TW200817159A - An electronic inlay module for electronic cards and tags - Google Patents

An electronic inlay module for electronic cards and tags

Info

Publication number
TW200817159A
TW200817159A TW096112304A TW96112304A TW200817159A TW 200817159 A TW200817159 A TW 200817159A TW 096112304 A TW096112304 A TW 096112304A TW 96112304 A TW96112304 A TW 96112304A TW 200817159 A TW200817159 A TW 200817159A
Authority
TW
Taiwan
Prior art keywords
electronic
tags
inlay
cards
electronic inlay
Prior art date
Application number
TW096112304A
Other languages
English (en)
Other versions
TWI385070B (zh
Inventor
Robert Singleton
Original Assignee
Innovatier Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Innovatier Inc filed Critical Innovatier Inc
Publication of TW200817159A publication Critical patent/TW200817159A/zh
Application granted granted Critical
Publication of TWI385070B publication Critical patent/TWI385070B/zh

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/064—Hermetically-sealed casings sealed by potting, e.g. waterproof resin poured in a rigid casing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1311—Foil encapsulation, e.g. of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1322—Encapsulation comprising more than one layer
TW096112304A 2006-04-10 2007-04-09 用於電子卡及電子標籤之電子嵌體模組 TWI385070B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US79052806P 2006-04-10 2006-04-10

Publications (2)

Publication Number Publication Date
TW200817159A true TW200817159A (en) 2008-04-16
TWI385070B TWI385070B (zh) 2013-02-11

Family

ID=38656001

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096112304A TWI385070B (zh) 2006-04-10 2007-04-09 用於電子卡及電子標籤之電子嵌體模組

Country Status (16)

Country Link
US (1) US7959085B2 (zh)
EP (1) EP2013821B1 (zh)
JP (1) JP5209602B2 (zh)
KR (1) KR101325422B1 (zh)
CN (1) CN101467164B (zh)
AT (1) ATE528975T1 (zh)
AU (1) AU2007243634A1 (zh)
BR (1) BRPI0710244B1 (zh)
CA (1) CA2648900A1 (zh)
IL (1) IL194564A0 (zh)
MX (1) MX2008013083A (zh)
MY (1) MY144445A (zh)
RU (1) RU2485587C2 (zh)
TW (1) TWI385070B (zh)
WO (1) WO2007126748A2 (zh)
ZA (1) ZA200808774B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
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TWI511050B (zh) * 2009-12-23 2015-12-01 Hynix Semiconductor Inc Ｌｅｄ封裝及包含此ｌｅｄ封裝之ｒｆｉｄ系統

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI511050B (zh) * 2009-12-23 2015-12-01 Hynix Semiconductor Inc Ｌｅｄ封裝及包含此ｌｅｄ封裝之ｒｆｉｄ系統

Also Published As

Publication number Publication date
TWI385070B (zh) 2013-02-11
KR101325422B1 (ko) 2013-11-04
AU2007243634A1 (en) 2007-11-08
RU2008144309A (ru) 2010-05-20
BRPI0710244B1 (pt) 2022-02-08
WO2007126748A2 (en) 2007-11-08
EP2013821B1 (en) 2011-10-12
EP2013821A2 (en) 2009-01-14
JP5209602B2 (ja) 2013-06-12
JP2009533760A (ja) 2009-09-17
CA2648900A1 (en) 2007-11-08
WO2007126748A3 (en) 2008-03-27
US7959085B2 (en) 2011-06-14
ATE528975T1 (de) 2011-10-15
MX2008013083A (es) 2008-12-16
ZA200808774B (en) 2009-07-29
IL194564A0 (en) 2009-08-03
MY144445A (en) 2011-09-15
BRPI0710244A2 (pt) 2021-07-06
RU2485587C2 (ru) 2013-06-20
CN101467164B (zh) 2013-08-21
KR20090014265A (ko) 2009-02-09
US20070235548A1 (en) 2007-10-11
CN101467164A (zh) 2009-06-24

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