TW200710234A - Copper alloy for electronic material - Google Patents

Copper alloy for electronic material

Info

Publication number
TW200710234A
TW200710234A TW095110257A TW95110257A TW200710234A TW 200710234 A TW200710234 A TW 200710234A TW 095110257 A TW095110257 A TW 095110257A TW 95110257 A TW95110257 A TW 95110257A TW 200710234 A TW200710234 A TW 200710234A
Authority
TW
Taiwan
Prior art keywords
mass
copper alloy
electronic material
ratio
electronic materials
Prior art date
Application number
TW095110257A
Other languages
English (en)
Chinese (zh)
Other versions
TWI331633B (enrdf_load_stackoverflow
Inventor
Naohiko Era
Kazuhiko Fukamachi
Hiroshi Kuwagaki
Original Assignee
Nippon Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining Co Ltd filed Critical Nippon Mining Co Ltd
Publication of TW200710234A publication Critical patent/TW200710234A/zh
Application granted granted Critical
Publication of TWI331633B publication Critical patent/TWI331633B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
TW095110257A 2005-03-24 2006-03-24 Copper alloy for electronic material TW200710234A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005085907 2005-03-24

Publications (2)

Publication Number Publication Date
TW200710234A true TW200710234A (en) 2007-03-16
TWI331633B TWI331633B (enrdf_load_stackoverflow) 2010-10-11

Family

ID=37023829

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095110257A TW200710234A (en) 2005-03-24 2006-03-24 Copper alloy for electronic material

Country Status (6)

Country Link
US (1) US8317948B2 (enrdf_load_stackoverflow)
EP (1) EP1873267B1 (enrdf_load_stackoverflow)
JP (1) JP5475230B2 (enrdf_load_stackoverflow)
CN (1) CN101146920A (enrdf_load_stackoverflow)
TW (1) TW200710234A (enrdf_load_stackoverflow)
WO (1) WO2006101172A1 (enrdf_load_stackoverflow)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5306591B2 (ja) * 2005-12-07 2013-10-02 古河電気工業株式会社 配線用電線導体、配線用電線、及びそれらの製造方法
US8287669B2 (en) 2007-05-31 2012-10-16 The Furukawa Electric Co., Ltd. Copper alloy for electric and electronic equipments
JP4303313B2 (ja) * 2007-09-28 2009-07-29 日鉱金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法
JP5006405B2 (ja) * 2007-11-01 2012-08-22 古河電気工業株式会社 電子機器用導体線材およびそれを用いた配線用電線
US20100316879A1 (en) * 2008-02-08 2010-12-16 Kuniteru Mihara Copper alloy material for electric/electronic components
JP4440313B2 (ja) * 2008-03-31 2010-03-24 日鉱金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ−Ｃｒ系合金
JP4837697B2 (ja) * 2008-03-31 2011-12-14 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法
WO2010016428A1 (ja) * 2008-08-05 2010-02-11 古河電気工業株式会社 電気・電子部品用銅合金材
WO2010016429A1 (ja) * 2008-08-05 2010-02-11 古河電気工業株式会社 電気・電子部品用銅合金材料
CN102227510B (zh) * 2008-12-01 2015-06-17 Jx日矿日石金属株式会社 电子材料用Cu-Ni-Si-Co系铜合金及其制造方法
JP4930527B2 (ja) * 2009-03-05 2012-05-16 日立電線株式会社 銅合金材及び銅合金材の製造方法
JP4708485B2 (ja) * 2009-03-31 2011-06-22 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｃｏ−Ｓｉ系銅合金及びその製造方法
JP2010255042A (ja) * 2009-04-24 2010-11-11 Hitachi Cable Ltd 銅合金及び銅合金の製造方法
CN102549180A (zh) 2009-09-28 2012-07-04 Jx日矿日石金属株式会社 电子材料用Cu－Ni－Si－Co系铜合金和其制造方法
JP4677505B1 (ja) * 2010-03-31 2011-04-27 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法
JP4830035B2 (ja) 2010-04-14 2011-12-07 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｓｉ−Ｃｏ系合金及びその製造方法
WO2011142643A2 (ko) * 2010-05-14 2011-11-17 한국기계연구원 구리합금 및 그 제조방법과 그 강도와 전기전도도를 향상시키는 방법
JP4672804B1 (ja) 2010-05-31 2011-04-20 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｃｏ−Ｓｉ系銅合金及びその製造方法
JP4708497B1 (ja) * 2010-06-03 2011-06-22 Ｊｘ日鉱日石金属株式会社 Ｃｕ−Ｃｏ−Ｓｉ系合金板及びその製造方法
JP4834781B1 (ja) 2010-08-24 2011-12-14 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｃｏ−Ｓｉ系合金
JP5451674B2 (ja) 2011-03-28 2014-03-26 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｓｉ−Ｃｏ系銅合金及びその製造方法
JP4799701B1 (ja) 2011-03-29 2011-10-26 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｃｏ−Ｓｉ系銅合金条及びその製造方法
US9159985B2 (en) * 2011-05-27 2015-10-13 Ostuka Techno Corporation Circuit breaker and battery pack including the same
JP5802150B2 (ja) * 2012-02-24 2015-10-28 株式会社神戸製鋼所 銅合金
CN103526072A (zh) * 2013-04-26 2014-01-22 洛阳新火种节能技术推广有限公司 一种铜基合金制作工艺
CN104388740B (zh) * 2014-10-28 2016-10-05 青岛玉兰祥商务服务有限公司 铜基石墨与锆粉末冶金复合材料及其制备方法
CN105112762A (zh) * 2015-08-14 2015-12-02 太仓安托建筑材料有限公司 一种高韧性铜合金
JP6246174B2 (ja) * 2015-10-05 2017-12-13 Ｊｘ金属株式会社 電子部品用Ｃｕ−Ｃｏ−Ｎｉ−Ｓｉ合金
JP6246173B2 (ja) 2015-10-05 2017-12-13 Ｊｘ金属株式会社 電子部品用Ｃｕ−Ｃｏ−Ｎｉ−Ｓｉ合金
CN106636734B (zh) * 2015-10-30 2019-01-15 北京有色金属研究总院 高强度、高导电、高抗应力松弛铜合金弹性材料及其制备方法
CN105400984A (zh) * 2015-11-13 2016-03-16 太仓荣中机电科技有限公司 一种性能均衡的电子合金材料
JP6385383B2 (ja) * 2016-03-31 2018-09-05 Ｊｘ金属株式会社 銅合金板材および銅合金板材の製造方法
CN106191725B (zh) * 2016-06-24 2018-01-26 河南江河机械有限责任公司 高强度高导电铜合金纳米相析出工艺方法
DE102016008753B4 (de) * 2016-07-18 2020-03-12 Wieland-Werke Ag Kupfer-Nickel-Zinn-Legierung, Verfahren zu deren Herstellung sowie deren Verwendung
CN107326215A (zh) * 2017-08-15 2017-11-07 徐高杰 一种槽楔用铜合金的加工方法
CN107988512A (zh) * 2017-11-30 2018-05-04 中铝洛阳铜加工有限公司 一种高强高弹铜镍硅钴系引线框架加工工艺
CN111057971A (zh) * 2019-12-23 2020-04-24 深圳金斯达应用材料有限公司 一种微合金高精度铜合金电子材料及其制备方法
CN111485132B (zh) * 2020-04-10 2021-09-10 宁波博威合金板带有限公司 一种综合性能优异的铜合金带材及其制备方法
CN112593115A (zh) * 2020-12-21 2021-04-02 杭州昶海电力科技有限公司 一种高压开关触片加工工艺

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2241815A (en) * 1938-08-12 1941-05-13 Mallory & Co Inc P R Method of treating copper alloy castings
US4191601A (en) * 1979-02-12 1980-03-04 Ampco-Pittsburgh Corporation Copper-nickel-silicon-chromium alloy having improved electrical conductivity
US4657601A (en) * 1983-11-10 1987-04-14 Brush Wellman Inc. Thermomechanical processing of beryllium-copper alloys
EP0189745B1 (en) * 1985-02-01 1988-06-29 Kabushiki Kaisha Kobe Seiko Sho Lead material for ceramic package ic
US4594221A (en) 1985-04-26 1986-06-10 Olin Corporation Multipurpose copper alloys with moderate conductivity and high strength
JP2542370B2 (ja) * 1986-09-30 1996-10-09 古河電気工業株式会社 半導体リ−ド用銅合金
DE3725830C2 (de) * 1986-09-30 2000-03-30 Furukawa Electric Co Ltd Kupfer-Zinn-Legierung für elektronische Instrumente
JP2862942B2 (ja) 1990-03-20 1999-03-03 古河電気工業株式会社 コルソン合金の熱処理方法
JP3049137B2 (ja) 1991-12-27 2000-06-05 株式会社神戸製鋼所 曲げ加工性が優れた高力銅合金及びその製造方法
JP3271351B2 (ja) 1993-01-28 2002-04-02 松下電器産業株式会社 スピーカ装置およびそれを用いたテレビジョン受像機
JP3510469B2 (ja) 1998-01-30 2004-03-29 古河電気工業株式会社 導電性ばね用銅合金及びその製造方法
US6506269B2 (en) * 1999-01-15 2003-01-14 Industrial Technology Research Institute High-strength and high-conductivity Cu-(Ni, Co, Fe)-Si copper alloy for use in leadframes and method of making the same
JP2001207229A (ja) 2000-01-27 2001-07-31 Nippon Mining & Metals Co Ltd 電子材料用銅合金
JP3520034B2 (ja) * 2000-07-25 2004-04-19 古河電気工業株式会社 電子電気機器部品用銅合金材
DE10392428T5 (de) 2002-03-12 2005-06-30 The Furukawa Electric Co., Ltd. Hochfester Leitkupferlegierungsdraht mit hervorragender Beständigkeit gegenüber Spannungsrelaxation
US7182823B2 (en) * 2002-07-05 2007-02-27 Olin Corporation Copper alloy containing cobalt, nickel and silicon

Also Published As

Publication number Publication date
EP1873267B1 (en) 2014-07-02
US8317948B2 (en) 2012-11-27
EP1873267A1 (en) 2008-01-02
JPWO2006101172A1 (ja) 2008-09-04
US20090035174A1 (en) 2009-02-05
JP5475230B2 (ja) 2014-04-16
TWI331633B (enrdf_load_stackoverflow) 2010-10-11
WO2006101172A1 (ja) 2006-09-28
CN101146920A (zh) 2008-03-19
EP1873267A4 (en) 2008-07-23

Similar Documents

Publication Publication Date Title
TW200710234A (en) Copper alloy for electronic material
WO2006106939A8 (ja) 電子材料用Ｃｕ－Ｎｉ－Ｓｉ－Ｃｏ－Ｃｒ系銅合金及びその製造方法
TW200706660A (en) Copper alloy having high strength and superior bending workability, and method for manufacturing copper alloy plates
WO2008123433A1 (ja) 電子材料用Ｃｕ－Ｎｉ－Ｓｉ系合金
TW200802711A (en) Method and structure for reducing contact resistance between silicide contact and overlying metallization
WO2010013790A1 (ja) 電気電子部品用銅合金材料とその製造方法
MY151333A (en) Silver plating in electronics manufacture.
TW200632114A (en) Titanium copper alloy having excellent punchability
EP1876604A4 (en) COLOR COMPOSITION AND METAL MATERIAL
WO2004024964A3 (en) Age-hardening copper-base alloy and processing
SG128578A1 (en) Display device
MY152076A (en) High strength and high conductivity copper alloy pipe, rod, or wire
DK1452613T3 (da) Blyfri kobberlegering og anvendelse deraf
MY142123A (en) Copper alloy
ATE491818T1 (de) Kupferlegierung für elektrische und elektronische geräte
TWI263685B (en) Copper alloy with high strength and high conductivity
ATE518968T1 (de) Kupferlegierungsplatte für elektrische und elektronische bauteile
WO2009057697A1 (ja) 電子機器用導体線材およびそれを用いた配線用電線
DE602005002898D1 (de) Kupferlegierung und Verfahren zu deren Herstellung
GB2433944A (en) Solder alloy
EP2439295A3 (en) Method for producing a Cr-Cu-alloy
TW200726567A (en) Solder alloy, solder ball and solder joint using the same
EP1063309A3 (en) Copper alloy
WO2009041194A1 (ja) 熱間加工性に優れた高強度高導電性銅合金
MY143219A (en) Copper alloy