TW200905221A - Inspection jig and inspection apparatus - Google Patents
Inspection jig and inspection apparatus Download PDFInfo
- Publication number
- TW200905221A TW200905221A TW097128552A TW97128552A TW200905221A TW 200905221 A TW200905221 A TW 200905221A TW 097128552 A TW097128552 A TW 097128552A TW 97128552 A TW97128552 A TW 97128552A TW 200905221 A TW200905221 A TW 200905221A
- Authority
- TW
- Taiwan
- Prior art keywords
- end side
- probe
- inspection
- insertion hole
- rear end
- Prior art date
Links
- 238000007689 inspection Methods 0.000 title claims abstract description 137
- 239000000523 sample Substances 0.000 claims abstract description 136
- 238000003780 insertion Methods 0.000 claims abstract description 70
- 230000037431 insertion Effects 0.000 claims abstract description 70
- 238000010586 diagram Methods 0.000 description 7
- 238000005452 bending Methods 0.000 description 4
- 206010036790 Productive cough Diseases 0.000 description 3
- 241000239226 Scorpiones Species 0.000 description 3
- 210000003802 sputum Anatomy 0.000 description 3
- 208000024794 sputum Diseases 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 241000251468 Actinopterygii Species 0.000 description 1
- 206010002368 Anger Diseases 0.000 description 1
- 235000018185 Betula X alpestris Nutrition 0.000 description 1
- 235000018212 Betula X uliginosa Nutrition 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- 229910000997 High-speed steel Inorganic materials 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005562 fading Methods 0.000 description 1
- 235000011389 fruit/vegetable juice Nutrition 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 235000003642 hunger Nutrition 0.000 description 1
- 230000002757 inflammatory effect Effects 0.000 description 1
- 239000010977 jade Substances 0.000 description 1
- 238000009940 knitting Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 108090000765 processed proteins & peptides Proteins 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007198751A JP2009036532A (ja) | 2007-07-31 | 2007-07-31 | 検査冶具および検査装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200905221A true TW200905221A (en) | 2009-02-01 |
| TWI383163B TWI383163B (enExample) | 2013-01-21 |
Family
ID=40331497
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097128552A TW200905221A (en) | 2007-07-31 | 2008-07-29 | Inspection jig and inspection apparatus |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2009036532A (enExample) |
| KR (1) | KR101011360B1 (enExample) |
| CN (1) | CN101358997A (enExample) |
| TW (1) | TW200905221A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113433360A (zh) * | 2020-03-23 | 2021-09-24 | 奥特斯(中国)有限公司 | 用于测试部件承载件同时防止变形的测试针对被测试部件承载件施加过多载荷的测试适配器 |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6255914B2 (ja) * | 2013-11-07 | 2018-01-10 | 日本電産リード株式会社 | 検査治具 |
| KR101565344B1 (ko) | 2013-12-13 | 2015-11-03 | 현대자동차주식회사 | 차량 연동 단말기 조명 제어 시스템 및 제어 방법 |
| JP6237441B2 (ja) * | 2014-04-24 | 2017-11-29 | 日本電産リード株式会社 | 電極構造体、検査治具、及び電極構造体の製造方法 |
| CN106324481B (zh) * | 2016-08-23 | 2018-11-27 | 管仙福 | 一种用于集成电路的定位检测装置 |
| IT201700021400A1 (it) * | 2017-02-24 | 2018-08-24 | Technoprobe Spa | Testa di misura a sonde verticali con migliorate proprietà in frequenza |
| CN106932615B (zh) * | 2017-04-28 | 2024-02-13 | 尼得科精密检测设备(浙江)有限公司 | 检查夹具及具备该检查夹具的检查装置 |
| CN112424615B (zh) * | 2018-07-13 | 2025-02-07 | 日本电产理德股份有限公司 | 检查治具以及检查装置 |
| US11454650B2 (en) * | 2018-07-18 | 2022-09-27 | Nidec-Read Corporation | Probe, inspection jig, inspection device, and method for manufacturing probe |
| KR102324248B1 (ko) * | 2020-06-19 | 2021-11-12 | 리노정밀(주) | 검사 장치용 블록 조립체 |
| CN113639979B (zh) * | 2021-07-26 | 2022-04-26 | 苏州佳祺仕信息科技有限公司 | 一种检测治具及用于检测带孔工件性能的检测装置 |
| KR102649845B1 (ko) * | 2023-11-29 | 2024-03-21 | 주식회사 나노시스 | 반도체 소자 테스터 지그 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0729838U (ja) * | 1993-11-08 | 1995-06-02 | 日本電子材料株式会社 | 座屈応力減少機構付垂直動作式プローブカード |
| JP3575501B2 (ja) * | 1995-05-15 | 2004-10-13 | 株式会社日本マイクロニクス | プローブ装置 |
| JPH09274054A (ja) * | 1996-04-08 | 1997-10-21 | Furukawa Electric Co Ltd:The | プローバー |
| JP3505495B2 (ja) | 2000-09-13 | 2004-03-08 | 日本電産リード株式会社 | 基板検査用検査治具、該検査治具を備えた基板検査装置および基板検査用検査治具の組立方法 |
| US7248482B2 (en) * | 2003-05-16 | 2007-07-24 | Matsushita Electric Industrial Co., Ltd. | Module with built-in circuit component and method for producing the same |
| TWI286606B (en) * | 2004-03-16 | 2007-09-11 | Gunsei Kimoto | Electric signal connecting device, and probe assembly and prober device using it |
| JP2005338065A (ja) * | 2004-04-26 | 2005-12-08 | Koyo Technos:Kk | 検査冶具および検査装置 |
| CN100535676C (zh) * | 2005-04-21 | 2009-09-02 | 株式会社光阳科技 | 检查夹具及检查装置 |
| JP3849948B1 (ja) * | 2005-11-16 | 2006-11-22 | 日本電産リード株式会社 | 基板検査用治具及び検査用プローブ |
| JP4448086B2 (ja) * | 2005-12-12 | 2010-04-07 | 大西電子株式会社 | プリント配線板の検査治具 |
-
2007
- 2007-07-31 JP JP2007198751A patent/JP2009036532A/ja active Pending
-
2008
- 2008-07-29 CN CNA2008101441557A patent/CN101358997A/zh active Pending
- 2008-07-29 TW TW097128552A patent/TW200905221A/zh not_active IP Right Cessation
- 2008-07-31 KR KR1020080075069A patent/KR101011360B1/ko not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113433360A (zh) * | 2020-03-23 | 2021-09-24 | 奥特斯(中国)有限公司 | 用于测试部件承载件同时防止变形的测试针对被测试部件承载件施加过多载荷的测试适配器 |
| CN113433360B (zh) * | 2020-03-23 | 2023-12-01 | 奥特斯(中国)有限公司 | 测试适配器、测试设备和测试部件承载件的方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI383163B (enExample) | 2013-01-21 |
| KR101011360B1 (ko) | 2011-01-28 |
| CN101358997A (zh) | 2009-02-04 |
| JP2009036532A (ja) | 2009-02-19 |
| KR20090013139A (ko) | 2009-02-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |