TWI317667B - - Google Patents

Info

Publication number
TWI317667B
TWI317667B TW096105302A TW96105302A TWI317667B TW I317667 B TWI317667 B TW I317667B TW 096105302 A TW096105302 A TW 096105302A TW 96105302 A TW96105302 A TW 96105302A TW I317667 B TWI317667 B TW I317667B
Authority
TW
Taiwan
Application number
TW096105302A
Other languages
Chinese (zh)
Other versions
TW200800454A (en
Inventor
Yutaka Kuroiwa
Motoichi Iga
Setsuro Ito
Yasuji Fukasawa
Mitsuru Watanabe
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Publication of TW200800454A publication Critical patent/TW200800454A/zh
Application granted granted Critical
Publication of TWI317667B publication Critical patent/TWI317667B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/703—Cooling arrangements
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B29/00—Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins
    • C03B29/04—Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins in a continuous way
    • C03B29/06—Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins in a continuous way with horizontal displacement of the products
    • C03B29/08—Glass sheets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Laser Beam Processing (AREA)
TW096105302A 2006-02-15 2007-02-13 Method and apparatus for chamfering glass substrate TW200800454A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006038018 2006-02-15

Publications (2)

Publication Number Publication Date
TW200800454A TW200800454A (en) 2008-01-01
TWI317667B true TWI317667B (ko) 2009-12-01

Family

ID=38371347

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096105302A TW200800454A (en) 2006-02-15 2007-02-13 Method and apparatus for chamfering glass substrate

Country Status (4)

Country Link
JP (1) JP5245819B2 (ko)
KR (1) KR100985428B1 (ko)
TW (1) TW200800454A (ko)
WO (1) WO2007094160A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10118255B2 (en) 2015-03-31 2018-11-06 Industrial Technology Research Institute Cutting method of a multilayer structure containing a brittle layer

Families Citing this family (49)

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JP5256658B2 (ja) * 2007-07-31 2013-08-07 旭硝子株式会社 ガラス基板の面取り方法および装置、面取りされたガラス基板
JP5113462B2 (ja) 2007-09-12 2013-01-09 三星ダイヤモンド工業株式会社 脆性材料基板の面取り方法
WO2009050938A1 (ja) * 2007-10-16 2009-04-23 Mitsuboshi Diamond Industrial Co., Ltd. 脆性材料基板のｕ字状溝加工方法およびこれを用いた除去加工方法およびくり抜き加工方法および面取り方法
KR101155902B1 (ko) * 2010-03-11 2012-06-20 삼성모바일디스플레이주식회사 그라인더, 상기 그라인더를 사용한 연마 방법, 상기 연마 방법을 사용한 표시 장치의 제조 방법 및 이를 사용하여 제조한 표시 장치
AT13206U1 (de) 2012-07-17 2013-08-15 Lisec Maschb Gmbh Verfahren und Anordnung zum Teilen von Flachglas
WO2014079478A1 (en) 2012-11-20 2014-05-30 Light In Light Srl High speed laser processing of transparent materials
JP6109551B2 (ja) * 2012-12-06 2017-04-05 株式会社倉元製作所 液晶パネル研磨方法
KR101438778B1 (ko) * 2012-12-28 2014-09-17 재단법인 포항산업과학연구원 압연판재의 모서리 균열 방지 장치 및 그 방법
EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
KR101494197B1 (ko) * 2013-05-03 2015-02-17 ㈜에이마크 유리 기판 챔퍼링 장치 및 방법
RU2543222C1 (ru) * 2013-08-23 2015-02-27 Общество С Ограниченной Ответственностью "Ласком" Способ притупления острых кромок стеклоизделий
US10293436B2 (en) 2013-12-17 2019-05-21 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US9815730B2 (en) 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US9850160B2 (en) 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
US9701563B2 (en) 2013-12-17 2017-07-11 Corning Incorporated Laser cut composite glass article and method of cutting
US10442719B2 (en) 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
US9676167B2 (en) 2013-12-17 2017-06-13 Corning Incorporated Laser processing of sapphire substrate and related applications
US20150165560A1 (en) 2013-12-17 2015-06-18 Corning Incorporated Laser processing of slots and holes
JP6324719B2 (ja) * 2013-12-27 2018-05-16 三星ダイヤモンド工業株式会社 ガラス基板の面取り方法及びレーザ加工装置
KR102445217B1 (ko) 2014-07-08 2022-09-20 코닝 인코포레이티드 재료를 레이저 가공하는 방법 및 장치
EP3536440A1 (en) 2014-07-14 2019-09-11 Corning Incorporated Glass article with a defect pattern
TWI659793B (zh) 2014-07-14 2019-05-21 美商康寧公司 用於使用可調整雷射束焦線來處理透明材料的系統及方法
US10611667B2 (en) 2014-07-14 2020-04-07 Corning Incorporated Method and system for forming perforations
EP3169476A1 (en) 2014-07-14 2017-05-24 Corning Incorporated Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block
US10047001B2 (en) 2014-12-04 2018-08-14 Corning Incorporated Glass cutting systems and methods using non-diffracting laser beams
EP3245166B1 (en) 2015-01-12 2020-05-27 Corning Incorporated Laser cutting of thermally tempered substrates using the multi photon absorption method
KR101619295B1 (ko) 2015-02-06 2016-05-11 주식회사 엘아이에스 유리기판 측면 가공방법
HUE055461T2 (hu) 2015-03-24 2021-11-29 Corning Inc Kijelzõ üveg kompozíciók lézeres vágása és feldolgozása
JP2018516215A (ja) 2015-03-27 2018-06-21 コーニング インコーポレイテッド 気体透過性窓、および、その製造方法
JP7082042B2 (ja) 2015-07-10 2022-06-07 コーニング インコーポレイテッド 可撓性基体シートに孔を連続形成する方法およびそれに関する製品
JP6650814B2 (ja) * 2016-04-07 2020-02-19 川崎重工業株式会社 加熱装置
SG11201809797PA (en) 2016-05-06 2018-12-28 Corning Inc Laser cutting and removal of contoured shapes from transparent substrates
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
KR20190035805A (ko) 2016-07-29 2019-04-03 코닝 인코포레이티드 레이저 처리를 위한 장치 및 방법
WO2018044843A1 (en) 2016-08-30 2018-03-08 Corning Incorporated Laser processing of transparent materials
KR102078294B1 (ko) 2016-09-30 2020-02-17 코닝 인코포레이티드 비-축대칭 빔 스폿을 이용하여 투명 워크피스를 레이저 가공하기 위한 기기 및 방법
KR102428350B1 (ko) 2016-10-24 2022-08-02 코닝 인코포레이티드 시트형 유리 기판의 레이저 기반 기계 가공을 위한 기판 프로세싱 스테이션
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
US10688599B2 (en) 2017-02-09 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
JP7037168B2 (ja) * 2017-09-06 2022-03-16 三星ダイヤモンド工業株式会社 ガラス基板の残留応力低減方法及びガラス基板の残留応力低減装置
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
US20220089479A1 (en) * 2018-11-30 2022-03-24 Hoya Corporation Method for manufacturing glass plate, method for chamfering glass plate, and method for manufacturing magnetic disk
KR102652560B1 (ko) * 2021-12-08 2024-03-29 (주)하나기술 레이저를 이용한 초박막 유리의 측면 가공 방법 및 가공된 초박막 유리

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000344551A (ja) * 1999-03-03 2000-12-12 Shin Meiwa Ind Co Ltd ガラス板の製造方法及びガラス板
JP2001335336A (ja) * 1999-06-22 2001-12-04 Shin Meiwa Ind Co Ltd 材料の処理方法、円盤形状材料の処理方法、ガラス材及びガラスディスク
JP2002012436A (ja) * 2000-06-23 2002-01-15 Nippon Sheet Glass Co Ltd ガラスの端面の処理方法、及び該処理方法により処理されたガラス
JP3823108B2 (ja) * 2001-08-10 2006-09-20 三星ダイヤモンド工業株式会社 脆性材料基板の面取り方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10118255B2 (en) 2015-03-31 2018-11-06 Industrial Technology Research Institute Cutting method of a multilayer structure containing a brittle layer

Also Published As

Publication number Publication date
JP5245819B2 (ja) 2013-07-24
TW200800454A (en) 2008-01-01
KR20080093421A (ko) 2008-10-21
WO2007094160A1 (ja) 2007-08-23
KR100985428B1 (ko) 2010-10-05
JPWO2007094160A1 (ja) 2009-07-02

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MM4A Annulment or lapse of patent due to non-payment of fees