TW200732378A - Photosensitive resin composition - Google Patents

Photosensitive resin composition

Info

Publication number
TW200732378A
TW200732378A TW095140058A TW95140058A TW200732378A TW 200732378 A TW200732378 A TW 200732378A TW 095140058 A TW095140058 A TW 095140058A TW 95140058 A TW95140058 A TW 95140058A TW 200732378 A TW200732378 A TW 200732378A
Authority
TW
Taiwan
Prior art keywords
resin composition
photosensitive resin
solvent
films
photosensitive
Prior art date
Application number
TW095140058A
Other languages
English (en)
Inventor
Takashi Chiba
Akio Saito
Shigehito Asano
Original Assignee
Jsr Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr Corp filed Critical Jsr Corp
Publication of TW200732378A publication Critical patent/TW200732378A/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW095140058A 2005-11-01 2006-10-30 Photosensitive resin composition TW200732378A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005318907 2005-11-01
JP2005318906 2005-11-01

Publications (1)

Publication Number Publication Date
TW200732378A true TW200732378A (en) 2007-09-01

Family

ID=38005692

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095140058A TW200732378A (en) 2005-11-01 2006-10-30 Photosensitive resin composition

Country Status (3)

Country Link
JP (1) JP5018482B2 (zh)
TW (1) TW200732378A (zh)
WO (1) WO2007052540A1 (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4878525B2 (ja) * 2006-09-01 2012-02-15 旭化成イーマテリアルズ株式会社 ポジ型感光性樹脂組成物
JP2008106110A (ja) * 2006-10-24 2008-05-08 Jsr Corp 重合体およびそれを含有する感光性樹脂組成物
JP2009009934A (ja) * 2007-05-29 2009-01-15 Jsr Corp 感放射線性樹脂組成物、絶縁膜および有機ｅｌ表示素子
JP2010037425A (ja) * 2008-08-05 2010-02-18 Jsr Corp 樹脂組成物、光学膜及び光学用部材
WO2010044381A1 (ja) * 2008-10-14 2010-04-22 日本化薬株式会社 フェノール性水酸基含有ポリイミド樹脂及びそれを用いた感光性樹脂組成物
KR20120024723A (ko) * 2009-06-30 2012-03-14 히다치 가세고교 가부시끼가이샤 감광성 접착제, 및 그것을 이용한 필름상 접착제, 접착 시트, 접착제 패턴, 접착제층 부착 반도체 웨이퍼 및 반도체 장치
KR101249686B1 (ko) 2009-07-16 2013-04-05 주식회사 엘지화학 폴리이미드 및 이를 포함하는 감광성 수지 조성물
JP5100894B2 (ja) * 2009-12-22 2012-12-19 新日鉄住金化学株式会社 ポリイミド樹脂、その製造方法、接着剤樹脂組成物、カバーレイフィルム及び回路基板
JP2023177343A (ja) 2022-06-01 2023-12-13 Jsr株式会社 感光性組成物及びその製造方法、硬化物及びその製造方法、表示素子並びにポリイミド

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3966590B2 (ja) * 1997-11-20 2007-08-29 旭化成エレクトロニクス株式会社 感光性組成物
JP3968884B2 (ja) * 1998-05-01 2007-08-29 日本メクトロン株式会社 感光性組成物
JP4374756B2 (ja) * 2000-09-22 2009-12-02 宇部興産株式会社 末端に酸無水物基を有するイミド系オリゴマ−および硬化性樹脂組成物
JP4204435B2 (ja) * 2002-10-10 2009-01-07 信越化学工業株式会社 熱硬化性基を含有する透明ポリイミドシリコーン樹脂
JP2004325540A (ja) * 2003-04-22 2004-11-18 Jsr Corp アルカリ現像ネガ型感光性ポリアミック酸組成物
JP2005010764A (ja) * 2003-05-23 2005-01-13 Sumitomo Bakelite Co Ltd ネガ型感光性樹脂組成物、半導体装置及び表示素子並びに半導体装置及び表示素子の製造方法
JP2005173027A (ja) * 2003-12-09 2005-06-30 Kyocera Chemical Corp ポジ型感光性樹脂組成物及びその硬化物
JP4372065B2 (ja) * 2004-09-09 2009-11-25 信越化学工業株式会社 無溶剤型ポリイミドシリコーン樹脂組成物及びその硬化樹脂皮膜
JP4530284B2 (ja) * 2004-10-07 2010-08-25 信越化学工業株式会社 ポリイミド系光硬化性樹脂組成物並びにパターン形成方法及び基板保護用皮膜

Also Published As

Publication number Publication date
WO2007052540A1 (ja) 2007-05-10
JP5018482B2 (ja) 2012-09-05
JPWO2007052540A1 (ja) 2009-04-30

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