TW200732378A - Photosensitive resin composition - Google Patents
Photosensitive resin compositionInfo
- Publication number
- TW200732378A TW200732378A TW095140058A TW95140058A TW200732378A TW 200732378 A TW200732378 A TW 200732378A TW 095140058 A TW095140058 A TW 095140058A TW 95140058 A TW95140058 A TW 95140058A TW 200732378 A TW200732378 A TW 200732378A
- Authority
- TW
- Taiwan
- Prior art keywords
- resin composition
- photosensitive resin
- solvent
- films
- photosensitive
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0387—Polyamides or polyimides
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005318907 | 2005-11-01 | ||
JP2005318906 | 2005-11-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200732378A true TW200732378A (en) | 2007-09-01 |
Family
ID=38005692
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095140058A TW200732378A (en) | 2005-11-01 | 2006-10-30 | Photosensitive resin composition |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5018482B2 (zh) |
TW (1) | TW200732378A (zh) |
WO (1) | WO2007052540A1 (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4878525B2 (ja) * | 2006-09-01 | 2012-02-15 | 旭化成イーマテリアルズ株式会社 | ポジ型感光性樹脂組成物 |
JP2008106110A (ja) * | 2006-10-24 | 2008-05-08 | Jsr Corp | 重合体およびそれを含有する感光性樹脂組成物 |
JP2009009934A (ja) * | 2007-05-29 | 2009-01-15 | Jsr Corp | 感放射線性樹脂組成物、絶縁膜および有機el表示素子 |
JP2010037425A (ja) * | 2008-08-05 | 2010-02-18 | Jsr Corp | 樹脂組成物、光学膜及び光学用部材 |
WO2010044381A1 (ja) * | 2008-10-14 | 2010-04-22 | 日本化薬株式会社 | フェノール性水酸基含有ポリイミド樹脂及びそれを用いた感光性樹脂組成物 |
KR20120024723A (ko) * | 2009-06-30 | 2012-03-14 | 히다치 가세고교 가부시끼가이샤 | 감광성 접착제, 및 그것을 이용한 필름상 접착제, 접착 시트, 접착제 패턴, 접착제층 부착 반도체 웨이퍼 및 반도체 장치 |
KR101249686B1 (ko) | 2009-07-16 | 2013-04-05 | 주식회사 엘지화학 | 폴리이미드 및 이를 포함하는 감광성 수지 조성물 |
JP5100894B2 (ja) * | 2009-12-22 | 2012-12-19 | 新日鉄住金化学株式会社 | ポリイミド樹脂、その製造方法、接着剤樹脂組成物、カバーレイフィルム及び回路基板 |
JP2023177343A (ja) | 2022-06-01 | 2023-12-13 | Jsr株式会社 | 感光性組成物及びその製造方法、硬化物及びその製造方法、表示素子並びにポリイミド |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3966590B2 (ja) * | 1997-11-20 | 2007-08-29 | 旭化成エレクトロニクス株式会社 | 感光性組成物 |
JP3968884B2 (ja) * | 1998-05-01 | 2007-08-29 | 日本メクトロン株式会社 | 感光性組成物 |
JP4374756B2 (ja) * | 2000-09-22 | 2009-12-02 | 宇部興産株式会社 | 末端に酸無水物基を有するイミド系オリゴマ−および硬化性樹脂組成物 |
JP4204435B2 (ja) * | 2002-10-10 | 2009-01-07 | 信越化学工業株式会社 | 熱硬化性基を含有する透明ポリイミドシリコーン樹脂 |
JP2004325540A (ja) * | 2003-04-22 | 2004-11-18 | Jsr Corp | アルカリ現像ネガ型感光性ポリアミック酸組成物 |
JP2005010764A (ja) * | 2003-05-23 | 2005-01-13 | Sumitomo Bakelite Co Ltd | ネガ型感光性樹脂組成物、半導体装置及び表示素子並びに半導体装置及び表示素子の製造方法 |
JP2005173027A (ja) * | 2003-12-09 | 2005-06-30 | Kyocera Chemical Corp | ポジ型感光性樹脂組成物及びその硬化物 |
JP4372065B2 (ja) * | 2004-09-09 | 2009-11-25 | 信越化学工業株式会社 | 無溶剤型ポリイミドシリコーン樹脂組成物及びその硬化樹脂皮膜 |
JP4530284B2 (ja) * | 2004-10-07 | 2010-08-25 | 信越化学工業株式会社 | ポリイミド系光硬化性樹脂組成物並びにパターン形成方法及び基板保護用皮膜 |
-
2006
- 2006-10-26 JP JP2007542669A patent/JP5018482B2/ja active Active
- 2006-10-26 WO PCT/JP2006/321435 patent/WO2007052540A1/ja active Application Filing
- 2006-10-30 TW TW095140058A patent/TW200732378A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
WO2007052540A1 (ja) | 2007-05-10 |
JP5018482B2 (ja) | 2012-09-05 |
JPWO2007052540A1 (ja) | 2009-04-30 |
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