TW200733787A - Substrate adhesion apparatus and method for sealing organic light emitting display using the same - Google Patents

Substrate adhesion apparatus and method for sealing organic light emitting display using the same

Info

Publication number
TW200733787A
TW200733787A TW095147856A TW95147856A TW200733787A TW 200733787 A TW200733787 A TW 200733787A TW 095147856 A TW095147856 A TW 095147856A TW 95147856 A TW95147856 A TW 95147856A TW 200733787 A TW200733787 A TW 200733787A
Authority
TW
Taiwan
Prior art keywords
groove
elastic member
discharge holes
light emitting
organic light
Prior art date
Application number
TW095147856A
Other languages
English (en)
Other versions
TWI339996B (en
Inventor
Jong-Woo Lee
Original Assignee
Samsung Sdi Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Sdi Co Ltd filed Critical Samsung Sdi Co Ltd
Publication of TW200733787A publication Critical patent/TW200733787A/zh
Application granted granted Critical
Publication of TWI339996B publication Critical patent/TWI339996B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/06—Joining glass to glass by processes other than fusing
    • C03C27/10—Joining glass to glass by processes other than fusing with the aid of adhesive specially adapted for that purpose
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/851—Division of substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
TW095147856A 2006-02-20 2006-12-20 Substrate adhesion apparatus and method for sealing organic light emitting display using the same TWI339996B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060016446A KR100713987B1 (ko) 2006-02-20 2006-02-20 기판 밀착장치 및 이를 이용한 유기전계발광 표시장치의밀봉방법

Publications (2)

Publication Number Publication Date
TW200733787A true TW200733787A (en) 2007-09-01
TWI339996B TWI339996B (en) 2011-04-01

Family

ID=38269539

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095147856A TWI339996B (en) 2006-02-20 2006-12-20 Substrate adhesion apparatus and method for sealing organic light emitting display using the same

Country Status (4)

Country Link
US (1) US20070197120A1 (zh)
JP (1) JP2007227343A (zh)
KR (1) KR100713987B1 (zh)
TW (1) TWI339996B (zh)

Cited By (16)

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CN102555404A (zh) * 2010-12-07 2012-07-11 Apro系统株式会社 使用空气挤压的层压装置及方法
TWI404695B (zh) * 2008-05-26 2013-08-11 Hamamatsu Photonics Kk Glass fusion method
US8839643B2 (en) 2008-06-11 2014-09-23 Hamamatsu Photonics K.K. Fusion bonding process for glass
US8863553B2 (en) 2008-05-26 2014-10-21 Hamamatsu Photonics K.K. Glass welding method
US9016091B2 (en) 2009-11-25 2015-04-28 Hamamatsu Photonics K.K. Glass welding method and glass layer fixing method
US9021836B2 (en) 2009-11-25 2015-05-05 Hamamatsu Photonics K.K. Glass welding method and glass layer fixing method
US9045365B2 (en) 2008-06-23 2015-06-02 Hamamatsu Photonics K.K. Fusion-bonding process for glass
US9073778B2 (en) 2009-11-12 2015-07-07 Hamamatsu Photonics K.K. Glass welding method
US9233872B2 (en) 2009-11-25 2016-01-12 Hamamatsu Photonics K.K. Glass welding method and glass layer fixing method
US9701582B2 (en) 2009-11-25 2017-07-11 Hamamatsu Photonics K.K. Glass welding method and glass layer fixing method
US9887059B2 (en) 2009-11-25 2018-02-06 Hamamatsu Photonics K.K. Glass welding method
US9922790B2 (en) 2009-11-25 2018-03-20 Hamamatsu Photonics K.K. Glass welding method
US10322469B2 (en) 2008-06-11 2019-06-18 Hamamatsu Photonics K.K. Fusion bonding process for glass
CN117729795A (zh) * 2024-02-07 2024-03-19 惠科股份有限公司 封装排水汽装置、显示面板的封装方法以及显示装置
CN117729793A (zh) * 2024-02-07 2024-03-19 惠科股份有限公司 封装排水汽装置、显示面板的封装方法以及显示装置
CN117729794A (zh) * 2024-02-07 2024-03-19 惠科股份有限公司 封装排水汽装置、显示面板的封装方法以及显示装置

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100673765B1 (ko) * 2006-01-20 2007-01-24 삼성에스디아이 주식회사 유기전계발광 표시장치 및 그 제조방법
US8038495B2 (en) 2006-01-20 2011-10-18 Samsung Mobile Display Co., Ltd. Organic light-emitting display device and manufacturing method of the same
KR100635514B1 (ko) 2006-01-23 2006-10-18 삼성에스디아이 주식회사 유기전계발광표시장치 및 그 제조방법
JP4456092B2 (ja) * 2006-01-24 2010-04-28 三星モバイルディスプレイ株式會社 有機電界発光表示装置及びその製造方法
JP4624309B2 (ja) * 2006-01-24 2011-02-02 三星モバイルディスプレイ株式會社 有機電界発光表示装置及びその製造方法
KR100688796B1 (ko) * 2006-01-25 2007-03-02 삼성에스디아이 주식회사 유기전계발광 표시 장치 및 그의 제작 방법
KR100688795B1 (ko) * 2006-01-25 2007-03-02 삼성에스디아이 주식회사 유기전계발광 표시장치 및 그 제조방법
KR100685853B1 (ko) * 2006-01-25 2007-02-22 삼성에스디아이 주식회사 유기전계발광표시장치 및 그 제조방법
US8164257B2 (en) * 2006-01-25 2012-04-24 Samsung Mobile Display Co., Ltd. Organic light emitting display and method of fabricating the same
KR100671641B1 (ko) 2006-01-25 2007-01-19 삼성에스디아이 주식회사 유기 전계 발광 표시장치 및 그 제조 방법
KR100671647B1 (ko) * 2006-01-26 2007-01-19 삼성에스디아이 주식회사 유기전계발광 표시 장치
JP4633674B2 (ja) 2006-01-26 2011-02-16 三星モバイルディスプレイ株式會社 有機電界発光表示装置及びその製造方法
KR100688790B1 (ko) * 2006-01-27 2007-03-02 삼성에스디아이 주식회사 유기 전계 발광 표시장치 및 그 제조 방법
KR100671639B1 (ko) * 2006-01-27 2007-01-19 삼성에스디아이 주식회사 유기 전계 발광 표시장치 및 그 제조 방법
KR100732817B1 (ko) 2006-03-29 2007-06-27 삼성에스디아이 주식회사 유기전계발광 표시장치 및 그 제조방법
KR100837618B1 (ko) * 2006-12-29 2008-06-13 주식회사 엘티에스 유리기판의 밀봉시스템 및 밀봉방법
US7883389B2 (en) 2007-02-08 2011-02-08 Copytele, Inc. Apparatus and method for rapid sealing of a flat panel display
US20090203283A1 (en) * 2008-02-07 2009-08-13 Margaret Helen Gentile Method for sealing an electronic device
KR100937864B1 (ko) * 2008-03-14 2010-01-21 삼성모바일디스플레이주식회사 프릿 실링 시스템
KR101045248B1 (ko) * 2009-02-10 2011-06-30 엘아이지에이디피 주식회사 기판 분리장치, 기판 분리방법, 미세패턴 형성장치 및 미세패턴 형성방법
US8860305B2 (en) 2009-07-09 2014-10-14 Corning Incorporated Methods for forming fritted cover sheets with masks and glass packages comprising the same
US9555516B2 (en) 2009-07-24 2017-01-31 Corning Incorporated Method for processing an edge of a glass plate
EP2549461A1 (en) * 2010-03-19 2013-01-23 Asahi Glass Company, Limited Electronic device and method for manufacturing same
KR20120070762A (ko) * 2010-12-22 2012-07-02 아프로시스템 주식회사 기포제거용 가압장치 및 방법
JPWO2012117978A1 (ja) * 2011-02-28 2014-07-07 旭硝子株式会社 気密部材とその製造方法
KR102145887B1 (ko) * 2013-08-09 2020-08-20 삼성디스플레이 주식회사 프릿 실링 시스템
CN104037196B (zh) * 2014-05-29 2017-06-27 京东方科技集团股份有限公司 一种发光显示面板及其制作方法
KR102132435B1 (ko) * 2018-12-26 2020-07-09 주식회사 에스에프에이 오엘이디(oled) 기판용 봉지장치
KR20200082504A (ko) * 2018-12-28 2020-07-08 엘지디스플레이 주식회사 조명 장치

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4238704A (en) * 1979-02-12 1980-12-09 Corning Glass Works Sealed beam lamp of borosilicate glass with a sealing glass of zinc silicoborate and a mill addition of cordierite
JPS60216333A (ja) * 1984-04-12 1985-10-29 Asahi Glass Co Ltd エレクトロクロミツク表示素子
JPS63163423A (ja) * 1986-12-26 1988-07-06 Matsushita Electric Ind Co Ltd 液晶表示装置の製造方法
JPH04147217A (ja) * 1990-10-11 1992-05-20 Hitachi Ltd 液晶表示素子セルの加圧装置
JPH0634983A (ja) * 1992-07-17 1994-02-10 Sharp Corp 貼合わせ装置
JPH06337429A (ja) * 1993-05-27 1994-12-06 M B K Maikurotetsuku:Kk 液晶セル用のプレスおよびアラインメント装置
JPH08146436A (ja) * 1994-11-16 1996-06-07 Ushio Inc 液晶パネルの貼り合わせ方法および装置
JP3120669B2 (ja) * 1994-11-16 2000-12-25 ウシオ電機株式会社 液晶パネルの貼り合わせ方法
JP3169864B2 (ja) * 1997-09-18 2001-05-28 日本電気株式会社 液晶パネル製造装置
JP3024609B2 (ja) * 1997-10-09 2000-03-21 日本電気株式会社 液晶表示素子セルの封孔装置
KR100480146B1 (ko) * 1999-10-30 2005-04-06 엘지.필립스 엘시디 주식회사 액정표시소자의 제조장치 및 방법
US6555025B1 (en) * 2000-01-31 2003-04-29 Candescent Technologies Corporation Tuned sealing material for sealing of a flat panel display
JP2002169135A (ja) * 2000-09-07 2002-06-14 Seiko Epson Corp セルギャップ調整装置、加圧封止装置及び液晶表示装置の製造方法
KR100720414B1 (ko) * 2002-02-27 2007-05-22 엘지.필립스 엘시디 주식회사 액정 표시 장치의 제조 방법
JP2004151656A (ja) * 2002-11-01 2004-05-27 Seiko Epson Corp 電気光学装置の製造方法および製造装置、並びに電気機器
JP4299021B2 (ja) * 2003-02-19 2009-07-22 ヤマト電子株式会社 封着加工材及び封着加工用ペースト
US6998776B2 (en) * 2003-04-16 2006-02-14 Corning Incorporated Glass package that is hermetically sealed with a frit and method of fabrication
US7371143B2 (en) * 2004-10-20 2008-05-13 Corning Incorporated Optimization of parameters for sealing organic emitting light diode (OLED) displays
KR20060058503A (ko) * 2004-11-25 2006-05-30 엘지전자 주식회사 캡 부착 장치

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI404695B (zh) * 2008-05-26 2013-08-11 Hamamatsu Photonics Kk Glass fusion method
US8516852B2 (en) 2008-05-26 2013-08-27 Hamamatsu Photonics K.K. Glass fusion method
US8863553B2 (en) 2008-05-26 2014-10-21 Hamamatsu Photonics K.K. Glass welding method
US8839643B2 (en) 2008-06-11 2014-09-23 Hamamatsu Photonics K.K. Fusion bonding process for glass
US10322469B2 (en) 2008-06-11 2019-06-18 Hamamatsu Photonics K.K. Fusion bonding process for glass
US9045365B2 (en) 2008-06-23 2015-06-02 Hamamatsu Photonics K.K. Fusion-bonding process for glass
US9073778B2 (en) 2009-11-12 2015-07-07 Hamamatsu Photonics K.K. Glass welding method
US9021836B2 (en) 2009-11-25 2015-05-05 Hamamatsu Photonics K.K. Glass welding method and glass layer fixing method
US9233872B2 (en) 2009-11-25 2016-01-12 Hamamatsu Photonics K.K. Glass welding method and glass layer fixing method
US9701582B2 (en) 2009-11-25 2017-07-11 Hamamatsu Photonics K.K. Glass welding method and glass layer fixing method
US9887059B2 (en) 2009-11-25 2018-02-06 Hamamatsu Photonics K.K. Glass welding method
US9922790B2 (en) 2009-11-25 2018-03-20 Hamamatsu Photonics K.K. Glass welding method
US9016091B2 (en) 2009-11-25 2015-04-28 Hamamatsu Photonics K.K. Glass welding method and glass layer fixing method
CN102555404A (zh) * 2010-12-07 2012-07-11 Apro系统株式会社 使用空气挤压的层压装置及方法
CN117729795A (zh) * 2024-02-07 2024-03-19 惠科股份有限公司 封装排水汽装置、显示面板的封装方法以及显示装置
CN117729793A (zh) * 2024-02-07 2024-03-19 惠科股份有限公司 封装排水汽装置、显示面板的封装方法以及显示装置
CN117729794A (zh) * 2024-02-07 2024-03-19 惠科股份有限公司 封装排水汽装置、显示面板的封装方法以及显示装置
CN117729795B (zh) * 2024-02-07 2024-05-03 惠科股份有限公司 封装排水汽装置、显示面板的封装方法以及显示装置
CN117729794B (zh) * 2024-02-07 2024-05-03 惠科股份有限公司 封装排水汽装置、显示面板的封装方法以及显示装置

Also Published As

Publication number Publication date
US20070197120A1 (en) 2007-08-23
KR100713987B1 (ko) 2007-05-04
TWI339996B (en) 2011-04-01
JP2007227343A (ja) 2007-09-06

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