TW200715361A - Substrate-processing apparatus, substrate-processing method, substrate-processing program, and computer-readable recording medium recorded with such program - Google Patents

Substrate-processing apparatus, substrate-processing method, substrate-processing program, and computer-readable recording medium recorded with such program

Info

Publication number
TW200715361A
TW200715361A TW095134330A TW95134330A TW200715361A TW 200715361 A TW200715361 A TW 200715361A TW 095134330 A TW095134330 A TW 095134330A TW 95134330 A TW95134330 A TW 95134330A TW 200715361 A TW200715361 A TW 200715361A
Authority
TW
Taiwan
Prior art keywords
substrate
program
processing
pattern
heat treatment
Prior art date
Application number
TW095134330A
Other languages
English (en)
Chinese (zh)
Other versions
TWI324790B (enExample
Inventor
Kunie Ogata
Michio Tanaka
Hiroshi Tomita
Ryoichi Uemura
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200715361A publication Critical patent/TW200715361A/zh
Application granted granted Critical
Publication of TWI324790B publication Critical patent/TWI324790B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW095134330A 2005-09-15 2006-09-15 Substrate-processing apparatus, substrate-processing method, substrate-processing program, and computer-readable recording medium recorded with such program TW200715361A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005268191 2005-09-15
JP2006179727A JP4666380B2 (ja) 2005-09-15 2006-06-29 基板処理装置、基板処理方法、基板処理プログラム、及びそのプログラムを記録したコンピュータ読み取り可能な記録媒体

Publications (2)

Publication Number Publication Date
TW200715361A true TW200715361A (en) 2007-04-16
TWI324790B TWI324790B (enExample) 2010-05-11

Family

ID=37864962

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095134330A TW200715361A (en) 2005-09-15 2006-09-15 Substrate-processing apparatus, substrate-processing method, substrate-processing program, and computer-readable recording medium recorded with such program

Country Status (5)

Country Link
US (1) US7862966B2 (enExample)
JP (1) JP4666380B2 (enExample)
KR (1) KR101072330B1 (enExample)
TW (1) TW200715361A (enExample)
WO (1) WO2007032370A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4891139B2 (ja) 2007-04-20 2012-03-07 東京エレクトロン株式会社 熱処理板の温度設定方法、熱処理板の温度設定装置及びコンピュータ読み取り可能な記憶媒体
JP4969304B2 (ja) 2007-04-20 2012-07-04 東京エレクトロン株式会社 熱処理板の温度設定方法、熱処理板の温度設定装置及びコンピュータ読み取り可能な記憶媒体
JP5160920B2 (ja) 2008-02-22 2013-03-13 ルネサスエレクトロニクス株式会社 半導体装置の製造方法、半導体装置の製造装置、及び製造プログラム
JP2010267879A (ja) * 2009-05-15 2010-11-25 Tokyo Electron Ltd レジストパターンのスリミング処理方法
JP5599754B2 (ja) * 2010-05-31 2014-10-01 東京エレクトロン株式会社 基板処理装置、基板処理方法、およびこの基板処理方法を実行するためのコンピュータプログラムが記録された記録媒体
JP2014003164A (ja) * 2012-06-19 2014-01-09 Tokyo Electron Ltd 半導体装置の製造方法及び半導体装置並びに半導体装置の製造システム
JP7162541B2 (ja) * 2019-01-22 2022-10-28 東京エレクトロン株式会社 基板処理装置、及び基板処理方法、及び記憶媒体

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07211630A (ja) * 1994-01-26 1995-08-11 Sony Corp パターン形成方法及びその装置
JP2001143850A (ja) * 1999-09-03 2001-05-25 Tokyo Electron Ltd 基板の加熱処理装置，基板の加熱処理方法，基板処理装置及び基板処理方法
US6402509B1 (en) * 1999-09-03 2002-06-11 Tokyo Electron, Limited Substrate processing apparatus and substrate processing method
KR100811964B1 (ko) * 2000-09-28 2008-03-10 동경 엘렉트론 주식회사 레지스트 패턴 형성장치 및 그 방법
EP1273973A1 (en) * 2001-07-03 2003-01-08 Infineon Technologies SC300 GmbH & Co. KG Method for adjusting a temperature in a resist process
JP4127664B2 (ja) * 2003-06-30 2008-07-30 株式会社東芝 現像処理装置の調整方法

Also Published As

Publication number Publication date
JP4666380B2 (ja) 2011-04-06
KR20080049018A (ko) 2008-06-03
TWI324790B (enExample) 2010-05-11
KR101072330B1 (ko) 2011-10-11
WO2007032370A1 (ja) 2007-03-22
JP2007110080A (ja) 2007-04-26
US20090047586A1 (en) 2009-02-19
US7862966B2 (en) 2011-01-04

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees