TW200704260A - Microphone with built-in dust-proof plate - Google Patents

Microphone with built-in dust-proof plate

Info

Publication number
TW200704260A
TW200704260A TW095100902A TW95100902A TW200704260A TW 200704260 A TW200704260 A TW 200704260A TW 095100902 A TW095100902 A TW 095100902A TW 95100902 A TW95100902 A TW 95100902A TW 200704260 A TW200704260 A TW 200704260A
Authority
TW
Taiwan
Prior art keywords
dust
microphone
capsule
proof plate
hole portion
Prior art date
Application number
TW095100902A
Other languages
English (en)
Other versions
TWI306720B (zh
Inventor
Toshiro Izuchi
Kazuo Ono
Kensuke Nakanishi
Hiroaki Onishi
Original Assignee
Hosiden Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hosiden Corp filed Critical Hosiden Corp
Publication of TW200704260A publication Critical patent/TW200704260A/zh
Application granted granted Critical
Publication of TWI306720B publication Critical patent/TWI306720B/zh

Links

Classifications

    • EFIXED CONSTRUCTIONS
    • E03WATER SUPPLY; SEWERAGE
    • E03CDOMESTIC PLUMBING INSTALLATIONS FOR FRESH WATER OR WASTE WATER; SINKS
    • E03C1/00Domestic plumbing installations for fresh water or waste water; Sinks
    • E03C1/12Plumbing installations for waste water; Basins or fountains connected thereto; Sinks
    • E03C1/26Object-catching inserts or similar devices for waste pipes or outlets
    • E03C1/264Separate sieves or similar object-catching inserts
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • H04R19/04Microphones
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/08Mouthpieces; Microphones; Attachments therefor
    • H04R1/083Special constructions of mouthpieces
    • H04R1/086Protective screens, e.g. all weather or wind screens
    • EFIXED CONSTRUCTIONS
    • E03WATER SUPPLY; SEWERAGE
    • E03CDOMESTIC PLUMBING INSTALLATIONS FOR FRESH WATER OR WASTE WATER; SINKS
    • E03C2201/00Details, devices or methods not otherwise provided for
    • E03C2201/40Arrangement of water treatment devices in domestic plumbing installations

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Environmental & Geological Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Hydrology & Water Resources (AREA)
  • Public Health (AREA)
  • Water Supply & Treatment (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
TW095100902A 2005-02-09 2006-01-10 Microphone with built-in dust-proof plate TW200704260A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005033175A JP4188325B2 (ja) 2005-02-09 2005-02-09 防塵板内蔵マイクロホン

Publications (2)

Publication Number Publication Date
TW200704260A true TW200704260A (en) 2007-01-16
TWI306720B TWI306720B (zh) 2009-02-21

Family

ID=36293657

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095100902A TW200704260A (en) 2005-02-09 2006-01-10 Microphone with built-in dust-proof plate

Country Status (6)

Country Link
US (1) US7974430B2 (zh)
EP (1) EP1691570B1 (zh)
JP (1) JP4188325B2 (zh)
KR (1) KR100697586B1 (zh)
CN (1) CN1819708B (zh)
TW (1) TW200704260A (zh)

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CN101132654B (zh) * 2006-08-21 2011-04-06 日月光半导体制造股份有限公司 微机电麦克风封装系统
JP4245625B2 (ja) * 2006-09-29 2009-03-25 ホシデン株式会社 エレクトレットコンデンサマイクロホン
GB2443458B (en) * 2006-10-31 2009-09-16 Motorola Inc Wind filter for use with a microphone
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JP5075474B2 (ja) * 2007-05-18 2012-11-21 株式会社オーディオテクニカ バウンダリーマイクロホン
JP2009005253A (ja) * 2007-06-25 2009-01-08 Hosiden Corp コンデンサマイクロホン
CN101346014B (zh) * 2007-07-13 2012-06-20 清华大学 微机电系统麦克风及其制备方法
JP2009055198A (ja) * 2007-08-24 2009-03-12 Rohm Co Ltd マイクロホン装置
JP2009055490A (ja) * 2007-08-29 2009-03-12 Rohm Co Ltd マイクロホン装置
JP4944760B2 (ja) * 2007-12-27 2012-06-06 ホシデン株式会社 エレクトレットコンデンサマイクロホン
JP2010171631A (ja) * 2009-01-21 2010-08-05 Yamaha Corp シリコンマイクロホン
EP2422531A2 (en) * 2009-04-23 2012-02-29 Knowles Electronics, LLC Microphone having diaphragm ring with increased stability
JP5449932B2 (ja) * 2009-09-04 2014-03-19 株式会社オーディオテクニカ コンデンサマイクロホン
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KR101066557B1 (ko) 2009-10-14 2011-09-21 주식회사 비에스이 플로팅 구조의 콘덴서 마이크로폰 조립체
JP4947168B2 (ja) * 2010-02-24 2012-06-06 オムロン株式会社 音響センサ
JP5550387B2 (ja) * 2010-03-11 2014-07-16 株式会社オーディオテクニカ 狭指向性マイクロホン
TWI501358B (zh) * 2011-04-08 2015-09-21 Unimicron Technology Crop 載板及其製作方法
CN102164325A (zh) * 2011-05-16 2011-08-24 瑞声声学科技(深圳)有限公司 微型麦克风
ITMI20111579A1 (it) * 2011-09-02 2013-03-03 Saati Spa Microfono mems con schermo tessile integrato di protezione.
TWI405508B (zh) * 2011-09-28 2013-08-11 Unimicron Technology Corp 線路板
CN103051986A (zh) * 2011-10-13 2013-04-17 海能达通信股份有限公司 一种音腔结构及电声产品
JP2013090142A (ja) * 2011-10-18 2013-05-13 Hosiden Corp エレクトレットコンデンサマイクロホン
US20130177192A1 (en) * 2011-10-25 2013-07-11 Knowles Electronics, Llc Vented Microphone Module
KR101942133B1 (ko) * 2012-03-21 2019-01-24 가부시키가이샤 도모에가와 세이시쇼 마이크로폰 장치, 마이크로폰 유닛, 마이크로폰 구조 및 이를 이용한 전자 기기
KR101224448B1 (ko) * 2012-04-30 2013-01-21 (주)파트론 센서 패키지 및 그의 제조 방법
KR20200004447A (ko) * 2012-05-31 2020-01-13 닛토덴코 가부시키가이샤 음향 부품용 보호 부재 및 방수 케이스
US8842858B2 (en) * 2012-06-21 2014-09-23 Invensense, Inc. Electret condenser microphone
US9078063B2 (en) * 2012-08-10 2015-07-07 Knowles Electronics, Llc Microphone assembly with barrier to prevent contaminant infiltration
KR101323431B1 (ko) 2012-09-28 2013-10-29 이오스 재팬, 인코포레이티드 콘덴서 마이크로폰 및 그 조립방법
KR101303954B1 (ko) 2012-12-14 2013-09-05 주식회사 비에스이 광대역 및 방수 특성을 위한 보텀 포트형 마이크로폰 조립체
US9369787B2 (en) * 2013-06-03 2016-06-14 Nokia Technologies Oy Shielded audio apparatus
KR101514332B1 (ko) * 2013-11-05 2015-04-22 (주)파트론 마이크로폰 패키지 및 그 제조 방법
KR101469606B1 (ko) * 2013-11-13 2014-12-05 (주)파트론 마이크로폰 패키지의 제조 방법
DE102014214525B4 (de) * 2014-07-24 2019-11-14 Robert Bosch Gmbh Mikro-elektromechanisches Bauteil und Herstellungsverfahren für mikro-elektromechanische Bauteile
DE102014224063B3 (de) * 2014-11-26 2016-03-17 Robert Bosch Gmbh MEMS-Bauelement mit einer deformierbaren Membran
CN106211578A (zh) * 2015-05-05 2016-12-07 深南电路股份有限公司 一种pcb板制作方法及pcb板
CN204761633U (zh) * 2015-06-10 2015-11-11 瑞声光电科技(常州)有限公司 发声器件
DE112016006987T5 (de) * 2016-06-21 2019-04-04 Intel Corporation Eingabevorrichtung für elektronische vorrichtungen
US11117797B2 (en) 2016-10-08 2021-09-14 Goertek. Inc MEMS device and electronics apparatus
DE102017115405B3 (de) 2017-07-10 2018-12-20 Epcos Ag MEMS-Mikrofon mit verbessertem Partikelfilter
DE102018203098B3 (de) * 2018-03-01 2019-06-19 Infineon Technologies Ag MEMS-Sensor
CN110902642A (zh) * 2018-09-17 2020-03-24 新科实业有限公司 Mems封装件及制造其的方法
CN109547907B (zh) * 2019-01-23 2024-01-05 东莞泉声电子有限公司 驻极体电容传声器及其制作方法
CN111099153B (zh) * 2019-12-31 2024-09-10 潍坊歌尔微电子有限公司 一种用于防尘结构的料带
DE102020120370B3 (de) 2020-08-03 2022-02-03 Infineon Technologies Ag Mems-sensor mit partikelfilter und verfahren zu seiner herstellung
CN112073580B (zh) * 2020-08-28 2021-09-28 湖南比沃新能源有限公司 通讯终端
AT523698B1 (de) * 2021-01-27 2022-03-15 Avl List Gmbh Vorrichtung zur akustischen messung von luftschallwellen

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Also Published As

Publication number Publication date
CN1819708A (zh) 2006-08-16
US7974430B2 (en) 2011-07-05
US20060177085A1 (en) 2006-08-10
JP2006222641A (ja) 2006-08-24
CN1819708B (zh) 2014-05-21
EP1691570A2 (en) 2006-08-16
TWI306720B (zh) 2009-02-21
EP1691570B1 (en) 2016-03-30
KR20060090583A (ko) 2006-08-14
KR100697586B1 (ko) 2007-03-22
JP4188325B2 (ja) 2008-11-26
EP1691570A3 (en) 2010-09-15

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees