TW200720323A - Thermosetting resin, thermosetting composition containing the same, and molded body obtained from the same - Google Patents

Thermosetting resin, thermosetting composition containing the same, and molded body obtained from the same

Info

Publication number
TW200720323A
TW200720323A TW095135594A TW95135594A TW200720323A TW 200720323 A TW200720323 A TW 200720323A TW 095135594 A TW095135594 A TW 095135594A TW 95135594 A TW95135594 A TW 95135594A TW 200720323 A TW200720323 A TW 200720323A
Authority
TW
Taiwan
Prior art keywords
thermosetting resin
same
thermosetting
composition containing
molded body
Prior art date
Application number
TW095135594A
Other languages
English (en)
Chinese (zh)
Other versions
TWI332514B (https=
Inventor
Yuji Eguchi
Kazuo Doyama
Hatsuo Ishida
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of TW200720323A publication Critical patent/TW200720323A/zh
Application granted granted Critical
Publication of TWI332514B publication Critical patent/TWI332514B/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/12Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D265/00Heterocyclic compounds containing six-membered rings having one nitrogen atom and one oxygen atom as the only ring hetero atoms
    • C07D265/041,3-Oxazines; Hydrogenated 1,3-oxazines
    • C07D265/121,3-Oxazines; Hydrogenated 1,3-oxazines condensed with carbocyclic rings or ring systems
    • C07D265/141,3-Oxazines; Hydrogenated 1,3-oxazines condensed with carbocyclic rings or ring systems condensed with one six-membered ring
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
TW095135594A 2005-09-29 2006-09-26 Thermosetting resin, thermosetting composition containing the same, and molded body obtained from the same TW200720323A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005284226 2005-09-29
JP2006047342 2006-02-23
JP2006054104 2006-02-28

Publications (2)

Publication Number Publication Date
TW200720323A true TW200720323A (en) 2007-06-01
TWI332514B TWI332514B (https=) 2010-11-01

Family

ID=37899633

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095135594A TW200720323A (en) 2005-09-29 2006-09-26 Thermosetting resin, thermosetting composition containing the same, and molded body obtained from the same

Country Status (6)

Country Link
US (1) US20090187003A1 (https=)
JP (1) JP4102853B2 (https=)
KR (1) KR100950398B1 (https=)
CN (1) CN101273081B (https=)
TW (1) TW200720323A (https=)
WO (1) WO2007037206A1 (https=)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007097305A1 (ja) * 2006-02-20 2007-08-30 Sekisui Chemical Co., Ltd. 熱硬化性樹脂の製造方法、熱硬化性樹脂、それを含む熱硬化性組成物、成形体、硬化体、並びにそれらを含む電子機器
JP4976894B2 (ja) * 2007-03-23 2012-07-18 積水化学工業株式会社 熱硬化性樹脂組成物及びそれから得られる成形体
JP2008291070A (ja) * 2007-05-22 2008-12-04 Sekisui Chem Co Ltd 熱硬化性樹脂の製造方法、及び熱硬化性樹脂
CN101668785B (zh) * 2007-08-02 2013-08-14 积水化学工业株式会社 具有苯并*嗪环的热固性树脂的制造方法
JP5175499B2 (ja) * 2007-08-20 2013-04-03 積水化学工業株式会社 熱硬化性樹脂組成物の製造方法
JP2009242669A (ja) * 2008-03-31 2009-10-22 Sekisui Chem Co Ltd 熱硬化性樹脂組成物の製造方法、熱硬化性樹脂組成物、成形体、硬化体及び電子部品
CN102076740B (zh) * 2008-07-03 2013-08-21 旭化成电子材料株式会社 耐热性树脂前体及使用其的感光性树脂组合物
JP5224978B2 (ja) * 2008-08-29 2013-07-03 積水化学工業株式会社 ベンゾオキサジン環を有する共重合体からなる熱硬化性樹脂
JP2010053324A (ja) * 2008-08-29 2010-03-11 Sekisui Chem Co Ltd ベンゾオキサジン環を有する熱硬化性樹脂を含有する樹脂組成物
CN103097422A (zh) * 2010-03-19 2013-05-08 迈图专业化学股份有限公司 主链苯并噁嗪低聚物组合物及其制备方法
TWI445727B (zh) * 2010-10-21 2014-07-21 Taiwan Union Technology Corp 樹脂組合物及由其製成之預浸材與印刷電路板
WO2015190131A1 (ja) * 2014-06-13 2015-12-17 Dic株式会社 硬化性樹脂組成物、その硬化物、半導体封止材料、半導体装置、プリプレグ、回路基板、ビルドアップフィルム、ビルドアップ基板、繊維強化複合材料、及び繊維強化樹脂成形品
CN105348527B (zh) * 2015-11-27 2017-11-21 广东生益科技股份有限公司 热固性树脂、含有它的热固性树脂组合物、固化物、预浸料、层压板以及印制电路板
FR3057802A1 (fr) 2016-10-26 2018-04-27 Compagnie Generale Des Etablissements Michelin Renfort metallique ou metallise dont la surface est revetue d'une polybenzoxazine
FR3057872A1 (fr) * 2016-10-26 2018-04-27 Compagnie Generale Des Etablissements Michelin Polybenzoxazine utilisable pour le revetement de metal et son collage a du caoutchouc
FR3067714A1 (fr) 2017-06-14 2018-12-21 Compagnie Generale Des Etablissements Michelin Polybenzoxazine sulfuree utilisable pour le revetement de metal et son collage a du caoutchouc
FR3067646A1 (fr) 2017-06-14 2018-12-21 Compagnie Generale Des Etablissements Michelin Renfort metallique ou metallise dont la surface est revetue d'une polybenzoxazine sulfuree
JP7124770B2 (ja) * 2019-03-07 2022-08-24 味の素株式会社 樹脂組成物

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4001192A (en) * 1971-11-16 1977-01-04 Hoechst Aktiengesellschaft Transparent polyamides from bis(aminomethyl)-norbornanes
US4410686A (en) * 1981-12-21 1983-10-18 The Dow Chemical Company Norbornyl modified polyesteramides and process for preparing same
JPH08183835A (ja) * 1994-12-28 1996-07-16 Hitachi Chem Co Ltd 熱硬化性樹脂組成物、接着剤シート及び接着剤付き 金属はく
EP0896014B1 (en) * 1996-12-27 2004-11-17 Maruzen Petrochemical Co., Ltd. Soluble polyimide resin, process for preparing the same, and polyimide resin solution composition
JP2003064180A (ja) * 2001-06-11 2003-03-05 Nippon Steel Chem Co Ltd ジヒドロベンゾキサジン環構造を有する硬化性樹脂及び耐熱性硬化樹脂
JP2003041001A (ja) * 2001-07-25 2003-02-13 Nippon Steel Chem Co Ltd ジヒドロベンゾキサジン環構造を有する熱硬化性樹脂、樹脂組成物及び硬化物
JP4715102B2 (ja) * 2004-03-26 2011-07-06 日立化成工業株式会社 新規な熱硬化性ベンゾオキサジン樹脂、その製造法及び硬化物
JP2006219566A (ja) * 2005-02-09 2006-08-24 Sekisui Chem Co Ltd 成形体及びその製造方法

Also Published As

Publication number Publication date
KR100950398B1 (ko) 2010-03-29
JP4102853B2 (ja) 2008-06-18
KR20080040791A (ko) 2008-05-08
JPWO2007037206A1 (ja) 2009-04-09
TWI332514B (https=) 2010-11-01
US20090187003A1 (en) 2009-07-23
WO2007037206A1 (ja) 2007-04-05
CN101273081B (zh) 2011-05-18
CN101273081A (zh) 2008-09-24

Similar Documents

Publication Publication Date Title
TW200720323A (en) Thermosetting resin, thermosetting composition containing the same, and molded body obtained from the same
WO2009054487A1 (ja) ポリイミド前駆体及びポリイミド前駆体を含む感光性樹脂組成物
DE60327380D1 (de) Thermoplastische Harzzusammensetzung, Polycarbonat-Harzzusammensetzung und daraus geformter Artikel
WO2009025151A1 (ja) 新規なアミド基含有シロキサンアミン化合物
EP1858996B8 (en) Coating composition for dielectric insulating film, dielectric insulating film prepared therefrom, and electric or electronic device comprising the same
WO2008093821A1 (ja) 高分子発光素子、高分子化合物、組成物、液状組成物及び導電性薄膜
TW200736363A (en) Material for organic electroluminescent device and organic electroluminescent device
ATE414118T1 (de) Lichtempfindliche dielektrische harzzusammensetzungen und ihre verwendungen
WO2009069537A1 (ja) 発光素子材料および発光素子
TW200745195A (en) Insulating material, process for producing electronic part/device, and electronic part/device
WO2009072582A1 (ja) 新規なホウ素化合物、それらの製造方法およびそれらを用いた機能性電子素子
TW200706613A (en) Biphenylene cross-linked phenol novolac resin and the use thereof
WO2004069900A3 (en) Bisaminophenyl-based curatives and amidine-based curatives and cure accelerators for perfluoroelastomeric compositions
MY150435A (en) Composition for forming silicon-containing fine pattern and method for forming fine pattern using the same
TW200739920A (en) Method for manufacturing organic semiconductor device and composition for forming insulating film used therein
EP2000510A4 (en) RESIN COMPOSITION, PAINT, RESIN FOIL AND SEMICONDUCTOR WITH RESIN FOIL
WO2005099312A3 (en) Triarylamine compounds for use as charge transport materials
WO2008120470A1 (ja) スルホ基含有高分子化合物とその中間体、および該化合物を含有する有機電界発光素子
TW200701432A (en) Electron device, operational device and display device
JP2016074902A (ja) 熱硬化性樹脂組成物及び熱硬化性樹脂
MY144113A (en) Resin composition for semiconductor encapsulation and semiconductor device
TW200745234A (en) Hydrophobic crosslinkable compositions for electronic applications
WO2007016115A3 (en) 6,13-bis(thienyl)pentacene compounds
TW200720258A (en) Compound having triazole ring structure substituted with pyridyl group and organic electroluminescent device
WO2007079103A3 (en) Compositions comprising novel compounds and electronic devices made with such compositions

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees