TW200714628A - Adamantane derivative, epoxy resin, and optical electronic member using resin composition comprising them - Google Patents
Adamantane derivative, epoxy resin, and optical electronic member using resin composition comprising themInfo
- Publication number
- TW200714628A TW200714628A TW095132728A TW95132728A TW200714628A TW 200714628 A TW200714628 A TW 200714628A TW 095132728 A TW095132728 A TW 095132728A TW 95132728 A TW95132728 A TW 95132728A TW 200714628 A TW200714628 A TW 200714628A
- Authority
- TW
- Taiwan
- Prior art keywords
- resin composition
- integer
- electronic member
- epoxy resin
- optical electronic
- Prior art date
Links
- ORILYTVJVMAKLC-UHFFFAOYSA-N adamantane Chemical class C1C(C2)CC3CC1CC2C3 ORILYTVJVMAKLC-UHFFFAOYSA-N 0.000 title abstract 5
- 239000011342 resin composition Substances 0.000 title abstract 5
- 230000003287 optical effect Effects 0.000 title abstract 4
- 239000003822 epoxy resin Substances 0.000 title abstract 3
- 229920000647 polyepoxide Polymers 0.000 title abstract 3
- 125000000217 alkyl group Chemical group 0.000 abstract 1
- 125000004432 carbon atom Chemical group C* 0.000 abstract 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 abstract 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 abstract 1
- 230000007774 longterm Effects 0.000 abstract 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D301/00—Preparation of oxiranes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
- C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
- C08G65/16—Cyclic ethers having four or more ring atoms
- C08G65/18—Oxetanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/32—Polymers modified by chemical after-treatment
- C08G65/329—Polymers modified by chemical after-treatment with organic compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0216—Coatings
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Epoxy Compounds (AREA)
- Led Device Packages (AREA)
- Polyethers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005256795A JP2007070407A (ja) | 2005-09-05 | 2005-09-05 | アダマンタン誘導体、エポキシ樹脂及びそれらを含む樹脂組成物を用いた光学電子部材 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200714628A true TW200714628A (en) | 2007-04-16 |
Family
ID=37835717
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095132728A TW200714628A (en) | 2005-09-05 | 2006-09-05 | Adamantane derivative, epoxy resin, and optical electronic member using resin composition comprising them |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20090137775A1 (zh) |
| EP (1) | EP1923416A4 (zh) |
| JP (1) | JP2007070407A (zh) |
| KR (1) | KR20080041201A (zh) |
| CN (1) | CN101258178A (zh) |
| AU (1) | AU2006288438A1 (zh) |
| TW (1) | TW200714628A (zh) |
| WO (1) | WO2007029598A1 (zh) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5134233B2 (ja) * | 2006-11-29 | 2013-01-30 | 出光興産株式会社 | アダマンタン誘導体、その製造方法及びアダマンタン誘導体を含む樹脂組成物 |
| JP2008163260A (ja) * | 2006-12-28 | 2008-07-17 | Showa Denko Kk | 発光素子封止用樹脂組成物およびランプ |
| JP5169422B2 (ja) * | 2007-04-20 | 2013-03-27 | 三菱化学株式会社 | 着色樹脂組成物、カラーフィルタ、液晶表示装置、及び有機ｅｌディスプレイ |
| JP2008274159A (ja) | 2007-05-01 | 2008-11-13 | Idemitsu Kosan Co Ltd | アダマンタン誘導体、その製造方法、該アダマンタン誘導体を含む樹脂組成物及びその用途 |
| US20100277684A1 (en) * | 2007-10-22 | 2010-11-04 | Hiroshi Fukushima | Display device and method for production thereof |
| JP5002444B2 (ja) * | 2007-12-25 | 2012-08-15 | パナソニック株式会社 | チップオンフィルム用液状エポキシ樹脂組成物、及び半導体装置 |
| JP2011129901A (ja) * | 2009-11-19 | 2011-06-30 | Mitsubishi Chemicals Corp | 半導体発光装置の製造方法 |
| JP6472754B2 (ja) * | 2013-10-07 | 2019-02-20 | 株式会社ダイセル | 硬化性エポキシ樹脂組成物 |
| CN105683154B (zh) * | 2013-10-25 | 2018-03-16 | 三菱瓦斯化学株式会社 | 氰酸酯化合物、包含该化合物的固化性树脂组合物及其固化物 |
| US9464224B2 (en) * | 2013-12-18 | 2016-10-11 | Rohm And Haas Electronic Materials Llc | Transformative wavelength conversion medium |
| CN103809827B (zh) * | 2014-01-26 | 2016-08-24 | 南通中尧机电制造有限公司 | 一种有机电容触摸屏的制造方法 |
| JP6472596B2 (ja) * | 2014-02-13 | 2019-02-20 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
| CN104877108A (zh) * | 2015-04-27 | 2015-09-02 | 北海和思科技有限公司 | 一种金刚烷基环氧树脂组合物 |
| CN104910123A (zh) * | 2015-05-30 | 2015-09-16 | 吴爱群 | 一种金刚烷基树脂单体的混合物及其制造方法 |
| JP7154194B2 (ja) * | 2019-07-02 | 2022-10-17 | サンスター技研株式会社 | 低温硬化性組成物 |
| CN117186361B (zh) * | 2023-08-08 | 2024-05-17 | 广东炎墨方案科技有限公司 | 一种金刚烷改性的高耐热光固化阻焊油墨及其制备方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU598896A1 (ru) * | 1976-08-23 | 1978-03-25 | Предприятие П/Я В-2304 | Бис-(3,4-эпоксициклогексилметиловые) эфиры 1,3-адамантанкарбоновой кислоты в качестве мономеров дл высокопрочных теплостойких эпоксиполимеров |
| JP2881969B2 (ja) | 1990-06-05 | 1999-04-12 | 富士通株式会社 | 放射線感光レジストとパターン形成方法 |
| JP2774229B2 (ja) | 1993-04-27 | 1998-07-09 | 帝人化成株式会社 | 光学用成形品 |
| JP3331121B2 (ja) | 1996-05-17 | 2002-10-07 | カネボウ株式会社 | ポリエステル重合体およびその成形体 |
| JPH10130371A (ja) | 1996-11-01 | 1998-05-19 | Nippon Kayaku Co Ltd | アダマンタン類、これらを含有する熱可塑性樹脂及びこれらを含有する熱硬化性樹脂組成物 |
| JP3415047B2 (ja) | 1998-11-18 | 2003-06-09 | ジャパンエポキシレジン株式会社 | 硬化性エポキシ樹脂組成物 |
| JP3889990B2 (ja) | 2002-05-01 | 2007-03-07 | Ｊｓｒ株式会社 | 含脂環共重合体、その製造方法、及び光学用樹脂 |
| JP2005146253A (ja) * | 2003-06-20 | 2005-06-09 | Tokuyama Corp | 硬化性多環式化合物、及びその製造方法 |
-
2005
- 2005-09-05 JP JP2005256795A patent/JP2007070407A/ja not_active Withdrawn
-
2006
- 2006-08-31 EP EP06797202A patent/EP1923416A4/en not_active Withdrawn
- 2006-08-31 CN CNA2006800325539A patent/CN101258178A/zh active Pending
- 2006-08-31 AU AU2006288438A patent/AU2006288438A1/xx active Pending
- 2006-08-31 KR KR1020087003774A patent/KR20080041201A/ko not_active Application Discontinuation
- 2006-08-31 WO PCT/JP2006/317242 patent/WO2007029598A1/ja active Application Filing
- 2006-08-31 US US12/065,651 patent/US20090137775A1/en not_active Abandoned
- 2006-09-05 TW TW095132728A patent/TW200714628A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| KR20080041201A (ko) | 2008-05-09 |
| EP1923416A1 (en) | 2008-05-21 |
| EP1923416A4 (en) | 2008-08-27 |
| CN101258178A (zh) | 2008-09-03 |
| AU2006288438A1 (en) | 2007-03-15 |
| WO2007029598A1 (ja) | 2007-03-15 |
| JP2007070407A (ja) | 2007-03-22 |
| US20090137775A1 (en) | 2009-05-28 |
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