TW200723418A - Resin-sealed molding apparatus with sealing means, and method of dismounting constituent part of die assembly fitted therein - Google Patents

Resin-sealed molding apparatus with sealing means, and method of dismounting constituent part of die assembly fitted therein

Info

Publication number
TW200723418A
TW200723418A TW095141683A TW95141683A TW200723418A TW 200723418 A TW200723418 A TW 200723418A TW 095141683 A TW095141683 A TW 095141683A TW 95141683 A TW95141683 A TW 95141683A TW 200723418 A TW200723418 A TW 200723418A
Authority
TW
Taiwan
Prior art keywords
die
ambient air
base board
mount base
air shutoff
Prior art date
Application number
TW095141683A
Other languages
English (en)
Inventor
Kazuhiro Ijiri
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of TW200723418A publication Critical patent/TW200723418A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/2608—Mould seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
TW095141683A 2005-11-29 2006-11-10 Resin-sealed molding apparatus with sealing means, and method of dismounting constituent part of die assembly fitted therein TW200723418A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005343742A JP4817818B2 (ja) 2005-11-29 2005-11-29 樹脂封止装置及びチェイスユニットの取り出し方法

Publications (1)

Publication Number Publication Date
TW200723418A true TW200723418A (en) 2007-06-16

Family

ID=38092010

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095141683A TW200723418A (en) 2005-11-29 2006-11-10 Resin-sealed molding apparatus with sealing means, and method of dismounting constituent part of die assembly fitted therein

Country Status (7)

Country Link
US (1) US20090162471A1 (zh)
EP (1) EP1956646A1 (zh)
JP (1) JP4817818B2 (zh)
KR (1) KR100910437B1 (zh)
CN (1) CN101185159A (zh)
TW (1) TW200723418A (zh)
WO (1) WO2007063673A1 (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5052214B2 (ja) * 2007-06-06 2012-10-17 住友重機械工業株式会社 樹脂封止金型
JP4454036B2 (ja) 2007-06-06 2010-04-21 ヒロセ電機株式会社 回路基板用雄電気コネクタ及び電気コネクタ組立体
IT1410977B1 (it) * 2010-06-14 2014-10-03 Automobili Lamborghini Spa Processo e dispositivi per fabbricare prodotti in materiali compositi
JP5562289B2 (ja) * 2011-05-27 2014-07-30 Ｔｏｗａ株式会社 樹脂成形用型の交換方法と交換機構及び樹脂成形装置
JP2013093504A (ja) * 2011-10-27 2013-05-16 Toshiba Corp 半導体装置の製造方法および冶具
CN104385221B (zh) * 2014-09-11 2016-09-07 合肥京东方光电科技有限公司 一种用于拆解显示模组的治具
CN106945258A (zh) * 2017-05-05 2017-07-14 台州华诚模具有限公司 带有喷涂挡板的lfi成型模具
CN108099119A (zh) * 2018-02-06 2018-06-01 重庆熵臻科技有限公司 一种机械模具用注塑装置的密封性改进
CN110722718B (zh) * 2019-10-25 2021-10-15 立讯精密组件(昆山)有限公司 一种模具组件及模具组件的装配方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62132626A (ja) * 1985-12-06 1987-06-15 Internatl Rectifier Corp Japan Ltd 樹脂モ−ルド金型用位置合わせ装置
US4793785A (en) * 1986-04-11 1988-12-27 Michio Osada Apparatus of multiplunger type for enclosing semiconductor elements with resin
JP2802272B2 (ja) * 1986-05-17 1998-09-24 トーワ株式会社 多品種少量生産に適した半導体装置の製造方法
JPH01321643A (ja) * 1988-06-22 1989-12-27 Mitsubishi Electric Corp 半導体装置の樹脂封止装置
JPH03244515A (ja) * 1990-02-22 1991-10-31 Fuji Electric Co Ltd トランスファ成形用金型装置
JP2846773B2 (ja) * 1992-09-01 1999-01-13 三菱電機株式会社 半導体装置の樹脂封止装置及び樹脂封止方法
JPH06315956A (ja) * 1993-05-06 1994-11-15 Nec Corp 樹脂封止装置
JP3566426B2 (ja) * 1995-10-30 2004-09-15 Ｔｏｗａ株式会社 電子部品の樹脂成形装置
JP4309234B2 (ja) * 2003-11-18 2009-08-05 アピックヤマダ株式会社 減圧成形対応金型装置の下型チェイス交換方法

Also Published As

Publication number Publication date
CN101185159A (zh) 2008-05-21
JP4817818B2 (ja) 2011-11-16
US20090162471A1 (en) 2009-06-25
EP1956646A1 (en) 2008-08-13
JP2007150054A (ja) 2007-06-14
WO2007063673A1 (ja) 2007-06-07
KR20080010412A (ko) 2008-01-30
KR100910437B1 (ko) 2009-08-04

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