TW200741833A - Processing apparatus, processing method, and process for producing chip - Google Patents

Processing apparatus, processing method, and process for producing chip

Info

Publication number
TW200741833A
TW200741833A TW095120253A TW95120253A TW200741833A TW 200741833 A TW200741833 A TW 200741833A TW 095120253 A TW095120253 A TW 095120253A TW 95120253 A TW95120253 A TW 95120253A TW 200741833 A TW200741833 A TW 200741833A
Authority
TW
Taiwan
Prior art keywords
holding
processed
holding portion
support portion
mold
Prior art date
Application number
TW095120253A
Other languages
English (en)
Other versions
TWI321811B (en
Inventor
Junichi Seki
Masao Majima
Nobuhito Suehira
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Kk filed Critical Canon Kk
Publication of TW200741833A publication Critical patent/TW200741833A/zh
Application granted granted Critical
Publication of TWI321811B publication Critical patent/TWI321811B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00444—Surface micromachining, i.e. structuring layers on the substrate
    • B81C1/0046—Surface micromachining, i.e. structuring layers on the substrate using stamping, e.g. imprinting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW095120253A 2005-06-07 2006-06-07 Processing apparatus, processing method, and process for producing chip TWI321811B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005167417 2005-06-07

Publications (2)

Publication Number Publication Date
TW200741833A true TW200741833A (en) 2007-11-01
TWI321811B TWI321811B (en) 2010-03-11

Family

ID=36968638

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095120253A TWI321811B (en) 2005-06-07 2006-06-07 Processing apparatus, processing method, and process for producing chip

Country Status (6)

Country Link
US (2) US7635260B2 (zh)
EP (1) EP1731964B1 (zh)
JP (1) JP3958344B2 (zh)
KR (1) KR100806231B1 (zh)
CN (2) CN100503264C (zh)
TW (1) TWI321811B (zh)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7307004B2 (en) * 2004-11-05 2007-12-11 National Taiwan University Method with mechanically strained silicon for enhancing speed of integrated circuits or devices
US7922474B2 (en) * 2005-02-17 2011-04-12 Asml Netherlands B.V. Imprint lithography
JP3958344B2 (ja) * 2005-06-07 2007-08-15 キヤノン株式会社 インプリント装置、インプリント方法及びチップの製造方法
US7927089B2 (en) * 2005-06-08 2011-04-19 Canon Kabushiki Kaisha Mold, apparatus including mold, pattern transfer apparatus, and pattern forming method
US8025829B2 (en) * 2006-11-28 2011-09-27 Nanonex Corporation Die imprint by double side force-balanced press for step-and-repeat imprint lithography
CN102360162B (zh) 2007-02-06 2015-08-26 佳能株式会社 刻印方法和刻印装置
JP5110924B2 (ja) * 2007-03-14 2012-12-26 キヤノン株式会社 モールド、モールドの製造方法、加工装置及び加工方法
JP5137635B2 (ja) * 2007-03-16 2013-02-06 キヤノン株式会社 インプリント方法、チップの製造方法及びインプリント装置
JP5473266B2 (ja) * 2007-08-03 2014-04-16 キヤノン株式会社 インプリント方法および基板の加工方法、基板の加工方法による半導体デバイスの製造方法
US20090166317A1 (en) * 2007-12-26 2009-07-02 Canon Kabushiki Kaisha Method of processing substrate by imprinting
JP4799575B2 (ja) * 2008-03-06 2011-10-26 株式会社東芝 インプリント方法
JP2011009641A (ja) * 2009-06-29 2011-01-13 Toshiba Corp 半導体装置の製造方法及びインプリント用テンプレート
US8747092B2 (en) 2010-01-22 2014-06-10 Nanonex Corporation Fast nanoimprinting apparatus using deformale mold
JP5864929B2 (ja) * 2011-07-15 2016-02-17 キヤノン株式会社 インプリント装置および物品の製造方法
JP5661666B2 (ja) * 2012-02-29 2015-01-28 株式会社東芝 パターン形成装置及び半導体装置の製造方法
US10105883B2 (en) 2013-03-15 2018-10-23 Nanonex Corporation Imprint lithography system and method for manufacturing
WO2014145826A2 (en) 2013-03-15 2014-09-18 Nanonex Corporation System and methods of mold/substrate separation for imprint lithography
JP6412317B2 (ja) 2013-04-24 2018-10-24 キヤノン株式会社 インプリント方法、インプリント装置および物品の製造方法
CN104552679B (zh) * 2015-01-12 2017-01-11 北京同方生物芯片技术有限公司 模具模芯的制备方法、模具模芯及生物芯片
US10248018B2 (en) * 2015-03-30 2019-04-02 Canon Kabushiki Kaisha Imprint apparatus and method of manufacturing article
US9993962B2 (en) * 2016-05-23 2018-06-12 Canon Kabushiki Kaisha Method of imprinting to correct for a distortion within an imprint system
JP6978859B2 (ja) * 2017-06-15 2021-12-08 キヤノン株式会社 インプリント装置、および物品の製造方法
KR102003468B1 (ko) * 2017-07-28 2019-07-24 주식회사 필옵틱스 기판 갭 유지 장치
KR102003467B1 (ko) * 2017-07-28 2019-07-24 주식회사 필옵틱스 기판 처짐 변형 조절 장치
KR102426957B1 (ko) * 2017-10-17 2022-08-01 캐논 가부시끼가이샤 임프린트 장치, 및 물품의 제조 방법
KR102048747B1 (ko) * 2018-04-16 2019-11-26 한국기계연구원 마이크로 소자 전사방법
JP7134725B2 (ja) * 2018-06-11 2022-09-12 キヤノン株式会社 型を用いて基板上の組成物を成形する成形装置、および物品の製造方法

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2959502A (en) * 1959-09-01 1960-11-08 Wolfgang W Gaertner Fabrication of semiconductor devices
US3337664A (en) * 1965-05-05 1967-08-22 Illinois Tool Works Method and apparatus for forming thermoplastic articles of unusual configuration
FR2209967B1 (zh) * 1972-12-08 1979-03-30 Thomson Csf
US4584157A (en) * 1983-04-25 1986-04-22 Arrem Plastics, Inc. Method for double-side thermoforming
NL194929C (nl) 1992-10-20 2003-07-04 Samsung Electronics Co Ltd Projectiebelichtingssysteem.
JP3309517B2 (ja) 1993-09-28 2002-07-29 セイコーエプソン株式会社 薄膜トランジスタの製造方法及び液晶表示装置の製造方法
US6614522B1 (en) * 1995-09-08 2003-09-02 Integ, Inc. Body fluid sampler
US5772905A (en) * 1995-11-15 1998-06-30 Regents Of The University Of Minnesota Nanoimprint lithography
US5951939A (en) * 1997-07-30 1999-09-14 Ford Motor Company Method for heating films for thermoforming
JP3780700B2 (ja) 1998-05-26 2006-05-31 セイコーエプソン株式会社 パターン形成方法、パターン形成装置、パターン形成用版、パターン形成用版の製造方法、カラーフィルタの製造方法、導電膜の製造方法及び液晶パネルの製造方法
US6029966A (en) * 1998-10-13 2000-02-29 Hertz; Allen D. Flexible, self conforming, workpiece support system
US6264187B1 (en) * 1998-10-13 2001-07-24 Galahad, Co. Method and apparatus for self-conforming support system
JP2000194142A (ja) 1998-12-25 2000-07-14 Fujitsu Ltd パタ―ン形成方法及び半導体装置の製造方法
US6334960B1 (en) * 1999-03-11 2002-01-01 Board Of Regents, The University Of Texas System Step and flash imprint lithography
KR100335070B1 (ko) 1999-04-21 2002-05-03 백승준 압축 성형 기법을 이용한 미세 패턴 형성 방법
US6873087B1 (en) 1999-10-29 2005-03-29 Board Of Regents, The University Of Texas System High precision orientation alignment and gap control stages for imprint lithography processes
SE515607C2 (sv) 1999-12-10 2001-09-10 Obducat Ab Anordning och metod vid tillverkning av strukturer
SE515962C2 (sv) * 2000-03-15 2001-11-05 Obducat Ab Anordning för överföring av mönster till objekt
JP2004523906A (ja) * 2000-10-12 2004-08-05 ボード・オブ・リージエンツ，ザ・ユニバーシテイ・オブ・テキサス・システム 室温かつ低圧マイクロおよびナノ転写リソグラフィのためのテンプレート
US6387787B1 (en) 2001-03-02 2002-05-14 Motorola, Inc. Lithographic template and method of formation and use
US6517977B2 (en) 2001-03-28 2003-02-11 Motorola, Inc. Lithographic template and method of formation and use
JP3588633B2 (ja) 2001-09-04 2004-11-17 独立行政法人産業技術総合研究所 インプリントリソグラフィー用移動ステージ
JP2003224077A (ja) * 2002-01-30 2003-08-08 Tokyo Electron Ltd プラズマ処理装置、電極部材、バッフル板の製造方法、処理装置、および、表面処理方法
US20050082698A1 (en) 2002-06-26 2005-04-21 George Gutman Method and apparatus for producing optical disk substrates
US6900881B2 (en) * 2002-07-11 2005-05-31 Molecular Imprints, Inc. Step and repeat imprint lithography systems
JP3814591B2 (ja) * 2002-07-29 2006-08-30 キヤノン株式会社 光学素子及び光学素子成形品およびその成形用金型及び射出成形方法
KR101056505B1 (ko) 2002-11-13 2011-08-11 몰레큘러 임프린츠 인코퍼레이티드 기판의 형상을 조절하기 위한 척킹 시스템 및 방법
JP4651390B2 (ja) 2003-03-27 2011-03-16 コリア・インスティテュート・オブ・マシナリー・アンド・マテリアルズ 多重浮彫要素スタンプを利用したｕｖナノインプリントリソグラフィ法
JP4183245B2 (ja) 2003-05-12 2008-11-19 キヤノン株式会社 アライメント方法、該アライメント方法を用いた露光方法
US6829988B2 (en) * 2003-05-16 2004-12-14 Suss Microtec, Inc. Nanoimprinting apparatus and method
JP2005077867A (ja) 2003-09-02 2005-03-24 Fujinon Corp フィルムスキャナ
JP2005101201A (ja) * 2003-09-24 2005-04-14 Canon Inc ナノインプリント装置
JP2005101313A (ja) 2003-09-25 2005-04-14 Canon Inc 微細パターン形成装置
KR100543130B1 (ko) 2004-01-29 2006-01-20 한국기계연구원 임프린트된 실리콘 기판을 이용한 복합 미세접촉 인쇄방법
JP4455092B2 (ja) * 2004-02-20 2010-04-21 キヤノン株式会社 加工装置及び加工方法
US7504268B2 (en) 2004-05-28 2009-03-17 Board Of Regents, The University Of Texas System Adaptive shape substrate support method
CN1307486C (zh) * 2004-12-20 2007-03-28 西安交通大学 聚二甲基硅氧烷微流控芯片复型光固化树脂模具制作方法
JP3958344B2 (ja) * 2005-06-07 2007-08-15 キヤノン株式会社 インプリント装置、インプリント方法及びチップの製造方法

Also Published As

Publication number Publication date
US20080042320A1 (en) 2008-02-21
US8246887B2 (en) 2012-08-21
JP3958344B2 (ja) 2007-08-15
TWI321811B (en) 2010-03-11
CN101566795B (zh) 2012-02-08
CN1876393A (zh) 2006-12-13
EP1731964A1 (en) 2006-12-13
CN101566795A (zh) 2009-10-28
EP1731964B1 (en) 2016-03-23
JP2007019479A (ja) 2007-01-25
CN100503264C (zh) 2009-06-24
KR20060127804A (ko) 2006-12-13
US20060273488A1 (en) 2006-12-07
US7635260B2 (en) 2009-12-22
KR100806231B1 (ko) 2008-02-22

Similar Documents

Publication Publication Date Title
TW200741833A (en) Processing apparatus, processing method, and process for producing chip
EP1793021A3 (en) Method for semiconductor processing using silicon carbide article
SG166091A1 (en) Method for producing isocyanates
TW200636846A (en) Method and apparatus for breaking workpiece, scribing and breaking method, and scribing apparatus with breaking function
TW200734706A (en) Patterning substrates employing multiple chucks
TNSN06383A1 (en) Device for aligning two shell molds
MY146892A (en) Machining apparatus and machining method
EP2154269A4 (en) PROCESS FOR PROCESSING SILICON BASE MATERIAL, OBJECT AND PROCESSING DEVICE PROCESSED BY THE METHOD
EP1385056A3 (en) Method and apparatus for reducing thermal stress in a wafer
TW200731032A (en) Substrate holding apparatus, exposure apparatus, and device production method
MY128593A (en) Strain correcting method for plane member and apparatus thereof
TW200603937A (en) Mechanical feeding device for manufacturing lumber, plastic workpiece and its processing method
PL1990151T3 (pl) Obrabiarka
WO2008024681A3 (en) Apparatus and methods for handling workpieces in a processing system
ATE371683T1 (de) Polarisierte gegenstände und herstellungsverfahren dafür
TW200700930A (en) Separation apparatus and method
MX2010006928A (es) Aparatos y metodos para moldeado por compresion.
TW200624207A (en) System method and apparatus for dry-in, dry-out, low defect laser dicing using proximity technology
ATE499327T1 (de) Schubverfahren und vorrichtung zum überführen von glasartikeln
TW200626515A (en) Perform production apparatus and perform production method
TW200631113A (en) Wire bonding apparatus and process
WO2004110711A3 (en) Apparatus for the production of caps
MXPA02002372A (es) Aparato para sostener articulos.
CN207480109U (zh) 用于玻璃模具的双面夹持夹具
PL1837134T3 (pl) Urządzenie manipulacyjne i sposób manipulowania detalami

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees