TW200732378A - Photosensitive resin composition - Google Patents

Photosensitive resin composition

Info

Publication number
TW200732378A
TW200732378A TW095140058A TW95140058A TW200732378A TW 200732378 A TW200732378 A TW 200732378A TW 095140058 A TW095140058 A TW 095140058A TW 95140058 A TW95140058 A TW 95140058A TW 200732378 A TW200732378 A TW 200732378A
Authority
TW
Taiwan
Prior art keywords
resin composition
photosensitive resin
solvent
films
photosensitive
Prior art date
Application number
TW095140058A
Other languages
English (en)
Inventor
Takashi Chiba
Akio Saito
Shigehito Asano
Original Assignee
Jsr Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr Corp filed Critical Jsr Corp
Publication of TW200732378A publication Critical patent/TW200732378A/zh

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/075Silicon-containing compounds
    • G03F7/0757Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387Polyamides or polyimides

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW095140058A 2005-11-01 2006-10-30 Photosensitive resin composition TW200732378A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005318906 2005-11-01
JP2005318907 2005-11-01

Publications (1)

Publication Number Publication Date
TW200732378A true TW200732378A (en) 2007-09-01

Family

ID=38005692

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095140058A TW200732378A (en) 2005-11-01 2006-10-30 Photosensitive resin composition

Country Status (3)

Country Link
JP (1) JP5018482B2 (zh)
TW (1) TW200732378A (zh)
WO (1) WO2007052540A1 (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4878525B2 (ja) * 2006-09-01 2012-02-15 旭化成イーマテリアルズ株式会社 ポジ型感光性樹脂組成物
JP2008106110A (ja) * 2006-10-24 2008-05-08 Jsr Corp 重合体およびそれを含有する感光性樹脂組成物
JP2009009934A (ja) * 2007-05-29 2009-01-15 Jsr Corp 感放射線性樹脂組成物、絶縁膜および有機el表示素子
JP2010037425A (ja) * 2008-08-05 2010-02-18 Jsr Corp 樹脂組成物、光学膜及び光学用部材
WO2010044381A1 (ja) * 2008-10-14 2010-04-22 日本化薬株式会社 フェノール性水酸基含有ポリイミド樹脂及びそれを用いた感光性樹脂組成物
JP5549671B2 (ja) * 2009-06-30 2014-07-16 日立化成株式会社 感光性接着剤、並びにそれを用いたフィルム状接着剤、接着シート、接着剤パターン、接着剤層付半導体ウェハ及び半導体装置
KR101249686B1 (ko) * 2009-07-16 2013-04-05 주식회사 엘지화학 폴리이미드 및 이를 포함하는 감광성 수지 조성물
KR101588492B1 (ko) * 2009-12-22 2016-01-25 신닛테츠 수미킨 가가쿠 가부시키가이샤 폴리이미드 수지, 그 제조 방법, 접착제 수지 조성물, 커버레이 필름 및 회로 기판
KR20230167323A (ko) 2022-06-01 2023-12-08 제이에스알 가부시끼가이샤 감광성 조성물 및 그의 제조 방법, 경화물 및 그의 제조 방법, 표시 소자 그리고 중합체

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3966590B2 (ja) * 1997-11-20 2007-08-29 旭化成エレクトロニクス株式会社 感光性組成物
JP3968884B2 (ja) * 1998-05-01 2007-08-29 日本メクトロン株式会社 感光性組成物
JP4374756B2 (ja) * 2000-09-22 2009-12-02 宇部興産株式会社 末端に酸無水物基を有するイミド系オリゴマ−および硬化性樹脂組成物
JP4204435B2 (ja) * 2002-10-10 2009-01-07 信越化学工業株式会社 熱硬化性基を含有する透明ポリイミドシリコーン樹脂
JP2004325540A (ja) * 2003-04-22 2004-11-18 Jsr Corp アルカリ現像ネガ型感光性ポリアミック酸組成物
JP2005010764A (ja) * 2003-05-23 2005-01-13 Sumitomo Bakelite Co Ltd ネガ型感光性樹脂組成物、半導体装置及び表示素子並びに半導体装置及び表示素子の製造方法
JP2005173027A (ja) * 2003-12-09 2005-06-30 Kyocera Chemical Corp ポジ型感光性樹脂組成物及びその硬化物
JP4372065B2 (ja) * 2004-09-09 2009-11-25 信越化学工業株式会社 無溶剤型ポリイミドシリコーン樹脂組成物及びその硬化樹脂皮膜
JP4530284B2 (ja) * 2004-10-07 2010-08-25 信越化学工業株式会社 ポリイミド系光硬化性樹脂組成物並びにパターン形成方法及び基板保護用皮膜

Also Published As

Publication number Publication date
JP5018482B2 (ja) 2012-09-05
JPWO2007052540A1 (ja) 2009-04-30
WO2007052540A1 (ja) 2007-05-10

Similar Documents

Publication Publication Date Title
TW200732378A (en) Photosensitive resin composition
EP2924061A3 (en) Silicone adhesive composition, a method for the preparation thereof and an adhesive film
TW200504146A (en) Resin composition for interlayer insulation of multilayer printed circuit board, adhesive film and prepreg
MY155358A (en) Resin compound for forming adhesive layer of multilayered flexible printed wiring board
GB2467701A (en) Water based paint compositions
DE602007002815D1 (de) Pulverbeschichtungszusammensetzung zur rohrbeschichtung
MY148272A (en) Curable silicone composition
SG179087A1 (en) Photosensitive resin composition and method for producing photosensitive resin film
TW200740922A (en) Heat curable resin composition, overcoating agent for flexible circuit board, and surface protective film
WO2008084843A1 (ja) 電子部品用接着剤
TW200615693A (en) Photosensitive insulating resin composition, cured production thereof and the use
TW200736352A (en) Conductive coating composition for protective film and method for producing coating layer using the same
WO2008087890A1 (ja) 熱硬化性樹脂組成物
TW200736290A (en) Resin composition, process for forming protective films of color filters and protective films of color filters
TW201612232A (en) Photosensitive resin composition, resist laminate and cured product thereof
TW200942580A (en) Radiation-sensitive resin composition, cured product thereof, and interlayer insulation film and optical device using the composition
MY148226A (en) Photosensitive resin composition, insulating film, protective film, and electronic equipment
JP2018154766A5 (zh)
TW200745194A (en) Epoxy resin hardener and epoxy resin composition
KR102187491B1 (ko) 필름용 수지 조성물, 절연 필름 및 반도체 장치
Chen et al. Study of epoxidized-cardanol containing cationic UV curable materials
JP6328414B2 (ja) 難燃性樹脂組成物、bステージ化した樹脂フィルム、樹脂付き金属箔およびカバーレイフィルム
WO2008133246A1 (ja) エポキシ樹脂組成物、樹脂フィルム、プリプレグ、及び多層プリント配線板
US7786029B2 (en) Resin composition and application thereof
KR102195623B1 (ko) 인덕터용 접착제 및 인덕터