TW200740923A - Room temperature curable type silicone rubber composition for protecting electric/electronic part, circuit-mounted plate, silver electrode and silver chip resistor - Google Patents

Room temperature curable type silicone rubber composition for protecting electric/electronic part, circuit-mounted plate, silver electrode and silver chip resistor

Info

Publication number
TW200740923A
TW200740923A TW095116952A TW95116952A TW200740923A TW 200740923 A TW200740923 A TW 200740923A TW 095116952 A TW095116952 A TW 095116952A TW 95116952 A TW95116952 A TW 95116952A TW 200740923 A TW200740923 A TW 200740923A
Authority
TW
Taiwan
Prior art keywords
silver
room temperature
rubber composition
silicone rubber
chip resistor
Prior art date
Application number
TW095116952A
Other languages
English (en)
Other versions
TWI379868B (zh
Inventor
Jun Horikoshi
Tsuneo Kimura
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of TW200740923A publication Critical patent/TW200740923A/zh
Application granted granted Critical
Publication of TWI379868B publication Critical patent/TWI379868B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/02—Polyamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Details Of Resistors (AREA)
TW095116952A 2005-05-13 2006-05-12 Room temperature curable type silicone rubber composition for protecting electric/electronic part, circuit-mounted plate, silver electrode and silver chip resistor TW200740923A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005141131A JP4569765B2 (ja) 2005-05-13 2005-05-13 電気・電子部品保護用室温硬化型シリコーンゴム組成物、並びに実装回路板、銀電極及び銀チップ抵抗器

Publications (2)

Publication Number Publication Date
TW200740923A true TW200740923A (en) 2007-11-01
TWI379868B TWI379868B (zh) 2012-12-21

Family

ID=37419476

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095116952A TW200740923A (en) 2005-05-13 2006-05-12 Room temperature curable type silicone rubber composition for protecting electric/electronic part, circuit-mounted plate, silver electrode and silver chip resistor

Country Status (5)

Country Link
US (1) US7553901B2 (zh)
JP (1) JP4569765B2 (zh)
KR (1) KR101390614B1 (zh)
CN (1) CN1876720B (zh)
TW (1) TW200740923A (zh)

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US9333454B2 (en) 2011-01-21 2016-05-10 International Business Machines Corporation Silicone-based chemical filter and silicone-based chemical bath for removing sulfur contaminants
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US8741804B2 (en) 2011-10-28 2014-06-03 International Business Machines Corporation Microcapsules adapted to rupture in a magnetic field
CA2855120A1 (en) 2011-11-10 2013-05-16 Momentive Performance Materials Inc. Moisture curable organopolysiloxane composition
WO2013090132A2 (en) 2011-12-15 2013-06-20 Momentive Performance Materials, Inc. Moisture curable organopolysiloxane compositions
KR101804832B1 (ko) 2011-12-15 2017-12-05 모멘티브 퍼포먼스 머티리얼즈 인크. 수분 경화성 오가노폴리실록산 조성물
CA2861659A1 (en) 2011-12-29 2013-07-04 Momentive Performance Materials, Inc. Moisture curable organopolysiloxane composition
US8879275B2 (en) 2012-02-21 2014-11-04 International Business Machines Corporation Anti-corrosion conformal coating comprising modified porous silica fillers for metal conductors electrically connecting an electronic component
US9716055B2 (en) 2012-06-13 2017-07-25 International Business Machines Corporation Thermal interface material (TIM) with thermally conductive integrated release layer
US20140000955A1 (en) * 2012-06-28 2014-01-02 International Business Machines Corporation Conformal Coating Capable of Scavenging a Corrosive Agent
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EP2994501A2 (en) 2013-05-10 2016-03-16 Momentive Performance Materials Inc. Non-metal catalyzed room temperature moisture curable organopolysiloxane compositions
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US10121573B2 (en) 2016-01-06 2018-11-06 International Business Machines Corporation Epoxy-based resin system composition containing a latent functionality for polymer adhesion improvement to prevent sulfur related corrosion
CN118271847A (zh) 2016-08-19 2024-07-02 陶氏东丽株式会社 用于保护电气/电子部件的室温可固化的有机聚硅氧烷组合物
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CN107778868B (zh) * 2017-11-17 2021-02-12 东莞兆舜有机硅科技股份有限公司 一种硅橡胶材料及其制备方法和用途
CN112513128B (zh) * 2018-08-03 2023-01-10 信越化学工业株式会社 室温固化性聚丁二烯树脂组合物、其制造方法和实装电路基板
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Also Published As

Publication number Publication date
JP2006316184A (ja) 2006-11-24
US7553901B2 (en) 2009-06-30
TWI379868B (zh) 2012-12-21
US20060257672A1 (en) 2006-11-16
JP4569765B2 (ja) 2010-10-27
KR20060117258A (ko) 2006-11-16
CN1876720B (zh) 2012-05-23
KR101390614B1 (ko) 2014-04-29
CN1876720A (zh) 2006-12-13

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