US4751481A - Molded resonator - Google Patents
Molded resonator Download PDFInfo
- Publication number
- US4751481A US4751481A US06/947,016 US94701686A US4751481A US 4751481 A US4751481 A US 4751481A US 94701686 A US94701686 A US 94701686A US 4751481 A US4751481 A US 4751481A
- Authority
- US
- United States
- Prior art keywords
- resonator
- molded
- resonator element
- dielectric material
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P7/00—Resonators of the waveguide type
- H01P7/08—Strip line resonators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
- H01P11/008—Manufacturing resonators
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
Definitions
- This invention relates to transmission line resonators in general and particularly to molded resonators.
- Prior art transmission line resonators such as stripline resonators having solid dielectric materials were constructed by a lamination process. For example, in one known method, a circuit trace is formed on a dielectric substrate, a second dielectric substrate is placed over and bonded to the first substrate, and an outer ground plane is then bonded to the substrates.
- This prior art approach includes a number of limitations such as expense of manufacture, limited electrical specifications, difficulties in making the external connections to the stripline elements, and microphonics (i.e. electrical instability during mechanical vibration). These limitations are overcome by the molded resonator.
- This molded resonator includes at least one preformed resonator element that is molded into a monolithic dielectric structure.
- This molded resonator includes at least one formed resonator element having a main resonator portion and opposed end leg portions for providing electrical connections to the main portion.
- the dielectric material is molded about the resonator element.
- a conductive ground plane is carried by the dielectric portion and electrically shields the resonator element.
- the resonator element is formed of wire having a circular cross-section.
- the resonator includes two formed resonator elements.
- one of the leg portions is connected to the conductive ground plane.
- a method of manufacturing a resonator includes the steps of forming at least one resonator element; placing the one resonator element in a mold; injecting a dielectric material to form a first molded member having corner support portions for precisely locating the member in a second mold; placing the first molded member in a second mold and injecting additional dielectric material to form a second molded member; and metallizing the second molded member to provide a ground plane for shielding the resonator element.
- the first molding member is formed with through holes and the additional dielectric materials is injected into the through holes thereby interconnecting the additional dielectric material on opposite sides of the resonator.
- FIG. 1 is a top plan view of a molded resonator after the first molding operation.
- FIG. 2 is a side elevational view of the molded resonator of FIG. 1.
- FIG. 3 is a bottom plan view of the molded resonator of FIG. 1.
- FIG. 4 is a side elevational view of the molded resonator after the second molding operation.
- FIG. 5 is a bottom plan view of the molded resonator of FIG. 4.
- FIG. 6 is a bottom plan view of the completed molded resonator.
- the molded resonator includes first and second resonator elements 11 and 12 that are preformed into predetermined shapes for providing desired electrical characteristics.
- the resonator elements 11 and 12 are formed of conductive material which, in the preferred embodiment, is hard drawn copper wire having a circular cross-section. While two resonator elements are illustrated in the preferred embodiment, a single resonator element or three or more can be utilized.
- Each of the resonator elements 11 and 12 includes a main resonator portion, 13 and 14 respectively, which is formed in a single plane.
- both portions 13 and 14 are substantially "U" shaped. Any other shape including a straight line can be utilized provided the shape and length are properly choosen to achieve the desired electrical characteristics in the finished resonator.
- resonator element 11 includes depending legs 15 and 16 located at opposite ends of the main resonator portion 13 and extending substantially perpendicular to the plane of the main portion 13.
- resonator element 12 includes, depending legs 17 and 18. The legs 15-18 provide the necessary electrical connections between the resonator main portions 13 and 14 and external circuits.
- the resonator elements 11 and 12 are placed in a precision mold (not shown) which locates the legs 15-18 while opposed side mold locating pins clamp and support the main resonator portions 13 and 14 in a precise predetermined location.
- a dielectric material is then injected into the mold to form the first molded member 19.
- the first molded member 19 has a plurality of holes 20 resulting from the mold locating pins that engage the main portions 13 and 14.
- Through holes 22 are provided in the first molded member 19, which also includes support protrusions 23 used for mechanical support in the second molding operation as well as, corner support portions 24 that are used to provide for exact location of the first molded portion 19 during the second molding operation.
- the first molded portion 19 is then placed in a second mold (not shown) and additional dielectric material is injected to form the second molded member 25, illustrated in FIGS. 4 and 5.
- the second molded member 25 provides a substantially parallelepiped structure that includes on its lower surface, two locating protrusions 26 and 27 used for positioning the molded resonator when used in a circuit such as a two-way portable radio.
- the legs 15-18 are sheared off substantially even with the surface of the second molded member 25.
- the second molded member 25 includes island portions 30 that have their surfaces in the plane of the surface of the second molded member.
- the island portions 30 are surrounded by ring depressions 31 in the surface of second molded member 25.
- a layer of resist material is deposited in the depressions 31.
- the exterior of a second molded member 25 is then metallized as by sputtering to provide an electrical shield or ground plane 32 around the resonator elements 11 and 12 thereby completing the molded resonator 10, as illustrated in
- the metallized ground plane 32 makes electrical connection to the legs 16 and 18.
- the metallization at islands 30 provides electrical connection to legs 15 and 17.
- the resist in depressions 31 prevent metallization of that area thereby electrically isolating islands 30 from the ground plane 32 on the surfaces of molded resonator 10.
- the legs 16 and 18 are not to be grounded, they can also be connected at islands 30 like legs 15 and 18.
- the first molding illustrated in FIGS. 1-3, is used for the precise positioning of the resonator elements 11 and 12.
- the corner portions 24 are used to precisely locate and support the first molded member 19 in the mold.
- the protrusions 23 by engaging the mold prevent flexing, bending or movement of the first molded member 19 during the high pressure molding operation.
- a substantially continuous and smooth outer surface is formed to provide a uniform surface for the application of the metallized ground plane 32 to complete the resonator 10.
- the support protrusions 23 and, corner support portions 24 are spaced from the resonator elements 11 and 12. This spacing is important to minimize the effects of discontinuities in the ground plane 32 that can exist at boundaries of the dielectric material from the first and second molding processes.
- the through holes 22 provide direct interconnection of the dielectric material of the second molding process in addition to the interconnection that occurs at the periphery of the second molded member 25, thereby providing increased structural integrity of the resonator.
- the dielectric material used in both molding processes is polyetherimide having a 10% fiberglass content such as that sold under the tradename ULTEM 2100 by General Electric Company.
- the high Q, mechanically stable resonator 10 can be incorporated into a circuit such as a two-way portable radio by making electrical connections at pads 30 and to the ground plane 32.
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/947,016 US4751481A (en) | 1986-12-29 | 1986-12-29 | Molded resonator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/947,016 US4751481A (en) | 1986-12-29 | 1986-12-29 | Molded resonator |
Publications (1)
Publication Number | Publication Date |
---|---|
US4751481A true US4751481A (en) | 1988-06-14 |
Family
ID=25485373
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US06/947,016 Expired - Fee Related US4751481A (en) | 1986-12-29 | 1986-12-29 | Molded resonator |
Country Status (1)
Country | Link |
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US (1) | US4751481A (en) |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5091218A (en) * | 1989-03-06 | 1992-02-25 | Motorola, Inc. | Method for producing a metallized pattern on a substrate |
EP0503466A1 (en) * | 1991-03-12 | 1992-09-16 | Motorola, Inc. | Resonant circuit element having insignificant microphonic effects |
US5294749A (en) * | 1991-09-23 | 1994-03-15 | Motorola, Inc. | Surface mountable molded electronic component |
US5398399A (en) * | 1992-08-31 | 1995-03-21 | Siemens Matsushita Components Gmbh | Process for metallizing monolithic microwave ceramic filters |
US5572180A (en) * | 1995-11-16 | 1996-11-05 | Motorola, Inc. | Surface mountable inductor |
US20070012771A1 (en) * | 2005-07-15 | 2007-01-18 | Innovatier, Inc. | RFID bracelet and method for manufacturing a RFID bracelet |
US20070235548A1 (en) * | 2006-04-10 | 2007-10-11 | Innovatier, Inc. | Electronic inlay module used for electronic cards and tags |
US20070290048A1 (en) * | 2006-06-20 | 2007-12-20 | Innovatier, Inc. | Embedded electronic device and method for manufacturing an embedded electronic device |
US20080055824A1 (en) * | 2006-08-25 | 2008-03-06 | Innovatier, Inc. | Battery powered device having a protective frame |
US20080160397A1 (en) * | 2006-08-25 | 2008-07-03 | Innovatier, Inc | Battery powered device having a protective frame |
US20080237356A1 (en) * | 2007-03-23 | 2008-10-02 | Innovatier, Inc. | Step card and method for making a step card |
US20080282540A1 (en) * | 2007-05-14 | 2008-11-20 | Innovatier, Inc. | Method for making advanced smart cards with integrated electronics using isotropic thermoset adhesive materials with high quality exterior surfaces |
US20090096614A1 (en) * | 2007-10-15 | 2009-04-16 | Innovatier, Inc. | Rfid power bracelet and method for manufacturing a rfid power bracelet |
US20090181215A1 (en) * | 2008-01-15 | 2009-07-16 | Innovatier, Inc. | Plastic card and method for making a plastic card |
KR20190008061A (en) | 2016-06-24 | 2019-01-23 | 닛토덴코 가부시키가이샤 | Continuous optical film laminate, roll of continuous optical film laminate and IPS liquid crystal display device |
Citations (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB798629A (en) * | 1955-09-01 | 1958-07-23 | Standard Telephones Cables Ltd | Electrical high frequency transmission line filter arrangements |
GB886311A (en) * | 1959-06-30 | 1962-01-03 | Ibm | Improvements in or relating to electrical strip line structures |
US3142808A (en) * | 1960-12-29 | 1964-07-28 | Ibm | Transmission line filter having coupling extending quarter wave length between strip line resonators |
US3512254A (en) * | 1965-08-10 | 1970-05-19 | Corning Glass Works | Method of making an electrical device |
US3534301A (en) * | 1967-06-12 | 1970-10-13 | Bell Telephone Labor Inc | Temperature compensated integrated circuit type narrowband stripline filter |
US3590329A (en) * | 1969-05-05 | 1971-06-29 | Sarkes Tarzian | Coil assembly and method of making the same |
US3617955A (en) * | 1969-04-08 | 1971-11-02 | Bell Telephone Labor Inc | Temperature compensated stripline filter |
US3774221A (en) * | 1972-06-20 | 1973-11-20 | R Francis | Multielement radio-frequency antenna structure having linear and helical conductive elements |
US3990024A (en) * | 1975-01-06 | 1976-11-02 | Xerox Corporation | Microstrip/stripline impedance transformer |
US4152679A (en) * | 1977-11-14 | 1979-05-01 | Hull Corporation | Microminiature electrical delay line utilizing thin film inductor array with magnetic enhancement and coupling |
US4193185A (en) * | 1978-01-12 | 1980-03-18 | Liautaud James P | Method of making a high tolerance coil assembly |
US4266206A (en) * | 1978-08-31 | 1981-05-05 | Motorola, Inc. | Stripline filter device |
US4398164A (en) * | 1980-01-24 | 1983-08-09 | Murata Manufacturing Co., Ltd. | Coaxial resonator |
US4484159A (en) * | 1982-03-22 | 1984-11-20 | Allied Corporation | Filter connector with discrete particle dielectric |
US4560965A (en) * | 1983-11-21 | 1985-12-24 | British Telecommunications Plc | Mounting dielectric resonators |
US4563662A (en) * | 1983-05-25 | 1986-01-07 | British Telecommunications | Mounting dielectric resonators |
US4603023A (en) * | 1983-12-01 | 1986-07-29 | International Business Machines Corporation | Method of making a hybrid dielectric probe interposer |
US4603311A (en) * | 1982-10-29 | 1986-07-29 | Thomson-Csf | Twin strip resonators and filters constructed from these resonators |
US4609892A (en) * | 1985-09-30 | 1986-09-02 | Motorola, Inc. | Stripline filter apparatus and method of making the same |
US4614922A (en) * | 1984-10-05 | 1986-09-30 | Sanders Associates, Inc. | Compact delay line |
-
1986
- 1986-12-29 US US06/947,016 patent/US4751481A/en not_active Expired - Fee Related
Patent Citations (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB798629A (en) * | 1955-09-01 | 1958-07-23 | Standard Telephones Cables Ltd | Electrical high frequency transmission line filter arrangements |
GB886311A (en) * | 1959-06-30 | 1962-01-03 | Ibm | Improvements in or relating to electrical strip line structures |
US3142808A (en) * | 1960-12-29 | 1964-07-28 | Ibm | Transmission line filter having coupling extending quarter wave length between strip line resonators |
US3512254A (en) * | 1965-08-10 | 1970-05-19 | Corning Glass Works | Method of making an electrical device |
US3534301A (en) * | 1967-06-12 | 1970-10-13 | Bell Telephone Labor Inc | Temperature compensated integrated circuit type narrowband stripline filter |
US3617955A (en) * | 1969-04-08 | 1971-11-02 | Bell Telephone Labor Inc | Temperature compensated stripline filter |
US3590329A (en) * | 1969-05-05 | 1971-06-29 | Sarkes Tarzian | Coil assembly and method of making the same |
US3774221A (en) * | 1972-06-20 | 1973-11-20 | R Francis | Multielement radio-frequency antenna structure having linear and helical conductive elements |
US3990024A (en) * | 1975-01-06 | 1976-11-02 | Xerox Corporation | Microstrip/stripline impedance transformer |
US4152679A (en) * | 1977-11-14 | 1979-05-01 | Hull Corporation | Microminiature electrical delay line utilizing thin film inductor array with magnetic enhancement and coupling |
US4193185A (en) * | 1978-01-12 | 1980-03-18 | Liautaud James P | Method of making a high tolerance coil assembly |
US4266206A (en) * | 1978-08-31 | 1981-05-05 | Motorola, Inc. | Stripline filter device |
US4398164A (en) * | 1980-01-24 | 1983-08-09 | Murata Manufacturing Co., Ltd. | Coaxial resonator |
US4484159A (en) * | 1982-03-22 | 1984-11-20 | Allied Corporation | Filter connector with discrete particle dielectric |
US4603311A (en) * | 1982-10-29 | 1986-07-29 | Thomson-Csf | Twin strip resonators and filters constructed from these resonators |
US4563662A (en) * | 1983-05-25 | 1986-01-07 | British Telecommunications | Mounting dielectric resonators |
US4560965A (en) * | 1983-11-21 | 1985-12-24 | British Telecommunications Plc | Mounting dielectric resonators |
US4603023A (en) * | 1983-12-01 | 1986-07-29 | International Business Machines Corporation | Method of making a hybrid dielectric probe interposer |
US4614922A (en) * | 1984-10-05 | 1986-09-30 | Sanders Associates, Inc. | Compact delay line |
US4609892A (en) * | 1985-09-30 | 1986-09-02 | Motorola, Inc. | Stripline filter apparatus and method of making the same |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5091218A (en) * | 1989-03-06 | 1992-02-25 | Motorola, Inc. | Method for producing a metallized pattern on a substrate |
EP0503466A1 (en) * | 1991-03-12 | 1992-09-16 | Motorola, Inc. | Resonant circuit element having insignificant microphonic effects |
US5294749A (en) * | 1991-09-23 | 1994-03-15 | Motorola, Inc. | Surface mountable molded electronic component |
US5398399A (en) * | 1992-08-31 | 1995-03-21 | Siemens Matsushita Components Gmbh | Process for metallizing monolithic microwave ceramic filters |
US5572180A (en) * | 1995-11-16 | 1996-11-05 | Motorola, Inc. | Surface mountable inductor |
US7607249B2 (en) | 2005-07-15 | 2009-10-27 | Innovatier Inc. | RFID bracelet and method for manufacturing a RFID bracelet |
US20070012771A1 (en) * | 2005-07-15 | 2007-01-18 | Innovatier, Inc. | RFID bracelet and method for manufacturing a RFID bracelet |
US20070235548A1 (en) * | 2006-04-10 | 2007-10-11 | Innovatier, Inc. | Electronic inlay module used for electronic cards and tags |
US7959085B2 (en) | 2006-04-10 | 2011-06-14 | Innovatier, Inc. | Electronic inlay module used for electronic cards and tags |
US20070290048A1 (en) * | 2006-06-20 | 2007-12-20 | Innovatier, Inc. | Embedded electronic device and method for manufacturing an embedded electronic device |
US8727224B2 (en) | 2006-06-20 | 2014-05-20 | Innovatier, Inc. | Embedded electronic device and method for manufacturing an embedded electronic device |
US20080055824A1 (en) * | 2006-08-25 | 2008-03-06 | Innovatier, Inc. | Battery powered device having a protective frame |
US20080160397A1 (en) * | 2006-08-25 | 2008-07-03 | Innovatier, Inc | Battery powered device having a protective frame |
US20080237356A1 (en) * | 2007-03-23 | 2008-10-02 | Innovatier, Inc. | Step card and method for making a step card |
US20080282540A1 (en) * | 2007-05-14 | 2008-11-20 | Innovatier, Inc. | Method for making advanced smart cards with integrated electronics using isotropic thermoset adhesive materials with high quality exterior surfaces |
US20090096614A1 (en) * | 2007-10-15 | 2009-04-16 | Innovatier, Inc. | Rfid power bracelet and method for manufacturing a rfid power bracelet |
US20090181215A1 (en) * | 2008-01-15 | 2009-07-16 | Innovatier, Inc. | Plastic card and method for making a plastic card |
KR20190008061A (en) | 2016-06-24 | 2019-01-23 | 닛토덴코 가부시키가이샤 | Continuous optical film laminate, roll of continuous optical film laminate and IPS liquid crystal display device |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: MOTOROLA, INC.SCHAUMBURG, ILL. A CORP. OF DE. Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNORS:GUZIK, ANDRZEJ T.;KLUESING, ALVIN D.;BUDANO, JOSEPH A. II;AND OTHERS;REEL/FRAME:004659/0361 Effective date: 19861223 Owner name: MOTOROLA, INC. A CORP. OF DE.,ILLINOIS Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:GUZIK, ANDRZEJ T.;KLUESING, ALVIN D.;BUDANO, JOSEPH A. II;AND OTHERS;REEL/FRAME:004659/0361 Effective date: 19861223 |
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REMI | Maintenance fee reminder mailed | ||
FPAY | Fee payment |
Year of fee payment: 4 |
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SULP | Surcharge for late payment | ||
FPAY | Fee payment |
Year of fee payment: 8 |
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REMI | Maintenance fee reminder mailed | ||
LAPS | Lapse for failure to pay maintenance fees | ||
FP | Lapsed due to failure to pay maintenance fee |
Effective date: 20000614 |
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STCH | Information on status: patent discontinuation |
Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |