TW200804839A - Electronic component testing apparatus - Google Patents
Electronic component testing apparatus Download PDFInfo
- Publication number
- TW200804839A TW200804839A TW096117208A TW96117208A TW200804839A TW 200804839 A TW200804839 A TW 200804839A TW 096117208 A TW096117208 A TW 096117208A TW 96117208 A TW96117208 A TW 96117208A TW 200804839 A TW200804839 A TW 200804839A
- Authority
- TW
- Taiwan
- Prior art keywords
- test
- carrier
- electronic component
- test carrier
- tst
- Prior art date
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 456
- 239000000969 carrier Substances 0.000 claims description 35
- 230000009747 swallowing Effects 0.000 claims 1
- 230000032258 transport Effects 0.000 claims 1
- 238000003860 storage Methods 0.000 description 16
- 238000012546 transfer Methods 0.000 description 12
- 102100021908 3-mercaptopyruvate sulfurtransferase Human genes 0.000 description 8
- 101000753843 Homo sapiens 3-mercaptopyruvate sulfurtransferase Proteins 0.000 description 8
- 101000640206 Tityus serrulatus Alpha-mammal toxin Ts2 Proteins 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 102100031048 Coiled-coil domain-containing protein 6 Human genes 0.000 description 2
- 101000777370 Homo sapiens Coiled-coil domain-containing protein 6 Proteins 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 241000251468 Actinopterygii Species 0.000 description 1
- 102100032306 Aurora kinase B Human genes 0.000 description 1
- 108090000749 Aurora kinase B Proteins 0.000 description 1
- 241000283086 Equidae Species 0.000 description 1
- 241001331845 Equus asinus x caballus Species 0.000 description 1
- 101000798007 Homo sapiens RAC-gamma serine/threonine-protein kinase Proteins 0.000 description 1
- 235000010627 Phaseolus vulgaris Nutrition 0.000 description 1
- 244000046052 Phaseolus vulgaris Species 0.000 description 1
- 102100032314 RAC-gamma serine/threonine-protein kinase Human genes 0.000 description 1
- 241000239226 Scorpiones Species 0.000 description 1
- 244000309464 bull Species 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000010977 jade Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 210000003205 muscle Anatomy 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2006/309955 WO2007135710A1 (ja) | 2006-05-18 | 2006-05-18 | 電子部品試験装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200804839A true TW200804839A (en) | 2008-01-16 |
TWI327224B TWI327224B (enrdf_load_stackoverflow) | 2010-07-11 |
Family
ID=38723025
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096117208A TW200804839A (en) | 2006-05-18 | 2007-05-15 | Electronic component testing apparatus |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR101042652B1 (enrdf_load_stackoverflow) |
TW (1) | TW200804839A (enrdf_load_stackoverflow) |
WO (1) | WO2007135710A1 (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI394960B (zh) * | 2008-07-08 | 2013-05-01 | Advantest Corp | Electronic component test methods, inserts, trays and electronic component test devices |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010146708A1 (ja) * | 2009-06-19 | 2010-12-23 | 株式会社アドバンテスト | 電子部品移載装置及びそれを備えた電子部品試験装置 |
JPWO2010146709A1 (ja) * | 2009-06-19 | 2012-11-29 | 株式会社アドバンテスト | 電子部品移載装置及び電子部品の移載方法 |
JP7561534B2 (ja) * | 2020-07-21 | 2024-10-04 | 株式会社アドバンテスト | 電子部品ハンドリング装置及び電子部品試験装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW379285B (en) * | 1997-07-02 | 2000-01-11 | Advantest Corp | Testing device for semiconductor components and the testing trays used in the testing apparatus |
JP2000065895A (ja) * | 1998-08-24 | 2000-03-03 | Ando Electric Co Ltd | オートハンドラおよびオートハンドラのキャリアの搬送方法 |
JP4109368B2 (ja) * | 1999-01-14 | 2008-07-02 | 株式会社アドバンテスト | 電子部品試験装置用マッチプレート |
JP3813772B2 (ja) * | 1999-09-27 | 2006-08-23 | 株式会社ルネサステクノロジ | 半導体装置の製造方法 |
-
2006
- 2006-05-18 KR KR1020087028998A patent/KR101042652B1/ko active Active
- 2006-05-18 WO PCT/JP2006/309955 patent/WO2007135710A1/ja active Application Filing
-
2007
- 2007-05-15 TW TW096117208A patent/TW200804839A/zh unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI394960B (zh) * | 2008-07-08 | 2013-05-01 | Advantest Corp | Electronic component test methods, inserts, trays and electronic component test devices |
Also Published As
Publication number | Publication date |
---|---|
TWI327224B (enrdf_load_stackoverflow) | 2010-07-11 |
WO2007135710A1 (ja) | 2007-11-29 |
KR101042652B1 (ko) | 2011-06-20 |
KR20090015938A (ko) | 2009-02-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI249217B (en) | System and method for testing semiconductor devices | |
TWI252209B (en) | Sorting handler for burn-in tester | |
WO1997005495A1 (fr) | Testeur de dispositif a semi-conducteurs | |
TWI284740B (en) | Insert and electronic component handling apparatus comprising the same | |
JP2000009798A (ja) | Ic試験装置 | |
TWI373626B (enrdf_load_stackoverflow) | ||
TW200804839A (en) | Electronic component testing apparatus | |
JP4222442B2 (ja) | 電子部品試験装置用インサート | |
TW200925087A (en) | Hi-fix board, test tray, test handler, and method for manufacturing packaged chips | |
TWI224198B (en) | Pusher and electronic part-testing apparatus with the same | |
JP5022375B2 (ja) | トレイ搬送装置及びそれを備えた電子部品試験装置 | |
TWI490970B (zh) | A pallet handling device, and an electronic component testing device provided with the device | |
JP5314668B2 (ja) | 電子部品移載装置およびそれを備えた電子部品試験装置 | |
TWI423370B (zh) | A test tray and an electronic component testing device having the tray | |
TW200841015A (en) | Method for testing system-in-package devices | |
TWI352815B (enrdf_load_stackoverflow) | ||
JP2003028924A (ja) | 電子部品ハンドリング装置および電子部品の温度制御方法 | |
TWI398638B (zh) | A method of removing the electronic component, and a control program for carrying out the method | |
KR101075140B1 (ko) | 테스트 트레이 및 이를 구비한 전자부품 시험장치 | |
TW200823471A (en) | Electronic component test equipment and method for conveying tray | |
JPH0384944A (ja) | 半導体検査装置及び検査方法 | |
TW200907379A (en) | Method for testing system-in-package devices | |
TW536770B (en) | Testing method of semiconductor device | |
TW200903507A (en) | Apparatus for testing system-in-package devices | |
TW200829938A (en) | Electronic component testing method and electronic component testing equipment |