TW200732850A - Water castable-water strippable top coats for 193 nm immersion lithography - Google Patents
Water castable-water strippable top coats for 193 nm immersion lithographyInfo
- Publication number
- TW200732850A TW200732850A TW095141318A TW95141318A TW200732850A TW 200732850 A TW200732850 A TW 200732850A TW 095141318 A TW095141318 A TW 095141318A TW 95141318 A TW95141318 A TW 95141318A TW 200732850 A TW200732850 A TW 200732850A
- Authority
- TW
- Taiwan
- Prior art keywords
- water
- topcoat
- immersion lithography
- topcoat material
- poly vinyl
- Prior art date
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title abstract 5
- 238000000671 immersion lithography Methods 0.000 title abstract 3
- 239000000463 material Substances 0.000 abstract 7
- 229920000642 polymer Polymers 0.000 abstract 3
- 238000000034 method Methods 0.000 abstract 2
- 239000000178 monomer Substances 0.000 abstract 2
- 229920002120 photoresistant polymer Polymers 0.000 abstract 2
- 239000004372 Polyvinyl alcohol Substances 0.000 abstract 1
- 125000001931 aliphatic group Chemical group 0.000 abstract 1
- 238000003384 imaging method Methods 0.000 abstract 1
- 238000007654 immersion Methods 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- 238000001459 lithography Methods 0.000 abstract 1
- 229920002689 polyvinyl acetate Polymers 0.000 abstract 1
- 229940075065 polyvinyl acetate Drugs 0.000 abstract 1
- 239000011118 polyvinyl acetate Substances 0.000 abstract 1
- 229920002451 polyvinyl alcohol Polymers 0.000 abstract 1
- 229940068984 polyvinyl alcohol Drugs 0.000 abstract 1
- 235000019422 polyvinyl alcohol Nutrition 0.000 abstract 1
- 229920001289 polyvinyl ether Polymers 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D129/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Coating compositions based on hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Coating compositions based on derivatives of such polymers
- C09D129/02—Homopolymers or copolymers of unsaturated alcohols
- C09D129/04—Polyvinyl alcohol; Partially hydrolysed homopolymers or copolymers of esters of unsaturated alcohols with saturated carboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D131/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid, or of a haloformic acid; Coating compositions based on derivatives of such polymers
- C09D131/02—Homopolymers or copolymers of esters of monocarboxylic acids
- C09D131/04—Homopolymers or copolymers of vinyl acetate
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Structural Engineering (AREA)
- Architecture (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Materials For Photolithography (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Paints Or Removers (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/284,358 US20070117040A1 (en) | 2005-11-21 | 2005-11-21 | Water castable-water strippable top coats for 193 nm immersion lithography |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200732850A true TW200732850A (en) | 2007-09-01 |
Family
ID=37507847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095141318A TW200732850A (en) | 2005-11-21 | 2006-11-08 | Water castable-water strippable top coats for 193 nm immersion lithography |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US20070117040A1 (enExample) |
| EP (1) | EP1951829B1 (enExample) |
| JP (1) | JP2009516859A (enExample) |
| KR (1) | KR101013051B1 (enExample) |
| CN (1) | CN101300317B (enExample) |
| AT (1) | ATE451433T1 (enExample) |
| DE (1) | DE602006011049D1 (enExample) |
| TW (1) | TW200732850A (enExample) |
| WO (1) | WO2007057263A1 (enExample) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080047930A1 (en) * | 2006-08-23 | 2008-02-28 | Graciela Beatriz Blanchet | Method to form a pattern of functional material on a substrate |
| US20090042148A1 (en) * | 2007-08-06 | 2009-02-12 | Munirathna Padmanaban | Photoresist Composition for Deep UV and Process Thereof |
| US8163468B2 (en) * | 2008-03-10 | 2012-04-24 | Micron Technology, Inc. | Method of reducing photoresist defects during fabrication of a semiconductor device |
| US8097401B2 (en) | 2009-03-24 | 2012-01-17 | International Business Machines Corporation | Self-forming top anti-reflective coating compositions and, photoresist mixtures and method of imaging using same |
| US8889341B2 (en) * | 2012-08-22 | 2014-11-18 | Eastman Kodak Company | Negative-working lithographic printing plate precursors and use |
| TWI639179B (zh) | 2014-01-31 | 2018-10-21 | 美商蘭姆研究公司 | 真空整合硬遮罩製程及設備 |
| US10566212B2 (en) | 2016-12-19 | 2020-02-18 | Lam Research Corporation | Designer atomic layer etching |
| US10276440B2 (en) | 2017-01-19 | 2019-04-30 | Honeywell International Inc. | Removable temporary protective layers for use in semiconductor manufacturing |
| US10796912B2 (en) * | 2017-05-16 | 2020-10-06 | Lam Research Corporation | Eliminating yield impact of stochastics in lithography |
| CN113039486B (zh) | 2018-11-14 | 2024-11-12 | 朗姆研究公司 | 可用于下一代光刻法中的硬掩模制作方法 |
| CN113227909B (zh) | 2018-12-20 | 2025-07-04 | 朗姆研究公司 | 抗蚀剂的干式显影 |
| TW202514246A (zh) | 2019-03-18 | 2025-04-01 | 美商蘭姆研究公司 | 基板處理方法與設備 |
| US12062538B2 (en) | 2019-04-30 | 2024-08-13 | Lam Research Corporation | Atomic layer etch and selective deposition process for extreme ultraviolet lithography resist improvement |
| TWI869221B (zh) | 2019-06-26 | 2025-01-01 | 美商蘭姆研究公司 | 利用鹵化物化學品的光阻顯影 |
| KR20250007037A (ko) | 2020-01-15 | 2025-01-13 | 램 리써치 코포레이션 | 포토레지스트 부착 및 선량 감소를 위한 하부층 |
| WO2021173557A1 (en) | 2020-02-28 | 2021-09-02 | Lam Research Corporation | Multi-layer hardmask for defect reduction in euv patterning |
| TWI876020B (zh) | 2020-04-03 | 2025-03-11 | 美商蘭姆研究公司 | 處理光阻的方法、以及用於沉積薄膜的設備 |
| CN116626993A (zh) | 2020-07-07 | 2023-08-22 | 朗姆研究公司 | 用于图案化辐射光致抗蚀剂图案化的集成干燥工艺 |
| JP7562696B2 (ja) | 2020-11-13 | 2024-10-07 | ラム リサーチ コーポレーション | フォトレジストのドライ除去用プロセスツール |
| CN116003665B (zh) * | 2021-10-22 | 2024-03-29 | 上海芯刻微材料技术有限责任公司 | 一种聚合物及含其的193nm光刻用顶涂层膜的制备方法 |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1772074C3 (de) * | 1967-03-29 | 1975-10-02 | Fuji Shashin Film K.K., Ashigara, Kanagawa (Japan) | Verfahren zur Herstellung einer farbphotographisclten Silberhalogenidemulsion |
| DE3825836A1 (de) * | 1988-07-29 | 1990-02-08 | Hoechst Ag | Photopolymerisierbares aufzeichnungsmaterial |
| US5273862A (en) * | 1988-07-29 | 1993-12-28 | Hoechst Aktiengesellschaft | Photopolymerizable recording material comprising a cover layer substantially impermeable to oxygen, binds oxygen and is soluble in water at 20°C. |
| US5240812A (en) * | 1990-09-18 | 1993-08-31 | International Business Machines Corporation | Top coat for acid catalyzed resists |
| JP2643056B2 (ja) * | 1991-06-28 | 1997-08-20 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 表面反射防止コーティング形成組成物及びその使用 |
| US5330883A (en) * | 1992-06-29 | 1994-07-19 | Lsi Logic Corporation | Techniques for uniformizing photoresist thickness and critical dimension of underlying features |
| JPH0737793A (ja) * | 1993-07-23 | 1995-02-07 | Sanyo Electric Co Ltd | 半導体装置の製造方法 |
| JP2985729B2 (ja) * | 1995-04-28 | 1999-12-06 | 信越化学工業株式会社 | 化学増幅型レジスト用保護膜材料 |
| JP3284056B2 (ja) * | 1995-09-12 | 2002-05-20 | 株式会社東芝 | 基板処理装置及びパターン形成方法 |
| US5879853A (en) * | 1996-01-18 | 1999-03-09 | Kabushiki Kaisha Toshiba | Top antireflective coating material and its process for DUV and VUV lithography systems |
| US6274295B1 (en) * | 1997-03-06 | 2001-08-14 | Clariant Finance (Bvi) Limited | Light-absorbing antireflective layers with improved performance due to refractive index optimization |
| JP2000089471A (ja) * | 1998-09-14 | 2000-03-31 | Sharp Corp | レジストパターンの形成方法 |
| US6232038B1 (en) * | 1998-10-07 | 2001-05-15 | Mitsubishi Chemical Corporation | Photosensitive composition, image-forming material and image-forming method employing it |
| CN1267000A (zh) * | 1999-03-11 | 2000-09-20 | 国际商业机器公司 | 环状烯烃聚合物和添加剂的光刻胶组合物 |
| US6251560B1 (en) * | 2000-05-05 | 2001-06-26 | International Business Machines Corporation | Photoresist compositions with cyclic olefin polymers having lactone moiety |
| JP3769171B2 (ja) * | 2000-05-17 | 2006-04-19 | 東京応化工業株式会社 | フレキソ印刷版製造用多層感光材料 |
| US6635401B2 (en) * | 2001-06-21 | 2003-10-21 | International Business Machines Corporation | Resist compositions with polymers having 2-cyano acrylic monomer |
| JP2003098674A (ja) * | 2001-09-21 | 2003-04-04 | Fuji Photo Film Co Ltd | 光重合性平版印刷版 |
| JP2004189600A (ja) * | 2002-10-16 | 2004-07-08 | Fuji Photo Film Co Ltd | インドリルフタリド化合物及びそれを用いた感熱記録材料 |
| US7303785B2 (en) * | 2003-06-03 | 2007-12-04 | Shin-Etsu Chemical Co., Ltd. | Antireflective film material, and antireflective film and pattern formation method using the same |
| KR100570211B1 (ko) * | 2003-12-24 | 2006-04-12 | 주식회사 하이닉스반도체 | 유기 반사방지막용 가교제 중합체, 이를 포함하는 유기반사 방지막 조성물 및 이를 이용한 포토레지스트의 패턴형성 방법 |
| US20050161644A1 (en) * | 2004-01-23 | 2005-07-28 | Peng Zhang | Immersion lithography fluids |
| JP4355944B2 (ja) * | 2004-04-16 | 2009-11-04 | 信越化学工業株式会社 | パターン形成方法及びこれに用いるレジスト上層膜材料 |
| KR100574490B1 (ko) * | 2004-04-27 | 2006-04-27 | 주식회사 하이닉스반도체 | 상부 반사방지막 중합체, 이의 제조방법 및 이를 함유하는상부 반사방지막 조성물 |
| JP4551701B2 (ja) * | 2004-06-14 | 2010-09-29 | 富士フイルム株式会社 | 液浸露光用保護膜形成組成物及びそれを用いたパターン形成方法 |
| US7049047B2 (en) * | 2004-08-10 | 2006-05-23 | Eastman Kodak Company | Imageable element with masking layer comprising sulfated polymer |
| US7183036B2 (en) * | 2004-11-12 | 2007-02-27 | International Business Machines Corporation | Low activation energy positive resist |
| US7288362B2 (en) * | 2005-02-23 | 2007-10-30 | International Business Machines Corporation | Immersion topcoat materials with improved performance |
-
2005
- 2005-11-21 US US11/284,358 patent/US20070117040A1/en not_active Abandoned
-
2006
- 2006-10-13 WO PCT/EP2006/067371 patent/WO2007057263A1/en not_active Ceased
- 2006-10-13 AT AT06794016T patent/ATE451433T1/de not_active IP Right Cessation
- 2006-10-13 DE DE602006011049T patent/DE602006011049D1/de active Active
- 2006-10-13 CN CN2006800412452A patent/CN101300317B/zh not_active Expired - Fee Related
- 2006-10-13 EP EP06794016A patent/EP1951829B1/en not_active Not-in-force
- 2006-10-13 KR KR1020087010979A patent/KR101013051B1/ko not_active Expired - Fee Related
- 2006-10-13 JP JP2008540550A patent/JP2009516859A/ja active Pending
- 2006-11-08 TW TW095141318A patent/TW200732850A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| DE602006011049D1 (de) | 2010-01-21 |
| ATE451433T1 (de) | 2009-12-15 |
| EP1951829B1 (en) | 2009-12-09 |
| CN101300317A (zh) | 2008-11-05 |
| JP2009516859A (ja) | 2009-04-23 |
| KR101013051B1 (ko) | 2011-02-14 |
| EP1951829A1 (en) | 2008-08-06 |
| KR20080068692A (ko) | 2008-07-23 |
| WO2007057263A1 (en) | 2007-05-24 |
| US20070117040A1 (en) | 2007-05-24 |
| CN101300317B (zh) | 2012-02-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW200732850A (en) | Water castable-water strippable top coats for 193 nm immersion lithography | |
| DE602006015428D1 (en) | Hie | |
| Boban et al. | Smooth, all-solid, low-hysteresis, omniphobic surfaces with enhanced mechanical durability | |
| Buck et al. | Superhydrophobic thin films fabricated by reactive layer-by-layer assembly of azlactone-functionalized polymers | |
| Pernites et al. | Tunable protein and bacterial cell adsorption on colloidally templated superhydrophobic polythiophene films | |
| Bao et al. | Control of the density of polymer brushes prepared by surface-initiated atom transfer radical polymerization | |
| Xiao et al. | Slippery liquid-infused porous surfaces showing marine antibiofouling properties | |
| Smith et al. | Nanopatterning the chemospecific immobilization of cowpea mosaic virus capsid | |
| Yu et al. | Methods for the topographical patterning and patterned surface modification of hydrogels based on hydroxyethyl methacrylate | |
| Huang et al. | Surface-initiated thermal radical polymerization on gold | |
| Munoz-Bonilla et al. | Self-organized hierarchical structures in polymer surfaces: self-assembled nanostructures within breath figures | |
| TW200615306A (en) | Silicon containing TARC/barrier layer | |
| Liu et al. | Facile synthesis of thermally stable poly (N-vinylpyrrolidone)-modified gold surfaces by surface-initiated atom transfer radical polymerization | |
| WO2005088397A3 (en) | A process of imaging a deep ultraviolet photoresist with a top coating and materials thereof | |
| Plummer et al. | Effect of impurities in cumyl dithiobenzoate on RAFT-mediated polymerizations | |
| ATE474031T1 (de) | Verfahren und zusammensetzung zur zonenisolierung eines bohrlochs | |
| JP2007528511A5 (enExample) | ||
| TW200906600A (en) | Solvent-assisted layer formation for imprint lithography | |
| Lu et al. | Large-amplitude, reversible, pH-triggered wetting transitions enabled by layer-by-layer films | |
| Galeotti et al. | Self-functionalizing polymer film surfaces assisted by specific polystyrene end-tagging | |
| Guo et al. | Switchable wettability on cooperative dual-responsive poly-L-lysine surface | |
| Kaholek et al. | Weak polyelectrolyte brush arrays fabricated by combining electron-beam lithography with surface-initiated photopolymerization | |
| Mortier et al. | 3, 4-Ethylenedioxypyrrole (EDOP) monomers with aromatic substituents for parahydrophobic surfaces by electropolymerization | |
| Wang et al. | Facile method to prepare smooth and homogeneous polymer brush surfaces of varied brush thickness and grafting density | |
| Sharpe et al. | Chemically patterned flat stamps for microcontact printing |