TW200800454A - Method and apparatus for chamfering glass substrate - Google Patents
Method and apparatus for chamfering glass substrate Download PDFInfo
- Publication number
- TW200800454A TW200800454A TW096105302A TW96105302A TW200800454A TW 200800454 A TW200800454 A TW 200800454A TW 096105302 A TW096105302 A TW 096105302A TW 96105302 A TW96105302 A TW 96105302A TW 200800454 A TW200800454 A TW 200800454A
- Authority
- TW
- Taiwan
- Prior art keywords
- glass substrate
- chamfering
- end surface
- laser beam
- glass
- Prior art date
Links
- 239000011521 glass Substances 0.000 title claims abstract description 257
- 239000000758 substrate Substances 0.000 title claims abstract description 234
- 238000000034 method Methods 0.000 title claims abstract description 70
- 239000000112 cooling gas Substances 0.000 claims abstract description 22
- 238000007664 blowing Methods 0.000 claims description 19
- 238000009826 distribution Methods 0.000 claims description 6
- 230000001678 irradiating effect Effects 0.000 claims description 6
- 239000006060 molten glass Substances 0.000 claims description 6
- 238000006124 Pilkington process Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 238000005452 bending Methods 0.000 abstract description 5
- 230000035939 shock Effects 0.000 abstract 1
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 16
- 230000035882 stress Effects 0.000 description 16
- 229910002092 carbon dioxide Inorganic materials 0.000 description 9
- 239000007789 gas Substances 0.000 description 9
- 239000001569 carbon dioxide Substances 0.000 description 8
- 230000008018 melting Effects 0.000 description 8
- 238000002844 melting Methods 0.000 description 8
- 239000004973 liquid crystal related substance Substances 0.000 description 7
- 238000001816 cooling Methods 0.000 description 5
- 230000007547 defect Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 230000010355 oscillation Effects 0.000 description 5
- 238000005336 cracking Methods 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000009499 grossing Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000009751 slip forming Methods 0.000 description 2
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 240000001949 Taraxacum officinale Species 0.000 description 1
- 235000006754 Taraxacum officinale Nutrition 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 235000013339 cereals Nutrition 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000003280 down draw process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/703—Cooling arrangements
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B29/00—Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins
- C03B29/04—Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins in a continuous way
- C03B29/06—Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins in a continuous way with horizontal displacement of the products
- C03B29/08—Glass sheets
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006038018 | 2006-02-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200800454A true TW200800454A (en) | 2008-01-01 |
| TWI317667B TWI317667B (ko) | 2009-12-01 |
Family
ID=38371347
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW096105302A TW200800454A (en) | 2006-02-15 | 2007-02-13 | Method and apparatus for chamfering glass substrate |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5245819B2 (ko) |
| KR (1) | KR100985428B1 (ko) |
| TW (1) | TW200800454A (ko) |
| WO (1) | WO2007094160A1 (ko) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI458594B (zh) * | 2010-03-11 | 2014-11-01 | Samsung Display Co Ltd | 研磨方法及使用該研磨方法之顯示面板製造方法 |
| TWI585489B (zh) * | 2012-12-06 | 2017-06-01 | 倉元製作所股份有限公司 | 液晶面板硏磨方法 |
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| JP5256658B2 (ja) * | 2007-07-31 | 2013-08-07 | 旭硝子株式会社 | ガラス基板の面取り方法および装置、面取りされたガラス基板 |
| JP5113462B2 (ja) | 2007-09-12 | 2013-01-09 | 三星ダイヤモンド工業株式会社 | 脆性材料基板の面取り方法 |
| KR101235617B1 (ko) * | 2007-10-16 | 2013-02-28 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | 취성 재료 기판의 ｕ자 형상 홈 가공 방법 및 이것을 사용한 제거 가공 방법 및 도려내기 가공 방법 및 모따기 방법 |
| AT13206U1 (de) | 2012-07-17 | 2013-08-15 | Lisec Maschb Gmbh | Verfahren und Anordnung zum Teilen von Flachglas |
| WO2014079478A1 (en) | 2012-11-20 | 2014-05-30 | Light In Light Srl | High speed laser processing of transparent materials |
| KR101438778B1 (ko) * | 2012-12-28 | 2014-09-17 | 재단법인 포항산업과학연구원 | 압연판재의 모서리 균열 방지 장치 및 그 방법 |
| EP2754524B1 (de) | 2013-01-15 | 2015-11-25 | Corning Laser Technologies GmbH | Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie |
| EP2781296B1 (de) | 2013-03-21 | 2020-10-21 | Corning Laser Technologies GmbH | Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser |
| KR101494197B1 (ko) * | 2013-05-03 | 2015-02-17 | ㈜에이마크 | 유리 기판 챔퍼링 장치 및 방법 |
| RU2543222C1 (ru) * | 2013-08-23 | 2015-02-27 | Общество С Ограниченной Ответственностью "Ласком" | Способ притупления острых кромок стеклоизделий |
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| JP6324719B2 (ja) * | 2013-12-27 | 2018-05-16 | 三星ダイヤモンド工業株式会社 | ガラス基板の面取り方法及びレーザ加工装置 |
| EP3166895B1 (en) | 2014-07-08 | 2021-11-24 | Corning Incorporated | Methods and apparatuses for laser processing materials |
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| WO2016115017A1 (en) | 2015-01-12 | 2016-07-21 | Corning Incorporated | Laser cutting of thermally tempered substrates using the multi photon absorption method |
| KR101619295B1 (ko) | 2015-02-06 | 2016-05-11 | 주식회사 엘아이에스 | 유리기판 측면 가공방법 |
| JP7292006B2 (ja) | 2015-03-24 | 2023-06-16 | コーニング インコーポレイテッド | ディスプレイガラス組成物のレーザ切断及び加工 |
| KR20170131638A (ko) | 2015-03-27 | 2017-11-29 | 코닝 인코포레이티드 | 가스 투과성 유리창 및 이의 제작방법 |
| JP6638514B2 (ja) | 2015-03-31 | 2020-01-29 | 日本電気硝子株式会社 | 脆性基板の切断方法 |
| EP3319911B1 (en) | 2015-07-10 | 2023-04-19 | Corning Incorporated | Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same |
| JP6650814B2 (ja) * | 2016-04-07 | 2020-02-19 | 川崎重工業株式会社 | 加熱装置 |
| EP3452418B1 (en) | 2016-05-06 | 2022-03-02 | Corning Incorporated | Laser cutting and removal of contoured shapes from transparent substrates |
| US10410883B2 (en) | 2016-06-01 | 2019-09-10 | Corning Incorporated | Articles and methods of forming vias in substrates |
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| CN109803934A (zh) | 2016-07-29 | 2019-05-24 | 康宁股份有限公司 | 用于激光处理的装置和方法 |
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| JP7037168B2 (ja) * | 2017-09-06 | 2022-03-16 | 三星ダイヤモンド工業株式会社 | ガラス基板の残留応力低減方法及びガラス基板の残留応力低減装置 |
| US11554984B2 (en) | 2018-02-22 | 2023-01-17 | Corning Incorporated | Alkali-free borosilicate glasses with low post-HF etch roughness |
| WO2020111282A1 (ja) * | 2018-11-30 | 2020-06-04 | Hoya株式会社 | ガラス板の製造方法、ガラス板の面取り方法、および磁気ディスクの製造方法 |
| KR102652560B1 (ko) * | 2021-12-08 | 2024-03-29 | (주)하나기술 | 레이저를 이용한 초박막 유리의 측면 가공 방법 및 가공된 초박막 유리 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000344551A (ja) * | 1999-03-03 | 2000-12-12 | Shin Meiwa Ind Co Ltd | ガラス板の製造方法及びガラス板 |
| JP2001335336A (ja) * | 1999-06-22 | 2001-12-04 | Shin Meiwa Ind Co Ltd | 材料の処理方法、円盤形状材料の処理方法、ガラス材及びガラスディスク |
| JP2002012436A (ja) * | 2000-06-23 | 2002-01-15 | Nippon Sheet Glass Co Ltd | ガラスの端面の処理方法、及び該処理方法により処理されたガラス |
| TWI252788B (en) * | 2001-08-10 | 2006-04-11 | Mitsuboshi Diamond Ind Co Ltd | Brittle material substrate chamfering method and chamfering device |
-
2007
- 2007-01-26 JP JP2008500427A patent/JP5245819B2/ja not_active Expired - Fee Related
- 2007-01-26 WO PCT/JP2007/051308 patent/WO2007094160A1/ja active Application Filing
- 2007-01-26 KR KR1020087017395A patent/KR100985428B1/ko not_active IP Right Cessation
- 2007-02-13 TW TW096105302A patent/TW200800454A/zh not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI458594B (zh) * | 2010-03-11 | 2014-11-01 | Samsung Display Co Ltd | 研磨方法及使用該研磨方法之顯示面板製造方法 |
| TWI585489B (zh) * | 2012-12-06 | 2017-06-01 | 倉元製作所股份有限公司 | 液晶面板硏磨方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2007094160A1 (ja) | 2007-08-23 |
| TWI317667B (ko) | 2009-12-01 |
| KR100985428B1 (ko) | 2010-10-05 |
| KR20080093421A (ko) | 2008-10-21 |
| JP5245819B2 (ja) | 2013-07-24 |
| JPWO2007094160A1 (ja) | 2009-07-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |