CN101755237B - 使表面形成图案的方法 - Google Patents

使表面形成图案的方法 Download PDF

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Publication number
CN101755237B
CN101755237B CN200780050792.1A CN200780050792A CN101755237B CN 101755237 B CN101755237 B CN 101755237B CN 200780050792 A CN200780050792 A CN 200780050792A CN 101755237 B CN101755237 B CN 101755237B
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CN
China
Prior art keywords
substrate
slurry
die
stamp
features
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CN200780050792.1A
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English (en)
Chinese (zh)
Other versions
CN101755237A (zh
Inventor
B·T·迈耶斯
J·卡贝克
W·萨阿迪
G·M·怀特塞德斯
R·库格勒
M·库尔萨韦
J·卡尼修斯
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Merck Patent GmbH
Nano Terra Inc
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Merck Patent GmbH
Nano Terra Inc
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Publication of CN101755237A publication Critical patent/CN101755237A/zh
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Expired - Fee Related legal-status Critical Current
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F7/00—Signs, name or number plates, letters, numerals, or symbols; Panels or boards

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  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Chemically Coating (AREA)
CN200780050792.1A 2006-12-05 2007-12-05 使表面形成图案的方法 Expired - Fee Related CN101755237B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US87280206P 2006-12-05 2006-12-05
US60/872,802 2006-12-05
PCT/US2007/024854 WO2008070087A2 (en) 2006-12-05 2007-12-05 Method for patterning a surface

Publications (2)

Publication Number Publication Date
CN101755237A CN101755237A (zh) 2010-06-23
CN101755237B true CN101755237B (zh) 2014-04-09

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN200780050792.1A Expired - Fee Related CN101755237B (zh) 2006-12-05 2007-12-05 使表面形成图案的方法

Country Status (7)

Country Link
US (1) US20080152835A1 (enExample)
EP (1) EP2095187A2 (enExample)
JP (1) JP2010512028A (enExample)
KR (1) KR20090107494A (enExample)
CN (1) CN101755237B (enExample)
TW (2) TW200839432A (enExample)
WO (1) WO2008070087A2 (enExample)

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US7951637B2 (en) * 2008-08-27 2011-05-31 Applied Materials, Inc. Back contact solar cells using printed dielectric barrier
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WO2010115027A1 (en) * 2009-04-01 2010-10-07 Nano Terra Inc. Methods of patterning substrates using microcontact printed polymer resists and articles prepared therefrom
TW201128301A (en) * 2009-08-21 2011-08-16 Nano Terra Inc Methods for patterning substrates using heterogeneous stamps and stencils and methods of making the stamps and stencils
TW201220974A (en) * 2010-05-21 2012-05-16 Nano Terra Inc Stencils for high-throughput micron-scale etching of substrates and processes of making and using the same
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CN104011882A (zh) 2012-01-12 2014-08-27 应用材料公司 制造太阳能电池装置的方法
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JP6136186B2 (ja) * 2012-10-16 2017-05-31 日立化成株式会社 液状組成物
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JP6011234B2 (ja) * 2012-10-16 2016-10-19 日立化成株式会社 組成物
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US20160090488A1 (en) * 2013-09-09 2016-03-31 FunNano USA, Inc. Mesh-like micro- and nanostructure for optically transparent conductive coatings and method for producing same
US20150118444A1 (en) * 2013-10-31 2015-04-30 General Electric Company Methods of manufacturing silica-forming articles having engineered surfaces to enhance resistance to creep sliding under high-temperature loading
US9750141B2 (en) * 2014-03-19 2017-08-29 Utilight Ltd Printing high aspect ratio patterns
US9868902B2 (en) 2014-07-17 2018-01-16 Soulbrain Co., Ltd. Composition for etching
JP2016086187A (ja) * 2016-02-01 2016-05-19 日立化成株式会社 ＳｉＮ膜の除去方法
WO2018026378A1 (en) * 2016-08-05 2018-02-08 Applied Materials, Inc. Method of imprint lithography of conductive materials; stamp for imprint lithography, and apparatus for imprint lithograph
CN109470675B (zh) * 2017-09-08 2024-04-02 清华大学 分子载体的制备方法
KR102081490B1 (ko) * 2017-12-07 2020-02-25 인하대학교 산학협력단 비닐계 호모폴리머 이온성 젤의 녹는점을 이용한 스탬핑 전사방법 및 이에 의하여 전사된 비닐계 호모폴리머 이온성 젤
CN110039890B (zh) * 2019-04-18 2020-09-18 云南开放大学 印刷色泽更亮丽的印刷装置
JP7205413B2 (ja) * 2019-08-07 2023-01-17 株式会社Sumco レーザマーク付きシリコンウェーハの製造方法
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Also Published As

Publication number Publication date
US20080152835A1 (en) 2008-06-26
WO2008070087A2 (en) 2008-06-12
EP2095187A2 (en) 2009-09-02
JP2010512028A (ja) 2010-04-15
WO2008070087A3 (en) 2009-04-30
CN101755237A (zh) 2010-06-23
TW201418875A (zh) 2014-05-16
KR20090107494A (ko) 2009-10-13
TW200839432A (en) 2008-10-01

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