TW200731032A - Substrate holding apparatus, exposure apparatus, and device production method - Google Patents

Substrate holding apparatus, exposure apparatus, and device production method

Info

Publication number
TW200731032A
TW200731032A TW096101721A TW96101721A TW200731032A TW 200731032 A TW200731032 A TW 200731032A TW 096101721 A TW096101721 A TW 096101721A TW 96101721 A TW96101721 A TW 96101721A TW 200731032 A TW200731032 A TW 200731032A
Authority
TW
Taiwan
Prior art keywords
region
substrate
base member
support section
gap
Prior art date
Application number
TW096101721A
Other languages
Chinese (zh)
Inventor
Takeyuki Mizutani
Yuichi Shibazaki
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of TW200731032A publication Critical patent/TW200731032A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions

Abstract

A substrate holding apparatus (4T) has a base member (30), a support section (81) formed on the base member (30) and supporting a substrate (P), a peripheral wall formed on the base member (30) and surrounding the support section (81), a first region (31) provided in an annular shape on the base member (30), along the peripheral wall (33), the first region (31) forming a first gap (G1) between the first region and the back face of the substrate (P) supported by the support section (81), the first region (31) holding influent liquid (LQ) entering from between the substrate (P) supported by the support section (81) and the peripheral wall (33), the influent liquid (LQ) being held between the first region (31) and the substrate (P), and a second region (32) provided on the base member (30), inside the first region (31) relative to the peripheral wall (33), the second region (32) forming a second gap (G2) between the second region (32) and the back face of the substrate (P) supported by the support section (81), the second gap (G2) being greater than the first gap (G1).
TW096101721A 2006-01-17 2007-01-17 Substrate holding apparatus, exposure apparatus, and device production method TW200731032A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006008555 2006-01-17

Publications (1)

Publication Number Publication Date
TW200731032A true TW200731032A (en) 2007-08-16

Family

ID=38287545

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096101721A TW200731032A (en) 2006-01-17 2007-01-17 Substrate holding apparatus, exposure apparatus, and device production method

Country Status (3)

Country Link
JP (1) JPWO2007083592A1 (en)
TW (1) TW200731032A (en)
WO (1) WO2007083592A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109314077A (en) * 2016-06-01 2019-02-05 佳能株式会社 Sucker, substrate keep equipment, patterning device and the method for manufacturing article

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3953460B2 (en) 2002-11-12 2007-08-08 エーエスエムエル ネザーランズ ビー．ブイ． Lithographic projection apparatus
US7433016B2 (en) 2005-05-03 2008-10-07 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP5029870B2 (en) * 2006-11-13 2012-09-19 株式会社ニコン Exposure method and apparatus, immersion member, exposure apparatus maintenance method, and device manufacturing method
US20090051895A1 (en) * 2007-08-24 2009-02-26 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, device manufacturing method, and processing system
US8023106B2 (en) * 2007-08-24 2011-09-20 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method
US8867022B2 (en) * 2007-08-24 2014-10-21 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, and device manufacturing method
NL1036924A1 (en) * 2008-06-02 2009-12-03 Asml Netherlands Bv Substrate table, lithographic apparatus and device manufacturing method.
NL2009189A (en) 2011-08-17 2013-02-19 Asml Netherlands Bv Support table for a lithographic apparatus, lithographic apparatus and device manufacturing method.
JP6706182B2 (en) * 2016-09-16 2020-06-03 キオクシア株式会社 Substrate holding device
EP3695276A1 (en) * 2017-10-12 2020-08-19 ASML Netherlands B.V. Substrate holder for use in a lithographic apparatus
CN115101467A (en) * 2022-05-11 2022-09-23 北京华卓精科科技股份有限公司 Silicon chip bearing device in photoetching equipment

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3953460B2 (en) * 2002-11-12 2007-08-08 エーエスエムエル ネザーランズ ビー．ブイ． Lithographic projection apparatus
JP2005175016A (en) * 2003-12-08 2005-06-30 Canon Inc Substrate holding device, exposure device using the same, and method of manufacturing device
JP2005277117A (en) * 2004-03-25 2005-10-06 Nikon Corp Substrate holding device, exposure method and device, and device manufacturing method
SG153813A1 (en) * 2004-06-09 2009-07-29 Nikon Corp Substrate holding device, exposure apparatus having same, exposure method, method for producing device, and liquid repellent plate
JP5119666B2 (en) * 2004-06-21 2013-01-16 株式会社ニコン Exposure apparatus, liquid removal method, and device manufacturing method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109314077A (en) * 2016-06-01 2019-02-05 佳能株式会社 Sucker, substrate keep equipment, patterning device and the method for manufacturing article
CN109314077B (en) * 2016-06-01 2023-06-02 佳能株式会社 Suction cup, substrate holding apparatus, patterning apparatus, and method of manufacturing article

Also Published As

Publication number Publication date
JPWO2007083592A1 (en) 2009-06-11
WO2007083592A1 (en) 2007-07-26

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