TW200746345A - Vibration-proof mechanism for article storage container - Google Patents

Vibration-proof mechanism for article storage container

Info

Publication number
TW200746345A
TW200746345A TW095139999A TW95139999A TW200746345A TW 200746345 A TW200746345 A TW 200746345A TW 095139999 A TW095139999 A TW 095139999A TW 95139999 A TW95139999 A TW 95139999A TW 200746345 A TW200746345 A TW 200746345A
Authority
TW
Taiwan
Prior art keywords
rack member
vibration
main body
foup
supported
Prior art date
Application number
TW095139999A
Other languages
English (en)
Inventor
Masanao Murata
Original Assignee
Asyst Shinko Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asyst Shinko Inc filed Critical Asyst Shinko Inc
Publication of TW200746345A publication Critical patent/TW200746345A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)
  • Packaging Frangible Articles (AREA)
TW095139999A 2005-10-31 2006-10-30 Vibration-proof mechanism for article storage container TW200746345A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005316013A JP2007123673A (ja) 2005-10-31 2005-10-31 物品収納用容器の防振機構

Publications (1)

Publication Number Publication Date
TW200746345A true TW200746345A (en) 2007-12-16

Family

ID=38005825

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095139999A TW200746345A (en) 2005-10-31 2006-10-30 Vibration-proof mechanism for article storage container

Country Status (6)

Country Link
US (1) US20100065467A1 (zh)
JP (1) JP2007123673A (zh)
KR (1) KR20080080493A (zh)
CN (2) CN101870394A (zh)
TW (1) TW200746345A (zh)
WO (1) WO2007052672A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI836195B (zh) * 2020-03-13 2024-03-21 日商村田機械股份有限公司 夾持裝置、搬運車及搬運方法

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4911045B2 (ja) * 2008-01-21 2012-04-04 ムラテックオートメーション株式会社 被搬送物及び防振機構
JP5463758B2 (ja) 2009-06-26 2014-04-09 村田機械株式会社 保管庫
FR2954583B1 (fr) 2009-12-18 2017-11-24 Alcatel Lucent Procede et dispositif de pilotage de fabrication de semi conducteurs par mesure de contamination
CN102858653B (zh) * 2010-05-24 2014-09-10 未来儿株式会社 基板收纳容器
FR2961946B1 (fr) * 2010-06-29 2012-08-03 Alcatel Lucent Dispositif de traitement pour boites de transport et de stockage
KR101297680B1 (ko) 2011-04-22 2013-08-21 주식회사 테라세미콘 풉 지지용 스테이지 및 이를 사용한 웨이퍼 처리 장치
US8900737B2 (en) * 2011-09-08 2014-12-02 Samsung Sdi Co., Ltd. Energy storage system
TWI431712B (zh) * 2011-09-20 2014-03-21 Gudeng Prec Ind Co Ltd 大型前開式晶圓盒
KR102113139B1 (ko) * 2013-09-11 2020-05-20 미라이얼 가부시키가이샤 기판수납용기
KR102338464B1 (ko) * 2015-01-08 2021-12-15 삼성전자주식회사 운반물 반송 유닛, 그를 포함하는 운반물 관리 장치
US10840121B2 (en) 2016-10-31 2020-11-17 Taiwan Semiconductor Manufacturing Co., Ltd. Method and apparatus for unpacking semiconductor wafer container
US10504762B2 (en) * 2018-02-06 2019-12-10 Applied Materials, Inc. Bridging front opening unified pod (FOUP)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06329206A (ja) * 1993-05-18 1994-11-29 Toshiba Corp ウエハカセット、ウエハカセット搬送用ハンド、及び、ウエハカセット形状検出装置
JPH07302833A (ja) * 1994-05-09 1995-11-14 Hitachi Cable Ltd ウェハ用キャリア
JPH0831907A (ja) * 1994-07-14 1996-02-02 Toshiba Microelectron Corp 半導体ウェーハ収納容器及びその操作方法
JPH0936215A (ja) * 1995-07-18 1997-02-07 Sony Corp キャリアケース
MX9703997A (es) * 1997-05-30 1998-11-30 Servicios Condumex Sa Sistema de embalaje y estibado de conductores electricos automotrices.
US5887718A (en) * 1998-03-19 1999-03-30 Creative Foam Corporation Article transport and storage device
US6398032B2 (en) * 1998-05-05 2002-06-04 Asyst Technologies, Inc. SMIF pod including independently supported wafer cassette
US6267245B1 (en) * 1998-07-10 2001-07-31 Fluoroware, Inc. Cushioned wafer container
CN1298599C (zh) * 2001-11-14 2007-02-07 诚实公司 用于半导体晶片输送容器的晶片支承件连接
JP4265312B2 (ja) * 2003-07-03 2009-05-20 アシスト テクノロジーズ ジャパン株式会社 懸垂型搬送台車およびその制御方法ならびに搬送システム
US7201276B2 (en) * 2003-11-07 2007-04-10 Entegris, Inc. Front opening substrate container with bottom plate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI836195B (zh) * 2020-03-13 2024-03-21 日商村田機械股份有限公司 夾持裝置、搬運車及搬運方法

Also Published As

Publication number Publication date
KR20080080493A (ko) 2008-09-04
CN101300672B (zh) 2010-08-11
CN101870394A (zh) 2010-10-27
WO2007052672A1 (ja) 2007-05-10
US20100065467A1 (en) 2010-03-18
CN101300672A (zh) 2008-11-05
JP2007123673A (ja) 2007-05-17

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