TW200738085A - Method and apparatus for a printed circuit board using laser assisted metallization and patterning of a substrate - Google Patents
Method and apparatus for a printed circuit board using laser assisted metallization and patterning of a substrateInfo
- Publication number
- TW200738085A TW200738085A TW095146926A TW95146926A TW200738085A TW 200738085 A TW200738085 A TW 200738085A TW 095146926 A TW095146926 A TW 095146926A TW 95146926 A TW95146926 A TW 95146926A TW 200738085 A TW200738085 A TW 200738085A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- printed circuit
- patterning
- circuit board
- laser assisted
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/486—Via connections through the substrate with or without pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49822—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0367—Metallic bump or raised conductor not used as solder bump
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0369—Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0733—Method for plating stud vias, i.e. massive vias formed by plating the bottom of a hole without plating on the walls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Ceramic Engineering (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/320,922 US7765691B2 (en) | 2005-12-28 | 2005-12-28 | Method and apparatus for a printed circuit board using laser assisted metallization and patterning of a substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200738085A true TW200738085A (en) | 2007-10-01 |
TWI327881B TWI327881B (en) | 2010-07-21 |
Family
ID=38192282
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095146926A TWI327881B (en) | 2005-12-28 | 2006-12-14 | Method for forming a printed circuit board |
Country Status (7)
Country | Link |
---|---|
US (1) | US7765691B2 (zh) |
JP (2) | JP2009516396A (zh) |
KR (1) | KR101025435B1 (zh) |
CN (1) | CN101347053B (zh) |
DE (1) | DE112006003613B4 (zh) |
TW (1) | TWI327881B (zh) |
WO (1) | WO2007078865A2 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7987589B2 (en) | 2008-10-13 | 2011-08-02 | Unimicron Technology Corp. | Multilayer three-dimensional circuit structure and manufacturing method thereof |
US8436254B2 (en) | 2008-07-14 | 2013-05-07 | Unimicron Technology Corp. | Method of fabricating circuit board structure |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8017022B2 (en) * | 2007-12-28 | 2011-09-13 | Intel Corporation | Selective electroless plating for electronic substrates |
US9113547B2 (en) * | 2008-10-24 | 2015-08-18 | Intel Corporation | Same layer microelectronic circuit patterning using hybrid laser projection patterning (LPP) and semi-additive patterning(SAP) |
US8395051B2 (en) * | 2008-12-23 | 2013-03-12 | Intel Corporation | Doping of lead-free solder alloys and structures formed thereby |
US20110095410A1 (en) * | 2009-10-28 | 2011-04-28 | Fairchild Semiconductor Corporation | Wafer level semiconductor device connector |
TWI405317B (zh) * | 2010-03-04 | 2013-08-11 | Unimicron Technology Corp | 封裝基板及其製法 |
US8835217B2 (en) | 2010-12-22 | 2014-09-16 | Intel Corporation | Device packaging with substrates having embedded lines and metal defined pads |
TWI432116B (zh) * | 2011-03-23 | 2014-03-21 | Unimicron Technology Corp | 線路板的內埋式線路結構的製造方法 |
CN102806789A (zh) * | 2011-06-03 | 2012-12-05 | 上海安费诺永亿通讯电子有限公司 | 在绝缘体表面形成金属图案的方法 |
US20130037312A1 (en) * | 2011-08-10 | 2013-02-14 | Invensas Corporation | High density trace formation method by laser ablation |
TWI504322B (zh) | 2012-03-29 | 2015-10-11 | Taiwan Green Point Entpr Co | 雙面電路板及其製備方法 |
US10149390B2 (en) | 2012-08-27 | 2018-12-04 | Mycronic AB | Maskless writing of a workpiece using a plurality of exposures having different focal planes using multiple DMDs |
US20140174791A1 (en) * | 2012-12-26 | 2014-06-26 | Unimicron Technology Corp. | Circuit board and manufacturing method thereof |
KR102356809B1 (ko) | 2014-12-26 | 2022-01-28 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
KR20160080526A (ko) | 2014-12-29 | 2016-07-08 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
IT201900005156A1 (it) * | 2019-04-05 | 2020-10-05 | St Microelectronics Srl | Procedimento per fabbricare leadframe per dispositivi a semiconduttore |
IT201900006740A1 (it) * | 2019-05-10 | 2020-11-10 | Applied Materials Inc | Procedimenti di strutturazione di substrati |
IT201900024292A1 (it) | 2019-12-17 | 2021-06-17 | St Microelectronics Srl | Procedimento per fabbricare dispositivi a semiconduttore e dispositivo a semiconduttore corrispondente |
CN113853063A (zh) * | 2021-09-09 | 2021-12-28 | 深圳市海目星激光智能装备股份有限公司 | 介电材料去除方法、激光去除设备与电子器件 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
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ATE56050T1 (de) | 1987-04-24 | 1990-09-15 | Siemens Ag | Verfahren zur herstellung von leiterplatten. |
DE69015878T2 (de) | 1989-04-17 | 1995-07-13 | Ibm | Mehrschichtleiterplattenstruktur. |
JPH03268392A (ja) * | 1990-03-16 | 1991-11-29 | Hitachi Chem Co Ltd | 多層配線板の製造法 |
US5462773A (en) * | 1992-12-28 | 1995-10-31 | Xerox Corporation | Synchronized process for catalysis of electroless metal plating on plastic |
JPH0758438A (ja) * | 1993-08-18 | 1995-03-03 | Shinko Electric Ind Co Ltd | 回路基板及びその製造方法 |
JP3493703B2 (ja) * | 1994-01-25 | 2004-02-03 | 松下電工株式会社 | 回路板の形成方法 |
JP3414024B2 (ja) * | 1995-01-30 | 2003-06-09 | 株式会社日立製作所 | 電子回路基板の配線修正方法 |
JPH09260808A (ja) * | 1996-03-19 | 1997-10-03 | Fujitsu Ltd | 光触媒反応による金属配線の形成方法及び基材 |
JP3111891B2 (ja) * | 1996-04-09 | 2000-11-27 | 株式会社村田製作所 | 無電解めっきのための活性化触媒液および無電解めっき方法 |
JP3633252B2 (ja) | 1997-01-10 | 2005-03-30 | イビデン株式会社 | プリント配線板及びその製造方法 |
JP3297006B2 (ja) * | 1997-12-05 | 2002-07-02 | イビデン株式会社 | 多層プリント配線板 |
DE19723734C2 (de) * | 1997-06-06 | 2002-02-07 | Gerhard Naundorf | Leiterbahnstrukturen auf einem nichtleitenden Trägermaterial und Verfahren zu ihrer Herstellung |
KR100244580B1 (ko) | 1997-06-24 | 2000-02-15 | 윤종용 | 금속 범프를 갖는 회로 기판의 제조 방법 및 그를 이용한 반도체 칩 패키지의 제조 방법 |
US6222136B1 (en) | 1997-11-12 | 2001-04-24 | International Business Machines Corporation | Printed circuit board with continuous connective bumps |
US6562656B1 (en) | 2001-06-25 | 2003-05-13 | Thin Film Module, Inc. | Cavity down flip chip BGA |
JP2003031924A (ja) * | 2001-07-16 | 2003-01-31 | Toray Eng Co Ltd | 金属回路形成方法 |
AU2002211864A1 (en) | 2001-07-23 | 2003-02-17 | Gary A. Clayton | Grid interposer |
US20030180448A1 (en) | 2002-03-21 | 2003-09-25 | T.L.M. Advanced Laser Technology Ltd. | Method for fabrication of printed circuit boards |
JP3953900B2 (ja) * | 2002-06-27 | 2007-08-08 | 日本特殊陶業株式会社 | 積層樹脂配線基板及びその製造方法 |
TWI254995B (en) * | 2004-01-30 | 2006-05-11 | Phoenix Prec Technology Corp | Presolder structure formed on semiconductor package substrate and method for fabricating the same |
JP2005286158A (ja) * | 2004-03-30 | 2005-10-13 | Seiko Epson Corp | パターン形成方法、電子デバイス及びその製造方法並びに電子機器 |
JP3918828B2 (ja) * | 2004-05-20 | 2007-05-23 | 株式会社トッパンNecサーキットソリューションズ | 半導体装置 |
-
2005
- 2005-12-28 US US11/320,922 patent/US7765691B2/en not_active Expired - Fee Related
-
2006
- 2006-12-13 KR KR1020087015840A patent/KR101025435B1/ko active IP Right Grant
- 2006-12-13 DE DE112006003613.0T patent/DE112006003613B4/de not_active Expired - Fee Related
- 2006-12-13 CN CN2006800494240A patent/CN101347053B/zh not_active Expired - Fee Related
- 2006-12-13 JP JP2008541441A patent/JP2009516396A/ja not_active Abandoned
- 2006-12-13 WO PCT/US2006/047814 patent/WO2007078865A2/en active Application Filing
- 2006-12-14 TW TW095146926A patent/TWI327881B/zh not_active IP Right Cessation
-
2011
- 2011-12-14 JP JP2011273536A patent/JP5404755B2/ja not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8436254B2 (en) | 2008-07-14 | 2013-05-07 | Unimicron Technology Corp. | Method of fabricating circuit board structure |
US7987589B2 (en) | 2008-10-13 | 2011-08-02 | Unimicron Technology Corp. | Multilayer three-dimensional circuit structure and manufacturing method thereof |
Also Published As
Publication number | Publication date |
---|---|
DE112006003613B4 (de) | 2017-11-23 |
CN101347053A (zh) | 2009-01-14 |
US20070144769A1 (en) | 2007-06-28 |
JP2009516396A (ja) | 2009-04-16 |
DE112006003613T5 (de) | 2008-11-13 |
CN101347053B (zh) | 2011-04-27 |
US7765691B2 (en) | 2010-08-03 |
KR20080070877A (ko) | 2008-07-31 |
JP2012089874A (ja) | 2012-05-10 |
TWI327881B (en) | 2010-07-21 |
WO2007078865A3 (en) | 2007-11-29 |
KR101025435B1 (ko) | 2011-03-28 |
WO2007078865A2 (en) | 2007-07-12 |
JP5404755B2 (ja) | 2014-02-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
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