TW200805619A - Memory card and memory card manufacturing method - Google Patents

Memory card and memory card manufacturing method Download PDF

Info

Publication number
TW200805619A
TW200805619A TW96103319A TW96103319A TW200805619A TW 200805619 A TW200805619 A TW 200805619A TW 96103319 A TW96103319 A TW 96103319A TW 96103319 A TW96103319 A TW 96103319A TW 200805619 A TW200805619 A TW 200805619A
Authority
TW
Taiwan
Prior art keywords
circuit board
semiconductor wafer
memory card
electrode
wafer
Prior art date
Application number
TW96103319A
Other languages
English (en)
Chinese (zh)
Inventor
Hidenobu Nishikawa
Hiroyuki Yamada
Shuichi Takeda
Atsunobu Iwamoto
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Publication of TW200805619A publication Critical patent/TW200805619A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5388—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates for flat cards, e.g. credit cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0657—Stacked arrangements of devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06517—Bump or bump-like direct electrical connections from device to substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06555—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06572—Auxiliary carrier between devices, the carrier having an electrical connection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06582—Housing for the assembly, e.g. chip scale package [CSP]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01087—Francium [Fr]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Credit Cards Or The Like (AREA)
  • Semiconductor Memories (AREA)
TW96103319A 2006-02-02 2007-01-30 Memory card and memory card manufacturing method TW200805619A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006025445 2006-02-02

Publications (1)

Publication Number Publication Date
TW200805619A true TW200805619A (en) 2008-01-16

Family

ID=38327336

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96103319A TW200805619A (en) 2006-02-02 2007-01-30 Memory card and memory card manufacturing method

Country Status (4)

Country Link
JP (1) JP4946872B2 (ja)
CN (1) CN101375299B (ja)
TW (1) TW200805619A (ja)
WO (1) WO2007088757A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI421904B (zh) * 2010-06-29 2014-01-01 Toshiba Kk Semiconductor memory device and manufacturing method thereof

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100891330B1 (ko) * 2007-02-21 2009-03-31 삼성전자주식회사 반도체 패키지 장치와, 반도체 패키지의 제조방법과,반도체 패키지 장치를 갖는 카드 장치 및 반도체 패키지장치를 갖는 카드 장치의 제조 방법
JP5141187B2 (ja) 2007-10-26 2013-02-13 富士通株式会社 Ｒｆｉｄタグ製造方法
US10251273B2 (en) * 2008-09-08 2019-04-02 Intel Corporation Mainboard assembly including a package overlying a die directly attached to the mainboard
JP4945682B2 (ja) * 2010-02-15 2012-06-06 株式会社東芝 半導体記憶装置およびその製造方法
US8553420B2 (en) 2010-10-19 2013-10-08 Tessera, Inc. Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics
US8633576B2 (en) 2011-04-21 2014-01-21 Tessera, Inc. Stacked chip-on-board module with edge connector
US8304881B1 (en) 2011-04-21 2012-11-06 Tessera, Inc. Flip-chip, face-up and face-down wirebond combination package
US8970028B2 (en) 2011-12-29 2015-03-03 Invensas Corporation Embedded heat spreader for package with multiple microelectronic elements and face-down connection
US9013033B2 (en) 2011-04-21 2015-04-21 Tessera, Inc. Multiple die face-down stacking for two or more die
US8928153B2 (en) 2011-04-21 2015-01-06 Tessera, Inc. Flip-chip, face-up and face-down centerbond memory wirebond assemblies
US8952516B2 (en) 2011-04-21 2015-02-10 Tessera, Inc. Multiple die stacking for two or more die

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2847949B2 (ja) * 1990-10-31 1999-01-20 松下電器産業株式会社 半導体装置
JPH06309523A (ja) * 1993-04-23 1994-11-04 Fuji Film Micro Device Kk メモリカード
JPH098222A (ja) * 1995-06-14 1997-01-10 Matsushita Electric Works Ltd 半導体装置を搭載した電子部品装置
JPH10240877A (ja) * 1997-02-28 1998-09-11 Fujitsu Ltd Ｉｃカード
JP2000085610A (ja) * 1998-09-17 2000-03-28 Toyota Motor Corp 車両用操舵制御装置
JP2001102516A (ja) * 1999-09-27 2001-04-13 Toshiba Corp 半導体装置およびその製造方法
JP2002109498A (ja) * 2000-09-28 2002-04-12 Toshiba Corp 携帯可能電子媒体
JP3499202B2 (ja) * 2000-10-16 2004-02-23 沖電気工業株式会社 半導体装置の製造方法
JP2002288618A (ja) * 2001-03-23 2002-10-04 Toshiba Corp 携帯可能電子媒体及び電子回路部品
JP3689694B2 (ja) * 2002-12-27 2005-08-31 松下電器産業株式会社 半導体装置及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI421904B (zh) * 2010-06-29 2014-01-01 Toshiba Kk Semiconductor memory device and manufacturing method thereof

Also Published As

Publication number Publication date
CN101375299B (zh) 2012-08-08
CN101375299A (zh) 2009-02-25
WO2007088757A1 (ja) 2007-08-09
JPWO2007088757A1 (ja) 2009-06-25
JP4946872B2 (ja) 2012-06-06

Similar Documents

Publication Publication Date Title
TW200805619A (en) Memory card and memory card manufacturing method
US8223500B2 (en) Memory card and method for manufacturing the same
US6372549B2 (en) Semiconductor package and semiconductor package fabrication method
JP4766053B2 (ja) Ｓｄメモリカードおよびｓｄメモリカードの製造方法
US8599571B2 (en) Memory card
JP5029597B2 (ja) カード型記録媒体およびカード型記録媒体の製造方法
JP2002289769A (ja) 積層型半導体装置およびその製造方法
JP2003115560A (ja) 半導体装置、積層半導体装置、半導体装置の製造方法及び積層半導体装置の製造方法
US7933127B2 (en) Memory card and memory card manufacturing method
US20060151206A1 (en) Semiconductor device and manufacturing method therefor
JP2000208698A (ja) 半導体装置
WO2006070863A1 (ja) 半導体チップの実装構造体およびその製造方法
US20110197438A1 (en) Method of manufacturing semiconductor device
JP2000286299A (ja) 半導体装置の接続方法
US10163820B2 (en) Chip carrier and method thereof
JP4034468B2 (ja) 半導体装置の製造方法
JP4952353B2 (ja) チップモジュールおよびメモリカード
JP2002299549A (ja) 積層型半導体装置およびその製造方法
JP2002289766A (ja) 積層型半導体装置およびその製造方法
US20110211323A1 (en) Circuit board, semiconductor device, and method of manufacturing the semiconductor device
JP4740555B2 (ja) 半導体装置及びその製造方法
JP2003124258A (ja) 半導体チップの実装方法、および半導体チップの実装構造
CN118198026A (zh) 半导体装置及半导体装置的制造方法
JP2008198920A (ja) 回路接合方法、回路部品積層体およびメモリカード
JP2004063805A (ja) 半導体装置