TW200712128A - Heat conductive silicone grease composition and cured product thereof - Google Patents
Heat conductive silicone grease composition and cured product thereofInfo
- Publication number
- TW200712128A TW200712128A TW095130251A TW95130251A TW200712128A TW 200712128 A TW200712128 A TW 200712128A TW 095130251 A TW095130251 A TW 095130251A TW 95130251 A TW95130251 A TW 95130251A TW 200712128 A TW200712128 A TW 200712128A
- Authority
- TW
- Taiwan
- Prior art keywords
- heat conductive
- component
- cured product
- mass
- conductive silicone
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title abstract 5
- 229920001296 polysiloxane Polymers 0.000 title abstract 5
- 239000004519 grease Substances 0.000 title abstract 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 3
- 125000003342 alkenyl group Chemical group 0.000 abstract 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 abstract 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 abstract 2
- 238000007259 addition reaction Methods 0.000 abstract 1
- 239000003054 catalyst Substances 0.000 abstract 1
- 239000011231 conductive filler Substances 0.000 abstract 1
- 238000011109 contamination Methods 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
- 229920006136 organohydrogenpolysiloxane Polymers 0.000 abstract 1
- 239000002245 particle Substances 0.000 abstract 1
- 229910052697 platinum Inorganic materials 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M169/00—Lubricating compositions characterised by containing as components a mixture of at least two types of ingredient selected from base-materials, thickeners or additives, covered by the preceding groups, each of these compounds being essential
- C10M169/04—Mixtures of base-materials and additives
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2201/00—Inorganic compounds or elements as ingredients in lubricant compositions
- C10M2201/04—Elements
- C10M2201/041—Carbon; Graphite; Carbon black
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2201/00—Inorganic compounds or elements as ingredients in lubricant compositions
- C10M2201/04—Elements
- C10M2201/05—Metals; Alloys
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2201/00—Inorganic compounds or elements as ingredients in lubricant compositions
- C10M2201/04—Elements
- C10M2201/05—Metals; Alloys
- C10M2201/053—Metals; Alloys used as base material
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2201/00—Inorganic compounds or elements as ingredients in lubricant compositions
- C10M2201/06—Metal compounds
- C10M2201/061—Carbides; Hydrides; Nitrides
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2229/00—Organic macromolecular compounds containing atoms of elements not provided for in groups C10M2205/00, C10M2209/00, C10M2213/00, C10M2217/00, C10M2221/00 or C10M2225/00 as ingredients in lubricant compositions
- C10M2229/04—Siloxanes with specific structure
- C10M2229/041—Siloxanes with specific structure containing aliphatic substituents
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2229/00—Organic macromolecular compounds containing atoms of elements not provided for in groups C10M2205/00, C10M2209/00, C10M2213/00, C10M2217/00, C10M2221/00 or C10M2225/00 as ingredients in lubricant compositions
- C10M2229/04—Siloxanes with specific structure
- C10M2229/041—Siloxanes with specific structure containing aliphatic substituents
- C10M2229/0415—Siloxanes with specific structure containing aliphatic substituents used as base material
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2229/00—Organic macromolecular compounds containing atoms of elements not provided for in groups C10M2205/00, C10M2209/00, C10M2213/00, C10M2217/00, C10M2221/00 or C10M2225/00 as ingredients in lubricant compositions
- C10M2229/04—Siloxanes with specific structure
- C10M2229/044—Siloxanes with specific structure containing silicon-to-hydrogen bonds
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2229/00—Organic macromolecular compounds containing atoms of elements not provided for in groups C10M2205/00, C10M2209/00, C10M2213/00, C10M2217/00, C10M2221/00 or C10M2225/00 as ingredients in lubricant compositions
- C10M2229/04—Siloxanes with specific structure
- C10M2229/046—Siloxanes with specific structure containing silicon-oxygen-carbon bonds
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
- C10N2010/00—Metal present as such or in compounds
- C10N2010/02—Groups 1 or 11
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
- C10N2010/00—Metal present as such or in compounds
- C10N2010/06—Groups 3 or 13
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
- C10N2010/00—Metal present as such or in compounds
- C10N2010/14—Group 7
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
- C10N2010/00—Metal present as such or in compounds
- C10N2010/16—Groups 8, 9, or 10
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
- C10N2020/00—Specified physical or chemical properties or characteristics, i.e. function, of component of lubricating compositions
- C10N2020/01—Physico-chemical properties
- C10N2020/055—Particles related characteristics
- C10N2020/06—Particles of special shape or size
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
- C10N2030/00—Specified physical or chemical properties which is improved by the additive characterising the lubricating composition, e.g. multifunctional additives
- C10N2030/02—Pour-point; Viscosity index
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Computer Hardware Design (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005238019A JP4634891B2 (ja) | 2005-08-18 | 2005-08-18 | 熱伝導性シリコーングリース組成物およびその硬化物 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200712128A true TW200712128A (en) | 2007-04-01 |
TWI428395B TWI428395B (zh) | 2014-03-01 |
Family
ID=37497965
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW95130251A TWI428395B (zh) | 2005-08-18 | 2006-08-17 | A thermally conductive silicone grease composition and a hardened product thereof |
Country Status (6)
Country | Link |
---|---|
US (1) | US20070042533A1 (zh) |
EP (1) | EP1754772A1 (zh) |
JP (1) | JP4634891B2 (zh) |
KR (1) | KR101244566B1 (zh) |
CN (1) | CN1923944B (zh) |
TW (1) | TWI428395B (zh) |
Families Citing this family (45)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6651736B2 (en) * | 2001-06-28 | 2003-11-25 | Intel Corporation | Short carbon fiber enhanced thermal grease |
JP4933094B2 (ja) * | 2005-12-27 | 2012-05-16 | 信越化学工業株式会社 | 熱伝導性シリコーングリース組成物 |
JP4495749B2 (ja) * | 2006-06-16 | 2010-07-07 | 信越化学工業株式会社 | 熱伝導性シリコーングリース組成物 |
TWI419931B (zh) * | 2006-06-16 | 2013-12-21 | Shinetsu Chemical Co | 導熱聚矽氧潤滑脂組成物 |
EP1878767A1 (en) * | 2006-07-12 | 2008-01-16 | Shin-Etsu Chemical Co., Ltd. | Heat conductive silicone grease composition and cured product thereof |
JP4514058B2 (ja) * | 2006-08-30 | 2010-07-28 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物及びその硬化物 |
JP2008274036A (ja) | 2007-04-26 | 2008-11-13 | Shin Etsu Chem Co Ltd | 放熱用シリコーングリース組成物 |
EP2188836A2 (en) * | 2007-09-11 | 2010-05-26 | Dow Corning Corporation | Thermal interface material, electronic device containing the thermal interface material, and methods for their preparation and use |
WO2009035906A2 (en) * | 2007-09-11 | 2009-03-19 | Dow Corning Corporation | Composite, thermal interface material containing the composite, and methods for their preparation and use |
JP5168732B2 (ja) * | 2007-09-21 | 2013-03-27 | 信越化学工業株式会社 | 変位耐久性を有する硬化物を与えるシリコーンゲル組成物 |
JP5372388B2 (ja) * | 2008-01-30 | 2013-12-18 | 東レ・ダウコーニング株式会社 | 熱伝導性シリコーングリース組成物 |
JP4656340B2 (ja) * | 2008-03-03 | 2011-03-23 | 信越化学工業株式会社 | 熱伝導性シリコーングリース組成物 |
JP2009235279A (ja) * | 2008-03-27 | 2009-10-15 | Shin Etsu Chem Co Ltd | 熱伝導性成形体およびその製造方法 |
JP2009256400A (ja) * | 2008-04-11 | 2009-11-05 | Shin Etsu Chem Co Ltd | 半導体素子用シリコーン接着剤 |
JP5105308B2 (ja) * | 2008-06-04 | 2012-12-26 | 信越化学工業株式会社 | 低温加熱時における硬化速度を促進した熱伝導性シリコーン組成物 |
JP5388329B2 (ja) * | 2008-11-26 | 2014-01-15 | 株式会社デンソー | 放熱用シリコーングリース組成物 |
US20100275440A1 (en) * | 2009-05-01 | 2010-11-04 | Sara Naomi Paisner | Highly conductive thermal interface and no pump-out thermal interface greases and method therefore |
US8012373B2 (en) * | 2009-05-12 | 2011-09-06 | Raytheon Company | Anti-corrosion thread compound for seawater environment |
JP2011140566A (ja) * | 2010-01-07 | 2011-07-21 | Dow Corning Toray Co Ltd | 熱伝導性シリコーングリース組成物 |
JP5619487B2 (ja) | 2010-06-24 | 2014-11-05 | 東レ・ダウコーニング株式会社 | 熱伝導性シリコーングリース組成物 |
CN102134474B (zh) * | 2010-12-29 | 2013-10-02 | 深圳市优宝惠新材料科技有限公司 | 导热硅脂组合物 |
US20140175505A1 (en) * | 2011-07-14 | 2014-06-26 | Ryosuke Yamazaki | Sealing agent for optical semiconductor devices, and optical semiconductor device |
JP2012052137A (ja) * | 2011-11-28 | 2012-03-15 | Shin-Etsu Chemical Co Ltd | 熱伝導性シリコーングリース組成物 |
JP2013159670A (ja) * | 2012-02-02 | 2013-08-19 | Dow Corning Toray Co Ltd | 硬化性シリコーン組成物、その硬化物、および光半導体装置 |
JP5814175B2 (ja) * | 2012-04-16 | 2015-11-17 | 信越化学工業株式会社 | Ledのリフレクター用熱硬化性シリコーン樹脂組成物並びにこれを用いたled用リフレクター及び光半導体装置 |
JP5756054B2 (ja) | 2012-04-16 | 2015-07-29 | 信越化学工業株式会社 | Ledのリフレクター用熱硬化性樹脂組成物並びにこれを用いたled用リフレクター及び光半導体装置 |
JP5783128B2 (ja) * | 2012-04-24 | 2015-09-24 | 信越化学工業株式会社 | 加熱硬化型熱伝導性シリコーングリース組成物 |
WO2013168291A1 (ja) * | 2012-05-11 | 2013-11-14 | 信越化学工業株式会社 | 熱伝導性シリコーングリース組成物 |
JP2014003152A (ja) | 2012-06-18 | 2014-01-09 | Dow Corning Toray Co Ltd | サーマルインターフェース材の形成方法および放熱構造体 |
CN102914404A (zh) * | 2012-11-08 | 2013-02-06 | 中北大学 | 消除爆炸光对冲击波超压测试传感器产生不利影响的方法 |
JP6383993B2 (ja) * | 2014-02-18 | 2018-09-05 | 協同油脂株式会社 | シリコーングリース組成物 |
JP6223590B2 (ja) * | 2015-05-22 | 2017-11-01 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 熱伝導性組成物 |
JP6436035B2 (ja) * | 2015-09-25 | 2018-12-12 | 信越化学工業株式会社 | 熱軟化性熱伝導性シリコーングリース組成物、熱伝導性被膜の形成方法、放熱構造及びパワーモジュール装置 |
JP2017079244A (ja) * | 2015-10-19 | 2017-04-27 | トヨタ自動車株式会社 | 半導体モジュールの冷却構造 |
CN106398226A (zh) * | 2016-05-05 | 2017-02-15 | 厦门安耐伟业新材料有限公司 | 导热硅凝胶及其制备方法 |
JP6879690B2 (ja) | 2016-08-05 | 2021-06-02 | スリーエム イノベイティブ プロパティズ カンパニー | 放熱用樹脂組成物、その硬化物、及びこれらの使用方法 |
JP6607166B2 (ja) * | 2016-10-31 | 2019-11-20 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物及び半導体装置 |
JP6874366B2 (ja) * | 2016-12-28 | 2021-05-19 | 信越化学工業株式会社 | シリコーン組成物およびその硬化物 |
KR102318181B1 (ko) | 2017-02-08 | 2021-10-27 | 엘켐 실리콘즈 유에스에이 코포레이션 | 열 관리가 개선된 이차 배터리 팩 |
CN108129841B (zh) * | 2017-12-25 | 2020-10-23 | 云南靖创液态金属热控技术研发有限公司 | 一种液态金属绝缘导热材料及其制备方法 |
CN110643331B (zh) * | 2019-10-12 | 2021-11-09 | 云南靖创液态金属热控技术研发有限公司 | 一种液态金属导热膏及其制备方法和应用 |
US11708494B2 (en) * | 2020-02-14 | 2023-07-25 | Icp Construction, Inc. | Oleophobic and hydrophobic composition |
US10777483B1 (en) | 2020-02-28 | 2020-09-15 | Arieca Inc. | Method, apparatus, and assembly for thermally connecting layers |
CN113913018B (zh) * | 2021-11-30 | 2022-11-11 | 四川大学 | 一种高流动性的绝缘导热硅脂及其制备方法 |
US12027442B1 (en) | 2023-01-31 | 2024-07-02 | Arieca Inc. | Thermal interface material, an integrated circuit formed therewith, and a method of application thereof |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07207160A (ja) * | 1994-01-11 | 1995-08-08 | Toshiba Silicone Co Ltd | シリコーン組成物およびその製造方法 |
JPH0853664A (ja) * | 1994-08-10 | 1996-02-27 | Fujitsu Ltd | 熱伝導材料及びその製造方法、電子部品の冷却方法、回路基板の冷却方法、並びに電子部品の実装方法 |
JP2000114438A (ja) * | 1998-09-30 | 2000-04-21 | Shin Etsu Chem Co Ltd | 半導体装置 |
US6706219B2 (en) * | 1999-09-17 | 2004-03-16 | Honeywell International Inc. | Interface materials and methods of production and use thereof |
US6984685B2 (en) * | 2000-04-05 | 2006-01-10 | The Bergquist Company | Thermal interface pad utilizing low melting metal with retention matrix |
CA2343486A1 (en) | 2000-10-17 | 2002-04-17 | The Bergquist Company | Method of preparing thermally conductive compounds by liquid metal bridged particle clusters |
JP4004270B2 (ja) * | 2001-11-05 | 2007-11-07 | 電気化学工業株式会社 | 高熱伝導性無機粉末および樹脂組成物 |
JP3803058B2 (ja) * | 2001-12-11 | 2006-08-02 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物、その硬化物及び敷設方法並びにそれを用いた半導体装置の放熱構造体 |
JP3928943B2 (ja) * | 2002-07-03 | 2007-06-13 | 信越化学工業株式会社 | 放熱部材、その製造方法及びその敷設方法 |
JP3844125B2 (ja) * | 2002-01-22 | 2006-11-08 | 信越化学工業株式会社 | 放熱部材、その製造方法及びその敷設方法 |
US6791839B2 (en) * | 2002-06-25 | 2004-09-14 | Dow Corning Corporation | Thermal interface materials and methods for their preparation and use |
JP4551074B2 (ja) * | 2003-10-07 | 2010-09-22 | 信越化学工業株式会社 | 硬化性オルガノポリシロキサン組成物および半導体装置 |
-
2005
- 2005-08-18 JP JP2005238019A patent/JP4634891B2/ja not_active Expired - Fee Related
-
2006
- 2006-07-24 EP EP20060253858 patent/EP1754772A1/en not_active Withdrawn
- 2006-08-17 KR KR1020060077485A patent/KR101244566B1/ko not_active IP Right Cessation
- 2006-08-17 US US11/505,435 patent/US20070042533A1/en not_active Abandoned
- 2006-08-17 TW TW95130251A patent/TWI428395B/zh not_active IP Right Cessation
- 2006-08-17 CN CN2006101150270A patent/CN1923944B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR101244566B1 (ko) | 2013-03-21 |
KR20070021933A (ko) | 2007-02-23 |
JP4634891B2 (ja) | 2011-02-16 |
US20070042533A1 (en) | 2007-02-22 |
JP2007051227A (ja) | 2007-03-01 |
TWI428395B (zh) | 2014-03-01 |
EP1754772A1 (en) | 2007-02-21 |
CN1923944A (zh) | 2007-03-07 |
CN1923944B (zh) | 2012-06-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200712128A (en) | Heat conductive silicone grease composition and cured product thereof | |
CN101544089B (zh) | 导热层压材料及其制造方法 | |
JP5447337B2 (ja) | シリコーン構造体の製造方法及び半導体装置 | |
TWI635169B (zh) | Thermally conductive composite sheet | |
CN103087530B (zh) | 可固化的有机基聚硅氧烷组合物以及半导体器件 | |
JP5283346B2 (ja) | 熱伝導性硬化物及びその製造方法 | |
KR102132243B1 (ko) | 열전도성 실리콘 조성물 및 경화물, 및 복합 시트 | |
CN101652209B (zh) | 制备非同质复合材料的方法 | |
MY170487A (en) | Heat conductive silicone composition, heat conductive layer, and semiconductor device | |
WO2009107757A3 (en) | Heat conductive cured product and making method | |
TW200720360A (en) | Thermosetting silicone rubber composition, electronic component and electronic device | |
ATE352871T1 (de) | Adaptive füller und thermische zwischenmaterialien | |
CN103146198A (zh) | 导热复合材料及其制成的导热复合片材 | |
JP2008038137A (ja) | 熱伝導性シリコーングリース組成物およびその硬化物 | |
EP1319690A3 (en) | A thermoconducting silicone composition, its curing product and installation method, and a heat dissipating structure of a semiconductor device using same | |
KR20080093997A (ko) | 방열재와 이를 이용한 반도체 장치 | |
KR20080006482A (ko) | 열전도성 실리콘 그리스 조성물 및 그의 경화물 | |
JP2014003152A (ja) | サーマルインターフェース材の形成方法および放熱構造体 | |
JP2015233104A (ja) | 熱伝導性シート | |
TW200503211A (en) | Thermal conductive composition, a heat-dissipating putty sheet and heat-dissipating structure using the same | |
TW202014472A (zh) | 低耐熱性聚矽氧組成物 | |
KR20200086307A (ko) | 열전도성 실리콘 그리스 조성물 | |
JP2014003141A (ja) | 熱伝導性シート及び電子機器 | |
JP2009235279A (ja) | 熱伝導性成形体およびその製造方法 | |
Anithambigai et al. | Synthesis and thermal analysis of aluminium nitride filled epoxy composites and its effective application as thermal interface material for LED applications |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |