TW200715361A - Substrate-processing apparatus, substrate-processing method, substrate-processing program, and computer-readable recording medium recorded with such program - Google Patents
Substrate-processing apparatus, substrate-processing method, substrate-processing program, and computer-readable recording medium recorded with such programInfo
- Publication number
- TW200715361A TW200715361A TW095134330A TW95134330A TW200715361A TW 200715361 A TW200715361 A TW 200715361A TW 095134330 A TW095134330 A TW 095134330A TW 95134330 A TW95134330 A TW 95134330A TW 200715361 A TW200715361 A TW 200715361A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- program
- processing
- pattern
- heat treatment
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005268191 | 2005-09-15 | ||
JP2006179727A JP4666380B2 (ja) | 2005-09-15 | 2006-06-29 | 基板処理装置、基板処理方法、基板処理プログラム、及びそのプログラムを記録したコンピュータ読み取り可能な記録媒体 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200715361A true TW200715361A (en) | 2007-04-16 |
TWI324790B TWI324790B (zh) | 2010-05-11 |
Family
ID=37864962
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095134330A TW200715361A (en) | 2005-09-15 | 2006-09-15 | Substrate-processing apparatus, substrate-processing method, substrate-processing program, and computer-readable recording medium recorded with such program |
Country Status (5)
Country | Link |
---|---|
US (1) | US7862966B2 (zh) |
JP (1) | JP4666380B2 (zh) |
KR (1) | KR101072330B1 (zh) |
TW (1) | TW200715361A (zh) |
WO (1) | WO2007032370A1 (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4891139B2 (ja) | 2007-04-20 | 2012-03-07 | 東京エレクトロン株式会社 | 熱処理板の温度設定方法、熱処理板の温度設定装置及びコンピュータ読み取り可能な記憶媒体 |
JP4969304B2 (ja) | 2007-04-20 | 2012-07-04 | 東京エレクトロン株式会社 | 熱処理板の温度設定方法、熱処理板の温度設定装置及びコンピュータ読み取り可能な記憶媒体 |
JP5160920B2 (ja) | 2008-02-22 | 2013-03-13 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法、半導体装置の製造装置、及び製造プログラム |
JP2010267879A (ja) * | 2009-05-15 | 2010-11-25 | Tokyo Electron Ltd | レジストパターンのスリミング処理方法 |
JP5599754B2 (ja) * | 2010-05-31 | 2014-10-01 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法、およびこの基板処理方法を実行するためのコンピュータプログラムが記録された記録媒体 |
JP2014003164A (ja) * | 2012-06-19 | 2014-01-09 | Tokyo Electron Ltd | 半導体装置の製造方法及び半導体装置並びに半導体装置の製造システム |
JP7162541B2 (ja) * | 2019-01-22 | 2022-10-28 | 東京エレクトロン株式会社 | 基板処理装置、及び基板処理方法、及び記憶媒体 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07211630A (ja) * | 1994-01-26 | 1995-08-11 | Sony Corp | パターン形成方法及びその装置 |
JP2001143850A (ja) * | 1999-09-03 | 2001-05-25 | Tokyo Electron Ltd | 基板の加熱処理装置,基板の加熱処理方法,基板処理装置及び基板処理方法 |
US6402509B1 (en) * | 1999-09-03 | 2002-06-11 | Tokyo Electron, Limited | Substrate processing apparatus and substrate processing method |
KR100811964B1 (ko) * | 2000-09-28 | 2008-03-10 | 동경 엘렉트론 주식회사 | 레지스트 패턴 형성장치 및 그 방법 |
EP1273973A1 (en) * | 2001-07-03 | 2003-01-08 | Infineon Technologies SC300 GmbH & Co. KG | Method for adjusting a temperature in a resist process |
JP4127664B2 (ja) * | 2003-06-30 | 2008-07-30 | 株式会社東芝 | 現像処理装置の調整方法 |
-
2006
- 2006-06-29 JP JP2006179727A patent/JP4666380B2/ja active Active
- 2006-09-13 KR KR1020087004066A patent/KR101072330B1/ko active IP Right Grant
- 2006-09-13 WO PCT/JP2006/318127 patent/WO2007032370A1/ja active Application Filing
- 2006-09-13 US US12/065,809 patent/US7862966B2/en not_active Expired - Fee Related
- 2006-09-15 TW TW095134330A patent/TW200715361A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
JP2007110080A (ja) | 2007-04-26 |
US7862966B2 (en) | 2011-01-04 |
KR20080049018A (ko) | 2008-06-03 |
TWI324790B (zh) | 2010-05-11 |
US20090047586A1 (en) | 2009-02-19 |
KR101072330B1 (ko) | 2011-10-11 |
WO2007032370A1 (ja) | 2007-03-22 |
JP4666380B2 (ja) | 2011-04-06 |
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