TW200712235A - Method of forming a indicator - Google Patents
Method of forming a indicatorInfo
- Publication number
- TW200712235A TW200712235A TW095135498A TW95135498A TW200712235A TW 200712235 A TW200712235 A TW 200712235A TW 095135498 A TW095135498 A TW 095135498A TW 95135498 A TW95135498 A TW 95135498A TW 200712235 A TW200712235 A TW 200712235A
- Authority
- TW
- Taiwan
- Prior art keywords
- indicator
- forming
- bulk material
- bores
- consumable
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3435—Target holders (includes backing plates and endblocks)
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3476—Testing and control
- H01J37/3479—Detecting exhaustion of target material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3476—Testing and control
- H01J37/3482—Detecting or avoiding eroding through
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4998—Combined manufacture including applying or shaping of fluent material
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- Plasma & Fusion (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physical Vapour Deposition (AREA)
- Extrusion Moulding Of Plastics Or The Like (AREA)
- Metal Rolling (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US72039005P | 2005-09-26 | 2005-09-26 | |
US72872405P | 2005-10-20 | 2005-10-20 | |
US11/427,618 US7891536B2 (en) | 2005-09-26 | 2006-06-29 | PVD target with end of service life detection capability |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200712235A true TW200712235A (en) | 2007-04-01 |
TWI319440B TWI319440B (en) | 2010-01-11 |
Family
ID=37892521
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095135498A TWI319440B (en) | 2005-09-26 | 2006-09-26 | Method of forming a indicator |
Country Status (5)
Country | Link |
---|---|
US (3) | US7891536B2 (zh) |
JP (1) | JP4646883B2 (zh) |
KR (1) | KR100827748B1 (zh) |
SG (1) | SG131006A1 (zh) |
TW (1) | TWI319440B (zh) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070068796A1 (en) * | 2005-09-26 | 2007-03-29 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of using a target having end of service life detection capability |
US7891536B2 (en) * | 2005-09-26 | 2011-02-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | PVD target with end of service life detection capability |
US8795486B2 (en) * | 2005-09-26 | 2014-08-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | PVD target with end of service life detection capability |
JP2009245988A (ja) * | 2008-03-28 | 2009-10-22 | Tokyo Electron Ltd | プラズマ処理装置、チャンバ内部品及びチャンバ内部品の寿命検出方法 |
DE102010052341B4 (de) * | 2010-11-25 | 2015-02-12 | Von Ardenne Gmbh | Schutzvorrichtung an Rohrtargets |
US20130206589A1 (en) * | 2012-02-14 | 2013-08-15 | Solar Applied Materials Technology Corp. | Sputtering Target Having Alarm Function |
US10060023B2 (en) | 2012-10-19 | 2018-08-28 | Infineon Technologies Ag | Backing plate for a sputter target, sputter target, and sputter device |
DE102013011068A1 (de) * | 2013-07-03 | 2015-01-08 | Oerlikon Trading Ag, Trübbach | Targetalter-Kompensationsverfahren zur Durchführung von stabilen reaktiven Sputterverfahren |
US10041868B2 (en) * | 2015-01-28 | 2018-08-07 | Lam Research Corporation | Estimation of lifetime remaining for a consumable-part in a semiconductor manufacturing chamber |
US9791415B2 (en) | 2015-06-25 | 2017-10-17 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for monitoring usage of a physical vapor deposition (PVD) target with an ultrasonic transducer |
CN109825810A (zh) * | 2019-04-04 | 2019-05-31 | 浙江工业大学 | 一种真空镀膜溅射靶材镀穿警报装置 |
US11424111B2 (en) * | 2020-06-25 | 2022-08-23 | Taiwan Semiconductor Manufacturing Company Limited | Sputtering target assembly to prevent overetch of backing plate and methods of using the same |
Family Cites Families (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1990718A (en) * | 1931-04-23 | 1935-02-12 | Elastic Stop Nut Corp | Process of making nuts |
DE1527872A1 (de) * | 1966-07-20 | 1969-12-04 | Reisholz Stahl & Roehrenwerk | Vorrichtung und Verfahren zum Strangpressen von Rohren |
US4324631A (en) | 1979-07-23 | 1982-04-13 | Spin Physics, Inc. | Magnetron sputtering of magnetic materials |
ATE10512T1 (de) | 1980-08-08 | 1984-12-15 | Battelle Development Corporation | Vorrichtung zur beschichtung von substraten mittels hochleistungskathodenzerstaeubung sowie zerstaeuberkathode fuer diese vorrichtung. |
US4336119A (en) | 1981-01-29 | 1982-06-22 | Ppg Industries, Inc. | Method of and apparatus for control of reactive sputtering deposition |
US4545882A (en) | 1983-09-02 | 1985-10-08 | Shatterproof Glass Corporation | Method and apparatus for detecting sputtering target depletion |
DE3630737C1 (de) * | 1986-09-10 | 1987-11-05 | Philips & Du Pont Optical | Kathodenzerstaeubungseinrichtung mit einer Vorrichtung zur Messung eines kritischen Target-Abtrages |
CH669609A5 (zh) | 1986-12-23 | 1989-03-31 | Balzers Hochvakuum | |
EP0417221A1 (de) | 1989-03-15 | 1991-03-20 | Balzers Aktiengesellschaft | Verfahren zur detektion des erreichens einer vorgebbaren tiefe der targetkörpererosion sowie targetkörper hierfür |
JPH0641744A (ja) | 1992-05-26 | 1994-02-15 | Hitachi Ltd | スパッタ装置 |
JPH0688230A (ja) | 1992-09-04 | 1994-03-29 | Nippon Steel Corp | スパッタリング装置 |
JPH06140383A (ja) | 1992-10-27 | 1994-05-20 | Nippon Steel Corp | スパッタリング装置 |
JPH06212416A (ja) | 1993-01-12 | 1994-08-02 | Nippon Steel Corp | スパッタリング装置 |
WO1994016845A1 (en) * | 1993-01-19 | 1994-08-04 | Jennings Winch & Foundry Co., Ltd. | Casting metal tubes having one closed end |
EP0615273A1 (en) * | 1993-03-12 | 1994-09-14 | Applied Materials, Inc. | Method and apparatus for detection of sputtering target erosion |
JPH06306593A (ja) | 1993-04-16 | 1994-11-01 | Nkk Corp | スパッタリング装置 |
JPH08176808A (ja) | 1993-04-28 | 1996-07-09 | Japan Energy Corp | 寿命警報機能を備えたスパッタリングタ−ゲット |
JPH0754140A (ja) | 1993-08-19 | 1995-02-28 | Matsushita Electron Corp | スパッタリング装置 |
JPH07258837A (ja) * | 1994-03-22 | 1995-10-09 | Mitsubishi Materials Corp | センサー付きセラミックスターゲット |
JPH07292472A (ja) | 1994-04-21 | 1995-11-07 | Sharp Corp | スパッタ装置のターゲット減肉量検出方法及びその装置 |
JP3504743B2 (ja) | 1994-09-30 | 2004-03-08 | 日本電産株式会社 | スピンドルモータ |
JPH1025571A (ja) | 1996-07-09 | 1998-01-27 | Sony Corp | スパッタ用ターゲット及びその製造方法 |
JP2003529206A (ja) | 1999-11-24 | 2003-09-30 | ハネウェル・インターナショナル・インコーポレーテッド | 物理蒸着ターゲット、導電性集積回路金属合金相互接続配線、電気めっきアノード、集積回路における導電性相互接続配線として用いるための金属合金 |
US6780794B2 (en) | 2000-01-20 | 2004-08-24 | Honeywell International Inc. | Methods of bonding physical vapor deposition target materials to backing plate materials |
US7063773B2 (en) | 2000-08-17 | 2006-06-20 | Tosoh Smd, Inc. | High purity sputter targets with target end-of-life indication and method of manufacture |
US6503380B1 (en) | 2000-10-13 | 2003-01-07 | Honeywell International Inc. | Physical vapor target constructions |
DE10110823A1 (de) * | 2001-03-07 | 2002-10-02 | Bosch Gmbh Robert | Verfahren zum Abtragen von Materialablagerungen, die bei einer Laserbearbeitung entstehen |
US6638402B2 (en) | 2001-06-05 | 2003-10-28 | Praxair S.T. Technology, Inc. | Ring-type sputtering target |
WO2003027785A1 (fr) | 2001-09-21 | 2003-04-03 | Olympus Corporation | Dispositif de gestion en mode de traitement par lots |
US20040262157A1 (en) * | 2003-02-25 | 2004-12-30 | Ford Robert B. | Method of forming sputtering target assembly and assemblies made therefrom |
JP2004299134A (ja) | 2003-03-28 | 2004-10-28 | Toshiba Mach Co Ltd | 射出成形機における材料供給装置及び射出成形機 |
US8795486B2 (en) | 2005-09-26 | 2014-08-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | PVD target with end of service life detection capability |
US20070068796A1 (en) | 2005-09-26 | 2007-03-29 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of using a target having end of service life detection capability |
US7891536B2 (en) * | 2005-09-26 | 2011-02-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | PVD target with end of service life detection capability |
-
2006
- 2006-06-29 US US11/427,618 patent/US7891536B2/en not_active Expired - Fee Related
- 2006-08-03 SG SG200605237-7A patent/SG131006A1/en unknown
- 2006-09-19 KR KR1020060090403A patent/KR100827748B1/ko active IP Right Grant
- 2006-09-25 JP JP2006259236A patent/JP4646883B2/ja active Active
- 2006-09-26 TW TW095135498A patent/TWI319440B/zh not_active IP Right Cessation
-
2011
- 2011-02-07 US US13/022,221 patent/US20110126397A1/en not_active Abandoned
-
2012
- 2012-01-24 US US13/356,950 patent/US8276648B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
SG131006A1 (en) | 2007-04-26 |
US7891536B2 (en) | 2011-02-22 |
TWI319440B (en) | 2010-01-11 |
US20070068804A1 (en) | 2007-03-29 |
KR100827748B1 (ko) | 2008-05-07 |
JP2007092174A (ja) | 2007-04-12 |
JP4646883B2 (ja) | 2011-03-09 |
KR20070034935A (ko) | 2007-03-29 |
US20110126397A1 (en) | 2011-06-02 |
US20120131784A1 (en) | 2012-05-31 |
US8276648B2 (en) | 2012-10-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |