JP2013075802A - 強化ガラス板切断方法 - Google Patents
強化ガラス板切断方法 Download PDFInfo
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- JP2013075802A JP2013075802A JP2011217739A JP2011217739A JP2013075802A JP 2013075802 A JP2013075802 A JP 2013075802A JP 2011217739 A JP2011217739 A JP 2011217739A JP 2011217739 A JP2011217739 A JP 2011217739A JP 2013075802 A JP2013075802 A JP 2013075802A
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- 239000005341 toughened glass Substances 0.000 title claims abstract description 277
- 238000005520 cutting process Methods 0.000 title claims abstract description 152
- 238000000034 method Methods 0.000 title claims abstract description 62
- 230000001678 irradiating effect Effects 0.000 claims description 9
- 238000012545 processing Methods 0.000 description 37
- 239000002585 base Substances 0.000 description 14
- 239000011521 glass Substances 0.000 description 13
- 238000012986 modification Methods 0.000 description 8
- 230000004048 modification Effects 0.000 description 8
- 239000000463 material Substances 0.000 description 5
- 238000005452 bending Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000003426 chemical strengthening reaction Methods 0.000 description 3
- 239000013256 coordination polymer Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000010128 melt processing Methods 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 229910052700 potassium Inorganic materials 0.000 description 2
- 239000011591 potassium Substances 0.000 description 2
- 229910001414 potassium ion Inorganic materials 0.000 description 2
- 229910001415 sodium ion Inorganic materials 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000001394 metastastic effect Effects 0.000 description 1
- 206010061289 metastatic neoplasm Diseases 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 238000002407 reforming Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
- C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
- C03C23/0025—Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Plasma & Fusion (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Laser Beam Processing (AREA)
Abstract
【解決手段】 この強化ガラス板切断方法においては、切断予定ライン5に沿って所定のパルスピッチPTでレーザ光Lを強化ガラス板1に照射する。これにより、切断予定ライン5に沿って強化ガラス板1の内部に改質領域7を形成する。強化ガラス板1の内部に形成された改質領域7は、上述したように、内部応力の解放の起点となる。このため、内部応力の解放により改質領域7に沿って割れが進展する。よって、この強化ガラス板切断方法によれば、切断予定ライン5に沿って、すなわち所望の形状に強化ガラス板1を切断できる。
【選択図】図8
Description
レーザ出力:20μJ
波長:532nm
パルス幅:600ps
パルスピッチPT:66.7μm
集光位置:レーザ光入射面から150μm。
Claims (9)
- 強化ガラス板の切断予定ラインに沿って前記強化ガラス板にレーザ光を照射することにより、前記切断予定ラインに沿って前記強化ガラス板の内部に改質領域を形成し、前記切断予定ラインに沿って前記強化ガラス板を切断する強化ガラス板切断方法であって、
前記切断予定ラインに沿って所定のパルスピッチで前記レーザ光を前記強化ガラス板に照射することにより、前記切断予定ラインに沿って前記強化ガラス板の内部に前記改質領域を形成する工程と、
前記切断予定ラインに沿って前記強化ガラス板を切断する工程と、を備え、
前記所定のパルスピッチは、前記改質領域から発生した割れが、前記強化ガラス板の内部応力によって、前記改質領域を形成してから所定時間経過した後に、前記強化ガラス板の表面及び裏面の少なくとも一方に到達するようなピッチである、
ことを特徴とする強化ガラス板切断方法。 - 前記所定のパルスピッチは、20μm以上100μm以下である、ことを特徴とする請求項1に記載の強化ガラス板切断方法。
- 前記強化ガラス板は、前記強化ガラスの縁部を含む外側部分と、前記外側部分よりも内側に位置する内側部分とを含み、
前記改質領域を形成する工程においては、前記切断予定ラインに沿って前記内側部分の全体に渡って延在するように前記改質領域を形成すると共に、前記外側部分に前記改質領域を形成しない、ことを特徴とする請求項1又は2に記載の強化ガラス板切断方法。 - 前記強化ガラス板を切断する工程においては、前記強化ガラス板から前記外側部分を切除した後に、前記強化ガラス板を放置することにより、前記内部応力によって前記切断予定ラインに沿って割れを伸展させて前記強化ガラス板を切断する、ことを特徴とする請求項3に記載の強化ガラス板切断方法。
- 前記強化ガラス板を切断する工程においては、前記切断予定ラインに沿って前記強化ガラス板に応力を加えることにより、前記強化ガラス板を切断する、ことを特徴とする請求項1〜3のいずれか一項に記載の強化ガラス板切断方法。
- 前記強化ガラス板は、前記強化ガラスの縁部を含む外側部分と、前記外側部分よりも内側に位置する内側部分とを含み、
前記改質領域を形成する工程においては、前記切断予定ラインに沿って前記外側部分及び前記内側部分の全体に渡って延在するように前記改質領域を形成する、ことを特徴とする請求項1又は2に記載の強化ガラス板切断方法。 - 前記強化ガラス板を切断する工程においては、前記強化ガラス板を放置することにより、前記内部応力によって前記切断予定ラインに沿って割れを伸展させて前記強化ガラス板を切断する、ことを特徴とする請求項6に記載の強化ガラス板切断方法。
- 前記強化ガラス板を切断する工程においては、前記切断予定ラインに沿って前記強化ガラス板に応力を加えることにより、前記強化ガラス板を切断する、ことを特徴とする請求項6に記載の強化ガラス板切断方法。
- 前記強化ガラス板を切断した後に、前記強化ガラス板から切り出された有効部分の切断面から前記改質領域を除去する工程をさらに備える、ことを特徴とする請求項1〜8のいずれか一項に記載の強化ガラス板切断方法。
Priority Applications (3)
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JP2011217739A JP5864988B2 (ja) | 2011-09-30 | 2011-09-30 | 強化ガラス板切断方法 |
PCT/JP2012/072938 WO2013047157A1 (ja) | 2011-09-30 | 2012-09-07 | 強化ガラス板切断方法 |
TW101134951A TWI629249B (zh) | 2011-09-30 | 2012-09-24 | Method for cutting tempered glass sheets |
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JP2011217739A JP5864988B2 (ja) | 2011-09-30 | 2011-09-30 | 強化ガラス板切断方法 |
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JP2013075802A true JP2013075802A (ja) | 2013-04-25 |
JP5864988B2 JP5864988B2 (ja) | 2016-02-17 |
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JP (1) | JP5864988B2 (ja) |
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WO2015080043A1 (ja) * | 2013-11-26 | 2015-06-04 | 旭硝子株式会社 | ガラス部材およびガラス部材の製造方法 |
WO2015182300A1 (ja) * | 2014-05-29 | 2015-12-03 | 旭硝子株式会社 | 光学ガラスおよびガラス基板の切断方法 |
US9676167B2 (en) | 2013-12-17 | 2017-06-13 | Corning Incorporated | Laser processing of sapphire substrate and related applications |
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US10249664B2 (en) | 2013-09-25 | 2019-04-02 | AGC Inc. | Optical glass |
US10252931B2 (en) | 2015-01-12 | 2019-04-09 | Corning Incorporated | Laser cutting of thermally tempered substrates |
US10280108B2 (en) | 2013-03-21 | 2019-05-07 | Corning Laser Technologies GmbH | Device and method for cutting out contours from planar substrates by means of laser |
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US10522963B2 (en) | 2016-08-30 | 2019-12-31 | Corning Incorporated | Laser cutting of materials with intensity mapping optical system |
US10526234B2 (en) | 2014-07-14 | 2020-01-07 | Corning Incorporated | Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block |
US10525657B2 (en) | 2015-03-27 | 2020-01-07 | Corning Incorporated | Gas permeable window and method of fabricating the same |
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TWI629249B (zh) | 2018-07-11 |
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