TW200909555A - Laminated tape for packing material - Google Patents

Laminated tape for packing material Download PDF

Info

Publication number
TW200909555A
TW200909555A TW097116671A TW97116671A TW200909555A TW 200909555 A TW200909555 A TW 200909555A TW 097116671 A TW097116671 A TW 097116671A TW 97116671 A TW97116671 A TW 97116671A TW 200909555 A TW200909555 A TW 200909555A
Authority
TW
Taiwan
Prior art keywords
base material
layer
packaging
tape
ionic liquid
Prior art date
Application number
TW097116671A
Other languages
English (en)
Chinese (zh)
Inventor
Hiroomi Hanai
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of TW200909555A publication Critical patent/TW200909555A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Packaging Frangible Articles (AREA)
  • Wrappers (AREA)
  • Packages (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW097116671A 2007-05-08 2008-05-06 Laminated tape for packing material TW200909555A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007123130A JP5419329B2 (ja) 2007-05-08 2007-05-08 包装材用積層テープ

Publications (1)

Publication Number Publication Date
TW200909555A true TW200909555A (en) 2009-03-01

Family

ID=40112516

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097116671A TW200909555A (en) 2007-05-08 2008-05-06 Laminated tape for packing material

Country Status (4)

Country Link
JP (1) JP5419329B2 (ja)
KR (1) KR20080099171A (ja)
CN (1) CN101302406B (ja)
TW (1) TW200909555A (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018118766A (ja) * 2017-01-26 2018-08-02 住友ベークライト株式会社 カバーテープおよび電子部品用包装体
CN107672265A (zh) * 2017-10-25 2018-02-09 浙江洁美电子信息材料有限公司 一种纸基上盖带及其制备方法
JP6950773B1 (ja) * 2020-03-17 2021-10-13 大日本印刷株式会社 電子部品包装用カバーテープおよび包装体
JP6950774B1 (ja) * 2020-03-17 2021-10-13 大日本印刷株式会社 電子部品包装用カバーテープおよび包装体

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4301673B2 (ja) * 2000-01-19 2009-07-22 日東電工株式会社 包装材用積層テープ
JP3766616B2 (ja) * 2001-07-30 2006-04-12 三光化学工業株式会社 制電性塗料用樹脂組成物、その製造方法およびそれを用いた成形品
US7601771B2 (en) * 2002-07-05 2009-10-13 Goldschmidt Gmbh Polymer compositions containing polymers and ionic liquids
JP2006182794A (ja) * 2004-12-24 2006-07-13 Mitsubishi Chemicals Corp 表面保護フィルム用ポリウレタン粘着剤組成物及び表面保護フィルム
JP4899593B2 (ja) * 2005-04-07 2012-03-21 住友ベークライト株式会社 電子部品包装用カバーテープ
JP2006299119A (ja) * 2005-04-21 2006-11-02 Sumitomo Bakelite Co Ltd 接着剤及びそれを用いたカバーテープ
CN101665671A (zh) * 2005-05-19 2010-03-10 日东电工株式会社 包装材料用层压带

Also Published As

Publication number Publication date
JP2008280365A (ja) 2008-11-20
CN101302406B (zh) 2014-02-19
JP5419329B2 (ja) 2014-02-19
CN101302406A (zh) 2008-11-12
KR20080099171A (ko) 2008-11-12

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