TW200841987A - Panel grinding device - Google Patents

Panel grinding device Download PDF

Info

Publication number
TW200841987A
TW200841987A TW096119676A TW96119676A TW200841987A TW 200841987 A TW200841987 A TW 200841987A TW 096119676 A TW096119676 A TW 096119676A TW 96119676 A TW96119676 A TW 96119676A TW 200841987 A TW200841987 A TW 200841987A
Authority
TW
Taiwan
Prior art keywords
belt
grinding
flat plate
panel
polishing
Prior art date
Application number
TW096119676A
Other languages
English (en)
Chinese (zh)
Inventor
Nobukazu Hosokai
Original Assignee
Sanshin Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanshin Co Ltd filed Critical Sanshin Co Ltd
Publication of TW200841987A publication Critical patent/TW200841987A/zh

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Optics & Photonics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
TW096119676A 2007-04-16 2007-06-01 Panel grinding device TW200841987A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007107149 2007-04-16

Publications (1)

Publication Number Publication Date
TW200841987A true TW200841987A (en) 2008-11-01

Family

ID=40033484

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096119676A TW200841987A (en) 2007-04-16 2007-06-01 Panel grinding device

Country Status (4)

Country Link
JP (1) JP2008284678A (ko)
KR (1) KR101143111B1 (ko)
CN (1) CN101288945B (ko)
TW (1) TW200841987A (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112548787A (zh) * 2020-12-24 2021-03-26 王瑞 一种电器插脚抛光装置

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102366919B (zh) * 2011-09-21 2015-01-07 杭州祥生砂光机制造有限公司 一圈两磨倒角去毛刺机及去毛刺方法
CN103317419B (zh) * 2013-06-17 2016-02-10 深圳市华星光电技术有限公司 研磨装置
CN104551941A (zh) * 2013-10-15 2015-04-29 青岛达沃斯达五金工具有限公司 一种双面砂带抛光机
CN105252387A (zh) * 2015-09-01 2016-01-20 深圳市易天自动化设备有限公司 一种液晶玻璃的研磨清洗设备
KR102429138B1 (ko) * 2017-07-10 2022-08-05 주식회사 케이씨텍 순환 구동 유닛 및 이를 포함하는 기판 연마 장치
JP6583701B2 (ja) * 2018-01-31 2019-10-02 株式会社サンシン ウオーム研磨方法及びその装置
CN110561235B (zh) * 2019-08-27 2023-08-29 雅视特科技（杭州）有限公司 全自动立式铸件表面打磨机及其操作方法
CN110900397B (zh) * 2019-12-05 2021-12-03 新沂市大自然木业有限公司 一种高精度可双面同时抛光的木板砂光机及其工作方式
CN111113530B (zh) * 2019-12-27 2021-10-01 湖南新汇制药股份有限公司 一种金樱子初加工装置和加工方法
CN112847055A (zh) * 2020-12-29 2021-05-28 张媛淇 一种新能源汽车用导流板加工打磨装置
CN117103093B (zh) * 2023-10-19 2023-12-29 成都广日电气设备有限公司 一种用于电梯生产的抛光机

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60151838A (ja) * 1984-01-19 1985-08-09 Matsushita Electric Ind Co Ltd 磁気記録媒体の製造方法
JPH0763930B2 (ja) * 1988-09-01 1995-07-12 株式会社ノリタケカンパニーリミテド 研摩テープを使用した平面研摩装置
JP2663022B2 (ja) * 1989-07-07 1997-10-15 株式会社ノリタケカンパニーリミテド 研摩テープを使用した平面研摩装置
CN1053384A (zh) * 1990-01-18 1991-07-31 丸仲化工机株式会社 砂磨方法及其装置
JP2001062696A (ja) * 1999-08-24 2001-03-13 Nihon Micro Coating Co Ltd 研掃方法及び装置
JP4519226B2 (ja) * 1999-11-12 2010-08-04 株式会社野田スクリーン プリント基板の研磨装置
US6520833B1 (en) * 2000-06-30 2003-02-18 Lam Research Corporation Oscillating fixed abrasive CMP system and methods for implementing the same
JP2002224940A (ja) * 2001-01-29 2002-08-13 Nihon Micro Coating Co Ltd 研磨装置
JP2004322305A (ja) * 2003-04-11 2004-11-18 Tokki Corp 基板表面平坦化・洗浄装置
CN2670054Y (zh) * 2003-11-25 2005-01-12 阳程科技股份有限公司 往复式上下磨刷机
JP3964886B2 (ja) * 2004-05-24 2007-08-22 日本ミクロコーティング株式会社 パネルクリーニング装置及び方法
KR20060068997A (ko) * 2004-12-17 2006-06-21 삼성전자주식회사 액정표시장치 제조용 연마 및 세정 시스템

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112548787A (zh) * 2020-12-24 2021-03-26 王瑞 一种电器插脚抛光装置

Also Published As

Publication number Publication date
CN101288945A (zh) 2008-10-22
KR20080093390A (ko) 2008-10-21
JP2008284678A (ja) 2008-11-27
CN101288945B (zh) 2010-12-08
KR101143111B1 (ko) 2012-05-08

Similar Documents

Publication Publication Date Title
TW200841987A (en) Panel grinding device
US5276999A (en) Machine for polishing surface of glass plate
TWI329551B (en) Double face plane polishing machine and method for polishing rectangular workpiece
TWI443768B (zh) A plate glass conveyance device and an exfoliating device
CN101977733A (zh) 用于修饰表面的方法、系统及装置
CN101909814A (zh) 研磨装置和研磨方法
KR101114726B1 (ko) 패널 클리닝 장치 및 방법
TW201247362A (en) Method of polishing plate-shaped body
TWI519249B (zh) Zipper with the chain of the grinding device and zipper with the ring
JP5395408B2 (ja) 揚送研磨装置
CN210966272U (zh) 玻璃加工用的表面清洁设备
TW200830003A (en) Apparatus for rubbing the alignment layer on a substrate
JPH1199458A (ja) 板状部材角縁面取装置
CN201208714Y (zh) 砂带式管材研磨机
CN215281198U (zh) 竹制品加工用毛竹片青面处理装置
JP2001062696A (ja) 研掃方法及び装置
KR20190078801A (ko) 기판 처리 장치
CN210415883U (zh) 不干胶除尘装置
JP4630840B2 (ja) 遊技媒体研磨装置
JP5243927B2 (ja) 研磨布の装着構造
JP5212983B2 (ja) 揚送研磨装置
JP2002210658A (ja) 研掃材の循環制御方法、および同装置
JPH11104341A (ja) パチンコ玉の揚送研磨装置
JP5520402B2 (ja) 揚送研磨装置
CN213164811U (zh) 研磨设备