US4751481A - Molded resonator - Google Patents

Molded resonator Download PDF

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Publication number
US4751481A
US4751481A US06/947,016 US94701686A US4751481A US 4751481 A US4751481 A US 4751481A US 94701686 A US94701686 A US 94701686A US 4751481 A US4751481 A US 4751481A
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US
United States
Prior art keywords
resonator
molded
resonator element
dielectric material
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
US06/947,016
Inventor
Andrzej T. Guzik
Alvin D. Kluesing
II Joseph A. Budano
Robert S. Kaltenecker
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Motorola Solutions Inc
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Motorola Solutions Inc
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Publication date
Application filed by Motorola Solutions Inc filed Critical Motorola Solutions Inc
Priority to US06/947,016 priority Critical patent/US4751481A/en
Assigned to MOTOROLA, INC. A CORP. OF DE. reassignment MOTOROLA, INC. A CORP. OF DE. ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: BUDANO, JOSEPH A. II, GUZIK, ANDRZEJ T., KALTENECKER, ROBERT S., KLUESING, ALVIN D.
Application granted granted Critical
Publication of US4751481A publication Critical patent/US4751481A/en
Anticipated expiration legal-status Critical
Application status is Expired - Fee Related legal-status Critical

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P7/00Resonators of the waveguide type
    • H01P7/08Strip line resonators
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H01P11/008Manufacturing resonators
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49016Antenna or wave energy "plumbing" making

Abstract

The molded resonator includes at least one formed resonator element having an resonator portion and opposed end leg portions which provide electrical connections to the main portion. A dielectric portion is molded about the resonator element. A conductive ground plane is carried by the dielectric portion and electrically shields the resonator element. The resonator element is formed of wire having a circular cross-section.

Description

BACKGROUND OF THE INVENTION

This invention relates to transmission line resonators in general and particularly to molded resonators. Prior art transmission line resonators, such as stripline resonators having solid dielectric materials were constructed by a lamination process. For example, in one known method, a circuit trace is formed on a dielectric substrate, a second dielectric substrate is placed over and bonded to the first substrate, and an outer ground plane is then bonded to the substrates. This prior art approach includes a number of limitations such as expense of manufacture, limited electrical specifications, difficulties in making the external connections to the stripline elements, and microphonics (i.e. electrical instability during mechanical vibration). These limitations are overcome by the molded resonator.

SUMMARY OF THE INVENTION

This molded resonator includes at least one preformed resonator element that is molded into a monolithic dielectric structure.

This molded resonator includes at least one formed resonator element having a main resonator portion and opposed end leg portions for providing electrical connections to the main portion. The dielectric material is molded about the resonator element. A conductive ground plane is carried by the dielectric portion and electrically shields the resonator element.

In one aspect of the invention, the resonator element is formed of wire having a circular cross-section. In another aspect of the invention, the resonator includes two formed resonator elements. In still another aspect of the invention, one of the leg portions is connected to the conductive ground plane.

A method of manufacturing a resonator includes the steps of forming at least one resonator element; placing the one resonator element in a mold; injecting a dielectric material to form a first molded member having corner support portions for precisely locating the member in a second mold; placing the first molded member in a second mold and injecting additional dielectric material to form a second molded member; and metallizing the second molded member to provide a ground plane for shielding the resonator element.

In one aspect of the method of manufacturing a resonator, the first molding member is formed with through holes and the additional dielectric materials is injected into the through holes thereby interconnecting the additional dielectric material on opposite sides of the resonator.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a top plan view of a molded resonator after the first molding operation.

FIG. 2 is a side elevational view of the molded resonator of FIG. 1.

FIG. 3 is a bottom plan view of the molded resonator of FIG. 1.

FIG. 4 is a side elevational view of the molded resonator after the second molding operation.

FIG. 5 is a bottom plan view of the molded resonator of FIG. 4.

FIG. 6 is a bottom plan view of the completed molded resonator.

DESCRIPTION OF THE PREFERRED EMBODIMENT

Referring now by characters of reference to the drawings and first to FIG. 1, it will be understood that the molded resonator includes first and second resonator elements 11 and 12 that are preformed into predetermined shapes for providing desired electrical characteristics. The resonator elements 11 and 12 are formed of conductive material which, in the preferred embodiment, is hard drawn copper wire having a circular cross-section. While two resonator elements are illustrated in the preferred embodiment, a single resonator element or three or more can be utilized.

Each of the resonator elements 11 and 12 includes a main resonator portion, 13 and 14 respectively, which is formed in a single plane. In the illustrated embodiment, both portions 13 and 14 are substantially "U" shaped. Any other shape including a straight line can be utilized provided the shape and length are properly choosen to achieve the desired electrical characteristics in the finished resonator.

As more clearly illustrated in FIGS. 2 and 3, resonator element 11 includes depending legs 15 and 16 located at opposite ends of the main resonator portion 13 and extending substantially perpendicular to the plane of the main portion 13. Likewise, resonator element 12 includes, depending legs 17 and 18. The legs 15-18 provide the necessary electrical connections between the resonator main portions 13 and 14 and external circuits.

The resonator elements 11 and 12 are placed in a precision mold (not shown) which locates the legs 15-18 while opposed side mold locating pins clamp and support the main resonator portions 13 and 14 in a precise predetermined location. A dielectric material is then injected into the mold to form the first molded member 19. After the first molding operation, the first molded member 19 has a plurality of holes 20 resulting from the mold locating pins that engage the main portions 13 and 14. Through holes 22 are provided in the first molded member 19, which also includes support protrusions 23 used for mechanical support in the second molding operation as well as, corner support portions 24 that are used to provide for exact location of the first molded portion 19 during the second molding operation.

The first molded portion 19 is then placed in a second mold (not shown) and additional dielectric material is injected to form the second molded member 25, illustrated in FIGS. 4 and 5. The second molded member 25 provides a substantially parallelepiped structure that includes on its lower surface, two locating protrusions 26 and 27 used for positioning the molded resonator when used in a circuit such as a two-way portable radio. The legs 15-18 are sheared off substantially even with the surface of the second molded member 25. At legs 15 and 17, the second molded member 25 includes island portions 30 that have their surfaces in the plane of the surface of the second molded member. The island portions 30 are surrounded by ring depressions 31 in the surface of second molded member 25. A layer of resist material is deposited in the depressions 31. The exterior of a second molded member 25 is then metallized as by sputtering to provide an electrical shield or ground plane 32 around the resonator elements 11 and 12 thereby completing the molded resonator 10, as illustrated in FIG. 6.

The metallized ground plane 32 makes electrical connection to the legs 16 and 18. The metallization at islands 30 provides electrical connection to legs 15 and 17. The resist in depressions 31 prevent metallization of that area thereby electrically isolating islands 30 from the ground plane 32 on the surfaces of molded resonator 10. In the event that the legs 16 and 18 are not to be grounded, they can also be connected at islands 30 like legs 15 and 18.

It is thought that the structural feature and functional advantages of the improved molded resonator have become fully apparent from the foregoing description of parts, but for completeness of disclosure a brief description of the manufacture operation of the resonator will be given. It will be understood that the particular form of the resonator elements 13 and 14 depend upon the desired operating characteristics of the molded resonator 10. The arrangement once chosen provides a high Q resonator due in part to the circular cross-section of the resonator elements 11 and 12.

The first molding, illustrated in FIGS. 1-3, is used for the precise positioning of the resonator elements 11 and 12. During the second molding the corner portions 24 are used to precisely locate and support the first molded member 19 in the mold. The protrusions 23 by engaging the mold prevent flexing, bending or movement of the first molded member 19 during the high pressure molding operation. During the second molding operation, a substantially continuous and smooth outer surface is formed to provide a uniform surface for the application of the metallized ground plane 32 to complete the resonator 10. The support protrusions 23 and, corner support portions 24 are spaced from the resonator elements 11 and 12. This spacing is important to minimize the effects of discontinuities in the ground plane 32 that can exist at boundaries of the dielectric material from the first and second molding processes.

The through holes 22 provide direct interconnection of the dielectric material of the second molding process in addition to the interconnection that occurs at the periphery of the second molded member 25, thereby providing increased structural integrity of the resonator. In the preferred embodiment, the dielectric material used in both molding processes is polyetherimide having a 10% fiberglass content such as that sold under the tradename ULTEM 2100 by General Electric Company.

After metallization, the high Q, mechanically stable resonator 10 can be incorporated into a circuit such as a two-way portable radio by making electrical connections at pads 30 and to the ground plane 32.

Claims (9)

We claim as our invention:
1. A molded resonator comprising:
at least one formed resonator element having a main resonator portion and opposed end leg portions providing electrical connection to the main portion,
a dielectric portion molded about the resonator element, including a first molding of dielectric material in which the resonator is precisely positioned, and a second molding of dielectric material providing a substantially continuous and smooth outer surface, and
a conductive ground plane carried by the dielectric portion outer surface electrically shields the resonator element.
2. A molded resonator as defined in claim 1, in which the resonator element is formed of wire having a circular cross-section.
3. A molded resonator as defined in claim 1, further comprising two formed resonator elements.
4. A molded resonator as defined in claim 1, in which one of the leg portions is connected to the conductive ground plane.
5. A molded resonator as defined in claim 1, in which the resonator element is formed of wire having a circular cross-section, and
one of the leg portions of the resonator element is connected to the ground plane.
6. A method of manufacturing a resonator comprising the steps of:
forming at least one resonator element,
placing said at least one resonator element in a mold and injecting a dielectric material to form a first molded member having corner support portions for precisely locating the member in a second mold;
placing the first molded member in a second mold and injecting additional dielectric material to form a second molded member; and
metallizing the second molded member to provide a ground plane for shielding the resonator element.
7. The method of claim 6 in which the first molded member is formed with through holes and the additional dielectric material is injected into the through holes thereby interconnecting the additional dielectric material on opposite sides of the resonator.
8. A method of manufacturing a resonator comprising the steps of:
forming at least one resonator element,
placing said at least one resonator element in a mold and injecting a dielectric material to form a first molded member having support portions for precisely locating the member in a second mold;
placing the first molded member in a second mold and injecting additional dielectric material to form a second molded member; and
metallizing the second molded member to provide a ground plane for shielding the resonator element.
9. The method of claim 8 in which the support portions of the first molded members are spaced from said resonator element.
US06/947,016 1986-12-29 1986-12-29 Molded resonator Expired - Fee Related US4751481A (en)

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US06/947,016 US4751481A (en) 1986-12-29 1986-12-29 Molded resonator

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Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5091218A (en) * 1989-03-06 1992-02-25 Motorola, Inc. Method for producing a metallized pattern on a substrate
EP0503466A1 (en) * 1991-03-12 1992-09-16 Motorola, Inc. Resonant circuit element having insignificant microphonic effects
US5294749A (en) * 1991-09-23 1994-03-15 Motorola, Inc. Surface mountable molded electronic component
US5398399A (en) * 1992-08-31 1995-03-21 Siemens Matsushita Components Gmbh Process for metallizing monolithic microwave ceramic filters
US5572180A (en) * 1995-11-16 1996-11-05 Motorola, Inc. Surface mountable inductor
US20070012771A1 (en) * 2005-07-15 2007-01-18 Innovatier, Inc. RFID bracelet and method for manufacturing a RFID bracelet
US20070235548A1 (en) * 2006-04-10 2007-10-11 Innovatier, Inc. Electronic inlay module used for electronic cards and tags
US20070290048A1 (en) * 2006-06-20 2007-12-20 Innovatier, Inc. Embedded electronic device and method for manufacturing an embedded electronic device
US20080055824A1 (en) * 2006-08-25 2008-03-06 Innovatier, Inc. Battery powered device having a protective frame
US20080160397A1 (en) * 2006-08-25 2008-07-03 Innovatier, Inc Battery powered device having a protective frame
US20080237356A1 (en) * 2007-03-23 2008-10-02 Innovatier, Inc. Step card and method for making a step card
US20080282540A1 (en) * 2007-05-14 2008-11-20 Innovatier, Inc. Method for making advanced smart cards with integrated electronics using isotropic thermoset adhesive materials with high quality exterior surfaces
US20090096614A1 (en) * 2007-10-15 2009-04-16 Innovatier, Inc. Rfid power bracelet and method for manufacturing a rfid power bracelet
US20090181215A1 (en) * 2008-01-15 2009-07-16 Innovatier, Inc. Plastic card and method for making a plastic card

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Publication number Priority date Publication date Assignee Title
GB798629A (en) * 1955-09-01 1958-07-23 Standard Telephones Cables Ltd Electrical high frequency transmission line filter arrangements
GB886311A (en) * 1959-06-30 1962-01-03 Ibm Improvements in or relating to electrical strip line structures
US3142808A (en) * 1960-12-29 1964-07-28 Ibm Transmission line filter having coupling extending quarter wave length between strip line resonators
US3512254A (en) * 1965-08-10 1970-05-19 Corning Glass Works Method of making an electrical device
US3534301A (en) * 1967-06-12 1970-10-13 Bell Telephone Labor Inc Temperature compensated integrated circuit type narrowband stripline filter
US3590329A (en) * 1969-05-05 1971-06-29 Sarkes Tarzian Coil assembly and method of making the same
US3617955A (en) * 1969-04-08 1971-11-02 Bell Telephone Labor Inc Temperature compensated stripline filter
US3774221A (en) * 1972-06-20 1973-11-20 R Francis Multielement radio-frequency antenna structure having linear and helical conductive elements
US3990024A (en) * 1975-01-06 1976-11-02 Xerox Corporation Microstrip/stripline impedance transformer
US4152679A (en) * 1977-11-14 1979-05-01 Hull Corporation Microminiature electrical delay line utilizing thin film inductor array with magnetic enhancement and coupling
US4193185A (en) * 1978-01-12 1980-03-18 Liautaud James P Method of making a high tolerance coil assembly
US4266206A (en) * 1978-08-31 1981-05-05 Motorola, Inc. Stripline filter device
US4398164A (en) * 1980-01-24 1983-08-09 Murata Manufacturing Co., Ltd. Coaxial resonator
US4484159A (en) * 1982-03-22 1984-11-20 Allied Corporation Filter connector with discrete particle dielectric
US4560965A (en) * 1983-11-21 1985-12-24 British Telecommunications Plc Mounting dielectric resonators
US4563662A (en) * 1983-05-25 1986-01-07 British Telecommunications Mounting dielectric resonators
US4603311A (en) * 1982-10-29 1986-07-29 Thomson-Csf Twin strip resonators and filters constructed from these resonators
US4603023A (en) * 1983-12-01 1986-07-29 International Business Machines Corporation Method of making a hybrid dielectric probe interposer
US4609892A (en) * 1985-09-30 1986-09-02 Motorola, Inc. Stripline filter apparatus and method of making the same
US4614922A (en) * 1984-10-05 1986-09-30 Sanders Associates, Inc. Compact delay line

Patent Citations (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB798629A (en) * 1955-09-01 1958-07-23 Standard Telephones Cables Ltd Electrical high frequency transmission line filter arrangements
GB886311A (en) * 1959-06-30 1962-01-03 Ibm Improvements in or relating to electrical strip line structures
US3142808A (en) * 1960-12-29 1964-07-28 Ibm Transmission line filter having coupling extending quarter wave length between strip line resonators
US3512254A (en) * 1965-08-10 1970-05-19 Corning Glass Works Method of making an electrical device
US3534301A (en) * 1967-06-12 1970-10-13 Bell Telephone Labor Inc Temperature compensated integrated circuit type narrowband stripline filter
US3617955A (en) * 1969-04-08 1971-11-02 Bell Telephone Labor Inc Temperature compensated stripline filter
US3590329A (en) * 1969-05-05 1971-06-29 Sarkes Tarzian Coil assembly and method of making the same
US3774221A (en) * 1972-06-20 1973-11-20 R Francis Multielement radio-frequency antenna structure having linear and helical conductive elements
US3990024A (en) * 1975-01-06 1976-11-02 Xerox Corporation Microstrip/stripline impedance transformer
US4152679A (en) * 1977-11-14 1979-05-01 Hull Corporation Microminiature electrical delay line utilizing thin film inductor array with magnetic enhancement and coupling
US4193185A (en) * 1978-01-12 1980-03-18 Liautaud James P Method of making a high tolerance coil assembly
US4266206A (en) * 1978-08-31 1981-05-05 Motorola, Inc. Stripline filter device
US4398164A (en) * 1980-01-24 1983-08-09 Murata Manufacturing Co., Ltd. Coaxial resonator
US4484159A (en) * 1982-03-22 1984-11-20 Allied Corporation Filter connector with discrete particle dielectric
US4603311A (en) * 1982-10-29 1986-07-29 Thomson-Csf Twin strip resonators and filters constructed from these resonators
US4563662A (en) * 1983-05-25 1986-01-07 British Telecommunications Mounting dielectric resonators
US4560965A (en) * 1983-11-21 1985-12-24 British Telecommunications Plc Mounting dielectric resonators
US4603023A (en) * 1983-12-01 1986-07-29 International Business Machines Corporation Method of making a hybrid dielectric probe interposer
US4614922A (en) * 1984-10-05 1986-09-30 Sanders Associates, Inc. Compact delay line
US4609892A (en) * 1985-09-30 1986-09-02 Motorola, Inc. Stripline filter apparatus and method of making the same

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5091218A (en) * 1989-03-06 1992-02-25 Motorola, Inc. Method for producing a metallized pattern on a substrate
EP0503466A1 (en) * 1991-03-12 1992-09-16 Motorola, Inc. Resonant circuit element having insignificant microphonic effects
US5294749A (en) * 1991-09-23 1994-03-15 Motorola, Inc. Surface mountable molded electronic component
US5398399A (en) * 1992-08-31 1995-03-21 Siemens Matsushita Components Gmbh Process for metallizing monolithic microwave ceramic filters
US5572180A (en) * 1995-11-16 1996-11-05 Motorola, Inc. Surface mountable inductor
US7607249B2 (en) 2005-07-15 2009-10-27 Innovatier Inc. RFID bracelet and method for manufacturing a RFID bracelet
US20070012771A1 (en) * 2005-07-15 2007-01-18 Innovatier, Inc. RFID bracelet and method for manufacturing a RFID bracelet
US20070235548A1 (en) * 2006-04-10 2007-10-11 Innovatier, Inc. Electronic inlay module used for electronic cards and tags
US7959085B2 (en) 2006-04-10 2011-06-14 Innovatier, Inc. Electronic inlay module used for electronic cards and tags
US20070290048A1 (en) * 2006-06-20 2007-12-20 Innovatier, Inc. Embedded electronic device and method for manufacturing an embedded electronic device
US8727224B2 (en) 2006-06-20 2014-05-20 Innovatier, Inc. Embedded electronic device and method for manufacturing an embedded electronic device
US20080160397A1 (en) * 2006-08-25 2008-07-03 Innovatier, Inc Battery powered device having a protective frame
US20080055824A1 (en) * 2006-08-25 2008-03-06 Innovatier, Inc. Battery powered device having a protective frame
US20080237356A1 (en) * 2007-03-23 2008-10-02 Innovatier, Inc. Step card and method for making a step card
US20080282540A1 (en) * 2007-05-14 2008-11-20 Innovatier, Inc. Method for making advanced smart cards with integrated electronics using isotropic thermoset adhesive materials with high quality exterior surfaces
US20090096614A1 (en) * 2007-10-15 2009-04-16 Innovatier, Inc. Rfid power bracelet and method for manufacturing a rfid power bracelet
US20090181215A1 (en) * 2008-01-15 2009-07-16 Innovatier, Inc. Plastic card and method for making a plastic card

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