作方法
CN208077535U (zh) * 2018-04-28 2018-11-09 京东方科技集团股份有限公司 一种柔性显示面板及柔性显示装置
CN110958761A (zh) * 2018-09-27 2020-04-03 北京小米移动软件有限公司 柔性电路板、终端设备
KR20230130203A (ko) 2022-03-02 2023-09-12 삼성디스플레이 주식회사 표시 장치

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3296365A (en) * 1964-04-03 1967-01-03 Thomas & Betts Co Inc Flat conductor cable jumper
US3914531A (en) * 1974-03-29 1975-10-21 Amp Inc Power isolated transmission cable assembly
US4470195A (en) * 1981-04-10 1984-09-11 Allied Corporation Offset reformable jumper
US4845315A (en) * 1984-05-02 1989-07-04 Mosaic Systems Cable system
CA2145608C (en) * 1994-03-29 2000-06-20 Kazuya Akashi Wire harness and method of manufacturing the same
JP3424785B2 (ja) * 1995-05-26 2003-07-07 矢崎総業株式会社 フラットケーブルとリード線の接合部およびその形成方法
JPH1079559A (ja) * 1996-09-04 1998-03-24 Fuji Photo Optical Co Ltd フレキシブルプリント基板のパターン構造
JP3682366B2 (ja) * 1997-12-26 2005-08-10 古河電気工業株式会社 ワイヤハーネス及びその製造方法
US5903440A (en) * 1998-01-30 1999-05-11 Delco Electronics Corporaiton Method of forming assemblies of circuit boards in different planes
KR100733877B1 (ko) * 2000-07-06 2007-07-02 엘지.필립스 엘시디 주식회사 가요성 인쇄회로 필름
US6407669B1 (en) * 2001-02-02 2002-06-18 3M Innovative Properties Company RFID tag device and method of manufacturing
US6529377B1 (en) * 2001-09-05 2003-03-04 Microelectronic & Computer Technology Corporation Integrated cooling system
US6668447B2 (en) * 2001-11-20 2003-12-30 St. Jude Children's Research Hospital Multilayered board comprising folded flexible circuits and method of manufacture
JP3794556B2 (ja) * 2001-12-03 2006-07-05 古河電気工業株式会社 フラット配線材を積層した積層配線材
JP4047778B2 (ja) * 2003-07-30 2008-02-13 矢崎総業株式会社 電線余長吸収装置
JP4536430B2 (ja) * 2004-06-10 2010-09-01 イビデン株式会社 フレックスリジッド配線板
TWI277381B (en) * 2005-04-12 2007-03-21 Au Optronics Corp Double-sided flexible printed circuit board
US7598867B2 (en) * 2005-09-01 2009-10-06 Alien Technology Corporation Techniques for folded tag antennas
JP2008112849A (ja) * 2006-10-30 2008-05-15 Toshiba Corp プリント配線板、プリント配線板の屈曲加工方法および電子機器
TWI326193B (en) * 2006-12-07 2010-06-11 Au Optronics Corp Flexible printed circuit

Also Published As

Publication number Publication date
US8058560B2 (en) 2011-11-15
TWI333820B (enExample) 2010-11-21
US20090120670A1 (en) 2009-05-14

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MM4A Annulment or lapse of patent due to non-payment of fees