TW200839432A - Method for patterning a surface - Google Patents

Method for patterning a surface Download PDF

Info

Publication number
TW200839432A
TW200839432A TW096146280A TW96146280A TW200839432A TW 200839432 A TW200839432 A TW 200839432A TW 096146280 A TW096146280 A TW 096146280A TW 96146280 A TW96146280 A TW 96146280A TW 200839432 A TW200839432 A TW 200839432A
Authority
TW
Taiwan
Prior art keywords
substrate
paste
stamp
feature
elastomeric
Prior art date
Application number
TW096146280A
Other languages
English (en)
Chinese (zh)
Inventor
Brian T Mayers
Jeff Carbeck
Wajeeh Saadi
George M Whitesides
Ralf Kugler
Monika Kursawe
Johannes Canisius
Original Assignee
Nano Terra Inc
Merck Patent Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nano Terra Inc, Merck Patent Gmbh filed Critical Nano Terra Inc
Publication of TW200839432A publication Critical patent/TW200839432A/zh

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M3/00Printing processes to produce particular kinds of printed work, e.g. patterns
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00Manufacture or treatment of nanostructures
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F7/00Signs, name or number plates, letters, numerals, or symbols; Panels or boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mathematical Physics (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Chemically Coating (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW096146280A 2006-12-05 2007-12-05 Method for patterning a surface TW200839432A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US87280206P 2006-12-05 2006-12-05

Publications (1)

Publication Number Publication Date
TW200839432A true TW200839432A (en) 2008-10-01

Family

ID=39081811

Family Applications (2)

Application Number Title Priority Date Filing Date
TW096146280A TW200839432A (en) 2006-12-05 2007-12-05 Method for patterning a surface
TW102136512A TW201418875A (zh) 2006-12-05 2007-12-05 用於圖案化表面的方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW102136512A TW201418875A (zh) 2006-12-05 2007-12-05 用於圖案化表面的方法

Country Status (7)

Country Link
US (1) US20080152835A1 (enExample)
EP (1) EP2095187A2 (enExample)
JP (1) JP2010512028A (enExample)
KR (1) KR20090107494A (enExample)
CN (1) CN101755237B (enExample)
TW (2) TW200839432A (enExample)
WO (1) WO2008070087A2 (enExample)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9362424B2 (en) * 2007-03-29 2016-06-07 Oscar Khaselev Electrical contacts
US20090139568A1 (en) * 2007-11-19 2009-06-04 Applied Materials, Inc. Crystalline Solar Cell Metallization Methods
US7888168B2 (en) * 2007-11-19 2011-02-15 Applied Materials, Inc. Solar cell contact formation process using a patterned etchant material
WO2009099417A1 (en) * 2008-02-06 2009-08-13 Nano Terra Inc. Stencils with removable backings for forming micron-sized features on surfaces and methods of making and using the same
WO2009114229A1 (en) * 2008-03-14 2009-09-17 Research Triangle Institute Selective planarization method and devices fabricated on planarized structures
JP5149083B2 (ja) * 2008-06-16 2013-02-20 富士フイルム株式会社 パターン形成方法、並びに基板加工方法、モールド構造体の複製方法、及びモールド構造体
US20100163526A1 (en) * 2008-06-27 2010-07-01 Nano Terra Inc. Patterning Processes Comprising Amplified Patterns
WO2010009295A2 (en) 2008-07-16 2010-01-21 Applied Materials, Inc. Hybrid heterojunction solar cell fabrication using a metal layer mask
US8685272B2 (en) * 2008-08-08 2014-04-01 Samsung Electronics Co., Ltd. Composition for etching silicon oxide layer, method for etching semiconductor device using the same, and composition for etching semiconductor device
CN102132422A (zh) * 2008-08-27 2011-07-20 应用材料股份有限公司 利用印刷介电阻障的背接触太阳能电池
JP5363856B2 (ja) * 2009-03-30 2013-12-11 富士フイルム株式会社 パターン形成方法
US20100252955A1 (en) * 2009-04-01 2010-10-07 Nano Terra Inc. Methods of Patterning Substrates Using Microcontact Printed Polymer Resists and Articles Prepared Therefrom
TW201128301A (en) * 2009-08-21 2011-08-16 Nano Terra Inc Methods for patterning substrates using heterogeneous stamps and stencils and methods of making the stamps and stencils
US20120097329A1 (en) * 2010-05-21 2012-04-26 Merck Patent Gesellschaft Stencils for High-Throughput Micron-Scale Etching of Substrates and Processes of Making and Using the Same
US20120070570A1 (en) * 2010-09-16 2012-03-22 Xerox Corporation Conductive thick metal electrode forming method
CN104011882A (zh) 2012-01-12 2014-08-27 应用材料公司 制造太阳能电池装置的方法
JP6136186B2 (ja) * 2012-10-16 2017-05-31 日立化成株式会社 液状組成物
US9550940B2 (en) 2012-10-16 2017-01-24 Hitachi Chemical Company, Ltd. Etching material
JP6011234B2 (ja) * 2012-10-16 2016-10-19 日立化成株式会社 組成物
JP2014082330A (ja) * 2012-10-16 2014-05-08 Hitachi Chemical Co Ltd SiN膜の除去方法
KR20140142005A (ko) * 2013-06-03 2014-12-11 삼성디스플레이 주식회사 기판 상에 막을 코팅하는 방법
US20160090488A1 (en) * 2013-09-09 2016-03-31 FunNano USA, Inc. Mesh-like micro- and nanostructure for optically transparent conductive coatings and method for producing same
US20150118444A1 (en) * 2013-10-31 2015-04-30 General Electric Company Methods of manufacturing silica-forming articles having engineered surfaces to enhance resistance to creep sliding under high-temperature loading
WO2015140775A1 (en) * 2014-03-19 2015-09-24 Utilight Ltd. Printing high aspect ratio patterns
US9868902B2 (en) 2014-07-17 2018-01-16 Soulbrain Co., Ltd. Composition for etching
JP2016086187A (ja) * 2016-02-01 2016-05-19 日立化成株式会社 SiN膜の除去方法
WO2018026378A1 (en) * 2016-08-05 2018-02-08 Applied Materials, Inc. Method of imprint lithography of conductive materials; stamp for imprint lithography, and apparatus for imprint lithograph
CN109470675B (zh) * 2017-09-08 2024-04-02 清华大学 分子载体的制备方法
KR102081490B1 (ko) * 2017-12-07 2020-02-25 인하대학교 산학협력단 비닐계 호모폴리머 이온성 젤의 녹는점을 이용한 스탬핑 전사방법 및 이에 의하여 전사된 비닐계 호모폴리머 이온성 젤
CN110039890B (zh) * 2019-04-18 2020-09-18 云南开放大学 印刷色泽更亮丽的印刷装置
JP7205413B2 (ja) * 2019-08-07 2023-01-17 株式会社Sumco レーザマーク付きシリコンウェーハの製造方法
US11549022B2 (en) * 2019-08-13 2023-01-10 The Boeing Company Conductive composites
US20230271445A1 (en) * 2022-02-25 2023-08-31 Intel Corporation Reusable composite stencil for spray processes

Family Cites Families (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2897066A (en) * 1956-10-12 1959-07-28 Hunt Capacitors Ltd A Electrical capacitors
DE1696714B1 (de) * 1968-03-13 1970-12-03 Zeiss Carl Fa Verfahren zur Herstellung eines Kennzeichens auf durchsichtigen Werkstoffen
US3647508A (en) * 1968-08-27 1972-03-07 King Seeley Thermos Co Method of making patterned metal coatings by selective etching of metal
US3716911A (en) * 1969-06-20 1973-02-20 Siemens Ag Method of producing small area semiconductor components
US4021279A (en) * 1972-04-20 1977-05-03 Stichting Reactor Centrum Nederland Method of forming groove pattern
US5296043A (en) * 1990-02-16 1994-03-22 Canon Kabushiki Kaisha Multi-cells integrated solar cell module and process for producing the same
JPH0580530A (ja) * 1991-09-24 1993-04-02 Hitachi Ltd 薄膜パターン製造方法
IT1272665B (it) * 1993-09-23 1997-06-26 Eurosolare Spa Procedimento per la preparazione di moduli fotovoltaici a base di silicio cristallino
US5512131A (en) * 1993-10-04 1996-04-30 President And Fellows Of Harvard College Formation of microstamped patterns on surfaces and derivative articles
US5688366A (en) * 1994-04-28 1997-11-18 Canon Kabushiki Kaisha Etching method, method of producing a semiconductor device, and etchant therefor
JP3057599B2 (ja) * 1994-07-06 2000-06-26 キヤノン株式会社 洗浄装置及び洗浄方法
WO1997006013A1 (en) * 1995-08-04 1997-02-20 International Business Machines Corporation Lithographic surface or thin layer modification
US5772905A (en) * 1995-11-15 1998-06-30 Regents Of The University Of Minnesota Nanoimprint lithography
US5725788A (en) * 1996-03-04 1998-03-10 Motorola Apparatus and method for patterning a surface
US6048623A (en) * 1996-12-18 2000-04-11 Kimberly-Clark Worldwide, Inc. Method of contact printing on gold coated films
JPH11243224A (ja) * 1997-12-26 1999-09-07 Canon Inc 光起電力素子モジュール及びその製造方法並びに非接触処理方法
US6334960B1 (en) * 1999-03-11 2002-01-01 Board Of Regents, The University Of Texas System Step and flash imprint lithography
US6047637A (en) * 1999-06-17 2000-04-11 Fujitsu Limited Method of paste printing using stencil and masking layer
US6517995B1 (en) * 1999-09-14 2003-02-11 Massachusetts Institute Of Technology Fabrication of finely featured devices by liquid embossing
US6632730B1 (en) * 1999-11-23 2003-10-14 Ebara Solar, Inc. Method for self-doping contacts to a semiconductor
US6294398B1 (en) * 1999-11-23 2001-09-25 The Trustees Of Princeton University Method for patterning devices
KR100812891B1 (ko) * 2000-04-28 2008-03-11 메르크 파텐트 게엠베하 무기물 표면용 에칭 페이스트
JP2002086483A (ja) 2000-09-14 2002-03-26 Matsushita Electric Works Ltd Frp成形品の製造方法
DE10047556A1 (de) * 2000-09-22 2002-04-11 Univ Konstanz Verfahren zur Herstellung einer Solarzelle und nach diesem Verfahren hergestellte Solarzelle
DE10104726A1 (de) * 2001-02-02 2002-08-08 Siemens Solar Gmbh Verfahren zur Strukturierung einer auf einem Trägermaterial aufgebrachten Oxidschicht
US20020130444A1 (en) * 2001-03-15 2002-09-19 Gareth Hougham Post cure hardening of siloxane stamps for microcontact printing
WO2002085639A1 (en) * 2001-04-25 2002-10-31 The Trustees Of Columbia University In The City Of New York Edge transfer lithography
US20030006527A1 (en) * 2001-06-22 2003-01-09 Rabolt John F. Method of fabricating micron-and submicron-scale elastomeric templates for surface patterning
DE10138105A1 (de) * 2001-08-03 2003-02-27 Infineon Technologies Ag Fotolack und Verfahren zum Strukturieren eines solchen Fotolacks
US20030071016A1 (en) * 2001-10-11 2003-04-17 Wu-Sheng Shih Patterned structure reproduction using nonsticking mold
EP1481395B1 (en) * 2002-02-25 2007-01-24 Koninklijke Philips Electronics N.V. Controlling the temperature of a laser diode in a disk drive
EP1378947A1 (en) * 2002-07-01 2004-01-07 Interuniversitair Microelektronica Centrum Vzw Semiconductor etching paste and the use thereof for localised etching of semiconductor substrates
US6957608B1 (en) * 2002-08-02 2005-10-25 Kovio, Inc. Contact print methods
DE10241300A1 (de) * 2002-09-04 2004-03-18 Merck Patent Gmbh Ätzpasten für Siliziumoberflächen und -schichten
AU2003291443A1 (en) * 2002-11-12 2004-06-03 Princeton University Compositions and processes for nanoimprinting
US9040090B2 (en) * 2003-12-19 2015-05-26 The University Of North Carolina At Chapel Hill Isolated and fixed micro and nano structures and methods thereof
US7354845B2 (en) * 2004-08-24 2008-04-08 Otb Group B.V. In-line process for making thin film electronic devices
EP1594001B1 (en) * 2004-05-07 2015-12-30 Obducat AB Device and method for imprint lithography
JP4889962B2 (ja) * 2004-05-14 2012-03-07 昭和電工株式会社 導電性構造体およびその製造方法ならびに燃料電池用セパレータ
KR100667134B1 (ko) * 2004-11-12 2007-01-12 엘지.필립스 엘시디 주식회사 평판표시소자의 제조방법 및 장치
US8721952B2 (en) * 2004-11-16 2014-05-13 International Business Machines Corporation Pneumatic method and apparatus for nano imprint lithography having a conforming mask
US7344955B2 (en) 2004-11-19 2008-03-18 International Business Machines Corporation Cut-and-paste imprint lithographic mold and method therefor
JP4758911B2 (ja) * 2004-12-28 2011-08-31 Rimtec株式会社 金型、インモールドコーティング方法及び被膜を持つ成形品
TWI280159B (en) * 2005-03-29 2007-05-01 Li Bing Huan Method for fabricating nano-adhesive
CN100526053C (zh) * 2005-03-29 2009-08-12 东捷科技股份有限公司 纳米贴纸的制造方法
US7442029B2 (en) * 2005-05-16 2008-10-28 Asml Netherlands B.V. Imprint lithography
EP1731962B1 (en) * 2005-06-10 2008-12-31 Obducat AB Pattern replication with intermediate stamp
KR101366505B1 (ko) * 2005-06-10 2014-02-24 오브듀캇 아베 고리형 올레핀 공중합체를 포함하는 임프린트 스탬프
DE602005010839D1 (de) 2005-06-10 2008-12-18 Obducat Ab Verfahren zum Kopieren eines Modells
TW200705541A (en) * 2005-07-25 2007-02-01 Li Bing Huan Manufacturing method of nano-sticker
CN1800984A (zh) * 2005-12-27 2006-07-12 国家纳米技术产业化基地 一种负型纳米压印方法
US8608972B2 (en) * 2006-12-05 2013-12-17 Nano Terra Inc. Method for patterning a surface

Also Published As

Publication number Publication date
TW201418875A (zh) 2014-05-16
EP2095187A2 (en) 2009-09-02
KR20090107494A (ko) 2009-10-13
WO2008070087A2 (en) 2008-06-12
US20080152835A1 (en) 2008-06-26
CN101755237A (zh) 2010-06-23
WO2008070087A3 (en) 2009-04-30
CN101755237B (zh) 2014-04-09
JP2010512028A (ja) 2010-04-15

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