TW200720323A - Thermosetting resin, thermosetting composition containing the same, and molded body obtained from the same - Google Patents

Thermosetting resin, thermosetting composition containing the same, and molded body obtained from the same

Info

Publication number
TW200720323A
TW200720323A TW095135594A TW95135594A TW200720323A TW 200720323 A TW200720323 A TW 200720323A TW 095135594 A TW095135594 A TW 095135594A TW 95135594 A TW95135594 A TW 95135594A TW 200720323 A TW200720323 A TW 200720323A
Authority
TW
Taiwan
Prior art keywords
thermosetting resin
same
thermosetting
composition containing
molded body
Prior art date
Application number
TW095135594A
Other languages
English (en)
Other versions
TWI332514B (zh
Inventor
Yuji Eguchi
Kazuo Doyama
Hatsuo Ishida
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of TW200720323A publication Critical patent/TW200720323A/zh
Application granted granted Critical
Publication of TWI332514B publication Critical patent/TWI332514B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/12—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D265/00—Heterocyclic compounds containing six-membered rings having one nitrogen atom and one oxygen atom as the only ring hetero atoms
    • C07D265/04—1,3-Oxazines; Hydrogenated 1,3-oxazines
    • C07D265/12—1,3-Oxazines; Hydrogenated 1,3-oxazines condensed with carbocyclic rings or ring systems
    • C07D265/14—1,3-Oxazines; Hydrogenated 1,3-oxazines condensed with carbocyclic rings or ring systems condensed with one six-membered ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
TW095135594A 2005-09-29 2006-09-26 Thermosetting resin, thermosetting composition containing the same, and molded body obtained from the same TW200720323A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005284226 2005-09-29
JP2006047342 2006-02-23
JP2006054104 2006-02-28

Publications (2)

Publication Number Publication Date
TW200720323A true TW200720323A (en) 2007-06-01
TWI332514B TWI332514B (zh) 2010-11-01

Family

ID=37899633

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095135594A TW200720323A (en) 2005-09-29 2006-09-26 Thermosetting resin, thermosetting composition containing the same, and molded body obtained from the same

Country Status (6)

Country Link
US (1) US20090187003A1 (zh)
JP (1) JP4102853B2 (zh)
KR (1) KR100950398B1 (zh)
CN (1) CN101273081B (zh)
TW (1) TW200720323A (zh)
WO (1) WO2007037206A1 (zh)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4248592B2 (ja) * 2006-02-20 2009-04-02 積水化学工業株式会社 熱硬化性樹脂の製造方法、熱硬化性樹脂、それを含む熱硬化性組成物、成形体、硬化体、並びにそれらを含む電子機器
JP4976894B2 (ja) * 2007-03-23 2012-07-18 積水化学工業株式会社 熱硬化性樹脂組成物及びそれから得られる成形体
JP2008291070A (ja) * 2007-05-22 2008-12-04 Sekisui Chem Co Ltd 熱硬化性樹脂の製造方法、及び熱硬化性樹脂
US7994270B2 (en) * 2007-08-02 2011-08-09 Sekisui Chemical Co., Ltd Method for producing thermosetting resin having benzoxazine ring
JP5175499B2 (ja) * 2007-08-20 2013-04-03 積水化学工業株式会社 熱硬化性樹脂組成物の製造方法
JP2009242669A (ja) * 2008-03-31 2009-10-22 Sekisui Chem Co Ltd 熱硬化性樹脂組成物の製造方法、熱硬化性樹脂組成物、成形体、硬化体及び電子部品
KR101249568B1 (ko) 2008-07-03 2013-04-01 아사히 가세이 이-매터리얼즈 가부시키가이샤 내열성 수지 전구체 및 그것을 사용한 감광성 수지 조성물
JP2010053324A (ja) * 2008-08-29 2010-03-11 Sekisui Chem Co Ltd ベンゾオキサジン環を有する熱硬化性樹脂を含有する樹脂組成物
JP5224978B2 (ja) * 2008-08-29 2013-07-03 積水化学工業株式会社 ベンゾオキサジン環を有する共重合体からなる熱硬化性樹脂
EP2580261A1 (en) * 2010-03-19 2013-04-17 Momentive Specialty Chemicals Research S.A. Main-chain benzoxazine oligomer compositions, and method for the preparation thereof
TWI445727B (zh) * 2010-10-21 2014-07-21 Taiwan Union Technology Corp 樹脂組合物及由其製成之預浸材與印刷電路板
KR102261522B1 (ko) * 2014-06-13 2021-06-08 디아이씨 가부시끼가이샤 경화성 수지 조성물, 그 경화물, 반도체 봉지 재료, 반도체 장치, 프리프레그, 회로 기판, 빌드업 필름, 빌드업 기판, 섬유 강화 복합 재료, 및 섬유 강화 수지 성형품
CN105348527B (zh) * 2015-11-27 2017-11-21 广东生益科技股份有限公司 热固性树脂、含有它的热固性树脂组合物、固化物、预浸料、层压板以及印制电路板
FR3057802A1 (fr) 2016-10-26 2018-04-27 Compagnie Generale Des Etablissements Michelin Renfort metallique ou metallise dont la surface est revetue d'une polybenzoxazine
FR3057872A1 (fr) * 2016-10-26 2018-04-27 Compagnie Generale Des Etablissements Michelin Polybenzoxazine utilisable pour le revetement de metal et son collage a du caoutchouc
FR3067714A1 (fr) 2017-06-14 2018-12-21 Compagnie Generale Des Etablissements Michelin Polybenzoxazine sulfuree utilisable pour le revetement de metal et son collage a du caoutchouc
FR3067646A1 (fr) 2017-06-14 2018-12-21 Compagnie Generale Des Etablissements Michelin Renfort metallique ou metallise dont la surface est revetue d'une polybenzoxazine sulfuree
JP7124770B2 (ja) * 2019-03-07 2022-08-24 味の素株式会社 樹脂組成物

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4001192A (en) * 1971-11-16 1977-01-04 Hoechst Aktiengesellschaft Transparent polyamides from bis(aminomethyl)-norbornanes
US4410686A (en) * 1981-12-21 1983-10-18 The Dow Chemical Company Norbornyl modified polyesteramides and process for preparing same
JPH08183835A (ja) * 1994-12-28 1996-07-16 Hitachi Chem Co Ltd 熱硬化性樹脂組成物、接着剤シート及び接着剤付き 金属はく
WO1998029471A1 (fr) * 1996-12-27 1998-07-09 Maruzen Petrochemical Co., Ltd. Resine polyimide soluble, son procede de preparation, et composition de solution de resine polyimide
JP2003064180A (ja) * 2001-06-11 2003-03-05 Nippon Steel Chem Co Ltd ジヒドロベンゾキサジン環構造を有する硬化性樹脂及び耐熱性硬化樹脂
JP2003041001A (ja) * 2001-07-25 2003-02-13 Nippon Steel Chem Co Ltd ジヒドロベンゾキサジン環構造を有する熱硬化性樹脂、樹脂組成物及び硬化物
JP4715102B2 (ja) * 2004-03-26 2011-07-06 日立化成工業株式会社 新規な熱硬化性ベンゾオキサジン樹脂、その製造法及び硬化物
JP2006219566A (ja) * 2005-02-09 2006-08-24 Sekisui Chem Co Ltd 成形体及びその製造方法

Also Published As

Publication number Publication date
JP4102853B2 (ja) 2008-06-18
KR20080040791A (ko) 2008-05-08
CN101273081B (zh) 2011-05-18
WO2007037206A1 (ja) 2007-04-05
TWI332514B (zh) 2010-11-01
KR100950398B1 (ko) 2010-03-29
US20090187003A1 (en) 2009-07-23
JPWO2007037206A1 (ja) 2009-04-09
CN101273081A (zh) 2008-09-24

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees