200941000 九、發明說明： 【發明所屬之技術領域】 本發明係與探針卡有關，特別是指一種用於測試影像感測晶片 之垂直式探針卡。 【先前技術】 一般測試半導體晶片之探針卡，主要是作為測試機台與半導 0 體晶片之間的連接物件，由測試機台提供電壓使半導體晶片產生 相對電性訊號而進行測試。但是若為影像感測晶片（例如GCD或 CMOS) ’則須將測試光線照射到影感測晶片之光學感應區，使晶片 因受光線之照射而產生電性變化，才能產生電性訊號至所連接的 探針卡及測試機台處。由於與習用一般探針卡的要求不同，於是 就有人改設計了專用於影像感測晶片之探針卡。 請參閱第一圖所示，係為習知用於測試影像感測晶片之探針 ❹卡10的剖面結構圖，其中，包含有一電路板11、一導引機構21， ...... ..... ·. ... . · 以及複數探針22 ;該電路板11具有一第一表面12、一第二表面 13，以及一貫通於該第一表面12與該第二表面13之開口 14，該 導引機構21具有複數穿孔’該導引機構21係設於該電路板u之 第二表面13 ’各該探針22係以導電材質製成，各該探針22 —端 係電性連接該電路板11，且位於該電路板11鄰近開口 14之位置， 而另一端則穿設該導引機構21之穿孔，且朝該導引機構21之外 側延伸’·藉此，利用電路板之開口 14即可供測試用之光線直接穿 200941000 射，使探針卡10可用於測試影像感測晶片23。 為此本發明人即思考是號以不同方式設計-域用於測試 影像感測晶#之探針卡。糾紐由探針卡上方直接照射，部份 光線會經電輪反射时，形成干涉躲，f彡響泰機結果的正 確性。此問題也是本發明人研究思考的課題。 【發明内容】 、本發明之主要目岐提供—種用於測試影像感測晶片之垂直 式探針卡’主要採聊簧式探針及m该置，並配合其他構 件的組合，形成—組不同於習財式的探針卡。 本發明之次要目的是提供一種具有濾片的垂直式探針卡，該 渡片是位於探針卡的光線照射路徑之中，能過濾掉不必要的光 線使通過的光線符合影像感測器所要求的内容，藉此讓測量的 準確度更加提高。 .為達成前述目的，本發明所提供甩於測試影像感測晶片之垂 、弋探針卡，包含有一電路板、至少一固定單元，以及複數彈簧 式心針。該電路板具有可透光—視窗，翻定單元結合於電路板 下面’但未職視窗所舰，朗定單元另具有複數貫穿的結合 該彈簣式探針結合於前朗定單元之結合㈣，其中，該彈 耳式仏針-端為—固定端’翻定端與前输處的線路作電性 連接’另-端為-伸顧針’該伸縮麟是延伸出細定單元的 置"T與衫像感測晶片做連接，該彈簧探針的設置方式是 200941000 • 採垂直於視窗方向。 另外本侧之垂直式探針卡另外具註少—翻，該濃片係 位於光線騎路徑之巾，該光_鱗徑是指光線由電路板上方 照射開始，經該電路板之視窗而到達待測之影像感測以處的路 徑。因此該翻可設置於電路板的視窗處，@定單元之間的開口 處。該濾片也可由一片或複數片所構成。 本發明由於將探針改縣彈簧式探針，且探針兩端改善為與 電路板連接的固定端’和與影像感測晶片連接的伸縮頂針，增加 探針_與探針卡的電性配合；以及使將不必要的光線過 濾掉，讓影像測試的準確度得以提高。 【實施方式】 k配合下列之圖示說明本發明之詳細結構及其連結關係，俾 使熟習該項技術領域者在研讀本說明書後能據以實施。 ❹ 讀參閱第二圖所示，係為本發明之結構剖面示意圖，包含有 一電路板40、至少一固定單元50，以及複數彈簧式探針3〇。該電 路板40的上下表面具有相關線路，於中間位置具有一視窗41，該 視囪41為貫穿電路板40的開口。該固定單元5〇結合於電路板4〇 下方位置’但未遮蔽著該視窗41。該固定單元50具有一第一固定 件51、一墼片52，以及一第二固定件53，該第一固定單件51與 第二固定件53處分別具有數結合孔511及531，每一個結合孔511 對應著另一結合孔531。該第一固定件51頂面是鄰近電路板4〇， 200941000 並與電路板40之間仍具有— 下外壁是結合於前述固定…°式探針30的上 内。合孔511及谢 板40處的線路作電性連接，另―縮頂固與該電路 32是延伸出該固定置m ”、、申縮頂針32’該伸縮頂針 q疋早兀50的下方位置，該彈簧探 於視窗41的方向設置，該伸_針&末可者^200941000 IX. DESCRIPTION OF THE INVENTION: FIELD OF THE INVENTION The present invention relates to probe cards, and more particularly to a vertical probe card for testing image sensing wafers. [Prior Art] A probe card for testing a semiconductor wafer is generally used as a connection object between a test machine and a semiconductor wafer, and a voltage is supplied from the test machine to test the semiconductor wafer to generate a relative electrical signal. However, if it is an image sensing chip (such as GCD or CMOS), the test light should be irradiated onto the optical sensing area of the shadow sensing chip, so that the wafer can be electrically changed by the light to generate an electrical signal. Connect the probe card to the test machine. Due to the different requirements of the conventional probe card, a probe card dedicated to the image sensing chip has been modified. Referring to the first figure, it is a cross-sectional structural view of a probe card 10 for testing an image sensing chip, which comprises a circuit board 11, a guiding mechanism 21, ... And a plurality of probes 22; the circuit board 11 has a first surface 12, a second surface 13, and a first surface 12 and the second surface 13 The opening 14 of the guiding mechanism 21 has a plurality of perforations. The guiding mechanism 21 is disposed on the second surface 13 of the circuit board u. Each of the probes 22 is made of a conductive material, and each of the probes 22 is end-to-end. The circuit board 11 is electrically connected to the circuit board 11 at a position adjacent to the opening 14 of the circuit board 11, and the other end is inserted through the through hole of the guiding mechanism 21 and extends toward the outer side of the guiding mechanism 21. The probe card 10 can be used to test the image sensing die 23 by using the opening 14 of the board, i.e., the light for testing, to pass through the 200941000. To this end, the inventor thought that the probe card was designed in a different manner to test the image sensing crystal. The correction button is directly irradiated by the top of the probe card, and some of the light will be reflected by the electric wheel to form interference interference, and the result of the Thai machine is correct. This problem is also a subject of research by the inventors. SUMMARY OF THE INVENTION The main object of the present invention is to provide a vertical probe card for testing an image sensing chip, which is mainly used to form a spring probe, and is combined with other components to form a group. Different from the wealthy probe card. A secondary object of the present invention is to provide a vertical probe card having a filter, which is located in the light-illuminating path of the probe card, and can filter out unnecessary light to make the passed light conform to the image sensor. The required content, thereby making the accuracy of the measurement even higher. In order to achieve the foregoing object, the present invention provides a vertical and 弋 probe card for testing an image sensing wafer, comprising a circuit board, at least one fixing unit, and a plurality of spring type pins. The circuit board has a light-transmissive-window, and the flipping unit is coupled to the underside of the circuit board. However, the Langding unit has a plurality of penetrating joints combined with the magazine-type probe and the combination of the front-standing unit (4). , wherein the ear-type pin-end is - the fixed end 'the fixed end is electrically connected with the line of the front input', and the other end is - the needle is extended. "T is connected to the shirt like the sensing chip. The spring probe is set up in 200941000. • It is perpendicular to the window. In addition, the vertical probe card on the side is additionally provided with a small-flip, which is located in the towel of the light riding path. The light-scale path means that the light starts from the upper side of the circuit board and reaches through the window of the circuit board. The image to be tested senses the path in which it is located. Therefore, the flip can be placed at the window of the circuit board, at the opening between the units. The filter may also consist of one or more sheets. In the present invention, since the probe is changed to a spring-type probe, and both ends of the probe are improved to be a fixed end connected to the circuit board and a telescopic ejector connected to the image sensing chip, the electrical properties of the probe_and the probe card are increased. Matching; and filtering out unnecessary light to improve the accuracy of image testing. [Embodiment] The detailed structure of the present invention and the connection relationship thereof will be described with reference to the following drawings, which can be implemented by those skilled in the art after studying this specification. Referring to the second figure, a cross-sectional view of the structure of the present invention includes a circuit board 40, at least one fixing unit 50, and a plurality of spring type probes 3''. The upper and lower surfaces of the circuit board 40 have associated lines, and have a window 41 at an intermediate position, which is an opening through the circuit board 40. The fixing unit 5 is coupled to the lower portion of the circuit board 4' but does not shield the window 41. The fixing unit 50 has a first fixing member 51, a cymbal 52, and a second fixing member 53. The first fixing member 51 and the second fixing member 53 have a plurality of coupling holes 511 and 531, respectively. The coupling hole 511 corresponds to the other coupling hole 531. The top surface of the first fixing member 51 is adjacent to the circuit board 4, 200941000 and still has a lower outer wall between the circuit board 40 and is coupled to the upper surface of the fixed probe 30. The circuit of the hole 511 and the board 40 is electrically connected, and the circuit 32 is extended to the fixed position m", and the ejector pin 32' is located below the telescopic pin 疋The spring is probed in the direction of the window 41, and the extension _needle &
自由選擇，諸如半圓形、針形、^^要而 明之垂直式撕相轉。 等祕。如此即為本發 定單本朗定單元5G縣實施财數量為-個，而該固 70 ~位置則具有―開口 55，該開口 55位於前述電路板 之該視窗41下方，該開口 55形賴大於或等於該視窗41 M曰 固疋早凡5〇也可為數個獨立的個體，結合及分佈於電路板40下 面’每個固定單元將複數彈簧式探針3〇固定於電路板4〇，使複數 彈簧式探針30乃分佈於鄰近視窗41觸的區域。 一立凊參閱第三圖所示’係為本發明之第一種實施例的結構剖面 |"、圖八中本實施例在原有的結構基礎上，增力口了 一渡片6〇， 該據片60位於垂直式探針卡内之光線照射路徑之中，該光線照射 路光線由電路板40上方照射開始’經該電路板之視窗而到 達待測之景遞感測晶#處的路徑。在本實施例巾該遽片即於電路 板40上方，位置完全遮蔽了該視窗41。但該濾片60也可直接設 置於該電路板40的視窗41内。該濾片60能過濾掉測試用的光線 200941000 中所不必要的部份，保留必要的光線穿過⑼下方的視窗 41 ’而將光線投射於待測物上，且該滤片6〇的種類可依使用者需 要而改變，諸如為紅外光截止滤片（IR CUT FILTER)或f*外光截止 渡片（UV CUT FILTER)、濾波片...等。 明參閱第四圖所示’係為本發明之第二種實施例的結構剖面 示意圖，其中，本實施例中主要是改變濾片6〇的設置位置，在本 實施财魏#⑼是設置於gj定單元5Q處，正縣說是設置於 ®第-固定件51處。因此本發明之滤片6〇並非僅限制能放置在一 . 固定位置。 本發月使用的;慮片6〇 ,除了採用單—濾片來過滤光線以外， 亦可以採用分層方式，即使用多個不同性質的遽片，逐漸將光線 _選至使用者所需要的光線性f。請參閱第五騎示，係為本發 明之第三種實施例的結構剖面示意I在本實施射，具有兩個 濾片61 62，β亥遽片61設置於固定單元50之第一固定件51處， 而滤片62職置於固定單元5〇之第二固定件沾處。籍此運用多 個不同功能的㈣’有鱗地過濾、光線，進而減少感測晶片分析 時所產生的誤差。 、請參閱第六圖所示’係為本發明垂直式探針卡用於測試影像 感測晶片之較佳實施_。本發明之垂直式探針卡祕一影像感 測晶片70時，該彈簧式探針3〇是以伸縮頂針犯與影像感測晶片 7〇的線路相接觸。當光線由板4G上方照射時，光祕經滤片 200941000 60處理後，再由視窗41到於達影像制晶片7Q的光學感應區η， 使晶片因受光線之照射而產生電性變化’提供電性訊號予彈餐式 探針30、電路板4〇與最後至測試機台，由測試機纟進行相關的: 試及資料處理。 ' 惟以上所述者，僅為本發明之較佳實施例而已，當不能以之 限定本發明實施之_，即大凡依本發日种請專利細所作之均 等變化與修飾H仍屬於本發明專抓錢之麵内。 = 〇 【圖式簡單說明】 第一圖係為習知探針卡的剖面結構圖； 第二圖係為本發明之結構剖面示意圖； =二圖係為本發明之第—種實施例的結構剖面示意圖； 第四圖係為本發明之第二種實施例的結構剖面示意圖； ^圖係為本發明之第三種實施例的結構剖面示意圖； ❹第，、圖係為本發明垂直式探針卡用於測試影像感測晶片之Free choice, such as semi-circular, needle-shaped, ^^ vertical and vertical tearing. Waiting for the secret. Therefore, the number of implementations of the 5G county of the present disclosure is -, and the position of the solid 70-position has an opening 55, which is located below the window 41 of the circuit board, and the opening 55 is larger than Or equal to the window 41 M 曰 疋 疋 疋 疋 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 疋 疋 疋 疋 ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' The plurality of spring-type probes 30 are distributed in an area adjacent to the window 41. Referring to the third figure, the structural section of the first embodiment of the present invention is shown in the third figure. In the eighth embodiment, the present embodiment is based on the original structure, and the force is increased by 6 〇. The data sheet 60 is located in the light irradiation path in the vertical probe card, and the light illuminating the road light is illuminated by the upper surface of the circuit board 40 to pass through the window of the circuit board to reach the scene sensing crystal # to be tested. path. In the embodiment, the slab is over the circuit board 40, and the window 41 is completely shielded. However, the filter 60 can also be placed directly in the window 41 of the circuit board 40. The filter 60 can filter out unnecessary portions of the test light 200941000, retaining the necessary light to pass through the window 41' under the (9) and projecting the light onto the object to be tested, and the type of the filter 6〇 It can be changed according to user needs, such as IR CUT FILTER or f* UV CUT FILTER, filter, etc. Referring to the fourth figure, a schematic cross-sectional view of a second embodiment of the present invention is shown. In this embodiment, the setting position of the filter 6〇 is mainly changed. In this embodiment, the financial Wei#(9) is set in At the 5th position of the gj fixed unit, Zhengxian said that it is disposed at the ® first-fixing member 51. Therefore, the filter 6 of the present invention is not limited to being placed in a fixed position. For use in this month's month; in addition to using a single filter to filter light, it is also possible to use a layered approach, that is, using a plurality of differently shaped cymbals, and gradually selecting the ray to the user's needs. Light linear f. Please refer to the fifth riding diagram, which is a structural sectional view of the third embodiment of the present invention. In the present embodiment, there are two filter pieces 61 62, and the β-shaped sheet 61 is disposed on the first fixing member of the fixing unit 50. At 51, the filter 62 is placed on the second fixture of the fixing unit 5〇. This uses a variety of different functions (4) to scale and filter light, which in turn reduces errors in sensing wafer analysis. Please refer to the sixth figure for a preferred implementation of the vertical probe card of the present invention for testing an image sensing chip. When the vertical probe card of the present invention is used to image the wafer 70, the spring type probe 3 is in contact with the line of the image sensing wafer 7 by the telescopic ejector pin. When the light is irradiated from above the plate 4G, the light secret filter is processed by the filter 200941000 60, and then the window 41 reaches the optical sensing area η of the image forming wafer 7Q, so that the wafer is electrically changed by the irradiation of the light. The electrical signal is applied to the bomb-type probe 30, the circuit board 4〇 and finally to the test machine, and the test machine 纟 performs related tests and data processing. The above is only the preferred embodiment of the present invention, and the present invention may not be limited thereto, that is, the equivalent variation and modification H made by the patent application according to the present invention still belong to the present invention. Specialize in the face of money. = 〇 [schematic description of the drawings] The first figure is a cross-sectional structural view of a conventional probe card; the second figure is a schematic cross-sectional view of the structure of the present invention; = the second figure is the structure of the first embodiment of the present invention 4 is a schematic cross-sectional view of a second embodiment of the present invention; ^ is a schematic cross-sectional view of a third embodiment of the present invention; ❹第,图图 is a vertical probe of the present invention Needle card for testing image sensing chip
施例圖。 I 【主要元件符號說明】 習知 (10) 探針卡 (11) 電路板 (12) 第一表面 (13) 第二表面 200941000 · (14)開口 (21) 導引機構 (22) 探針 (23) 影像感測晶片 本發明 (30) 彈箐式探針 (31) 伸縮頂針 ® (32)固定端 . (40)電路板 (41)視窗 (50) 固定單元 (51) 第一固定件 (52) 墊片 (53) 第二固定件 ® (60)濾片 (61) 濾片 (62) 濾片 (70) 影像感測晶片 (71) 光學感應區Example map. I [Description of main component symbols] Conventional (10) Probe card (11) Circuit board (12) First surface (13) Second surface 200941000 · (14) Opening (21) Guide mechanism (22) Probe ( 23) Image sensing wafer The present invention (30) magazine probe (31) telescopic thimble® (32) fixed end. (40) circuit board (41) window (50) fixing unit (51) first fixing member ( 52) Gasket (53) Second Fixture® (60) Filter (61) Filter (62) Filter (70) Image Sensing Wafer (71) Optical Sensing Area